The category is 'Embedded - System On Chip (SoC)'
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- Package / Case
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- Peripherals
- Primary Attributes
- RAM Size
- Moisture Sensitivity Level (MSL)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Mounting Type | Package / Case | Surface Mount | Mounting Feature | Shell Material | Supplier Device Package | Housing Material | Insert Material | Body Material | Number of Terminals | Backshell Material, Plating | Contact Material - Plating | Core Material | Approvals | Base Product Number | Contact Finish Mating | Contact Materials | Data RAM Size | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Lead Free Status / RoHS Status | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Mfr | Mounting Styles | Number of I/Os | Number of Logic Elements | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Primary Material | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Voltage Rated | Voltage Rating AC | Voltage Rating DC | Voltage, Rating | Operating Temperature | Packaging | Series | Size / Dimension | Tolerance | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Termination | Connector Type | Number of Positions | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Color | Applications | Gender | HTS Code | Fastening Type | Subcategory | Current Rating (Amps) | Technology | Terminal Position | Orientation | Terminal Form | Shielding | Peak Reflow Temperature (Cel) | Ingress Protection | Terminal Pitch | Reach Compliance Code | Current Rating | Insulation Color | Shell Finish | Shell Size - Insert | JESD-30 Code | Number of Outputs | Qualification Status | Power Supplies | Inductance | DC Resistance (DCR) | Speed | RAM Size | Shell Size, MIL | Max DC Current | Core Processor | Peripherals | Program Memory Size | Connectivity | Cable Opening | Lead/Base Style | Response Time | Architecture | Number of Inputs | Fuse Type | Seated Height-Max | Programmable Logic Type | Breaking Capacity @ Rated Voltage | Thread Size | Number of Positions/Contacts | Includes | DC Cold Resistance | Internal Switch(s) | Primary Attributes | Number of Logic Cells | Number of Cores | Body Color | Panel Hole Size | Industry Recognized Mating Diameter | Actual Diameter | Signal Lines | Flash Size | Mating Length/Depth | Features | Length | Width | Contact Finish Thickness - Mating | Material Flammability Rating |
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 | Mfr Part No XCZU48DR-1FFVE1156I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD | 366 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU49DR-1FSVF1760E | AMD | Datasheet | - | - | Min: 1 Mult: 1 | Free Hanging (In-Line) | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | Thermoplastic | -- | Copper Alloy | Copper Alloy | -- | AMD | 622 | Tray | Active | 250VAC, 140VDC | -40°C ~ 85°C | Bulk | 3558 | Active | Solder | Phono (RCA) Plug | Male | Unshielded | 6A | -- | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 0.203 (5.16mm) | MCU, FPGA | -- | 2 Conductors, 2 Contacts | 2 pcs - 1 Connector, 1 Handle | Does Not Contain Switch | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | Silver, Black | -- | 3.20mm ID, 9.00mm OD (RCA) | -- | Mono | - | 0.640 (16.30mm) | Mounting Hardware | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S025T-1FCS325I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Through Hole | 2AG, 5mm x 15mm (Axial) | 325-FCBGA (11x11) | CE, CSA, cURus, PSE | M2S025 | 64 kB | - | - | -- | 166 MHz | Microchip Technology | SMD/SMT | 180 | 27696 LE | Tray | Active | Non-Compliant | 350V | 140V | -55°C ~ 125°C | Bulk | 3JQ | 0.217 Dia x 0.591 L (5.50mm x 15.00mm) | Active | -- | -- | 2A | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | Fast | MCU, FPGA | Cartridge, Glass | 100A AC, 150A DC | 0.041 Ohms | FPGA - 25K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No I.MX 6ULTRALITE / MCIMX6G2CVM05AB | NXP | Datasheet | - | - | Min: 1 Mult: 1 | Ferrite | Non-Compliant | 15 % | 125 °C | -55 °C | 22 µH | 24 mΩ | 4 A | Axial | 22.86 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU42DR-L1FFVE1156I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | ABB | AMD | 366 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 489K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVC1502-1LLIVSVA1596 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1596-BFBGA | 1596-BGA (37.5x37.5) | AMD | 478 | Tray | Active | -40°C ~ 100°C (TJ) | Versal™ AI Core | 400MHz, 1GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 80k Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S150-1FC1152I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 1152-BBGA, FCBGA | YES | 1152-FCBGA (35x35) | 1152 | M2S150 | 64 kB | MICROSEMI CORP | - | - | Microsemi Corporation | M2S150-1FC1152I | 166 MHz | Microchip Technology | SMD/SMT | 574 | 146124 LE | Tray | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.81 | No | 1.26 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | SmartFusion®2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B1152 | 574 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 574 | 2.9 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 150K Logic Modules | 146124 | 1 Core | 512KB | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU43DR-L2FSVG1517I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | AMD | 561 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU47DR-L2FSVE1156I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD | 366 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S025T-VFG400 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 400-LFBGA | 400-VFBGA (17x17) | M2S025 | 64 kB | - | - | 166 MHz | Microchip Technology | 207 | 27696 LE | Tray | Active | 0°C ~ 85°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 25K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MPFS250T-FCVG784EES | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | Microchip Technology | MCU - 136, FPGA - 372 | Tray | Active | 0°C ~ 100°C | PolarFire™ | - | 2.2MB | RISC-V | DMA, PCI, PWM | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 254K Logic Modules | 128kB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA008R16A2E2V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | Free Hanging (In-Line) | - | - | Aluminum | - | - | - | MS27467E25B | Gold | Copper Alloy | Amphenol Aerospace Operations | 384 | Bulk | Metal | Active | - | -65°C ~ 175°C | Military, MIL-DTL-38999 Series I, LJT | Crimp | Plug, Male Pins | 19 | Olive Drab | Aviation, Military | Bayonet Lock | - | A | Shielded | Environment Resistant | Olive Drab Cadmium over Nickel | 25-19 | 1.4GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | - | MPU, FPGA | FPGA - 764K Logic Elements | - | Coupling Nut | 50.0µin (1.27µm) | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA014R24B2E3V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Kamaya Inc. | 768 | Tape & Reel (TR) | Active | 0°C ~ 100°C (TJ) | * | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.4M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1402-1LSIVFVC1596 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1596-BFBGA | 1596-BGA (37.5x37.5) | AMD | 748 | Tray | Active | -40°C ~ 100°C (TJ) | Versal™ Prime | 400MHz, 1GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.2M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVP1502-2MLEVSVA2785 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 2785-BFBGA | 2785-BGA (50x50) | AMD | 780 | Tray | Active | 0°C ~ 100°C (TJ) | Versal® Premium | 600MHz, 1.4GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Premium FPGA, 3.7M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU67DR-1FSVE1156I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVC1802-2MLIVIVA1596 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1596-BFBGA, FCBGA | 1596-FCBGA (40x40) | AMD | 500 | Tray | Active | -40°C ~ 100°C (TJ) | Versal™ AI Core | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.5M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVE1752-2LSEVSVA1596 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1596-BFBGA | 1596-BGA (37.5x37.5) | AMD | 500 | Tray | Active | 0°C ~ 100°C (TJ) | Versal™ AI Core | 450MHz, 1.08GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1402-2MSEVFVC1596 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1596-BFBGA | 1596-BGA (37.5x37.5) | AMD | 748 | Tray | Active | 0°C ~ 100°C (TJ) | Versal™ Prime | 600MHz, 1.4GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.2M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVC1802-2MSIVSVD1760 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD | 692 | Tray | Active | -40°C ~ 100°C (TJ) | Versal™ AI Core | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.5M Logic Cells | - |
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XCZU48DR-1FFVE1156I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU49DR-1FSVF1760E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S025T-1FCS325I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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I.MX 6ULTRALITE / MCIMX6G2CVM05AB
NXP
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU42DR-L1FFVE1156I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCVC1502-1LLIVSVA1596
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S150-1FC1152I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU43DR-L2FSVG1517I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU47DR-L2FSVE1156I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S025T-VFG400
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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MPFS250T-FCVG784EES
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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AGFA008R16A2E2V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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AGFA014R24B2E3V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCVM1402-1LSIVFVC1596
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCVP1502-2MLEVSVA2785
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU67DR-1FSVE1156I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCVC1802-2MLIVIVA1596
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCVE1752-2LSEVSVA1596
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCVM1402-2MSEVFVC1596
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCVC1802-2MSIVSVD1760
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire