The category is 'Embedded - System On Chip (SoC)'
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Mounting Type | Package / Case | Surface Mount | Supplier Device Package | Material | Number of Terminals | Angle | Approvals | Base Product Number | Brand | Cable Style | Clock Frequency-Max | Data RAM Size | Device Logic Units | Display | Distributed RAM | Factory Pack QuantityFactory Pack Quantity | Grip Type | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer | Manufacturer Part Number | Maximum Cable Diameter (mm) | Maximum Clock Frequency | Maximum Number of User I/Os | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Cable Diameter (mm) | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Supplier Package | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Timing Range | Typical Operating Supply Voltage | Unit Weight | Operating Temperature | Packaging | Series | JESD-609 Code | Termination | Terminal Finish | Composition | Applications | HTS Code | Subcategory | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Output | Pin Count | JESD-30 Code | Function | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Speed | RAM Size | Core Processor | Peripherals | Program Memory Size | Connectivity | Architecture | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Product Type | Coil Voltage | Screening Level | Speed Grade | Primary Attributes | Number of Registers | Number of CLBs | Number of Logic Cells | Number of Cores | Number of Equivalent Gates | Flash Size | Mode of Operation | Product Category | Contacts | Length | Width |
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 | Mfr Part No M2S050T-FG896I | Microchip | Datasheet | 1968 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 896-BGA | YES | 896-FBGA (31x31) | 896 | M2S050 | 64 kB | MICROSEMI CORP | - | - | Microsemi Corporation | M2S050T-FG896I | 166 MHz | Microchip Technology | 3 | SMD/SMT | 377 | 56340 LE | Tray | PLASTIC/EPOXY | BGA | BGA, BGA896,30X30,40 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.81 | Non-Compliant | No | 1.26 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | SmartFusion®2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B896 | 377 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 377 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 50K Logic Modules | 56340 | 1 Core | 256KB | 31 mm | 31 mm | ||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F200M3F-CS288 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 288-TFBGA, CSPBGA | 288-CSP (11x11) | A2F200 | Microchip Technology | MCU - 31, FPGA - 78 | Tray | Active | 0°C ~ 85°C (TJ) | SmartFusion® | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S005S-1TQG144T2 | Microchip | Datasheet | 2144 | - | Min: 1 Mult: 1 | 144-LQFP | 144-TQFP (20x20) | M2S005 | MICROSEMI CORP | Microsemi Corporation | M2S005S-1TQG144T2 | Microchip Technology | 3 | 213 | Tray | Active | Active | 40 | 5.79 | Yes | 0°C ~ 85°C (TJ) | SmartFusion®2 | Pure Matte Tin (Sn) | 250 | compliant | 166MHz | 64KB | ARM® Cortex®-M3 | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 5K Logic Modules | 128KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F200M3F-FG484I | Microchip | Datasheet | 2008 | - | Min: 1 Mult: 1 | 484-BGA | YES | 484-FPBGA (23x23) | 484 | A2F200 | 80 MHz | MICROSEMI CORP | Microsemi Corporation | A2F200M3F-FG484I | Microchip Technology | 3 | MCU - 41, FPGA - 94 | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,26X26,40 | BGA484,26X26,40 | SQUARE | GRID ARRAY | Active | Active | 20 | 5.23 | No | 1.575 V | 1.425 V | 1.5 V | -40°C ~ 100°C (TJ) | SmartFusion® | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B484 | 94 | Not Qualified | 1.5,1.8,2.5,3.3 V | INDUSTRIAL | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 94 | 4608 CLBS, 200000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | 4608 | 4608 | 200000 | 256KB | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU3CG-L2SFVA625E | AMD | Datasheet | 520 |
| Min: 1 Mult: 1 | 625-BFBGA, FCBGA | 625-FCBGA (21x21) | ABB | KA2-2143 | AMD | 180 | Tray | Active | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 533MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU11EG-3FFVC1156E | AMD | Datasheet | - | - | Min: 1 Mult: 1 | Surface | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | CSA, UL | XCZU11 | Amperite | 230C180B | 0.927 V | AMD | 0.873 V | 360 | Tray | Active | 180 | 0.9000 V | 0 to 100 °C | Zynq® UltraScale+™ MPSoC EG | 0.110 in Flat Blade | 600MHz, 667MHz, 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 230 VAC, 230 VDC | 3 | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells | - | Off Delay | 1NC | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S010-1TQG144I | Microchip | Datasheet | 2148 |
| Min: 1 Mult: 1 | 144-LQFP | 144-TQFP (20x20) | Steel | Straight | cUL, UL | M2S010 | Round | 64 kB | Bushing Grip with Strain Relief | - | - | Crouse-Hinds Industrial Produc | CGB399 | 30.18 mm | 166 MHz | Microchip Technology | 25.4 mm | SMD/SMT | 84 | 12084 LE | Tray | Active | No | 1.2000 V | -40 to 100 °C | SmartFusion®2 | Metallic | 166MHz | 64KB | ARM® Cortex®-M3 | - | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1 | FPGA - 10K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU3EG-1SFVA625E | AMD | Datasheet | 44 | - | Min: 1 Mult: 1 | 625-BFBGA, FCBGA | 625-FCBGA (21x21) | XCZU3 | 154,350 | Johnson Controls | VH7281GS+8122G | 180 | 0.892 V | AMD | 0.808 V | 180 | Tray | Active | FCBGA | 0.8500 V | 0 to 100 °C | Zynq® UltraScale+™ MPSoC EG | 625 | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Extended Industrial | 1 | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | 141,120 | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU2CG-L1SFVA625I | AMD | Datasheet | 1768 | - | Min: 1 Mult: 1 | 625-BFBGA, FCBGA | 625-FCBGA (21x21) | XCZU2 | Cutler Hammer, Div of Eaton Corp | DH363FGKV | 0.742, 0.892 V | AMD | 0.698, 0.808 V | 180 | Tray | Active | 0.72, 0.85 V | -40 to 100 °C | Zynq® UltraScale+™ MPSoC CG | 625 | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 1L | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU11EG-2FFVC1760I | AMD | Datasheet | 700 |
| Min: 1 Mult: 1 | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | XCZU11 | Miscellaneous | AMD | 512 | Tray | Active | 0.8500 V | -40 to 100 °C | Zynq® UltraScale+™ MPSoC EG | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 2 | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU19EG-L2FFVB1517E | AMD | Datasheet | 760 | - | Min: 1 Mult: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | XCZU19 | Greenlee | 0254-51 | AMD | 644 | Tray | Active | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU17EG-2FFVD1760E | AMD | Datasheet | 594 | - | Min: 1 Mult: 1 | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | XCZU17 | No Display | Johnson Controls | TE-6100-11 | AMD | 308 | Tray | Active | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | Indoor | 1 kOhm Nickel RTD | Temperature | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 926K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S025T-1VFG256I | Microchip | Datasheet | 39 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 256-LBGA | 256-FPBGA (17x17) | M2S025 | 64 kB | - | - | 166 MHz | Microchip Technology | SMD/SMT | 138 | 27696 LE | Tray | Active | Compliant | 1.2000 V | -40 to 100 °C | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1 | FPGA - 25K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F060M3E-TQG144I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | YES | 144 | 80 MHz | MICROSEMI CORP | Microsemi Corporation | A2F060M3E-TQG144I | 3 | PLASTIC/EPOXY | LFQFP | LFQFP, QFP144,.87SQ,20 | QFP144,.87SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Obsolete | 30 | 8.63 | Yes | 1.575 V | 1.425 V | 1.5 V | e3 | PURE MATTE TIN (394) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | QUAD | GULL WING | 250 | 0.5 mm | compliant | S-PQFP-G144 | 33 | Not Qualified | 1.5,1.8,2.5,3.3 V | 33 | 1536 CLBS, 60000 GATES | 1.6 mm | FIELD PROGRAMMABLE GATE ARRAY | 1536 | 1536 | 60000 | 20 mm | 20 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S005-TQG144 | Microchip | Datasheet | 300 | - | Min: 1 Mult: 1 | 144-LQFP | 144-TQFP (20x20) | M2S005 | Microchip Technology / Atmel | 64 kB | 191 kbit | 60 | - | - | Microchip | 166 MHz | + 85 C | Microchip Technology | 0 C | Yes | SMD/SMT | 84 | 505 LAB | 6060 LE | Tray | Active | Details | 0.035380 oz | 0°C ~ 85°C (TJ) | Tray | SmartFusion®2 | SOC - Systems on a Chip | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | - | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | SoC FPGA | FPGA - 5K Logic Modules | 1 Core | 128KB | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F060M3E-CSG288 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | YES | 288 | MICROSEMI CORP | Microsemi Corporation | A2F060M3E-CSG288 | 85 °C | PLASTIC/EPOXY | TFBGA | TFBGA, | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Obsolete | 8.46 | 1.575 V | 1.425 V | 1.5 V | 8542.39.00.01 | CMOS | BOTTOM | BALL | 0.5 mm | compliant | S-PBGA-B288 | OTHER | 1536 CLBS, 60000 GATES | 1.05 mm | FIELD PROGRAMMABLE GATE ARRAY | 1536 | 60000 | 11 mm | 11 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F060M3E-1FGG256 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | YES | 256 | 100 MHz | MICROSEMI CORP | Microsemi Corporation | A2F060M3E-1FGG256 | 3 | 85 °C | PLASTIC/EPOXY | LBGA | LBGA, BGA256,16X16,40 | BGA256,16X16,40 | SQUARE | GRID ARRAY, LOW PROFILE | Obsolete | 30 | 5.8 | Yes | 1.575 V | 1.425 V | 1.5 V | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B256 | 66 | Not Qualified | 1.5,1.8,2.5,3.3 V | OTHER | 66 | 1536 CLBS, 60000 GATES | 1.7 mm | FIELD PROGRAMMABLE GATE ARRAY | 1536 | 1536 | 60000 | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S050T-FG484I | Microchip | Datasheet | 2048 | - | Min: 1 Mult: 1 | 484-BGA | 484-FPBGA (23x23) | M2S050 | 64 kB | - | - | 166 MHz | Microchip Technology | SMD/SMT | 267 | 56340 LE | Tray | Active | -40°C ~ 100°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | STD | FPGA - 50K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F060M3E-1CSG288I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | YES | 288 | 100 MHz | MICROSEMI CORP | Microsemi Corporation | A2F060M3E-1CSG288I | PLASTIC/EPOXY | TFBGA | TFBGA, BGA288,21X21,20 | BGA288,21X21,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Obsolete | 30 | 5.25 | Yes | 1.575 V | 1.425 V | 1.5 V | e1 | TIN SILVER COPPER | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 260 | 0.5 mm | compliant | S-PBGA-B288 | 68 | Not Qualified | 1.5,1.8,2.5,3.3 V | 68 | 1536 CLBS, 60000 GATES | 1.05 mm | FIELD PROGRAMMABLE GATE ARRAY | 1536 | 1536 | 60000 | 11 mm | 11 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060T-VFG400I | Microchip | Datasheet | 1859 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 400-LFBGA | 400-VFBGA (17x17) | M2S060 | 64 kB | - | - | 166 MHz | 1.26 V | Microchip Technology | 1.14 V | 207 | 56520 LE | Tray | Active | Non-Compliant | 1.2000 V | -40 to 100 °C | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | STD | FPGA - 60K Logic Modules | 1 Core | 256KB |
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M2S050T-FG896I
Microchip
Package:Embedded - System On Chip (SoC)
212.938777
-
A2F200M3F-CS288
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S005S-1TQG144T2
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
A2F200M3F-FG484I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU3CG-L2SFVA625E
AMD
Package:Embedded - System On Chip (SoC)
662.012504
-
XCZU11EG-3FFVC1156E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S010-1TQG144I
Microchip
Package:Embedded - System On Chip (SoC)
42.393072
-
XCZU3EG-1SFVA625E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU2CG-L1SFVA625I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU11EG-2FFVC1760I
AMD
Package:Embedded - System On Chip (SoC)
8,201.625748
-
XCZU19EG-L2FFVB1517E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU17EG-2FFVD1760E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S025T-1VFG256I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
A2F060M3E-TQG144I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S005-TQG144
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
A2F060M3E-CSG288
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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A2F060M3E-1FGG256
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S050T-FG484I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
A2F060M3E-1CSG288I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S060T-VFG400I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire