The category is 'Memory'
Memory (6000)
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- RoHS Status
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- Memory Interface
- Memory Size
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- Voltage - Supply
- Moisture Sensitivity Level (MSL)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Contact Plating | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Number of Terminals | Clock Frequency-Max (fCLK) | Ihs Manufacturer | Manufacturer | Manufacturer Part Number | Memory Types | Moisture Sensitivity Levels | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Reflow Temperature-Max (s) | Risk Rank | Rohs Code | Supply Voltage-Nom (Vsup) | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Subcategory | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Supply Voltage | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Interface | Memory Size | Number of Ports | Nominal Supply Current | Operating Mode | Clock Frequency | Supply Current-Max | Access Time | Memory Format | Memory Interface | Data Bus Width | Organization | Output Characteristics | Seated Height-Max | Memory Width | Write Cycle Time - Word, Page | Address Bus Width | Density | Standby Current-Max | Memory Density | Max Frequency | Screening Level | Access Time (Max) | Parallel/Serial | I/O Type | Sync/Async | Word Size | Memory IC Type | Programming Voltage | Serial Bus Type | Endurance | Write Cycle Time-Max (tWC) | Data Retention Time-Min | Write Protection | Standby Voltage-Min | Alternate Memory Width | Data Polling | Toggle Bit | Command User Interface | Number of Sectors/Size | Sector Size | Ready/Busy | Boot Block | Refresh Cycles | Common Flash Interface | I2C Control Byte | Reverse Pinout | Height | Height Seated (Max) | Length | Width | Radiation Hardening | REACH SVHC | RoHS Status | Lead Free |
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 | Mfr Part No W971GG6SB-25 | Winbond Electronics | Datasheet | 1799 | - | Min: 1 Mult: 1 | 10 Weeks | Surface Mount | Surface Mount | 84-TFBGA | 84 | Volatile | 0°C~85°C TC | Tray | 2011 | Active | 3 (168 Hours) | 84 | AUTO/SELF REFRESH | 1.7V~1.9V | BOTTOM | NOT SPECIFIED | 1 | 1.8V | 0.8mm | NOT SPECIFIED | 1.8V | 1.9V | 1.7V | 1Gb 64M x 16 | 1 | SYNCHRONOUS | 200MHz | 400ps | DRAM | Parallel | 16b | 64MX16 | 16 | 15ns | 13b | 8 Gb | 1.2mm | 12.5mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No AT21CS11-SSH10-B | Microchip Technology | Datasheet | 30 | - | Min: 1 Mult: 1 | 8 Weeks | Surface Mount | 8-SOIC (0.154, 3.90mm Width) | YES | Non-Volatile | -40°C~85°C TC | Tube | Active | 3 (168 Hours) | 8 | 2.7V~4.5V | DUAL | NOT SPECIFIED | 1 | 1.27mm | NOT SPECIFIED | AT21CS11 | R-PDSO-G8 | 4.5V | 2.7V | 1Kb 128 x 8 | SYNCHRONOUS | 125kHz | EEPROM | I2C, Single Wire | 128X8 | 8 | 5ms | 1024 bit | SERIAL | 1-WIRE | 5ms | 1.75mm | 4.9mm | 3.9mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No 25LC160C-I/MS | Microchip Technology | Datasheet | 8000 |
| Min: 1 Mult: 1 | 7 Weeks | Surface Mount | Surface Mount | 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2009 | e3 | yes | Active | 1 (Unlimited) | 8 | EAR99 | Matte Tin (Sn) - annealed | 2.5V~5.5V | DUAL | 260 | 1 | 5V | 0.65mm | 40 | 25LC160C | 8 | 5V | SPI, Serial | 16Kb 2K x 8 | 5mA | 10MHz | 100 ns | EEPROM | SPI | 8 | 5ms | 16 kb | 0.000001A | SPI | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE/SOFTWARE | 1.1mm | 3mm | 3mm | No | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No 24LC01B-I/STG | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | 0.4 MHz | MICROCHIP TECHNOLOGY INC | Microchip Technology Inc | 24LC01B-I/STG | 1 | 128 words | 128 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSSOP, TSSOP8,.25 | TSSOP8,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Active | SOIC | 40 | 5.17 | Yes | e3 | Yes | EAR99 | Matte Tin (Sn) | 8542.32.00.51 | EEPROMs | CMOS | DUAL | GULL WING | 260 | 1 | 0.65 mm | compliant | 8 | R-PDSO-G8 | Not Qualified | 5.5 V | 3/5 V | INDUSTRIAL | 2.5 V | SYNCHRONOUS | 0.003 mA | 128X8 | 1.2 mm | 8 | 0.000005 A | 1024 bit | SERIAL | EEPROM | I2C | 1000000 Write/Erase Cycles | 5 ms | 200 | HARDWARE | 1010XXXR | NO | 3 mm | 4.4 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No W949D6DBHX5E | Winbond Electronics | Datasheet | 8 |
| Min: 1 Mult: 1 | 10 Weeks | Surface Mount | 60-TFBGA | YES | Volatile | -25°C~85°C TC | Tray | 2016 | Active | 3 (168 Hours) | 60 | EAR99 | AUTO/SELF REFRESH | 1.7V~1.95V | BOTTOM | NOT SPECIFIED | 1 | 1.8V | 0.8mm | NOT SPECIFIED | R-PBGA-B60 | 1.95V | 1.7V | 512Mb 32M x 16 | 1 | SYNCHRONOUS | 200MHz | 5ns | DRAM | Parallel | 32MX16 | 16 | 15ns | 536870912 bit | 1.025mm | 9mm | 8mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No IS62WV25616EBLL-45TLI | ISSI, Integrated Silicon Solution Inc | Datasheet | - |
| Min: 1 Mult: 1 | 8 Weeks | Surface Mount | 44-TSOP (0.400, 10.16mm Width) | YES | 44 | Volatile | Industrial grade | -40°C~85°C TA | Tray | e3 | Active | 3 (168 Hours) | 44 | Matte Tin (Sn) | 8542.32.00.41 | 2.2V~3.6V | DUAL | 260 | 1 | 3V | 0.8mm | 10 | 3.6V | 2.2V | 4Mb 256K x 16 | SRAM | Parallel | 256KX16 | 16 | 45ns | 4194304 bit | 45 ns | 1.2mm | 18.41mm | 10.16mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No S29GL128N10TFI010 | Cypress Semiconductor Corp | Datasheet | 2 |
| Min: 1 Mult: 1 | 13 Weeks | Surface Mount | Surface Mount | 56-TFSOP (0.724, 18.40mm Width) | 56 | Non-Volatile | -40°C~85°C TA | Tray | GL-N | e3 | Active | 3 (168 Hours) | 56 | Matte Tin (Sn) | 8542.32.00.51 | 2.7V~3.6V | DUAL | 1 | 3V | 0.5mm | 3.6V | 2.7V | 128Mb 16M x 8 8M x 16 | 90mA | FLASH | Parallel | 8MX16 | 16 | 100ns | 128 Mb | 100 ns | Asynchronous | 3V | 8 | 1.2mm | 18.4mm | 14mm | No | RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No 93LC66CX-I/SN | Microchip Technology | Datasheet | 28 | - | Min: 1 Mult: 1 | 6 Weeks | Tin | Surface Mount | Surface Mount | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2003 | e3 | yes | Active | 1 (Unlimited) | 8 | EAR99 | 2.5V~5.5V | DUAL | 260 | 1 | 3V | 1.27mm | 40 | 93LC66C | 8 | 5.5V | 3/5V | 2.5V | Serial | 4Kb 512 x 8 256 x 16 | 2mA | 3MHz | 200 ns | EEPROM | SPI | 256X16 | 16 | 6ms | 4 kb | 0.000001A | MICROWIRE | 1000000 Write/Erase Cycles | 6ms | 200 | SOFTWARE | 8 | 1.75mm | 4.9mm | 3.9mm | No | ROHS3 Compliant | Lead Free | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No CY7C1021DV33-10VXIT | Cypress Semiconductor Corp | Datasheet | 8 |
| Min: 1 Mult: 1 | 7 Weeks | Surface Mount | Surface Mount | 44-BSOJ (0.400, 10.16mm Width) | 44 | Volatile | -40°C~85°C TA | Tape & Reel (TR) | 1996 | e4 | yes | Active | 3 (168 Hours) | 44 | Nickel/Palladium/Gold (Ni/Pd/Au) | 3V~3.6V | DUAL | 260 | 1 | 3.3V | 30 | CY7C1021 | 44 | 3.3V | 3.63V | 3V | 1Mb 64K x 16 | 1 | 60mA | SRAM | Parallel | 3-STATE | 16 | 10ns | 16b | 1 Mb | 0.003A | 100MHz | COMMON | Asynchronous | 16b | 2V | 3.7592mm | 28.575mm | No | ROHS3 Compliant | Lead Free | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 93LC46B-I/STG | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | 2 MHz | MICROCHIP TECHNOLOGY INC | Microchip Technology Inc | 93LC46B-I/STG | 1 | 64 words | 64 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSSOP, TSSOP8,.25 | TSSOP8,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Not Recommended | SOIC | 40 | 5.04 | Yes | 3 V | e3 | Yes | EAR99 | Matte Tin (Sn) | 8542.32.00.51 | EEPROMs | CMOS | DUAL | GULL WING | 260 | 1 | 0.65 mm | compliant | 8 | R-PDSO-G8 | Not Qualified | 5.5 V | 3/5 V | INDUSTRIAL | 2.5 V | SYNCHRONOUS | 0.002 mA | 64X16 | 1.2 mm | 16 | 0.000001 A | 1024 bit | SERIAL | EEPROM | MICROWIRE | 1000000 Write/Erase Cycles | 6 ms | 200 | SOFTWARE | 4.4 mm | 3 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No BR24G1MFJ-3AGTE2 | ROHM Semiconductor | Datasheet | 99976 | - | Min: 1 Mult: 1 | 10 Weeks | Tin | Surface Mount | Surface Mount | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | Industrial grade | -40°C~85°C TA | Tape & Reel (TR) | 1999 | Active | 1 (Unlimited) | 8 | SEATED HT-CALCULATED | 1.7V~5.5V | DUAL | NOT SPECIFIED | 1 | 1.27mm | NOT SPECIFIED | BR24G1M | 5.5V | 1.7V | 2-Wire, I2C, Serial | 1Mb 128K x 8 | SYNCHRONOUS | 1MHz | 450 ns | EEPROM | I2C | 8 | 5ms | 1 Mb | I2C | 5ms | 1.65mm | 4.9mm | 3.9mm | Unknown | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No W25Q64JVSFIQ | Winbond Electronics | Datasheet | 179 | - | Min: 1 Mult: 1 | 10 Weeks | Surface Mount | 16-SOIC (0.295, 7.50mm Width) | YES | Non-Volatile | -40°C~85°C TA | Tube | 2016 | SpiFlash® | Active | 3 (168 Hours) | 16 | 3A991.B.1.A | 8542.32.00.51 | 2.7V~3.6V | DUAL | NOT SPECIFIED | 1 | 3V | 1.27mm | NOT SPECIFIED | R-PDSO-G16 | 3.6V | 2.7V | SPI, Serial | 64Mb 8M x 8 | SYNCHRONOUS | 133MHz | FLASH | SPI - Quad I/O | 64MX1 | 1 | 3ms | 67108864 bit | 2.7V | 2.64mm | 10.31mm | 7.49mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No AT24CS08-STUM-T | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | 2 Weeks | Surface Mount | Surface Mount | SOT-23-5 Thin, TSOT-23-5 | 5 | Non-Volatile | -40°C~85°C TA | Cut Tape (CT) | 2005 | e3 | yes | Active | 1 (Unlimited) | 8 | Matte Tin (Sn) | 1.7V~5.5V | DUAL | 1 | 5V | AT24CS08 | R-PDSO-G8 | 1.7V | 2-Wire, I2C, Serial | 8Kb 1K x 8 | 3mA | 1MHz | 550ns | EEPROM | I2C | 1KX8 | 8 | 5ms | 8 kb | 0.000001A | I2C | 1000000 Write/Erase Cycles | 100 | HARDWARE | 1010DMMR | 1mm | 2.9mm | 1.6mm | No | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No IS42S32400F-7TL | ISSI, Integrated Silicon Solution Inc | Datasheet | - |
| Min: 1 Mult: 1 | 8 Weeks | Surface Mount | Surface Mount | 86-TFSOP (0.400, 10.16mm Width) | 86 | Volatile | Commercial grade | 0°C~70°C TA | Tray | e3 | Active | 3 (168 Hours) | 86 | EAR99 | Matte Tin (Sn) - annealed | AUTO/SELF REFRESH | 8542.32.00.02 | 3V~3.6V | DUAL | 1 | 3.3V | 0.5mm | 86 | 3.3V | 3.6V | 3V | 128Mb 4M x 32 | 1 | 100mA | 143MHz | 5.4ns | DRAM | Parallel | 32b | 4MX32 | 3-STATE | 14b | 128 Mb | 0.002A | COMMON | 4096 | 1.05mm | 22.42mm | 10.29mm | No | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No CY7C1565KV18-450BZXC | Cypress Semiconductor Corp | Datasheet | 62 |
| Min: 1 Mult: 1 | 13 Weeks | Surface Mount | Surface Mount | 165-LBGA | 165 | Volatile | 0°C~70°C TA | Tray | 2003 | e1 | Active | 3 (168 Hours) | 165 | Tin/Silver/Copper (Sn/Ag/Cu) | PIPELINED ARCHITECTURE | 1.7V~1.9V | BOTTOM | 260 | 1 | 1.8V | 1mm | 30 | CY7C1565 | 165 | 1.8V | 1.9V | 1.7V | 72Mb 2M x 36 | 2 | 1.1A | 450MHz | 450 ps | SRAM | Parallel | 3-STATE | 36 | 19b | 72 Mb | 0.34A | SEPARATE | Synchronous | 36b | 1.7V | 1.4mm | 15mm | No | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No CY62256VNLL-70SNXI | Cypress Semiconductor Corp | Datasheet | 4 |
| Min: 1 Mult: 1 | 15 Weeks | Surface Mount | Surface Mount | 28-SOIC (0.295, 7.50mm Width) | 28 | Volatile | -40°C~85°C TA | Tube | 2002 | MoBL® | e4 | yes | Obsolete | 3 (168 Hours) | 28 | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | 2.7V~3.6V | DUAL | 260 | 1 | 3V | 1MHz | 30 | CY62256 | 28 | 3V | 3.6V | 2.7V | 256Kb 32K x 8 | 1 | 30mA | SRAM | Parallel | 32KX8 | 3-STATE | 70ns | 15b | 256 kb | 0.000006A | 70 ns | COMMON | Asynchronous | 8b | 2.794mm | 18.03mm | 7.62mm | No | No SVHC | ROHS3 Compliant | Lead Free | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No M24C32-WBN6P | STMicroelectronics | Datasheet | - |
| Min: 1 Mult: 1 | Through Hole | Through Hole | 8-DIP (0.300, 7.62mm) | 8 | Non-Volatile | Automotive grade | -40°C~85°C TA | Tube | e3 | Obsolete | 1 (Unlimited) | 8 | Matte Tin (Sn) - annealed | 2.5V~5.5V | DUAL | 1 | 5V | 2.54mm | M24C32 | 8 | 5.5V | 3/5V | 2.5V | 2-Wire, I2C, Serial | 32Kb 4K x 8 | 5mA | 1MHz | 450ns | EEPROM | I2C | 5ms | 32 kb | 0.000002A | AEC-Q100 | I2C | 1000000 Write/Erase Cycles | 5ms | 40 | HARDWARE | 1010DDDR | 3.3mm | 9.27mm | 6.35mm | No | No SVHC | ROHS3 Compliant | Lead Free | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No SST39VF3202C-70-4I-B3KE | Microchip Technology | Datasheet | 431 | - | Min: 1 Mult: 1 | 7 Weeks | Surface Mount | Surface Mount | 48-TFBGA | 48 | Non-Volatile | -40°C~85°C TA | Tray | 2010 | SST39 MPF™ | e1 | yes | Active | 1 (Unlimited) | 48 | Tin/Silver/Copper (Sn/Ag/Cu) | TOP BOOT-BLOCK | 2.7V~3.6V | BOTTOM | 260 | 1 | 3V | 0.8mm | 40 | SST39VF3202C | 48 | 3.3V | 3.6V | 2.7V | 32Mb 2M x 16 | 15mA | 70ns | FLASH | Parallel | 16b | 2MX16 | 16 | 10μs | 21b | 32 Mb | 0.00005A | Asynchronous | 16b | 2.7V | YES | YES | YES | 863 | 4K32K | YES | TOP | YES | 1.2mm | 8mm | No | ROHS3 Compliant | Lead Free | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No SST39VF3201B-70-4C-B3KE | Microchip Technology | Datasheet | 14 |
| Min: 1 Mult: 1 | 7 Weeks | Surface Mount | 48-TFBGA | YES | 48 | Non-Volatile | 0°C~70°C TA | Tray | 2000 | SST39 MPF™ | e1 | yes | Active | 3 (168 Hours) | 48 | 3A991.B.1.A | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM BOOT BLOCK | 8542.32.00.51 | 2.7V~3.6V | BOTTOM | 260 | 1 | 3V | 0.8mm | 40 | SST39VF3201B | 48 | 3.3V | 3.6V | 2.7V | 32Mb 2M x 16 | 15mA | 70ns | FLASH | Parallel | 16b | 2MX16 | 16 | 10μs | 21b | 32 Mb | 0.00002A | Asynchronous | 16b | 2.7V | YES | YES | YES | 1K | 2K | BOTTOM | YES | 1.2mm | 8mm | No | ROHS3 Compliant | Lead Free | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 24LC21AT-I/SNG | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | 0.4 MHz | MICROCHIP TECHNOLOGY INC | Microchip Technology Inc | 24LC21AT-I/SNG | 1 | 128 words | 128 | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | 3.90 MM, ROHS COMPLIANT, PLASTIC, SOIC-8 | RECTANGULAR | SMALL OUTLINE | Active | SOIC | 40 | 5.19 | Yes | 3 V | e3 | Yes | EAR99 | Matte Tin (Sn) | 2-WIRE SERIAL INTERFACE | 8542.32.00.51 | CMOS | DUAL | GULL WING | 260 | 1 | 1.27 mm | compliant | 8 | R-PDSO-G8 | Not Qualified | 5.5 V | INDUSTRIAL | 2.5 V | SYNCHRONOUS | 128X8 | 1.75 mm | 8 | 1024 bit | SERIAL | EEPROM | I2C | 10 ms | 4.9 mm | 3.9 mm |
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W971GG6SB-25
Winbond Electronics
Package:Memory
Price: please inquire
-
AT21CS11-SSH10-B
Microchip Technology
Package:Memory
Price: please inquire
-
25LC160C-I/MS
Microchip Technology
Package:Memory
0.767649
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24LC01B-I/STG
Microchip
Package:Memory
Price: please inquire
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W949D6DBHX5E
Winbond Electronics
Package:Memory
4.112060
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IS62WV25616EBLL-45TLI
ISSI, Integrated Silicon Solution Inc
Package:Memory
4.800878
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S29GL128N10TFI010
Cypress Semiconductor Corp
Package:Memory
0.427725
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93LC66CX-I/SN
Microchip Technology
Package:Memory
Price: please inquire
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CY7C1021DV33-10VXIT
Cypress Semiconductor Corp
Package:Memory
3.753726
-
93LC46B-I/STG
Microchip
Package:Memory
Price: please inquire
-
BR24G1MFJ-3AGTE2
ROHM Semiconductor
Package:Memory
Price: please inquire
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W25Q64JVSFIQ
Winbond Electronics
Package:Memory
Price: please inquire
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AT24CS08-STUM-T
Microchip Technology
Package:Memory
Price: please inquire
-
IS42S32400F-7TL
ISSI, Integrated Silicon Solution Inc
Package:Memory
6.594890
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CY7C1565KV18-450BZXC
Cypress Semiconductor Corp
Package:Memory
27.961084
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CY62256VNLL-70SNXI
Cypress Semiconductor Corp
Package:Memory
0.181615
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M24C32-WBN6P
STMicroelectronics
Package:Memory
0.302526
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SST39VF3202C-70-4I-B3KE
Microchip Technology
Package:Memory
Price: please inquire
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SST39VF3201B-70-4C-B3KE
Microchip Technology
Package:Memory
0.560647
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24LC21AT-I/SNG
Microchip
Package:Memory
Price: please inquire