The category is 'Interface - Telecom'
Interface - Telecom (6000)
- All Manufacturers
- Moisture Sensitivity Level (MSL)
- Part Status
- RoHS Status
- Package / Case
- Mounting Type
- Packaging
- Factory Lead Time
- Number of Circuits
- Function
- Voltage - Supply
- Terminal Position
- Number of Terminations
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Surface Mount | Number of Terminals | Date Of Intro | Ihs Manufacturer | Moisture Sensitivity Levels | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Nom | JESD-609 Code | Pbfree Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Number of Functions | Terminal Pitch | Reach Compliance Code | Pin Count | JESD-30 Code | Qualification Status | Temperature Grade | Operating Mode | Supply Current-Max | Seated Height-Max | Telecom IC Type | Filter | Neg Supply Voltage-Nom | Make-break Ratio | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | Mfr Part No LXT380BE | Inphi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 160 | INPHI CORP | 85 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Transferred | 3.3 V | 8542.39.00.01 | BOTTOM | BALL | 1 | 1 mm | compliant | S-PBGA-B160 | Not Qualified | INDUSTRIAL | 1.8 mm | PCM TRANSCEIVER | 15 mm | 15 mm | ||||||||||||||||
![]() | Mfr Part No LXT380BE | Cortina Systems Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 160 | CORTINA SYSTEMS INC | 85 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Transferred | BGA | 3.3 V | 8542.39.00.01 | BOTTOM | BALL | 1 | 1 mm | compliant | 160 | S-PBGA-B160 | Not Qualified | INDUSTRIAL | 1.8 mm | PCM TRANSCEIVER | 15 mm | 15 mm | ||||||||||||||
![]() | Mfr Part No T5551-PAE | Atmel Corporation | Datasheet | - | - | Min: 1 Mult: 1 | NO | 2 | ATMEL CORP | 1 | 85 °C | -40 °C | PLASTIC/EPOXY | , MODULE,12LEAD,1.2 | MODULE,12LEAD,1.2 | RECTANGULAR | MICROELECTRONIC ASSEMBLY | Obsolete | No | No | 8542.39.00.01 | DUAL | UNSPECIFIED | 1 | compliant | R-PDMA-X2 | Not Qualified | INDUSTRIAL | TELECOM CIRCUIT | ||||||||||||||||||
![]() | Mfr Part No T5551-PAE | Temic Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | TEMIC SEMICONDUCTORS | 85 °C | -40 °C | Transferred | 1 | unknown | Not Qualified | INDUSTRIAL | TELECOM CIRCUIT | ||||||||||||||||||||||||||||||||
![]() | Mfr Part No TEA1083A | Philips Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | NO | 16 | PHILIPS SEMICONDUCTORS | 70 °C | -25 °C | PLASTIC/EPOXY | DIP | DIP, DIP16,.3 | DIP16,.3 | RECTANGULAR | IN-LINE | Transferred | No | 3.6 V | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-PDIP-T16 | Not Qualified | OTHER | 4 mA | ||||||||||||||||
![]() | Mfr Part No TEA1083A | NXP Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | NO | 16 | NXP SEMICONDUCTORS | 75 °C | -25 °C | PLASTIC/EPOXY | DIP | 0.300 INCH, PLASTIC, DIP-16 | DIP16,.3 | RECTANGULAR | IN-LINE | Obsolete | DIP | 3.6 V | 8542.39.00.01 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | compliant | 16 | R-PDIP-T16 | Not Qualified | COMMERCIAL EXTENDED | 0.004 mA | 4.7 mm | TELECOM CIRCUIT | 21.6 mm | 7.62 mm | ||||||||||||
![]() | Mfr Part No MDBT40-P256RV3 | Raytec Corporation | Datasheet | - | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No PEF24624E | Infineon Technologies AG | Datasheet | - | - | Min: 1 Mult: 1 | YES | 324 | INFINEON TECHNOLOGIES AG | 85 °C | -40 °C | PLASTIC/EPOXY | BGA | 19 X 19 MM, PLASTIC, LBGA-324 | SQUARE | GRID ARRAY | Obsolete | 1.8 V | 8542.39.00.01 | BOTTOM | BALL | 1 | unknown | S-PBGA-B324 | INDUSTRIAL | TELECOM CIRCUIT | |||||||||||||||||||||
![]() | Mfr Part No PEF24624E | Lantiq | Datasheet | - | - | Min: 1 Mult: 1 | YES | 324 | LANTIQ | 85 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Obsolete | 1.8 V | 8542.39.00.01 | BOTTOM | BALL | 1 | compliant | S-PBGA-B324 | INDUSTRIAL | TELECOM CIRCUIT | |||||||||||||||||||||
![]() | Mfr Part No R8075J | Conexant Systems Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 28 | CONEXANT SYSTEMS | 70 °C | PLASTIC/EPOXY | QCCJ | QCCJ, LDCC28,.5SQ | LDCC28,.5SQ | SQUARE | CHIP CARRIER | Transferred | No | 5 V | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | QUAD | J BEND | 1.27 mm | compliant | S-PQCC-J28 | Not Qualified | COMMERCIAL | ||||||||||||||||||
![]() | Mfr Part No ATA5746-PXPW | Atmel Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 24 | ATMEL CORP | 105 °C | -40 °C | UNSPECIFIED | HVQCCN | HVQCCN, LCC24,.2SQ,25 | LCC24,.2SQ,25 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Obsolete | QFN | Yes | 3 V | 8542.39.00.01 | QUAD | NO LEAD | 1 | 0.65 mm | compliant | 24 | S-XQCC-N24 | Not Qualified | INDUSTRIAL | 0.01 mA | 1 mm | TELECOM CIRCUIT | 5 mm | 5 mm | |||||||||||
![]() | Mfr Part No MH88634K | Zarlink Semiconductor Inc | Datasheet | - | - | Min: 1 Mult: 1 | NO | 21 | ZARLINK SEMICONDUCTOR INC | 70 °C | PLASTIC/EPOXY | SIP | SIP, SIP21,.13 | SIP21,.13 | RECTANGULAR | IN-LINE | Obsolete | No | 5 V | e0 | TIN LEAD | 8542.39.00.01 | SINGLE | THROUGH-HOLE | 1 | 2.54 mm | unknown | R-PSIP-T21 | Not Qualified | COMMERCIAL | 0.013 mA | 15.9 mm | SLIC | -5 V | |||||||||||||
![]() | Mfr Part No EF2A51A125E10B-T10 | Thin Film Technology Corp (TFT) | Datasheet | - | - | Min: 1 Mult: 1 | YES | 2 | THIN FILM TECHNOLOGY CORP | 85 °C | -40 °C | PLASTIC/EPOXY | VSON | VSON, | RECTANGULAR | SMALL OUTLINE, VERY THIN PROFILE | Obsolete | SOIC | e4 | GOLD OVER NICKEL | 8542.39.00.01 | DUAL | NO LEAD | 1 | unknown | 2 | R-PDSO-N2 | Not Qualified | INDUSTRIAL | 0.35 mm | LINE EQUALIZER | 1.52 mm | 0.76 mm | ||||||||||||||
![]() | Mfr Part No PCD3322CT | NXP Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | YES | 20 | NXP SEMICONDUCTORS | 70 °C | -25 °C | PLASTIC/EPOXY | SOP | SOP, | RECTANGULAR | SMALL OUTLINE | Obsolete | 3 V | SELECTABLE MAKE/BREAK RATIO 1:2 | 8542.39.00.01 | DUAL | GULL WING | 1 | 1.27 mm | unknown | R-PDSO-G20 | Not Qualified | OTHER | 0.4 mA | 2.65 mm | TELEPHONE DIALER CIRCUIT | 1:1.5 | 12.8 mm | 7.5 mm | |||||||||||||
![]() | Mfr Part No TXC-04226 | Transwitch Corporation | Datasheet | - | - | Min: 1 Mult: 1 | TRANSWITCH CORP | , | Obsolete | unknown | |||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No PEB2041P | Siemens | Datasheet | - | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XWM9705EFT/V | Cirrus Logic | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | CIRRUS LOGIC INC | 85 °C | -25 °C | PLASTIC/EPOXY | TFQFP | TFQFP, | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | Obsolete | 3.3 V | 8542.39.00.01 | QUAD | GULL WING | 1 | 0.5 mm | compliant | S-PQFP-G48 | OTHER | SYNCHRONOUS | 1.2 mm | PCM CODEC | YES | 7 mm | 7 mm | |||||||||||||||
![]() | Mfr Part No TMS3705DDRG4 | Texas Instruments | Datasheet | - | - | Min: 1 Mult: 1 | 2016-10-20 | TEXAS INSTRUMENTS INC | , | Obsolete | 8542.39.00.01 | unknown | TELECOM CIRCUIT | ||||||||||||||||||||||||||||||||||
![]() | Mfr Part No BCM2121 | Broadcom Limited | Datasheet | - | - | Min: 1 Mult: 1 | YES | 200 | BROADCOM CORP | 1 | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Obsolete | BGA | No | 1.8 V | 8542.39.00.01 | BOTTOM | BALL | 1 | compliant | 200 | S-PBGA-B200 | Not Qualified | TELECOM CIRCUIT | |||||||||||||||||||
![]() | Mfr Part No SI3019-F-KTR | Silicon Laboratories Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 20 | SILICON LABORATORIES INC | 70 °C | PLASTIC/EPOXY | TSSOP | TSSOP20,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | No | 3.3 V | 8542.39.00.01 | DUAL | GULL WING | 0.635 mm | unknown | R-PDSO-G20 | Not Qualified | COMMERCIAL | 10 mA |
LXT380BE
Inphi Corporation
Package:Interface - Telecom
Price: please inquire
LXT380BE
Cortina Systems Inc
Package:Interface - Telecom
Price: please inquire
T5551-PAE
Atmel Corporation
Package:Interface - Telecom
Price: please inquire
T5551-PAE
Temic Semiconductors
Package:Interface - Telecom
Price: please inquire
TEA1083A
Philips Semiconductors
Package:Interface - Telecom
Price: please inquire
TEA1083A
NXP Semiconductors
Package:Interface - Telecom
Price: please inquire
MDBT40-P256RV3
Raytec Corporation
Package:Interface - Telecom
Price: please inquire
PEF24624E
Infineon Technologies AG
Package:Interface - Telecom
Price: please inquire
PEF24624E
Lantiq
Package:Interface - Telecom
Price: please inquire
R8075J
Conexant Systems Inc
Package:Interface - Telecom
Price: please inquire
ATA5746-PXPW
Atmel Corporation
Package:Interface - Telecom
Price: please inquire
MH88634K
Zarlink Semiconductor Inc
Package:Interface - Telecom
Price: please inquire
EF2A51A125E10B-T10
Thin Film Technology Corp (TFT)
Package:Interface - Telecom
Price: please inquire
PCD3322CT
NXP Semiconductors
Package:Interface - Telecom
Price: please inquire
TXC-04226
Transwitch Corporation
Package:Interface - Telecom
Price: please inquire
PEB2041P
Siemens
Package:Interface - Telecom
Price: please inquire
XWM9705EFT/V
Cirrus Logic
Package:Interface - Telecom
Price: please inquire
TMS3705DDRG4
Texas Instruments
Package:Interface - Telecom
Price: please inquire
BCM2121
Broadcom Limited
Package:Interface - Telecom
Price: please inquire
SI3019-F-KTR
Silicon Laboratories Inc
Package:Interface - Telecom
Price: please inquire
