The category is 'Interface - Telecom'
Interface - Telecom (6000)
- All Manufacturers
- Moisture Sensitivity Level (MSL)
- Part Status
- RoHS Status
- Package / Case
- Mounting Type
- Packaging
- Factory Lead Time
- Number of Circuits
- Function
- Voltage - Supply
- Terminal Position
- Number of Terminations
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Surface Mount | Number of Terminals | Ihs Manufacturer | Moisture Sensitivity Levels | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Nom | JESD-609 Code | Pbfree Code | Terminal Finish | Applications | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Temperature Grade | Supply Current-Max | Data Rate | Seated Height-Max | Screening Level | Telecom IC Type | Number of Transceivers | Output Low Current-Max | Filter | Companding Law | Neg Supply Voltage-Nom | Standard | Gain Tolerance-Max | Linear Coding | ISDN Access Rate | Reference Point | Output High Voltage-Min | Output Low Voltage-Max | Length | Width |
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![]() | Mfr Part No TXC-05870AIBG | Transwitch Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 256 | TRANSWITCH CORP | 85 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Obsolete | BGA | 2.5 V | 8542.39.00.01 | BOTTOM | BALL | 1 | 1.27 mm | unknown | 256 | S-PBGA-B256 | Not Qualified | INDUSTRIAL | TELECOM CIRCUIT | 27 mm | 27 mm | ||||||||||||||||||||||||||
![]() | Mfr Part No TISP61060P | Bourns Inc | Datasheet | - | - | Min: 1 Mult: 1 | NO | 8 | BOURNS INC | 85 °C | -40 °C | PLASTIC/EPOXY | DIP | DIP, | RECTANGULAR | IN-LINE | Obsolete | DIP | No | 8542.39.00.01 | DUAL | THROUGH-HOLE | NOT SPECIFIED | 1 | 2.54 mm | compliant | NOT SPECIFIED | 8 | R-PDIP-T8 | Not Qualified | INDUSTRIAL | 5.08 mm | SURGE PROTECTION CIRCUIT | 9.5 mm | 7.62 mm | |||||||||||||||||||||||
![]() | Mfr Part No UPD72103LP | NEC Electronics Group | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MT8931BE | Zarlink Semiconductor Inc | Datasheet | - | - | Min: 1 Mult: 1 | NO | 28 | ZARLINK SEMICONDUCTOR INC | 85 °C | -40 °C | PLASTIC/EPOXY | DIP | DIP, DIP28,.6 | DIP28,.6 | RECTANGULAR | IN-LINE | Obsolete | No | 5 V | e0 | TIN LEAD | 8542.39.00.01 | DUAL | THROUGH-HOLE | 260 | 1 | 2.54 mm | unknown | R-PDIP-T28 | Not Qualified | INDUSTRIAL | 192 Mbps | 6.35 mm | DIGITAL SLIC | ANSI T1.605 | BASIC | S/T | 2.4 V | 0.4 V | 37.4 mm | 10.16 mm | ||||||||||||||||
![]() | Mfr Part No PMB2200T | Siemens | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No TXC-03103-AITQ | Transwitch Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 128 | TRANSWITCH CORP | PLASTIC/EPOXY | LFQFP | LFQFP, | RECTANGULAR | FLATPACK, LOW PROFILE, FINE PITCH | Obsolete | QFP | QUAD | GULL WING | 0.5 mm | unknown | 128 | R-PQFP-G128 | Not Qualified | 1.6 mm | FRAMER | 20 mm | 14 mm | |||||||||||||||||||||||||||||||
![]() | Mfr Part No TJA1028T/3V3/10 | NXP Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | NXP SEMICONDUCTORS | 150 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP, | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | Active | SOIC | 12 V | 8542.39.00.01 | DUAL | GULL WING | 1 | 1.27 mm | unknown | 8 | R-PDSO-G8 | Not Qualified | 1.75 mm | AEC-Q100 | LIN TRANSCEIVER | 1 | 4.9 mm | 3.9 mm | |||||||||||||||||||||||
![]() | Mfr Part No T5744-TKS | Microchip Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 20 | MICROCHIP TECHNOLOGY INC | 105 °C | -40 °C | PLASTIC/EPOXY | LSSOP | SSO-20 | SSOP20,.25 | RECTANGULAR | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | Obsolete | No | 5 V | e0 | TIN LEAD | 8542.39.00.01 | DUAL | GULL WING | 1 | 0.65 mm | unknown | R-PDSO-G20 | Not Qualified | INDUSTRIAL | 0.0087 mA | 1.45 mm | TELECOM CIRCUIT | 6.625 mm | 4.4 mm | ||||||||||||||||||||||
![]() | Mfr Part No M21215-13P | Mindspeed Technologies Inc | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No TM266HCA | Pulse Electronics Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 16 | PULSE ELECTRONICS CORP | 125 °C | -55 °C | PLASTIC/EPOXY | SOP | SOP, SOP16,.4 | SOP16,.4 | RECTANGULAR | SMALL OUTLINE | Active | No | 5 V | 8542.39.00.01 | DUAL | GULL WING | 1.27 mm | compliant | R-PDSO-G16 | Not Qualified | MILITARY | ATM/SONET/SDH TRANSCEIVER | |||||||||||||||||||||||||||||
![]() | Mfr Part No TM266HCB2 | Pulse Electronics Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 16 | PULSE ELECTRONICS CORP | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP, SOP16,.4 | SOP16,.4 | RECTANGULAR | SMALL OUTLINE | Active | No | 3.3 V | 8542.39.00.01 | DUAL | GULL WING | 1.27 mm | compliant | R-PDSO-G16 | Not Qualified | INDUSTRIAL | ATM/SONET/SDH TRANSCEIVER | |||||||||||||||||||||||||||||
![]() | Mfr Part No PEB2084 | Infineon Technologies AG | Datasheet | - | - | Min: 1 Mult: 1 | YES | 44 | INFINEON TECHNOLOGIES AG | 70 °C | PLASTIC/EPOXY | QFP | QFP44,.5SQ,32 | SQUARE | FLATPACK | Obsolete | No | 5 V | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | QUAD | GULL WING | 0.8 mm | not_compliant | S-PQFP-G44 | Not Qualified | COMMERCIAL | 192 Mbps | 0.007 A | ANSI T1.605 | BASIC | S/T | 2.4 V | 0.45 V | |||||||||||||||||||||||
![]() | Mfr Part No MSM6999RS | LAPIS Semiconductor Co Ltd | Datasheet | - | - | Min: 1 Mult: 1 | NO | 16 | LAPIS SEMICONDUCTOR CO LTD | 70 °C | PLASTIC/EPOXY | DIP | DIP, DIP16,.3 | DIP16,.3 | RECTANGULAR | IN-LINE | Obsolete | 5 V | 8542.39.00.01 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | R-PDIP-T16 | Not Qualified | COMMERCIAL | 14 mA | PCM CODEC | YES | MU-LAW | -5 V | 0.8 dB | NOT AVAILABLE | ||||||||||||||||||||||||
![]() | Mfr Part No PEB4264 | Lantiq | Datasheet | - | - | Min: 1 Mult: 1 | YES | 20 | LANTIQ | 70 °C | PLASTIC/EPOXY | SOP | SOP, | RECTANGULAR | SMALL OUTLINE | Transferred | SOIC | No | 5 V | e0 | No | TIN LEAD | 8542.39.00.01 | DUAL | GULL WING | 1 | 1.27 mm | unknown | 20 | R-PDSO-G20 | Not Qualified | COMMERCIAL | 3.7 mm | SLIC | 15.9 mm | 11 mm | ||||||||||||||||||||||
![]() | Mfr Part No PEB4264 | Intel Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 20 | INTEL CORP | 70 °C | PLASTIC/EPOXY | SOP | SOP, | RECTANGULAR | SMALL OUTLINE | Contact Manufacturer | No | 5 V | e0 | TIN LEAD | 8542.39.00.01 | DUAL | GULL WING | 1 | 1.27 mm | compliant | R-PDSO-G20 | Not Qualified | COMMERCIAL | 3.7 mm | SLIC | 15.9 mm | 11 mm | |||||||||||||||||||||||||
![]() | Mfr Part No RFFM6403 | RF Micro Devices Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 28 | RF MICRO DEVICES INC | 3 | 85 °C | -40 °C | UNSPECIFIED | HLGA | HLGA, LCC28,.24SQ,28 | LCC28,.24SQ,28 | SQUARE | GRID ARRAY, HEAT SINK/SLUG | Transferred | Yes | 3.6 V | 8542.39.00.01 | BOTTOM | BUTT | 1 | 0.7 mm | unknown | S-XBGA-B28 | Not Qualified | INDUSTRIAL | 1.5 mA | 1.05 mm | TELECOM CIRCUIT | 6 mm | 6 mm | |||||||||||||||||||||||
![]() | Mfr Part No PMB2240 | Infineon Technologies AG | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | INFINEON TECHNOLOGIES AG | 85 °C | -30 °C | PLASTIC/EPOXY | TFQFP | TFQFP, | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | Obsolete | QFP | 8542.39.00.01 | QUAD | GULL WING | 1 | 0.5 mm | unknown | 48 | S-PQFP-G48 | Not Qualified | OTHER | 1.1 mm | RF AND BASEBAND CIRCUIT | 7 mm | 7 mm | ||||||||||||||||||||||||||
![]() | Mfr Part No PMB2240 | Siemens | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | SIEMENS A G | 85 °C | -30 °C | PLASTIC/EPOXY | , | SQUARE | FLATPACK | Transferred | QFP | 8542.39.00.01 | QUAD | GULL WING | 1 | unknown | 48 | S-PQFP-G48 | Not Qualified | OTHER | RF AND BASEBAND CIRCUIT | |||||||||||||||||||||||||||||||
![]() | Mfr Part No SY88823VKG | Micrel Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 10 | MICREL INC | 1 | 85 °C | -40 °C | PLASTIC/EPOXY | HTSSOP | LEAD FREE, MSOP-10 | TSSOP10,.19,20 | SQUARE | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | Transferred | Yes | 3.3 V | e4 | Nickel/Palladium/Gold (Ni/Pd/Au) | SDH; SONET | DUAL | GULL WING | 260 | 1 | 0.5 mm | compliant | 40 | S-PDSO-G10 | Not Qualified | INDUSTRIAL | 0.065 mA | 1.1 mm | ATM/SONET/SDH SUPPORT CIRCUIT | 3 mm | 3 mm | |||||||||||||||||||
![]() | Mfr Part No SY88823VKG | Microchip Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 10 | MICROCHIP TECHNOLOGY INC | 3 | 85 °C | -40 °C | PLASTIC/EPOXY | HTSSOP | LEAD FREE, MSOP-10 | SQUARE | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | Active | Yes | 3.3 V | e4 | NICKEL PALLADIUM GOLD | 8542.39.00.01 | DUAL | GULL WING | 1 | 0.5 mm | compliant | S-PDSO-G10 | Not Qualified | INDUSTRIAL | 1.1 mm | ATM/SONET/SDH SUPPORT CIRCUIT | 3 mm | 3 mm |
TXC-05870AIBG
Transwitch Corporation
Package:Interface - Telecom
Price: please inquire
TISP61060P
Bourns Inc
Package:Interface - Telecom
Price: please inquire
UPD72103LP
NEC Electronics Group
Package:Interface - Telecom
Price: please inquire
MT8931BE
Zarlink Semiconductor Inc
Package:Interface - Telecom
Price: please inquire
PMB2200T
Siemens
Package:Interface - Telecom
Price: please inquire
TXC-03103-AITQ
Transwitch Corporation
Package:Interface - Telecom
Price: please inquire
TJA1028T/3V3/10
NXP Semiconductors
Package:Interface - Telecom
Price: please inquire
T5744-TKS
Microchip Technology Inc
Package:Interface - Telecom
Price: please inquire
M21215-13P
Mindspeed Technologies Inc
Package:Interface - Telecom
Price: please inquire
TM266HCA
Pulse Electronics Corporation
Package:Interface - Telecom
Price: please inquire
TM266HCB2
Pulse Electronics Corporation
Package:Interface - Telecom
Price: please inquire
PEB2084
Infineon Technologies AG
Package:Interface - Telecom
Price: please inquire
MSM6999RS
LAPIS Semiconductor Co Ltd
Package:Interface - Telecom
Price: please inquire
PEB4264
Lantiq
Package:Interface - Telecom
Price: please inquire
PEB4264
Intel Corporation
Package:Interface - Telecom
Price: please inquire
RFFM6403
RF Micro Devices Inc
Package:Interface - Telecom
Price: please inquire
PMB2240
Infineon Technologies AG
Package:Interface - Telecom
Price: please inquire
PMB2240
Siemens
Package:Interface - Telecom
Price: please inquire
SY88823VKG
Micrel Inc
Package:Interface - Telecom
Price: please inquire
SY88823VKG
Microchip Technology Inc
Package:Interface - Telecom
Price: please inquire
