The category is 'Embedded - System On Chip (SoC)'
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Contact Plating | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Material | Housing Material | Number of Terminals | Base Product Number | Body Orientation | Brand | Capacitance - nF | Capacitance - uF | Case Code - in | Case Code - mm | Class | Data RAM Size | Degree of protection (IP) | Degree of protection (NEMA) | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer | Manufacturer Part Number | Material quality | Maximum Clock Frequency | Maximum Operating Temperature | Mfr | Minimum Operating Temperature | Model | Moisture Sensitive | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part # Aliases | Part Life Cycle Code | Product Status | Qualification | Reflow Temperature-Max (s) | Resistor Values | Risk Rank | RoHS | Rohs Code | Shell Sizes | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Termination Method | Tradename | Unit Weight | Voltage Rating DC | Voltage, Rating | Operating Temperature | Packaging | Series | Tolerance | Part Status | Termination | Temperature Coefficient | Max Operating Temperature | Min Operating Temperature | HTS Code | Capacitance | Subcategory | Technology | Terminal Position | Terminal Form | Shielding | Peak Reflow Temperature (Cel) | Terminal Pitch | Depth | Reach Compliance Code | Current Rating | Frequency | Base Part Number | Termination Style | JESD-30 Code | Number of Outputs | Qualification Status | Number of Contacts | Contact Gender | Operating Supply Voltage | Dielectric | Lead Spacing | Power Supplies | Temperature Grade | Voltage | Interface | Memory Size | Wire/Cable Type | Speed | RAM Size | Core Processor | Number of Resistors | Peripherals | Program Memory Size | Connectivity | Architecture | Number of Inputs | Circuit Type | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Product Type | Operating Temperature Range | Core Architecture | Output Format | Primary Attributes | Number of Logic Cells | Number of Cores | Flash Size | Product | Features | Product Category | Strain Relief | IP Rating | Height | Length | Width |
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 | Mfr Part No XCVM1402-1LSENBVB1024 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Tin | 1024-BFBGA | 1024-BGA (31x31) | Xilinx | 1 | Xilinx | + 100 C | AMD Xilinx | 0 C | 424 | Tray | Active | Non-Compliant | 0°C ~ 100°C (TJ) | Versal™ Prime | SOC - Systems on a Chip | 700 mV | 400MHz, 1GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | System-On-Modules - SOM | Versal™ Prime FPGA, 1.2M Logic Cells | - | SoC FPGA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1302-2LLENBVB1024 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Cable | 1024-BFBGA | 1024-BGA (31x31) | Xilinx | 1 | Xilinx | + 110 C | AMD Xilinx | 0 C | 316 | Tray | Active | Compliant | 0°C ~ 100°C (TJ) | Versal™ Prime | SOC - Systems on a Chip | Shielded | 700 mV | Data | 450MHz, 1.08GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | System-On-Modules - SOM | Versal™ Prime FPGA, 70k Logic Cells | - | SoC FPGA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MPFS160T-1FCVG484T2 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 484-BFBGA, FCBGA | 484-FCBGA (19x19) | Microchip Technology | MCU - 136, FPGA - 108 | Tray | Active | -40°C ~ 125°C (TJ) | - | - | 1.4125MB | RISC-V | DMA, PCI, PWM | CANbus, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 161K Logic Modules | 128KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGID023R18A2E3E | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Welwyn Components / TT Electronics | 1206 | 3216 | 3000 | TT Electronics | Intel | PCB Mount | 480 | Tray | Active | 0.000705 oz | 0°C ~ 100°C (TJ) | Reel | PWC | Resistors | Thick Film | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Thick Film Resistors | FPGA - 2.3M Logic Elements | - | - | Thick Film Resistors - SMD | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFB022R31C2E2VAA | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 720 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.2M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU6CG-1FFVB1156E | AMD | Datasheet | 600 | - | Min: 1 Mult: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | Steel | XCZU6 | IP54 | Other | Other | AMD | 328 | Bulk | Active | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 800 | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 469K+ Logic Cells | - | 1800 | 1200 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA022R31C2E4X | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 720 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.2M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z014S-1CLG484I | AMD | Datasheet | 2303 |
| Min: 1 Mult: 1 | 484-LFBGA, CSPBGA | 484-CSPBGA (19x19) | Metal | XC7Z014 | AMD | Support rail | 200 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq®-7000 | 15 | 667MHz | 256KB | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Artix™-7 FPGA, 65K Logic Cells | - | 35 | 745 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA006R16A2I3V | Intel | Datasheet | 649 | - | Min: 1 Mult: 1 | - | - | Intel | 384 | Tray | Active | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 573K Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA027R25A3I3E | Intel | Datasheet | - | - | Min: 1 Mult: 1 | Silver | Cable Mount | - | - | Metal, Polymer | Straight | +85°C | Intel | -40°C | 624 | Tray | Active | M16 | Solder | 300 V | -40°C ~ 100°C (TJ) | Signalmate C091 | 5.0A | 6 | Male | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.7M Logic Elements | - | Yes | IP40 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU7EG-1FFVF1517E | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | XCZU7 | AMD | 464 | Tray | Active | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10AS027H3F34E2LG | ALTERA | Datasheet | 564 |
| Min: 1 Mult: 1 | FBGA-1152 | YES | Stainless Steel | 1152 | Intel / Altera | - | 1 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS027H3F34E2LG | 1.2 GHz | Yes | SMD/SMT | 384 | 33750 LAB | 270000 LE | 100 °C | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | 965284 | Active | NOT SPECIFIED | 5.43 | Details | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | 0°C ~ 100°C (TJ) | Tray | Arria 10 SX | Active | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B1152 | 384 | Not Qualified | 0.9 V | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 384 | 3.65 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 270K Logic Elements | 270000 | 2 Core | -- | SoC FPGA | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XQZU59DR-L2FSQF1760I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | SOM-16 | 16 | Bourns | 2000 | Bourns | + 125 C | - 55 C | AEC-Q200 | 3.9 kOhms | Details | 0.035274 oz | Reel | 4800P | 2 % | 100 PPM / C | Resistors | SMD/SMT | 1.27 mm | 8 | Isolated | Resistor Networks & Arrays | - 55 C to + 125 C | Networks | Resistor Networks & Arrays | 2.03 mm | 9.53 mm | 7.62 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 1SX040HH3F35I2VG | Intel | Datasheet | 680 |
| Min: 1 Mult: 1 | 1206 (3216 metric) | 1152-FBGA (35x35) | Vishay / Vitramon | 1.5 nF | 0.0015 uF | 1206 | 3216 | Class 1 | 15000 | Vishay | + 125 C | Intel | - 55 C | 374 | Tray | Active | Details | 0.000952 oz | 100 VDC | -40°C ~ 100°C (TJ) | Reel | VJ W1BC Basic Comm | 1 % | Flexible (Soft) | 1500 pF | Capacitors | SMD/SMT | C0G (NP0) | 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Ceramic Capacitors | FPGA - 400K Logic Elements | - | General Type MLCCs | Multilayer Ceramic Capacitors MLCC - SMD/SMT | 0.8 mm | 3.2 mm | 1.6 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No BCM53570B0IFSBG | Broadcom | Datasheet | 118 | - | Min: 1 Mult: 1 | - | - | Amphenol Positronic | 1 | Positronic | Broadcom Limited | - | Tray | Active | Details | - | - | D-Sub Connectors | Si | 1.25GHz | - | ARM® Cortex®-A9, ARM® Cortex®-R5 | SERDES | ACL, MAC, QSGMII | MPU | Mixed Contact D-Sub Connectors | - | - | D-Sub Mixed Contact Connectors | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No BCM53570B0KFSBG | Broadcom | Datasheet | 151 | - | Min: 1 Mult: 1 | - | - | Amphenol Positronic | 189 | Positronic | Broadcom Limited | - | Tray | Active | N | - | - | D-Sub Connectors | Si | 1.25GHz | - | ARM® Cortex®-A9, ARM® Cortex®-R5 | SERDES | ACL, MAC, QSGMII | MPU | Mixed Contact D-Sub Connectors | - | - | D-Sub Mixed Contact Connectors | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MCIMX7D3DVK10SB | NXP | Datasheet | - | - | Min: 1 Mult: 1 | CTS Electronic Components | 3000 | CTS | Details | Reel | 520 | Oscillators | TCXO | Clipped Sine Wave | TCXO Oscillators | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10AS027H2F35I2SG | ALTERA | Datasheet | 542 |
| Min: 1 Mult: 1 | FBGA-1152 | YES | 1152 | Intel / Altera | - | 1 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | TAIWAN SEMICONDUCTOR | 10AS027H2F35I2SG | 1.2 GHz | Yes | SMD/SMT | 384 | 33750 LAB | 270000 LE | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | 965283 | Active | NOT SPECIFIED | 5.43 | Details | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | -40°C ~ 100°C (TJ) | TO-252 (D-PAK) | Arria 10 SX | Active | 8542.39.00.01 | Ciss - 257.3pF | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B1152 | 384 | Not Qualified | 0.9 V | INDUSTRIAL | VDS - 600V | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 384 | 3.5 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 270K Logic Elements | 270000 | 2 Core | -- | SoC FPGA | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5CSEBA4U23C8N | ALTERA | Datasheet | 2242 |
| Min: 1 Mult: 1 | 672-FBGA | 484 | 672-UBGA (23x23) | TAIWAN SEMICONDUCTOR | MCU - 181, FPGA - 145 | Compliant | 0°C ~ 85°C (TJ) | SOT-23 | Cyclone® V SE | Active | 85 °C | 0 °C | 600 MHz | 1.1 V | Supply Voltage Maximum - 6V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 2.9 MB | 600MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 40000 | ARM | FPGA - 40K Logic Elements | -- | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5CSXFC6C6U23I7NES | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | 672-FBGA | 672-UBGA (23x23) | MCU - 181, FPGA - 145 | -40°C ~ 100°C (TJ) | Tray | Cyclone® V SX | Obsolete | 5CSXFC6 | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 110K Logic Elements | -- |
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XCVM1402-1LSENBVB1024
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVM1302-2LLENBVB1024
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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MPFS160T-1FCVG484T2
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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AGID023R18A2E3E
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
AGFB022R31C2E2VAA
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU6CG-1FFVB1156E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
AGFA022R31C2E4X
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XC7Z014S-1CLG484I
AMD
Package:Embedded - System On Chip (SoC)
145.358473
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AGFA006R16A2I3V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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AGFA027R25A3I3E
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU7EG-1FFVF1517E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
10AS027H3F34E2LG
ALTERA
Package:Embedded - System On Chip (SoC)
1,998.797035
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XQZU59DR-L2FSQF1760I
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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1SX040HH3F35I2VG
Intel
Package:Embedded - System On Chip (SoC)
2,258.272480
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BCM53570B0IFSBG
Broadcom
Package:Embedded - System On Chip (SoC)
Price: please inquire
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BCM53570B0KFSBG
Broadcom
Package:Embedded - System On Chip (SoC)
Price: please inquire
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MCIMX7D3DVK10SB
NXP
Package:Embedded - System On Chip (SoC)
Price: please inquire
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10AS027H2F35I2SG
ALTERA
Package:Embedded - System On Chip (SoC)
2,275.795723
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5CSEBA4U23C8N
ALTERA
Package:Embedded - System On Chip (SoC)
128.226749
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5CSXFC6C6U23I7NES
ALTERA
Package:Embedded - System On Chip (SoC)
Price: please inquire