The category is 'Embedded - System On Chip (SoC)'
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- Moisture Sensitivity Level (MSL)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Mounting Type | Package / Case | Surface Mount | Mounting Feature | Shell Material | Supplier Device Package | Dielectric Material | Number of Terminals | Base Product Number | Brand | Contact Finish Mating | Data RAM Size | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Instruction Set Architecture | JTAG Support | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Supply Voltage | Mfr | Minimum Operating Supply Voltage | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of CPU Cores | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part # Aliases | Part Life Cycle Code | Primary Material | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Unit Weight | Voltage Rated | Voltage Rating AC | Voltage Rating DC | Voltage, Rating | Operating Temperature | Packaging | Series | Size / Dimension | Tolerance | JESD-609 Code | Pbfree Code | Part Status | Termination | Temperature Coefficient | Connector Type | Type | Number of Positions | Terminal Finish | Color | Applications | Additional Feature | HTS Code | Capacitance | Fastening Type | Subcategory | Current Rating (Amps) | Technology | Voltage - Supply | Terminal Position | Orientation | Terminal Form | Shielding | Peak Reflow Temperature (Cel) | Ingress Protection | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | Frequency Stability | Output | Shell Finish | Pin Count | Shell Size - Insert | JESD-30 Code | Function | Base Resonator | Current - Supply (Max) | Number of Outputs | Qualification Status | Operating Supply Voltage | ESR (Equivalent Series Resistance) | Lead Spacing | Power Supplies | Temperature Grade | Interface | Load Capacitance | Speed | RAM Size | Operating Mode | Shell Size, MIL | Lead Style | Core Processor | Frequency Tolerance | Peripherals | Program Memory Size | Spread Spectrum Bandwidth | Connectivity | Architecture | Data Bus Width | Number of Inputs | Seated Height-Max | Programmable Logic Type | Product Type | Screening Level | Speed Grade | Absolute Pull Range (APR) | Primary Attributes | Number of Logic Cells | Number of Cores | Flash Size | Features | Product Category | Device Core | Height Seated (Max) | Length | Width | Thickness (Max) | Contact Finish Thickness - Mating | Ratings |
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 | Mfr Part No M2S060-VF400 | Microchip | Datasheet | 2345 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Panel Mount | 400-LFBGA | Flange | Aluminum Alloy | 400-VFBGA (17x17) | CB2 | Silver | 64 kB | - | - | 166 MHz | ITT Cannon, LLC | 207 | 56520 LE | Bulk | Metal | Active | Non-Compliant | 50V | -55°C ~ 125°C | MIL-DTL-5015, CB | Crimp | Receptacle, Male Pins | 22 | Black | Reverse Bayonet Lock | 22A, 41A | N (Normal) | - | IP67 - Dust Tight, Waterproof | Black Zinc Cobalt | 28-11 | 166MHz | 64KB | - | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 60K Logic Modules | 1 Core | 256KB | - | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060-FG676I | Microchip | Datasheet | 2129 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 676-BGA | 676-FBGA (27x27) | M2S060 | 64 kB | - | - | 166 MHz | PEI-Genesis | 387 | 56520 LE | Bulk | Active | Non-Compliant | -40°C ~ 100°C (TJ) | * | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 60K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MPFS160T-FCVG484T2 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 484-BFBGA, FCBGA | 484-FCBGA (19x19) | Microchip Technology | MCU - 136, FPGA - 108 | Tray | Active | -40°C ~ 125°C (TJ) | - | - | 1.4125MB | RISC-V | DMA, PCI, PWM | CANbus, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 161K Logic Modules | 128KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S090TS-1FGG676I | Microchip | Datasheet | 1885 |
| Min: 1 Mult: 1 | 676-BGA | YES | 676-FBGA (27x27) | 676 | M2S090 | 64 kB | MICROSEMI CORP | - | - | Microsemi Corporation | M2S090TS-1FGG676I | 166 MHz | 1.26 V | Microchip Technology | 1.14 V | 3 | 425 | 86316 LE | Tray | PLASTIC/EPOXY | BGA | FBGA-676 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.3 | Yes | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | -40 to 100 °C | SmartFusion®2 | e1 | Yes | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B676 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 1 | FPGA - 90K Logic Modules | 1 Core | 512KB | 27 mm | 27 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5ASXMB5G4F40C4 | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 1517-BBGA, FCBGA | 1517-FBGA, FC (40x40) | Intel | MCU - 208, FPGA - 540 | Tray | Obsolete | 0°C ~ 85°C (TJ) | Arria V SX | 925MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 462K Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU43DR-1FSVG1517E | AMD | Datasheet | - | - | Min: 1 Mult: 1 | Through Hole | Radial - 4 Leads | 1517-FCBGA (40x40) | Polypropylene (PP), Metallized | Vishay Beyschlag/Draloric/BC Components | 561 | Tray | Active | - | 800V | -40°C ~ 85°C | MKP1848H DC-Link | 1.654 L x 1.181 W (42.00mm x 30.00mm) | ±5% | PC Pins | Automotive; DC Link, DC Filtering | 20 µF | 4.6 mOhms | 1.476 (37.50mm) | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | 85C/85% Humidity; Low ESR, Low ESL | 1.791 (45.50mm) | AEC-Q200 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S025TS-FGG484I | Microchip | Datasheet | 2349 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Free Hanging (In-Line) | 484-BGA | - | Aluminum Alloy | 484-FPBGA (23x23) | KPT06 | Gold | ITT Cannon, LLC | 267 | Bulk | Metal | Active | Non-Compliant | 1000VAC, 1400VDC | -55°C ~ 125°C | KPT | Solder Cup | Plug, Female Sockets | 21 | Olive Drab | Bayonet Lock | 13A | N (Normal) | - | Environment Resistant | Olive Drab Cadmium | 22-21 | 166MHz | 64KB | - | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 25K Logic Modules | 256KB | Potted | 50.0µin (1.27µm) | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU48DR-1FFVE1156E | AMD | Datasheet | 482 | - | Min: 1 Mult: 1 | Surface Mount | 4-SMD, No Lead | 1156-FCBGA (35x35) | RISC | Yes | SiTime | 6 | 366 | Strip | Active | -20°C ~ 70°C | SiT1602B | 0.197 L x 0.126 W (5.00mm x 3.20mm) | XO (Standard) | 1.8V | 74.176 MHz | ±20ppm | HCMOS, LVCMOS | 1156 | Enable/Disable | MEMS | 4.1mA | 0.85 V | JTAG | 500MHz, 1.2GHz | 38 Mb | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | - | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32 Bit | Extended | - | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | Arm Cortex A53/Arm Cortex R5 | 0.031 (0.80mm) | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S150T-FCSG536 | Microchip | Datasheet | 1740 | - | Min: 1 Mult: 1 | 536-LFBGA, CSPBGA | 536-CSPBGA (16x16) | M2S150 | 64 kB | - | - | 166 MHz | KYOCERA AVX | 293 | 146124 LE | Bulk | Active | 0°C ~ 85°C (TJ) | * | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 150K Logic Modules | 1 Core | 512KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S050TS-1FGG896I | Microchip | Datasheet | 1674 | - | Min: 1 Mult: 1 | Surface Mount | 4-SMD, No Lead | 896-FBGA (31x31) | M2S050 | 64 kB | - | - | 166 MHz | Suntsu Electronics, Inc. | SMD/SMT | 377 | 56340 LE | Bulk | Active | -40°C ~ 85°C | SXT224 | 0.098 L x 0.079 W (2.50mm x 2.00mm) | MHz Crystal | 12 MHz | ±15ppm | 120 Ohms | 10pF | 166MHz | 64KB | Fundamental | ARM® Cortex®-M3 | ±15ppm | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 50K Logic Modules | 1 Core | 256KB | 0.026 (0.65mm) | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S150T-1FCV484 | Microchip | Datasheet | 1641 | - | Min: 1 Mult: 1 | Surface Mount, MLCC | 1808 (4520 Metric) | 484-FBGA (19x19) | M2S150 | 64 kB | - | - | 166 MHz | Vishay Vitramon | 273 | 146124 LE | Tape & Reel (TR) | Obsolete | 1500V (1.5kV) | -55°C ~ 125°C | VJ OMD | 0.186 L x 0.080 W (4.72mm x 2.03mm) | ±5% | C0G, NP0 | Boardflex Sensitive | 12 pF | - | 166MHz | 64KB | - | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 150K Logic Modules | 1 Core | 512KB | Soft Termination, High Voltage | - | 0.086 (2.18mm) | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060-1FCSG325I | Microchip | Datasheet | 1992 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 325-TFBGA, FCBGA | YES | 325-FCBGA (11x11) | 325 | M2S060 | 64 kB | MICROSEMI CORP | - | - | Microsemi Corporation | M2S060-1FCSG325I | 166 MHz | KYOCERA AVX | 3 | 200 | 56520 LE | Bulk | PLASTIC/EPOXY | TFBGA | FBGA-325 | BGA325,21X21,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | 5.8 | Compliant | Yes | 1.26 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | * | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | LG-MIN, WD-MIN | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 250 | 0.5 mm | compliant | 40 | S-PBGA-B325 | 200 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 200 | 1.01 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 60K Logic Modules | 56520 | 1 Core | 256KB | 11 mm | 11 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFB014R24B1I1V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 3 | Intel | Intel | 768 | Tray | Active | Details | -40°C ~ 100°C (TJ) | Tray | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.4M Logic Elements | - | Intel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 1SX065HH3F35I3VG | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 1152-BBGA, FCBGA | 1152-FBGA (35x35) | Intel | 24 | Intel | Intel | 392 | Tray | Active | -40°C ~ 100°C (TJ) | Tray | Stratix® 10 SX | 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 650K Logic Elements | - | Intel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA012R24B2E2V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 3 | Intel | Intel | 768 | Tray | Active | Details | 0°C ~ 100°C (TJ) | Tray | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.2M Logic Elements | - | Intel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10AS032E4F29E3LG | ALTERA | Datasheet | 656 |
| Min: 1 Mult: 1 | FBGA-780 | YES | 780 | Intel / Altera | - | 1 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS032E4F29E3LG | 1.2 GHz | Yes | SMD/SMT | 360 | 40000 LAB | 320000 LE | 100 °C | PLASTIC/EPOXY | BGA | BGA, BGA780,28X28,40 | BGA780,28X28,40 | SQUARE | GRID ARRAY | 965057 | Active | NOT SPECIFIED | 5.45 | Details | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | 0°C ~ 100°C (TJ) | Tray | Arria 10 SX | Active | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B780 | 360 | Not Qualified | 0.9 V | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 360 | 3.35 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 320K Logic Elements | 320000 | 2 Core | -- | SoC FPGA | 29 mm | 29 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 1SX250LU3F50E2VG | ALTERA | Datasheet | 460 |
| Min: 1 Mult: 1 | 704 | 0°C ~ 100°C (TJ) | Tray | Stratix® 10 SX | Active | 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 2500K Logic Elements | -- | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10AS016C4U19I3LG | ALTERA | Datasheet | 622 |
| Min: 1 Mult: 1 | 484-BFBGA, FCBGA | YES | 484-UBGA (19x19) | 484 | Intel / Altera | - | 1 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS016C4U19I3LG | 1.2 GHz | Yes | SMD/SMT | 192 | 20000 LAB | 160000 LE | 100 °C | -40 °C | PLASTIC/EPOXY | FBGA | FBGA, BGA484,22X22,32 | BGA484,22X22,32 | SQUARE | GRID ARRAY, FINE PITCH | 964679 | Active | NOT SPECIFIED | 5.47 | Non-Compliant | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | 0.423288 oz | -40°C ~ 100°C (TJ) | Tray | Arria 10 SX | Active | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | NOT SPECIFIED | 0.8 mm | compliant | S-PBGA-B484 | 192 | Not Qualified | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 192 | 3.25 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 160K Logic Elements | 160000 | 2 Core | -- | SoC FPGA | 19 mm | 19 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10AS066H2F34I1SG | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | 1152-BBGA, FCBGA | 1152-FCBGA (35x35) | 492 | -40°C ~ 100°C (TJ) | Tray | Arria 10 SX | Discontinued at Digi-Key | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 660K Logic Elements | -- | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 1SX250LN3F43E3VG | ALTERA | Datasheet | 516 |
| Min: 1 Mult: 1 | 688 | 0°C ~ 100°C (TJ) | Tray | Stratix® 10 SX | Active | 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 2500K Logic Elements | -- |
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M2S060-VF400
Microchip
Package:Embedded - System On Chip (SoC)
180.827627
-
M2S060-FG676I
Microchip
Package:Embedded - System On Chip (SoC)
240.926577
-
MPFS160T-FCVG484T2
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S090TS-1FGG676I
Microchip
Package:Embedded - System On Chip (SoC)
472.079543
-
5ASXMB5G4F40C4
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU43DR-1FSVG1517E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S025TS-FGG484I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU48DR-1FFVE1156E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S150T-FCSG536
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S050TS-1FGG896I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S150T-1FCV484
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S060-1FCSG325I
Microchip
Package:Embedded - System On Chip (SoC)
188.663848
-
AGFB014R24B1I1V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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1SX065HH3F35I3VG
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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AGFA012R24B2E2V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
10AS032E4F29E3LG
ALTERA
Package:Embedded - System On Chip (SoC)
1,696.930851
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1SX250LU3F50E2VG
ALTERA
Package:Embedded - System On Chip (SoC)
15,549.849085
-
10AS016C4U19I3LG
ALTERA
Package:Embedded - System On Chip (SoC)
884.024102
-
10AS066H2F34I1SG
ALTERA
Package:Embedded - System On Chip (SoC)
Price: please inquire
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1SX250LN3F43E3VG
ALTERA
Package:Embedded - System On Chip (SoC)
10,758.108549