The category is 'Embedded - System On Chip (SoC)'
- All Manufacturers
- Packaging
- Series
- Package / Case
- Number of I/Os
- Architecture
- Connectivity
- Core Processor
- Operating Temperature
- Peripherals
- Primary Attributes
- RAM Size
- Moisture Sensitivity Level (MSL)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Package / Case | Surface Mount | Number of I/Os | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Number of Outputs | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Speed | RAM Size | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Connectivity | Architecture | Number of Inputs | Programmable Logic Type | Primary Attributes | Number of Logic Cells | Height Seated (Max) | Length | Width | Radiation Hardening | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No 10AS022C3U19I2LG | Intel | Datasheet | 9 | - | Min: 1 Mult: 1 | 8 Weeks | 484-BFBGA | YES | 192 | -40°C~100°C TJ | Tray | Arria 10 SX | Active | 3 (168 Hours) | 484 | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.9V | 0.8mm | NOT SPECIFIED | S-PBGA-B484 | 192 | Not Qualified | 0.93V | 0.9V | 0.87V | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 192 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 220K Logic Elements | 220000 | 3.25mm | 19mm | 19mm | RoHS Compliant | |||||||||
 | Mfr Part No 10AS027H4F34I3LG | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | 1152-BBGA, FCBGA | YES | 384 | -40°C~100°C TJ | Tray | Arria 10 SX | Active | 3 (168 Hours) | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.9V | 1mm | NOT SPECIFIED | S-PBGA-B1152 | 384 | Not Qualified | 0.93V | 0.9V | 0.87V | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 384 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 270K Logic Elements | 270000 | 3.65mm | 35mm | 35mm | RoHS Compliant | ||||||||||
 | Mfr Part No 10AS032E3F27I2LG | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 672-BBGA, FCBGA | YES | 240 | -40°C~100°C TJ | Tray | Arria 10 SX | Active | 3 (168 Hours) | 672 | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.9V | 1mm | NOT SPECIFIED | S-PBGA-B672 | 240 | Not Qualified | 0.93V | 0.9V | 0.87V | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 240 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 320K Logic Elements | 320000 | 3.25mm | 27mm | 27mm | RoHS Compliant | ||||||||||
 | Mfr Part No 10AS048E3F29E2LG | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | 780-BBGA, FCBGA | YES | 360 | 0°C~100°C TJ | Tray | Arria 10 SX | Active | 3 (168 Hours) | 780 | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.9V | 1mm | NOT SPECIFIED | S-PBGA-B780 | 360 | Not Qualified | 0.93V | 0.9V | 0.87V | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 360 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 480K Logic Elements | 480000 | 3.35mm | 29mm | 29mm | RoHS Compliant | |||||||||
| Mfr Part No 10AS022E3F27E2LG | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 672-BBGA, FCBGA | YES | 240 | 0°C~100°C TJ | Tray | Arria 10 SX | Active | 3 (168 Hours) | 672 | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.9V | 1mm | NOT SPECIFIED | S-PBGA-B672 | 240 | Not Qualified | 0.93V | 0.9V | 0.87V | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 240 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 220K Logic Elements | 220000 | 3.25mm | 27mm | 27mm | RoHS Compliant | ||||||||||
| Mfr Part No 10AS027H3F34I2SG | Intel | Datasheet | 652 | - | Min: 1 Mult: 1 | 8 Weeks | 1152-BBGA, FCBGA | YES | 384 | -40°C~100°C TJ | Tray | Arria 10 SX | Active | 3 (168 Hours) | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.9V | 1mm | NOT SPECIFIED | S-PBGA-B1152 | 384 | Not Qualified | 0.93V | 0.9V | 0.87V | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 384 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 270K Logic Elements | 270000 | 3.65mm | 35mm | 35mm | RoHS Compliant | ||||||||||
| Mfr Part No 10AS027E2F29I2SG | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | 780-BBGA, FCBGA | YES | 360 | -40°C~100°C TJ | Tray | Arria 10 SX | Active | 3 (168 Hours) | 780 | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.9V | 1mm | NOT SPECIFIED | S-PBGA-B780 | 360 | Not Qualified | 0.93V | 0.9V | 0.87V | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 360 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 270K Logic Elements | 270000 | 3.35mm | 29mm | 29mm | RoHS Compliant | |||||||||
| Mfr Part No 10AS027E2F29E2LG | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 780-BBGA, FCBGA | YES | 360 | 0°C~100°C TJ | Tray | Arria 10 SX | Active | 3 (168 Hours) | 780 | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.9V | 1mm | NOT SPECIFIED | S-PBGA-B780 | 360 | Not Qualified | 0.93V | 0.9V | 0.87V | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 360 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 270K Logic Elements | 270000 | 3.35mm | 29mm | 29mm | RoHS Compliant | ||||||||||
 | Mfr Part No BCM1122A4KEBG | Broadcom Limited | Datasheet | 124 | - | Min: 1 Mult: 1 | BGA | Obsolete | 1 (Unlimited) | No | RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No XCZU4CG-L2FBVB900E | Xilinx Inc. | Datasheet | 12 | - | Min: 1 Mult: 1 | 11 Weeks | 900-BBGA, FCBGA | YES | 204 | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC CG | Active | 4 (72 Hours) | 900 | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.72V | NOT SPECIFIED | R-PBGA-B900 | 0.742V | 0.698V | 500MHz, 1.2GHz | 256KB | MICROPROCESSOR CIRCUIT | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | ROHS3 Compliant | ||||||||||||||||
| Mfr Part No 10AS027H4F34E3SG | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | 1152-BBGA, FCBGA | YES | 384 | 0°C~100°C TJ | Tray | Arria 10 SX | Active | 3 (168 Hours) | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.9V | 1mm | NOT SPECIFIED | S-PBGA-B1152 | 384 | Not Qualified | 0.93V | 0.9V | 0.87V | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 384 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 270K Logic Elements | 270000 | 3.65mm | 35mm | 35mm | RoHS Compliant | ||||||||||
| Mfr Part No 10AS027H2F34I2SG | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | 1152-BBGA, FCBGA | YES | 384 | -40°C~100°C TJ | Tray | Arria 10 SX | Active | 3 (168 Hours) | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.9V | 1mm | NOT SPECIFIED | S-PBGA-B1152 | 384 | Not Qualified | 0.93V | 0.9V | 0.87V | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 384 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 270K Logic Elements | 270000 | 3.65mm | 35mm | 35mm | RoHS Compliant | ||||||||||
| Mfr Part No 10AS016E3F29E2SG | Intel | Datasheet | 2 | - | Min: 1 Mult: 1 | 8 Weeks | 780-BBGA, FCBGA | YES | 288 | 0°C~100°C TJ | Tray | Arria 10 SX | Active | 3 (168 Hours) | 780 | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.9V | 1mm | NOT SPECIFIED | S-PBGA-B780 | 288 | Not Qualified | 0.93V | 0.9V | 0.87V | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 288 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 160K Logic Elements | 160000 | 3.35mm | 29mm | 29mm | RoHS Compliant | |||||||||
| Mfr Part No 10AS032E2F27E2LG | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 672-BBGA, FCBGA | YES | 240 | 0°C~100°C TJ | Tray | Arria 10 SX | Active | 3 (168 Hours) | 672 | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.9V | 1mm | NOT SPECIFIED | S-PBGA-B672 | 240 | Not Qualified | 0.93V | 0.9V | 0.87V | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 240 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 320K Logic Elements | 320000 | 3.25mm | 27mm | 27mm | RoHS Compliant | ||||||||||
| Mfr Part No 10AS027H3F34E2LG | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | 1152-BBGA, FCBGA | YES | 384 | 0°C~100°C TJ | Tray | Arria 10 SX | Active | 3 (168 Hours) | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.9V | 1mm | NOT SPECIFIED | S-PBGA-B1152 | 384 | Not Qualified | 0.93V | 0.9V | 0.87V | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 384 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 270K Logic Elements | 270000 | 3.65mm | 35mm | 35mm | RoHS Compliant | ||||||||||
| Mfr Part No 5ASTFD5K3F40I3N | Intel | Datasheet | 541 | - | Min: 1 Mult: 1 | 8 Weeks | 1517-BBGA, FCBGA | YES | MCU - 208, FPGA - 540 | -40°C~100°C TJ | Tray | Arria V ST | e1 | Active | 3 (168 Hours) | TIN SILVER COPPER | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.15V | 1mm | NOT SPECIFIED | 5ASTFD5 | S-PBGA-B1517 | 1.18V | 1.12V | 1.05GHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | 670MHz | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 462K Logic Elements | 2.7mm | 40mm | 40mm | RoHS Compliant | |||||||||||
| Mfr Part No XCZU19EG-3FFVD1760E | Xilinx Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 11 Weeks | 1760-BBGA, FCBGA | 308 | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | Active | 4 (72 Hours) | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 600MHz, 667MHz, 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells | ROHS3 Compliant | ||||||||||||||||||||||||||
| Mfr Part No 10AS027H3F35I2SG | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | 1152-BBGA, FCBGA | YES | 384 | -40°C~100°C TJ | Tray | Arria 10 SX | Active | 3 (168 Hours) | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.9V | 1mm | NOT SPECIFIED | S-PBGA-B1152 | 384 | Not Qualified | 0.93V | 0.9V | 0.87V | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 384 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 270K Logic Elements | 270000 | 3.5mm | 35mm | 35mm | RoHS Compliant | ||||||||||
| Mfr Part No XCZU17EG-3FFVB1517E | Xilinx Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 11 Weeks | 1517-BBGA, FCBGA | 644 | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | Active | 4 (72 Hours) | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 600MHz, 667MHz, 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 926K+ Logic Cells | ROHS3 Compliant | ||||||||||||||||||||||||||
 | Mfr Part No XCZU11EG-1FFVC1156I | Xilinx Inc. | Datasheet | 428 |
| Min: 1 Mult: 1 | 11 Weeks | 1156-BBGA, FCBGA | 360 | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | Active | 4 (72 Hours) | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells | ROHS3 Compliant |
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10AS022C3U19I2LG
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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10AS027H4F34I3LG
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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10AS032E3F27I2LG
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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10AS048E3F29E2LG
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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10AS022E3F27E2LG
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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10AS027H3F34I2SG
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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10AS027E2F29I2SG
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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10AS027E2F29E2LG
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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BCM1122A4KEBG
Broadcom Limited
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU4CG-L2FBVB900E
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
Price: please inquire
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10AS027H4F34E3SG
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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10AS027H2F34I2SG
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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10AS016E3F29E2SG
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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10AS032E2F27E2LG
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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10AS027H3F34E2LG
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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5ASTFD5K3F40I3N
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU19EG-3FFVD1760E
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
Price: please inquire
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10AS027H3F35I2SG
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU17EG-3FFVB1517E
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU11EG-1FFVC1156I
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
5,236.396187