The category is 'Interface - Telecom'
Interface - Telecom (6000)
- All Manufacturers
- Moisture Sensitivity Level (MSL)
- Part Status
- RoHS Status
- Package / Case
- Mounting Type
- Packaging
- Factory Lead Time
- Number of Circuits
- Function
- Voltage - Supply
- Terminal Position
- Number of Terminations
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Surface Mount | Number of Terminals | Ihs Manufacturer | Manufacturer Package Code | Moisture Sensitivity Levels | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Nom | JESD-609 Code | Pbfree Code | ECCN Code | Terminal Finish | Applications | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Power Supplies | Temperature Grade | Supply Current-Max | Data Rate | Seated Height-Max | Screening Level | Telecom IC Type | Number of Transceivers | Neg Supply Voltage-Nom | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No SI4743-C10-AM | Silicon Laboratories Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 24 | SILICON LABORATORIES INC | 85 °C | -40 °C | UNSPECIFIED | HVQCCN | 4 X 4 MM, 0.825 MM HEIGHT, ROHS COMPLIANT, MO-220VGGD-8, QFN-24 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Transferred | 3.3 V | 8542.39.00.01 | QUAD | NO LEAD | 1 | 0.5 mm | unknown | S-XQCC-N24 | INDUSTRIAL | 0.9 mm | AEC-Q100 | TELECOM CIRCUIT | 4 mm | 4 mm | |||||||||||||||||||||
 | Mfr Part No ICS1893BK | Integrated Device Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 56 | INTEGRATED DEVICE TECHNOLOGY INC | MLF | 3 | 70 °C | PLASTIC/EPOXY | HVQCCN | 8 X 8 MM, PLASTIC, M0-220VLLD-5, MLF2-56 | LCC56,.31SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Obsolete | DFN | No | 3.3 V | e0 | No | Tin/Lead (Sn85Pb15) | 8542.39.00.01 | QUAD | NO LEAD | 240 | 1 | 0.5 mm | not_compliant | 30 | 56 | S-PQCC-N56 | Not Qualified | COMMERCIAL | 0.16 mA | 100000 Mbps | 1 mm | INTERFACE CIRCUIT | 1 | 8 mm | 8 mm | ||||||||
| Mfr Part No SARA-U280-00S-01 | u-blox AG | Datasheet | - | - | Min: 1 Mult: 1 | YES | 96 | U-BLOX AG | 4 | 55 °C | -20 °C | UNSPECIFIED | BCC | PACKAGE-96 | RECTANGULAR | CHIP CARRIER | Obsolete | Yes | 3.8 V | ALSO HAVE EXTENDED OPERATING INPUT VOLTAGE FROM 3.10V TO 4.5V | 8542.39.00.01 | BOTTOM | BUTT | 1 | unknown | R-XBCC-B96 | COMMERCIAL | 3.25 mm | TELECOM CIRCUIT | 26 mm | 16 mm | ||||||||||||||||||||
| Mfr Part No INT5200 | Qualcomm | Datasheet | - | - | Min: 1 Mult: 1 | QUALCOMM INC | , | Contact Manufacturer | 8542.39.00.01 | unknown | |||||||||||||||||||||||||||||||||||||||||
| Mfr Part No SIW3500DIF1 | RF Micro Devices Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 94 | RF MICRO DEVICES INC | 85 °C | -40 °C | PLASTIC/EPOXY | VFBGA | VFBGA, | SQUARE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Obsolete | DIE | Yes | 1.8 V | e2 | TIN SILVER | 8542.39.00.01 | BOTTOM | BALL | 1 | compliant | 94 | S-PBGA-B94 | Not Qualified | INDUSTRIAL | 0.415 mm | TELECOM CIRCUIT | 3.7 mm | 3.7 mm | |||||||||||||||||
| Mfr Part No SC14428F4M80VDN | Sitel Semiconductor BV | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No ITCZDEE9P-OL2-146-AB | ITT Interconnect Solutions | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No S2021A | Applied Micro Circuits Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 225 | APPLIED MICRO CIRCUITS CORP | 70 °C | CERAMIC, METAL-SEALED COFIRED | BGA | BGA, HPGA224,18X18 | HPGA224,18X18 | SQUARE | GRID ARRAY | Obsolete | PGA | No | 5 V | e0 | TIN LEAD | 8542.39.00.01 | BOTTOM | BALL | 1 | 2.54 mm | unknown | 225 | S-CBGA-B225 | Not Qualified | COMMERCIAL | 429 mA | 10.4648 mm | TELECOM CIRCUIT | -5.2 V | 47.244 mm | 47.244 mm | ||||||||||||||
| Mfr Part No SC41344DW | Freescale Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 16 | MOTOROLA SEMICONDUCTOR PRODUCTS | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP, SOP16,.4 | SOP16,.4 | RECTANGULAR | SMALL OUTLINE | Obsolete | No | e0 | Tin/Lead (Sn/Pb) | DUAL | GULL WING | 1.27 mm | unknown | R-PDSO-G16 | Not Qualified | 2.8/10 V | INDUSTRIAL | TELECOMM CIRCUIT | ||||||||||||||||||||||
| Mfr Part No TLV32037I | Texas Instruments | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No TCP-3047H-DT | onsemi | Datasheet | - | - | Min: 1 Mult: 1 | YES | 12 | ON SEMICONDUCTOR | 567KE | 85 °C | -30 °C | PLASTIC/EPOXY | VFBGA | VFBGA, | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Obsolete | Yes | Yes | 8542.39.00.01 | BOTTOM | BALL | 1 | compliant | R-PBGA-B12 | OTHER | 0.611 mm | TELECOM CIRCUIT | 1.179 mm | 0.722 mm | |||||||||||||||||||||
| Mfr Part No MM1513 | Mitsumi Electric Co Ltd | Datasheet | - | - | Min: 1 Mult: 1 | YES | 6 | MITSUMI ELECTRIC CO LTD | PLASTIC/EPOXY | LSSOP | LSSOP, | RECTANGULAR | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | Contact Manufacturer | SOT | 8542.39.00.01 | DUAL | GULL WING | 1 | 0.95 mm | unknown | 6 | R-PDSO-G6 | Not Qualified | 1.4 mm | TELECOM CIRCUIT | 2.9 mm | 1.6 mm | |||||||||||||||||||||||
| Mfr Part No BCM43794B0IFFBG | Broadcom Limited | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No TXC-03108AIBG | Transwitch Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 256 | TRANSWITCH CORP | 85 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, BGA256,20X20,50 | BGA256,20X20,50 | SQUARE | GRID ARRAY | Obsolete | BGA | 3.3 V | 8542.39.00.01 | BOTTOM | BALL | 1 | 1.27 mm | unknown | 256 | S-PBGA-B256 | Not Qualified | INDUSTRIAL | 140 mA | 2.32 mm | FRAMER | 27 mm | 27 mm | |||||||||||||||||
| Mfr Part No PM-8005-0-72WLPSP-TR-02-0 | Qualcomm | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No TH72035KLD | Melexis Microelectronic Integrated Systems | Datasheet | - | - | Min: 1 Mult: 1 | YES | 10 | MELEXIS N V | 125 °C | -40 °C | PLASTIC/EPOXY | SON | SON, SOLCC10,.12,20 | SOLCC10,.12,20 | RECTANGULAR | SMALL OUTLINE | Obsolete | Yes | 3 V | e3 | Matte Tin (Sn) | 8542.39.00.01 | DUAL | NO LEAD | 0.5 mm | compliant | R-PDSO-N10 | Not Qualified | AUTOMOTIVE | 17.3 mA | |||||||||||||||||||||
| Mfr Part No PT7A4409LJ | Pericom Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 44 | PERICOM TECHNOLOGY INC | 85 °C | -40 °C | PLASTIC/EPOXY | QCCJ | QCCJ, LDCC44,.7SQ | LDCC44,.7SQ | SQUARE | CHIP CARRIER | Transferred | 3.3 V | 8542.39.00.01 | QUAD | J BEND | 1.27 mm | unknown | S-PQCC-J44 | Not Qualified | INDUSTRIAL | 40 mA | ||||||||||||||||||||||||
| Mfr Part No RFFM6401SR | RF Micro Devices Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 28 | RF MICRO DEVICES INC | 85 °C | -40 °C | UNSPECIFIED | HLGA | HLGA, | RECTANGULAR | GRID ARRAY, HEAT SINK/SLUG | Transferred | 3.6 V | 5A991.G | 8517.62.00.50 | BOTTOM | BUTT | 1 | unknown | R-XBGA-B28 | INDUSTRIAL | 1.25 mm | TELECOM CIRCUIT | 5.5 mm | 5 mm | ||||||||||||||||||||||
| Mfr Part No ACS8526 | Semtech Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 64 | SEMTECH CORP | 85 °C | -40 °C | PLASTIC/EPOXY | LFQFP | LFQFP, QFP64,.47SQ,20 | QFP64,.47SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Obsolete | QFP | No | 3.3 V | e0 | No | TIN LEAD | SDH; SONET | 8542.39.00.01 | QUAD | GULL WING | 1 | 0.5 mm | unknown | 64 | S-PQFP-G64 | Not Qualified | INDUSTRIAL | 1.6 mm | ATM/SONET/SDH SUPPORT CIRCUIT | 10 mm | 10 mm | |||||||||||||
| Mfr Part No MSM6955GS | LAPIS Semiconductor Co Ltd | Datasheet | - | - | Min: 1 Mult: 1 | YES | 44 | LAPIS SEMICONDUCTOR CO LTD | 70 °C | PLASTIC/EPOXY | QFF | QFF, QFL44,.37X.4,32 | QFL44,.37X.4,32 | RECTANGULAR | FLATPACK | Obsolete | No | 5 V | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | QUAD | FLAT | 0.8 mm | unknown | R-PQFP-F44 | Not Qualified | COMMERCIAL |
-
SI4743-C10-AM
Silicon Laboratories Inc
Package:Interface - Telecom
Price: please inquire
-
ICS1893BK
Integrated Device Technology Inc
Package:Interface - Telecom
Price: please inquire
-
SARA-U280-00S-01
u-blox AG
Package:Interface - Telecom
Price: please inquire
-
INT5200
Qualcomm
Package:Interface - Telecom
Price: please inquire
-
SIW3500DIF1
RF Micro Devices Inc
Package:Interface - Telecom
Price: please inquire
-
SC14428F4M80VDN
Sitel Semiconductor BV
Package:Interface - Telecom
Price: please inquire
-
ITCZDEE9P-OL2-146-AB
ITT Interconnect Solutions
Package:Interface - Telecom
Price: please inquire
-
S2021A
Applied Micro Circuits Corporation
Package:Interface - Telecom
Price: please inquire
-
SC41344DW
Freescale Semiconductor
Package:Interface - Telecom
Price: please inquire
-
TLV32037I
Texas Instruments
Package:Interface - Telecom
Price: please inquire
-
TCP-3047H-DT
onsemi
Package:Interface - Telecom
Price: please inquire
-
MM1513
Mitsumi Electric Co Ltd
Package:Interface - Telecom
Price: please inquire
-
BCM43794B0IFFBG
Broadcom Limited
Package:Interface - Telecom
Price: please inquire
-
TXC-03108AIBG
Transwitch Corporation
Package:Interface - Telecom
Price: please inquire
-
PM-8005-0-72WLPSP-TR-02-0
Qualcomm
Package:Interface - Telecom
Price: please inquire
-
TH72035KLD
Melexis Microelectronic Integrated Systems
Package:Interface - Telecom
Price: please inquire
-
PT7A4409LJ
Pericom Technology Inc
Package:Interface - Telecom
Price: please inquire
-
RFFM6401SR
RF Micro Devices Inc
Package:Interface - Telecom
Price: please inquire
-
ACS8526
Semtech Corporation
Package:Interface - Telecom
Price: please inquire
-
MSM6955GS
LAPIS Semiconductor Co Ltd
Package:Interface - Telecom
Price: please inquire