The category is 'Embedded - System On Chip (SoC)'
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- Package / Case
- Number of I/Os
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- Peripherals
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- RAM Size
- Moisture Sensitivity Level (MSL)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Mounting Type | Package / Case | Surface Mount | Supplier Device Package | Housing Material | Number of Terminals | Approvals | Base Product Number | Brand | Case Size | Case Style | Clock Frequency-Max | Connections | Data RAM Size | Display | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Supply Voltage | Mfr | Minimum Operating Supply Voltage | Moisture Sensitive | Moisture Sensitivity Levels | Mounting | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Number of Outlets | Operating Temperature-Max | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Range | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Schedule B | Shaft Type | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Timing Range | Typical Operating Supply Voltage | Unit Weight | Operating Temperature | Packaging | Series | JESD-609 Code | Pbfree Code | Termination | Type | Terminal Finish | Applications | Additional Feature | HTS Code | Subcategory | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Depth | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | Output | Pin Count | JESD-30 Code | Function | Number of Outputs | Qualification Status | Output Voltage | Output Type | Power Supplies | Temperature Grade | Memory Size | Speed | RAM Size | Core Processor | Peripherals | Program Memory Size | Connectivity | Architecture | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Product Type | Protocol | Max Frequency | Power - Output | Speed Grade | RF Family/Standard | Sensitivity | Data Rate (Max) | Primary Attributes | Serial Interfaces | Current - Receiving | Current - Transmitting | Number of CLBs | Number of Logic Cells | Modulation | Number of Cores | Number of Equivalent Gates | Flash Size | Mode of Operation | Nominal Input Voltage (AC) | Input Voltage | Product Category | Contacts | Bearings | IP Rating | Mating Connector | Length | Width | Lead Free |
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 | Mfr Part No M2S025-VFG400I | Microchip | Datasheet | 1925 | - | Min: 1 Mult: 1 | VFPBGA-400 | 400-VFBGA (17x17) | M2S025 | Microchip Technology / Atmel | 64 kB | 90 | - | - | Microchip | 166 MHz | Microchip Technology | Yes | SMD/SMT | 207 | 2308 LAB | 27696 LE | Tray | Active | Details | 0.227784 oz | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | SOC - Systems on a Chip | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | SoC FPGA | STD | FPGA - 25K Logic Modules | 1 Core | 256KB | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F060M3E-CS288I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | YES | 288 | 80 MHz | MICROSEMI CORP | Microsemi Corporation | A2F060M3E-CS288I | PLASTIC/EPOXY | TFBGA | 11 X 11 MM, 1.05 MM HEIGHT, 0.50 MM PITCH, BGA-288 | BGA288,21X21,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Obsolete | 20 | 5.84 | No | 1.575 V | 1.425 V | 1.5 V | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 235 | 0.5 mm | compliant | S-PBGA-B288 | 68 | Not Qualified | 1.5,1.8,2.5,3.3 V | 68 | 1536 CLBS, 60000 GATES | 1.05 mm | FIELD PROGRAMMABLE GATE ARRAY | 1536 | 1536 | 60000 | 11 mm | 11 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F060M3E-1FG256 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | YES | 256 | 100 MHz | MICROSEMI CORP | Microsemi Corporation | A2F060M3E-1FG256 | 3 | 85 °C | PLASTIC/EPOXY | LBGA | 1 MM PITCH, FBGA-256 | BGA256,16X16,40 | SQUARE | GRID ARRAY, LOW PROFILE | Obsolete | 20 | 5.84 | No | 1.575 V | 1.425 V | 1.5 V | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 225 | 1 mm | unknown | S-PBGA-B256 | 66 | Not Qualified | 1.5,1.8,2.5,3.3 V | OTHER | 66 | 1536 CLBS, 60000 GATES | 1.7 mm | FIELD PROGRAMMABLE GATE ARRAY | 1536 | 1536 | 60000 | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S025TS-FG484I | Microchip | Datasheet | 2379 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 484-BGA | 484-FPBGA (23x23) | M2S025 | 64 kB | - | - | 166 MHz | Microchip Technology | SMD/SMT | 267 | 27696 LE | Tray | Active | Non-Compliant | -40°C ~ 100°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 25K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No BCM6750A2KFEBG | Broadcom | Datasheet | 52 |
| Min: 1 Mult: 1 | - | - | - | Broadcom / Avago | 420 | Broadcom Limited | Broadcom Limited | Tray | Active | Details | - | - | TxRx Only | Wireless & RF Modules | - | 6GHz | - | WiFi Modules | 802.11a/b/g/-x | - | WiFi | - | - | I²S, SPI, PCI, UART, USB | - | - | 1024QAM | WiFi Modules - 802.11 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060T-VF400I | Microchip | Datasheet | 2032 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 400-LFBGA | YES | 400-VFBGA (17x17) | 400 | M2S060 | 64 kB | MICROSEMI CORP | - | - | Microsemi Corporation | M2S060T-VF400I | 166 MHz | Microchip Technology | 207 | 56520 LE | Tray | PLASTIC/EPOXY | LFBGA | VFBGA-400 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 30 | 5.88 | Non-Compliant | No | 1.26 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | SmartFusion®2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 240 | 0.8 mm | not_compliant | S-PBGA-B400 | 207 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 207 | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 60K Logic Modules | 56520 | 1 Core | 256KB | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S150T-FCV484I | Microchip | Datasheet | 1744 |
| Min: 1 Mult: 1 | 484-BFBGA | YES | 484-FBGA (19x19) | 484 | M2S150 | 64 kB | MICROSEMI CORP | - | - | Microsemi Corporation | M2S150T-FCV484I | 166 MHz | Microchip Technology | 273 | 146124 LE | Tray | PLASTIC/EPOXY | FBGA | VFBGA-484 | BGA484,22X22,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | Active | 30 | 5.81 | No | 1.26 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | SmartFusion®2 | e0 | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 240 | 0.8 mm | not_compliant | S-PBGA-B484 | 273 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 273 | 3.15 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 150K Logic Modules | 146124 | 1 Core | 512KB | 19 mm | 19 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU4CG-1FBVB900I | AMD | Datasheet | 779 |
| Min: 1 Mult: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | XCZU4 | Cutler Hammer, Div of Eaton Co | XTAE080FS1TD5E100 | 0.892 V | AMD | 0.808 V | 204 | Tray | Active | 0.8500 V | -40 to 100 °C | Zynq® UltraScale+™ MPSoC CG | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 1 | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S025-1FG484I | Microchip | Datasheet | 1681 | - | Min: 1 Mult: 1 | 484-BGA | 484-FPBGA (23x23) | M2S025 | 64 kB | - | - | Clarostat-Honeywell | 73JA500 | 166 MHz | 1.26 V | Microchip Technology | 1.14 V | SMD/SMT | 267 | 27696 LE | Tray | Active | 1.2000 V | -40 to 100 °C | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1 | FPGA - 25K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060T-FCSG325I | Microchip | Datasheet | 1752 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | DIN Rail,Surface | 325-TFBGA, FCBGA | YES | 325-FCBGA (11x11) | 325 | CSA, UL | M2S060 | MICROSEMI CORP | Syrelec, Brand of Crouzet Control | SHS1S24A | 1.26 V | Microchip Technology | 1.14 V | 3 | 200 | Tray | PLASTIC/EPOXY | TFBGA | FBGA-325 | BGA325,21X21,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | 2.36 | No | Yes | 8542390000 | 1.26 V | 1.14 V | 1.2 V | 1 | 1.2000 V | -40 to 100 °C | SmartFusion®2 | e1 | 0.250 in Flat Blade | Tin/Silver/Copper (Sn/Ag/Cu) | LG-MIN, WD-MIN | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 250 | 0.5 mm | compliant | 40 | S-PBGA-B325 | 200 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 200 | 1.01 mm | FIELD PROGRAMMABLE GATE ARRAY | STD | FPGA - 60K Logic Modules | 56520 | 256KB | Interval | Solid State | IP66 | 11 mm | 11 mm | Lead Free | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S150-FCG1152 | Microchip | Datasheet | 2374 | - | Min: 1 Mult: 1 | 1152-BBGA, FCBGA | 1152-FCBGA (35x35) | M2S150 | Danaher Controls | HS350100G134C | Microchip Technology | Hollowshaft | 574 | Tray | Active | Hollow | 1.2000 V | -40 to 70 Degrees C | SmartFusion®2 | 6 ft Cable | 5~26 VDC | Differential | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | STD | FPGA - 150K Logic Modules | 512KB | 5~26 VDC | Yes | IP67 | Not Included | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU17EG-2FFVC1760E | AMD | Datasheet | 559 | - | Min: 1 Mult: 1 | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | XCZU17 | Miscellaneous | AMD | 512 | Tray | Active | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 926K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU7EV-3FFVF1517E | AMD | Datasheet | 669 |
| Min: 1 Mult: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | XCZU7 | No Display | Siemens Building Technologies | QAA1011.AATU | 0.927 V | AMD | 0.873 V | 464 | Tray | Active | 0.9000 V | 0 to 100 °C | Zynq® UltraScale+™ MPSoC EV | Indoor | 1 kOhm Platinum RTD | Temperature | 600MHz, 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 3 | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S150T-FCS536I | Microchip | Datasheet | 1826 | - | Min: 1 Mult: 1 | 536-LFBGA, CSPBGA | YES | 536-CSPBGA (16x16) | 536 | M2S150 | 64 kB | MICROSEMI CORP | - | - | Microsemi Corporation | M2S150T-FCS536I | 166 MHz | 1.26 V | Microchip Technology | 1.14 V | 293 | 146124 LE | Tray | PLASTIC/EPOXY | BGA | FBGA-536 | BGA536,30X30,20 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.81 | No | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | -40 to 100 °C | SmartFusion®2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 240 | not_compliant | 536 | S-PBGA-B536 | 293 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 293 | FIELD PROGRAMMABLE GATE ARRAY | STD | FPGA - 150K Logic Modules | 146124 | 1 Core | 512KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060TS-1VFG400T2 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 400-LFBGA | 400-VFBGA (17x17) | M2S060 | MICROSEMI CORP | Miscellaneous | IRTR68 | Microchip Technology | 3 | 207 | Tray | , | Active | Active | 40 | 5.8 | Yes | -40°C ~ 125°C (TJ) | Automotive, AEC-Q100, SmartFusion®2 | e1 | Yes | Tin/Silver/Copper (Sn/Ag/Cu) | 250 | compliant | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FIELD PROGRAMMABLE GATE ARRAY | 1 | FPGA - 60K Logic Modules | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060TS-1FGG676T2 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 676-BGA | 676-FBGA (27x27) | M2S060 | Johnson Controls | VS027431B-SM1P3 | Microchip Technology | Panel | 387 | JHSN_DRIV_VSD-II | Active | -40°C ~ 125°C (TJ) | Automotive, AEC-Q100, SmartFusion®2 | 15.3125 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 320 Hz | 1 | FPGA - 60K Logic Modules | 256KB | 480 VAC | 9.40625 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S025TS-1VFG256T2 | Microchip | Datasheet | 2145 |
| Min: 1 Mult: 1 | 256-LBGA | 256-FPBGA (17x17) | M2S025 | No Display | Honeywell | C7772G1004/U | Microchip Technology | 138 | Tray | Active | 1.2000 V | 0 to 85 °C | Automotive, AEC-Q100, SmartFusion®2 | Indoor | 10 kOhm NTC | Temperature | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1 | FPGA - 25K Logic Modules | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S050T-VFG400 | Microchip | Datasheet | 1688 | - | Min: 1 Mult: 1 | 400-LFBGA | 400-VFBGA (17x17) | M2S050 | 2.5 | Lower Mount | 1/4 NPT | 64 kB | - | - | NOSHOK | 25-410-1500-psi/kg/cm2 | 166 MHz | Microchip Technology | SMD/SMT | 207 | 56340 LE | Tray | Active | 0-1,500 psi | 1.2000 V | 0 to 85 °C | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | STD | FPGA - 50K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU19EG-L1FFVC1760I | AMD | Datasheet | 532 |
| Min: 1 Mult: 1 | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | XCZU19 | Cutler Hammer, Div of Eaton Co | MUBADP330 | AMD | 512 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU11EG-L1FFVC1760I | AMD | Datasheet | 670 |
| Min: 1 Mult: 1 | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | Aluminum | XCZU11 | Grace Technologies | P-E5P1-M3RF0 | AMD | 512 | (2) GFCI | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells | - | IP65 |
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M2S025-VFG400I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
A2F060M3E-CS288I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
A2F060M3E-1FG256
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S025TS-FG484I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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BCM6750A2KFEBG
Broadcom
Package:Embedded - System On Chip (SoC)
25.547295
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M2S060T-VF400I
Microchip
Package:Embedded - System On Chip (SoC)
236.807876
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M2S150T-FCV484I
Microchip
Package:Embedded - System On Chip (SoC)
246.426339
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XCZU4CG-1FBVB900I
AMD
Package:Embedded - System On Chip (SoC)
1,705.907575
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M2S025-1FG484I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S060T-FCSG325I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S150-FCG1152
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU17EG-2FFVC1760E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU7EV-3FFVF1517E
AMD
Package:Embedded - System On Chip (SoC)
6,596.879758
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M2S150T-FCS536I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S060TS-1VFG400T2
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S060TS-1FGG676T2
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S025TS-1VFG256T2
Microchip
Package:Embedded - System On Chip (SoC)
207.875762
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M2S050T-VFG400
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU19EG-L1FFVC1760I
AMD
Package:Embedded - System On Chip (SoC)
7,961.845752
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XCZU11EG-L1FFVC1760I
AMD
Package:Embedded - System On Chip (SoC)
7,176.887193