The category is 'Memory'
Memory (6000)
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Contact Plating | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Number of Terminals | Access Time-Max | Clock Frequency-Max (fCLK) | Ihs Manufacturer | Manufacturer | Manufacturer Part Number | Memory Types | Moisture Sensitivity Levels | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Supply Voltage-Nom (Vsup) | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Subcategory | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Supply Voltage | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Interface | Max Supply Voltage | Min Supply Voltage | Memory Size | Number of Ports | Nominal Supply Current | Operating Mode | Clock Frequency | Supply Current-Max | Access Time | Memory Format | Memory Interface | Data Bus Width | Organization | Output Characteristics | Seated Height-Max | Memory Width | Write Cycle Time - Word, Page | Address Bus Width | Density | Standby Current-Max | Memory Density | Max Frequency | Screening Level | Access Time (Max) | Parallel/Serial | I/O Type | Sync/Async | Word Size | Memory IC Type | Programming Voltage | Serial Bus Type | Endurance | Write Cycle Time-Max (tWC) | Data Retention Time-Min | Write Protection | Standby Voltage-Min | Alternate Memory Width | Data Polling | Toggle Bit | Command User Interface | Number of Sectors/Size | Sector Size | Page Size | Ready/Busy | Boot Block | Refresh Cycles | Common Flash Interface | I2C Control Byte | Sequential Burst Length | Interleaved Burst Length | Height | Height Seated (Max) | Length | Width | Radiation Hardening | REACH SVHC | RoHS Status | Lead Free |
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 | Mfr Part No BR25L320FJ-WE2 | ROHM Semiconductor | Datasheet | 1567 | - | Min: 1 Mult: 1 | 18 Weeks | Copper, Tin | Surface Mount | Surface Mount | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2010 | e2 | yes | Not For New Designs | 1 (Unlimited) | 8 | EAR99 | TIN COPPER | 1.8V~5.5V | DUAL | 260 | 1 | 2.5V | 1.27mm | 10 | BR25L320 | 8 | 5V | SPI, Serial | 32Kb 4K x 8 | 3mA | 5MHz | 70 ns | EEPROM | SPI | 8 | 5ms | 32 kb | 0.000002A | SPI | 1000000 Write/Erase Cycles | 5ms | 40 | HARDWARE/SOFTWARE | 1.65mm | 4.9mm | 3.9mm | No | ROHS3 Compliant | Lead Free | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No 24LC014T-E/MS | Microchip Technology | Datasheet | 37 | - | Min: 1 Mult: 1 | 13 Weeks | Tin | Surface Mount | Surface Mount | 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) | 8 | Non-Volatile | -40°C~125°C TA | Tape & Reel (TR) | 2008 | yes | Active | 1 (Unlimited) | 8 | 2.5V~5.5V | DUAL | 1 | 0.65mm | 24LC014 | 5V | I2C, Serial | 1Kb 128 x 8 | 3mA | 400kHz | 900ns | EEPROM | I2C | 8 | 5ms | 1 kb | 0.000001A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010DDDR | 1.1mm | 3mm | 3mm | No | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No 24AA02E64T-E/SN | Microchip Technology | Datasheet | 28 |
| Min: 1 Mult: 1 | 9 Weeks | Tin | Surface Mount | Surface Mount | 8-SOIC (0.154, 3.90mm Width) | Non-Volatile | Automotive grade | -40°C~125°C TA | Tape & Reel (TR) | 2009 | e3 | Active | 1 (Unlimited) | 8 | 100KHZ AVAILABLE @1.7V | 1.7V~5.5V | DUAL | 260 | 1 | 5V | 1.27mm | 40 | 24AA02E64 | R-PDSO-G8 | Not Qualified | 5.5V | 1.8/5V | 2.5V | 2-Wire, I2C, Serial | 2Kb 256 x 8 | SYNCHRONOUS | 400kHz | 900ns | EEPROM | I2C | 256X8 | 8 | 5ms | 0.000005A | 2048 bit | TS 16949 | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | 1010XXXR | 1.75mm | 4.9mm | 3.9mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No IS62WV1288BLL-55QLI | ISSI, Integrated Silicon Solution Inc | Datasheet | 4 |
| Min: 1 Mult: 1 | 8 Weeks | Surface Mount | Surface Mount | 32-SOIC (0.445, 11.30mm Width) | 32 | Volatile | Industrial grade | -40°C~85°C TA | Tube | e3 | yes | Active | 2 (1 Year) | 32 | EAR99 | Matte Tin (Sn) - annealed | 2.5V~3.6V | DUAL | 260 | 1 | 3V | 40 | 32 | 3.3V | 3.6V | 2.5V | 1Mb 128K x 8 | 1 | 8mA | SRAM | Parallel | 3-STATE | 8 | 55ns | 17b | 1 Mb | 0.000005A | 55 ns | COMMON | Asynchronous | 8b | 3mm | 20.445mm | No | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No BR24T16FVM-WTR | ROHM Semiconductor | Datasheet | 27 | - | Min: 1 Mult: 1 | 7 Weeks | Copper, Tin | Surface Mount | Surface Mount | 8-VSSOP, 8-MSOP (0.110, 2.80mm Width) | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2013 | e3 | yes | Active | 1 (Unlimited) | 8 | MATTE TIN | 1.6V~5.5V | DUAL | 225 | 1 | 2.5V | 0.65mm | NOT SPECIFIED | R-PDSO-G8 | Not Qualified | 5.5V | 1.8/5V | 1.6V | 2-Wire, I2C, Serial | 16Kb 2K x 8 | SYNCHRONOUS | 400kHz | 900 ns | EEPROM | I2C | 2KX8 | 8 | 5ms | 16 kb | 0.000002A | I2C | 1000000 Write/Erase Cycles | 5ms | 40 | HARDWARE | 1010MMMR | 0.9mm | 2.9mm | 2.8mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No CY62148ELL-55SXA | Cypress Semiconductor Corp | Datasheet | 8 |
| Min: 1 Mult: 1 | Surface Mount | Surface Mount | 32-SOIC (0.445, 11.30mm Width) | 32 | Volatile | -40°C~85°C TA | Tube | 2007 | MoBL® | e4 | yes | Obsolete | 3 (168 Hours) | 32 | Nickel/Palladium/Gold (Ni/Pd/Au) | 4.5V~5.5V | DUAL | 260 | 1 | 5V | 20 | CY62148 | 32 | 5V | 5V | 4Mb 512K x 8 | 1 | 20mA | SRAM | Parallel | 3-STATE | 8 | 55ns | 19b | 4 Mb | 0.000007A | 18MHz | 55 ns | COMMON | Asynchronous | 8b | 2V | 2.997mm | 20.4465mm | No | ROHS3 Compliant | Lead Free | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No IS61C64AL-10JLI | ISSI, Integrated Silicon Solution Inc | Datasheet | 8 |
| Min: 1 Mult: 1 | 8 Weeks | Surface Mount | 28-BSOJ (0.300, 7.62mm Width) | YES | 28 | Volatile | -40°C~85°C TA | Tray | e3 | yes | Active | 3 (168 Hours) | 28 | EAR99 | Matte Tin (Sn) - annealed | 4.75V~5.25V | DUAL | 260 | 1 | 5V | 40 | 28 | 5V | 5V | 64Kb 8K x 8 | 1 | 50mA | SRAM | Parallel | 8KX8 | 3-STATE | 10ns | 13b | 64 kb | COMMON | Asynchronous | 8b | 2V | 3.56mm | 7.62mm | No | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No S29GL01GS10DHI020 | Cypress Semiconductor Corp | Datasheet | 1024 |
| Min: 1 Mult: 1 | 16 Weeks | Copper, Silver, Tin | Surface Mount | Surface Mount | 64-LBGA | 64 | Non-Volatile | -40°C~85°C TA | Tray | 2012 | GL-S | Active | 3 (168 Hours) | 64 | 3A991.B.1.A | 8542.32.00.51 | 2.7V~3.6V | BOTTOM | 1 | 3V | 1mm | 3.6V | 3/3.3V | 2.7V | 1Gb 64M x 16 | 60mA | 100ns | FLASH | Parallel | 16b | 128MX8 | 8 | 60ns | 26b | 1 Gb | 0.0001A | Asynchronous | 16b | 3V | YES | YES | YES | 1K | 64K | 32B | YES | BOTTOM/TOP | YES | 1.4mm | 9mm | No | No SVHC | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No K4B1G1646G-BCH9 | Samsung | Datasheet | - | - | Min: 1 Mult: 1 | YES | 96 | 0.255 ns | 667 MHz | SAMSUNG SEMICONDUCTOR INC | Samsung Semiconductor | K4B1G1646G-BCH9 | 3 | 67108864 words | 64000000 | PLASTIC/EPOXY | FBGA | FBGA, BGA96,9X16,32 | BGA96,9X16,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | Obsolete | NOT SPECIFIED | 8.58 | Yes | 1.5 V | e1 | Yes | Tin/Silver/Copper (Sn/Ag/Cu) | DRAMs | CMOS | BOTTOM | BALL | 225 | 0.8 mm | compliant | R-PBGA-B96 | Not Qualified | 1.5 V | 0.17 mA | 64MX16 | 3-STATE | 16 | 0.01 A | 1073741824 bit | COMMON | DDR DRAM | 8192 | 4,8 | 4,8 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No BR25H020FVM-2CTR | ROHM Semiconductor | Datasheet | 69 |
| Min: 1 Mult: 1 | 16 Weeks | Surface Mount | 8-VSSOP, 8-MSOP (0.110, 2.80mm Width) | YES | 8 | Non-Volatile | Automotive grade | -40°C~125°C TA | Cut Tape (CT) | 2013 | Automotive, AEC-Q100 | Active | 1 (Unlimited) | 8 | ALSO OPERATES AT 2.5V WITH 5MHZ | 2.5V~5.5V | DUAL | NOT SPECIFIED | 1 | 5V | 0.65mm | NOT SPECIFIED | Not Qualified | 5.5V | 3/5V | 4.5V | 2Kb 256 x 8 | SYNCHRONOUS | 10MHz | EEPROM | SPI | 8 | 4ms | 0.00001A | SERIAL | SPI | 1000000 Write/Erase Cycles | 4ms | 100 | HARDWARE/SOFTWARE | 0.9mm | 2.9mm | Unknown | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 24LC08BH-I/MS | Microchip Technology | Datasheet | 5 | - | Min: 1 Mult: 1 | 5 Weeks | Tin | Surface Mount | Surface Mount | 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2007 | e3 | yes | Active | 1 (Unlimited) | 8 | EAR99 | 2.5V~5.5V | DUAL | 260 | 1 | 5V | 0.65mm | 40 | 24LC08BH | 8 | 5V | I2C, Serial | 8Kb 256 x 8 x 4 | 3mA | 400kHz | 900ns | EEPROM | I2C | 8 | 5ms | 8 kb | 0.000001A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010XMMR | 1.1mm | 3mm | 3mm | No | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No W29GL064CB7S | Winbond Electronics | Datasheet | 16000 | - | Min: 1 Mult: 1 | 14 Weeks | Tin | Surface Mount | Surface Mount | 48-TFSOP (0.724, 18.40mm Width) | 48 | Non-Volatile | -40°C~85°C TA | Tube | 2012 | Obsolete | 3 (168 Hours) | 48 | 3A991.B.1.A | BOTTOM BOOT BLOCK | 8542.32.00.51 | 2.7V~3.6V | DUAL | 1 | 3V | 0.5mm | 48 | 3.6V | 3/3.3V | 2.7V | 64Mb 8M x 8 4M x 16 | FLASH | Parallel | 64MX1 | 1 | 70ns | 22b | 64 Mb | 0.000005A | 70 ns | 3V | 8 | YES | YES | YES | 8127 | 8K64K | 8/16words | YES | BOTTOM | YES | 1.2mm | 18.4mm | No | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No SST39VF1602-70-4C-EKE-T | Microchip Technology | Datasheet | 1129 |
| Min: 1 Mult: 1 | 7 Weeks | Surface Mount | 48-TFSOP (0.724, 18.40mm Width) | YES | 48 | Non-Volatile | 0°C~70°C TA | Tape & Reel (TR) | 2011 | SST39 MPF™ | e3 | Active | 3 (168 Hours) | 48 | Matte Tin (Sn) - annealed | 2.7V~3.6V | DUAL | 0.5mm | SST39VF1602 | 3.3V | 16Mb 1M x 16 | 18mA | 70ns | FLASH | Parallel | 16b | 1MX16 | 16 | 10μs | 20b | 16 Mb | 0.00002A | Asynchronous | 16b | YES | YES | YES | 512 | 2K | TOP | YES | No | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No S29GL128P10FFI012 | Cypress Semiconductor Corp | Datasheet | 320 |
| Min: 1 Mult: 1 | 12 Weeks | Copper, Silver, Tin | Surface Mount | Surface Mount | 64-LBGA | 64 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2003 | GL-P | e1 | Active | 3 (168 Hours) | 64 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 8542.32.00.51 | 2.7V~3.6V | BOTTOM | 260 | 1 | 3V | 1mm | 40 | 3.6V | 3/3.3V | 2.7V | 128Mb 16M x 8 | 110mA | FLASH | Parallel | 128MX1 | 1 | 100ns | 128 Mb | 0.000005A | 100 ns | Asynchronous | 3V | 8 | YES | YES | YES | 128 | 128K | 8/16words | YES | YES | 1.4mm | 13mm | 11mm | No | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No S25FL208K0RMFI010 | Cypress Semiconductor Corp | Datasheet | 741 | - | Min: 1 Mult: 1 | Surface Mount | Surface Mount | 8-SOIC (0.209, 5.30mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tray | 2013 | FL2-K | Obsolete | 3 (168 Hours) | 8 | EAR99 | 2.7V~3.6V | DUAL | 1 | 3V | 1.27mm | 3.6V | 3/3.3V | 2.7V | SPI, Serial | 8Mb 1M x 8 | 25mA | 76MHz | 5 ns | FLASH | SPI | 8b | 8 | 5ms | 1b | 8 Mb | 0.000032A | Synchronous | 8b | 3V | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 256B | 2.159mm | No | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 24AA08T-I/MSG | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | 0.1 MHz | MICROCHIP TECHNOLOGY INC | Microchip Technology Inc | 24AA08T-I/MSG | 1 | 1024 words | 1000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | ROHS COMPLIANT, PLASTIC, MSOP-8 | TSSOP8,.19 | SQUARE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Active | MSOP | 40 | 5.26 | Compliant | Yes | 2.5 V | Tape & Reel (TR) | e3 | Yes | EAR99 | Matte Tin (Sn) | 85 °C | -40 °C | 8542.32.00.51 | EEPROMs | CMOS | DUAL | GULL WING | 260 | 1 | 0.65 mm | compliant | 400 kHz | 8 | S-PDSO-G8 | Not Qualified | 5.5 V | 2/5 V | INDUSTRIAL | 1.7 V | I2C | 5.5 V | 1.8 V | 1 kB | SYNCHRONOUS | 0.003 mA | 900 ns | 1KX8 | 1.1 mm | 8 | 0.000001 A | 8192 bit | 400 kHz | SERIAL | EEPROM | I2C | 1000000 Write/Erase Cycles | 5 ms | 200 | HARDWARE | 1010XMMR | 3 mm | 3 mm | Lead Free | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No 25C080-I/P | Microchip Technology | Datasheet | 241 | - | Min: 1 Mult: 1 | 7 Weeks | Through Hole | 8-DIP (0.300, 7.62mm) | NO | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2004 | e3 | yes | Active | 1 (Unlimited) | 8 | EAR99 | Matte Tin (Sn) | 4.5V~5.5V | DUAL | 1 | 5V | 2.54mm | 25C080 | 8 | 5V | 5V | SPI, Serial | 8Kb 1K x 8 | 5mA | 3MHz | 150 ns | EEPROM | SPI | 5ms | 8 kb | 0.000005A | SPI | 10000000 Write/Erase Cycles | 5ms | 200 | HARDWARE/SOFTWARE | 4.953mm | 10.16mm | 7.112mm | No | No SVHC | ROHS3 Compliant | Lead Free | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No IS43R16160D-5TLI | ISSI, Integrated Silicon Solution Inc | Datasheet | 8 |
| Min: 1 Mult: 1 | 8 Weeks | Surface Mount | Surface Mount | 66-TSSOP (0.400, 10.16mm Width) | 66 | Volatile | -40°C~85°C TA | Tray | Active | 3 (168 Hours) | 66 | EAR99 | AUTO/SELF REFRESH | 8542.32.00.24 | 2.3V~2.7V | DUAL | 1 | 2.5V | 0.65mm | 66 | 2.5V | 2.7V | 2.3V | 256Mb 16M x 16 | 1 | 330mA | 200MHz | 700ps | DRAM | Parallel | 16b | 16MX16 | 3-STATE | 16 | 15ns | 15b | 256 Mb | 0.004A | COMMON | 8192 | 248 | 248 | 1.2mm | 22.22mm | No | ROHS3 Compliant | Lead Free | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No AT93C56A-10TU-2.7 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | Surface Mount | 8-TSSOP (0.173, 4.40mm Width) | 8 | 8-TSSOP | Non-Volatile | -40°C~85°C TA | Tube | Obsolete | 1 (Unlimited) | 85°C | -40°C | 2.7V~5.5V | 1MHz | AT93C56A | 5V | Serial | 5.5V | 2.7V | 2Kb 256 x 8 128 x 16 | 2mA | 2MHz | 2 μs | EEPROM | SPI | 10ms | 2 kb | 1MHz | No | ROHS3 Compliant | Lead Free | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No IS43DR16320D-3DBLI | ISSI, Integrated Silicon Solution Inc | Datasheet | 40 |
| Min: 1 Mult: 1 | 8 Weeks | Surface Mount | Surface Mount | 84-TFBGA | 84 | Volatile | Industrial grade | -40°C~85°C TA | Tray | e1 | Active | 3 (168 Hours) | 84 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | PROGRAMMABLE CAS LATENCY | 8542.32.00.28 | 1.7V~1.9V | BOTTOM | NOT SPECIFIED | 1 | 1.8V | 0.8mm | NOT SPECIFIED | Not Qualified | 1.8V | 1.9V | 1.7V | 512Mb 32M x 16 | 1 | 230mA | SYNCHRONOUS | 333MHz | 450ps | DRAM | Parallel | 32MX16 | 3-STATE | 16 | 15ns | 15b | 512 Mb | 0.025A | COMMON | 8192 | 48 | 48 | 1.2mm | 12.5mm | ROHS3 Compliant |
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BR25L320FJ-WE2
ROHM Semiconductor
Package:Memory
Price: please inquire
-
24LC014T-E/MS
Microchip Technology
Package:Memory
Price: please inquire
-
24AA02E64T-E/SN
Microchip Technology
Package:Memory
0.484631
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IS62WV1288BLL-55QLI
ISSI, Integrated Silicon Solution Inc
Package:Memory
2.922141
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BR24T16FVM-WTR
ROHM Semiconductor
Package:Memory
Price: please inquire
-
CY62148ELL-55SXA
Cypress Semiconductor Corp
Package:Memory
0.827692
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IS61C64AL-10JLI
ISSI, Integrated Silicon Solution Inc
Package:Memory
2.318740
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S29GL01GS10DHI020
Cypress Semiconductor Corp
Package:Memory
16.728821
-
K4B1G1646G-BCH9
Samsung
Package:Memory
Price: please inquire
-
BR25H020FVM-2CTR
ROHM Semiconductor
Package:Memory
0.518907
-
24LC08BH-I/MS
Microchip Technology
Package:Memory
Price: please inquire
-
W29GL064CB7S
Winbond Electronics
Package:Memory
Price: please inquire
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SST39VF1602-70-4C-EKE-T
Microchip Technology
Package:Memory
5.472960
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S29GL128P10FFI012
Cypress Semiconductor Corp
Package:Memory
6.044080
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S25FL208K0RMFI010
Cypress Semiconductor Corp
Package:Memory
Price: please inquire
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24AA08T-I/MSG
Microchip
Package:Memory
Price: please inquire
-
25C080-I/P
Microchip Technology
Package:Memory
Price: please inquire
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IS43R16160D-5TLI
ISSI, Integrated Silicon Solution Inc
Package:Memory
5.512089
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AT93C56A-10TU-2.7
Microchip Technology
Package:Memory
Price: please inquire
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IS43DR16320D-3DBLI
ISSI, Integrated Silicon Solution Inc
Package:Memory
1.600293