The category is 'Embedded - System On Chip (SoC)'
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- Package / Case
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- Peripherals
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- RAM Size
- Moisture Sensitivity Level (MSL)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Number of Terminals | Base Product Number | Brand | Clock Frequency-Max | Data RAM Size | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Ir - Maximum Reverse Leakage Current | Ir - Reverse Current | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Temperature | Mfr | Minimum Operating Temperature | Moisture Sensitive | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part # Aliases | Part Life Cycle Code | Pd - Power Dissipation | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Unit Weight | Vz - Zener Voltage | Zz - Zener Impedance | Operating Temperature | Packaging | Series | JESD-609 Code | Part Status | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Color | HTS Code | Subcategory | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Base Part Number | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Configuration | Memory Size | Speed | RAM Size | Core Processor | Peripherals | Program Memory Size | Connectivity | Architecture | Number of Inputs | Test Current | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Product Type | Max Frequency | Number of Logic Blocks (LABs) | Speed Grade | Number of Transceivers | Primary Attributes | Zener Current | Number of Logic Cells | Number of Cores | Flash Size | Product Category | Height | Length | Width | Lead Free |
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 | Mfr Part No 1SX040HH1F35I2LG | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 1152-BBGA, FCBGA | 1152-FBGA (35x35) | Intel | 374 | Tray | Active | -40°C ~ 100°C (TJ) | Stratix® 10 SX | Beige | 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 400K Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU19EG-2FFVD1760I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | XCZU19 | AMD | 308 | Tray | Active | Non-Compliant | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFD023R25A2E2V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 480 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.3M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5CSEBA6U19C8N | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | 484-FBGA | YES | 484 | 484-UBGA (19x19) | 484 | INTEL CORP | Intel Corporation | 5CSEBA6U19C8N | MCU - 151, FPGA - 66 | 85 °C | PLASTIC/EPOXY | FBGA | FBGA, BGA484,22X22,32 | BGA484,22X22,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | NOT SPECIFIED | 2.07 | Compliant | Yes | 1.13 V | 1.07 V | 1.1 V | 0°C ~ 85°C (TJ) | Tray | Cyclone® V SE | Active | 85 °C | 0 °C | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | NOT SPECIFIED | 0.8 mm | compliant | 5CSEBA6 | S-PBGA-B484 | 66 | Not Qualified | 1.13 V | 1.1,1.2/3.3,2.5 V | OTHER | 773.9 kB | 600MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 66 | 1.9 mm | FIELD PROGRAMMABLE GATE ARRAY | 110000 | 800 MHz | 41509 | 8 | FPGA - 110K Logic Elements | 110000 | -- | 19 mm | 19 mm | ||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10AS027H3F35E2SG | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | FBGA-1152 | D38999/26FF | Intel / Altera | - | 1 | 2 x 32 kB | 2 x 32 kB | Intel | 1.2 GHz | Corsair | Yes | SMD/SMT | 384 | 33750 LAB | 270000 LE | Bag | 965285 | Active | Details | Arria 10 SoC | 0°C ~ 100°C (TJ) | Tray | * | Active | SOC - Systems on a Chip | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | SoC FPGA | FPGA - 270K Logic Elements | 2 Core | -- | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFB008R16A3I3E | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Advanced Energy | 1 | Advanced Energy | Intel | 384 | Tray | Active | -40°C ~ 100°C (TJ) | Agilex F | DC-DC Converter | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Non-Isolated DC-DC Converters | FPGA - 764K Logic Elements | - | Non-Isolated DC/DC Converters | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1402-1MSENBVB1024-ES9919 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Amphenol Aerospace | 1 | Amphenol | + 100 C | 0 C | Details | 38999 | D38999 III | Circular Connectors | 800 mV | Circular MIL Spec Connector | Circular MIL Spec Connector | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVC1502-1MSEVSVA2197 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | SOD-123-2 | 2197-FCBGA (45x45) | Panjit | 5000 | 0.1 uA | 0.1 uA | Panjit | + 150 C | AMD | - 55 C | SMD/SMT | 586 | Tray | 200 mW | Active | Details | 0.000353 oz | 47 V | 100 Ohms | 0°C ~ 100°C (TJ) | Reel | Versal™ AI Core | Diodes & Rectifiers | Single | 600MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | 5 mA | Zener Diodes | Versal™ AI Core FPGA, 800k Logic Cells | 0.1 uA | - | Zener Diodes | 0.9 mm | 1.95 mm | 1.35 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU48DR-2FSVE1156E | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | Amphenol Positronic | 5 | Positronic | AMD Xilinx | 366 | Tray | Active | Details | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | D-Sub Connectors | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Mixed Contact D-Sub Connectors | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | D-Sub Mixed Contact Connectors | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU47DR-L2FSVG1517I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | AMD Xilinx | 561 | Active | Non-Compliant | -40°C ~ 100°C (TJ) | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFB006R24C2I1V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | SOT-23-3 | - | Panjit | 12000 | 0.1 uA | 0.1 uA | Panjit | + 150 C | Intel | - 55 C | SMD/SMT | 576 | Tray | 300 mW | Active | Details | 0.000296 oz | 22 V | 55 Ohms | -40°C ~ 100°C (TJ) | Reel | Agilex F | Diodes & Rectifiers | Dual Common Anode | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | 5 mA | Zener Diodes | FPGA - 573K Logic Elements | 0.1 uA | - | Zener Diodes | 1 mm | 3.04 mm | 1.4 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFC019R25A1I1V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Panjit | 12000 | Panjit | Intel | 480 | Tray | Active | Details | 0.000145 oz | -40°C ~ 100°C (TJ) | Reel | Agilex F | Diodes & Rectifiers | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Diodes - General Purpose, Power, Switching | FPGA - 1.9M Logic Elements | - | Diodes - General Purpose, Power, Switching | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFD023R25A2I3E | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 480 | Tray | Active | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.3M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU49DR-L2FSVF1760I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | AMD | 622 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFC019R25A2E3E | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 480 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.9M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFB006R16A3I3E | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 384 | Tray | Active | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 573K Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F500M3G-1FGG256 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 256-LBGA | 256-FPBGA (17x17) | A2F500 | Microchip Technology | MCU - 25, FPGA - 66 | Tray | Active | 0°C ~ 85°C (TJ) | SmartFusion® | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 1 | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 512KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10AS032E2F27I1HG | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | 672-BBGA, FCBGA | 672-FBGA (27x27) | Intel / Altera | - | 40 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS032E2F27I1HG | 1.2 GHz | + 100 C | - 40 C | Yes | SMD/SMT | 240 | 40000 LAB | 320000 LE | 965054 | Active | 5.66 | Details | Yes | Arria 10 SoC | -40°C ~ 100°C (TJ) | Tray | Arria 10 SX | Active | SOC - Systems on a Chip | unknown | 950 mV | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | SoC FPGA | 12 Transceiver | FPGA - 320K Logic Elements | 2 Core | -- | SoC FPGA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5CSEBA5U19I7N | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | 484-FBGA | YES | 484 | 484-UBGA (19x19) | 484 | 622 MHz | INTEL CORP | Intel Corporation | 5CSEBA5U19I7N | MCU - 151, FPGA - 66 | PLASTIC/EPOXY | FBGA | FBGA, BGA484,22X22,32 | BGA484,22X22,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | 40 | 5.55 | Non-Compliant | Yes | 1.13 V | 1.07 V | 1.1 V | -40°C ~ 100°C (TJ) | Tray | Cyclone® V SE | e1 | Active | TIN SILVER COPPER | 100 °C | -40 °C | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 260 | 0.8 mm | compliant | 5CSEBA5 | S-PBGA-B484 | 66 | Not Qualified | 1.13 V | 1.1,1.2/3.3,2.5 V | 556.3 kB | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 66 | 1.9 mm | FIELD PROGRAMMABLE GATE ARRAY | 85000 | 800 MHz | 32075 | 7 | FPGA - 85K Logic Elements | 85000 | -- | 19 mm | 19 mm | Lead Free | |||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA022R24C3E4X | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 744 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.2M Logic Elements | - |
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1SX040HH1F35I2LG
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU19EG-2FFVD1760I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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AGFD023R25A2E2V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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5CSEBA6U19C8N
ALTERA
Package:Embedded - System On Chip (SoC)
Price: please inquire
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10AS027H3F35E2SG
ALTERA
Package:Embedded - System On Chip (SoC)
Price: please inquire
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AGFB008R16A3I3E
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCVM1402-1MSENBVB1024-ES9919
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCVC1502-1MSEVSVA2197
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU48DR-2FSVE1156E
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU47DR-L2FSVG1517I
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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AGFB006R24C2I1V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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AGFC019R25A1I1V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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AGFD023R25A2I3E
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU49DR-L2FSVF1760I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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AGFC019R25A2E3E
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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AGFB006R16A3I3E
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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A2F500M3G-1FGG256
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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10AS032E2F27I1HG
ALTERA
Package:Embedded - System On Chip (SoC)
Price: please inquire
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5CSEBA5U19I7N
ALTERA
Package:Embedded - System On Chip (SoC)
Price: please inquire
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AGFA022R24C3E4X
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire