The category is 'Memory'
Memory (6000)
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Lifecycle Status | Contact Plating | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Number of Terminals | Clock Frequency-Max (fCLK) | Ihs Manufacturer | Manufacturer | Manufacturer Part Number | Memory Types | Moisture Sensitivity Levels | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Supply Voltage-Nom (Vsup) | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Subcategory | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Supply Voltage | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Interface | Max Supply Voltage | Min Supply Voltage | Memory Size | Number of Ports | Nominal Supply Current | Operating Mode | Max Supply Current | Clock Frequency | Supply Current-Max | Access Time | Memory Format | Memory Interface | Data Bus Width | Organization | Output Characteristics | Seated Height-Max | Memory Width | Write Cycle Time - Word, Page | Address Bus Width | Density | Standby Current-Max | Memory Density | Max Frequency | Screening Level | Access Time (Max) | Parallel/Serial | I/O Type | Sync/Async | Word Size | Memory IC Type | Programming Voltage | Serial Bus Type | Endurance | Write Cycle Time-Max (tWC) | Data Retention Time-Min | Write Protection | Standby Voltage-Min | Alternate Memory Width | Data Polling | Toggle Bit | Command User Interface | Number of Sectors/Size | Sector Size | Page Size | Ready/Busy | Common Flash Interface | I2C Control Byte | Height | Height Seated (Max) | Length | Width | Radiation Hardening | REACH SVHC | RoHS Status | Lead Free |
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 | Mfr Part No S25FL216K0PMFI011 | Cypress Semiconductor Corp | Datasheet | 7760 | - | Min: 1 Mult: 1 | 9 Weeks | Surface Mount | Surface Mount | 8-SOIC (0.209, 5.30mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2013 | FL2-K | Obsolete | 3 (168 Hours) | 8 | 2.7V~3.6V | 1 | 3V | 1.27mm | 3.6V | 3/3.3V | 2.7V | SPI, Serial | 16Mb 2M x 8 | 25mA | 65MHz | 5 ns | FLASH | SPI - Dual I/O | 8b | 16MX1 | 1 | 5ms | 1b | 16 Mb | 0.000032A | Synchronous | 8b | 3V | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 256B | 2.159mm | No | No SVHC | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No M95010-RMN6TP | STMicroelectronics | Datasheet | 8000 | - | Min: 1 Mult: 1 | 13 Weeks | ACTIVE (Last Updated: 6 months ago) | Surface Mount | Surface Mount | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | e4 | Active | 1 (Unlimited) | 8 | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | 1.8V~5.5V | DUAL | 260 | 1 | 2.5V | 1.27mm | 30 | M95010 | 8 | 5V | SPI, Serial | 1Kb 128 x 8 | 5mA | 20MHz | 60 ns | EEPROM | SPI | 8 | 5ms | 1 kb | 0.0005A | SPI | 1000000 Write/Erase Cycles | 5ms | 40 | HARDWARE/SOFTWARE | 1.75mm | 4.9mm | 3.9mm | No | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No S34ML08G201TFI000 | Cypress Semiconductor Corp | Datasheet | - | - | Min: 1 Mult: 1 | 20 Weeks | Tin | Surface Mount | Surface Mount | 48-TFSOP (0.724, 18.40mm Width) | 48 | Non-Volatile | -40°C~85°C TA | Tray | 2013 | ML-2 | e3 | Discontinued | 3 (168 Hours) | 48 | 8542.32.00.51 | 2.7V~3.6V | DUAL | 1 | 3.3V | 0.5mm | 3.3V | 3.6V | 2.7V | 8Gb 1G x 8 | 30mA | 30 μs | FLASH | Parallel | 8b | 1GX8 | 8 | 25ns | 31b | 8 Gb | 0.00005A | 3V | NO | NO | YES | 4K | 256K | 2kB | YES | 1.2mm | 18.4mm | No | No SVHC | ROHS3 Compliant | Lead Free | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No 24AA08T-I/STG | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | 0.1 MHz | MICROCHIP TECHNOLOGY INC | Microchip Technology Inc | 24AA08T-I/STG | 1 | 1024 words | 1000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | 4.40 MM, ROHS COMPLIANT, PLASTIC, MO-153, TSSOP-8 | TSSOP8,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Active | TSSOP | 40 | 5.25 | Compliant | Yes | 2.5 V | Tape & Reel (TR) | e3 | Yes | EAR99 | Matte Tin (Sn) | 85 °C | -40 °C | 8542.32.00.51 | EEPROMs | CMOS | DUAL | GULL WING | 260 | 1 | 0.65 mm | compliant | 400 kHz | 8 | R-PDSO-G8 | Not Qualified | 5.5 V | 2/5 V | INDUSTRIAL | 1.7 V | I2C | 5.5 V | 1.8 V | 1 kB | SYNCHRONOUS | 0.003 mA | 900 ns | 1KX8 | 1.2 mm | 8 | 0.000001 A | 8192 bit | 400 kHz | SERIAL | EEPROM | I2C | 1000000 Write/Erase Cycles | 5 ms | 200 | HARDWARE | 1010XMMR | 4.4 mm | 3 mm | Lead Free | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No CY7C2644KV18-300BZXI | Cypress Semiconductor Corp | Datasheet | 1924 |
| Min: 1 Mult: 1 | 13 Weeks | Surface Mount | 165-LBGA | YES | 165 | Volatile | -40°C~85°C TA | Tray | 2003 | Active | 3 (168 Hours) | 165 | 3A991.B.2.A | PIPELINED ARCHITECTURE | 8542.32.00.41 | 1.7V~1.9V | BOTTOM | 1 | 1.8V | 1mm | CY7C2644 | 1.9V | 1.7V | 144Mb 4M x 36 | 300MHz | SRAM | Parallel | 4MX36 | 36 | 150994944 bit | 1.4mm | 17mm | 15mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No AT28LV010-20TU-235 | Microchip Technology | Datasheet | 21 |
| Min: 1 Mult: 1 | 6 Weeks | Surface Mount | 32-TFSOP (0.724, 18.40mm Width) | YES | Non-Volatile | -40°C~85°C TC | Tape & Reel (TR) | 1997 | e3 | Active | 3 (168 Hours) | 32 | Matte Tin (Sn) | 3V~3.6V | DUAL | NOT SPECIFIED | 1 | 3.3V | 0.5mm | NOT SPECIFIED | R-PDSO-G32 | 3.465V | 3.135V | 1Mb 128K x 8 | ASYNCHRONOUS | 200ns | EEPROM | Parallel | 128KX8 | 8 | 10ms | 1048576 bit | 3V | 10ms | 1.2mm | 18.4mm | 8mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No W25Q64CVSFIG | Winbond Electronics | Datasheet | 110 | - | Min: 1 Mult: 1 | Surface Mount | Surface Mount | 16-SOIC (0.295, 7.50mm Width) | 16 | Non-Volatile | -40°C~85°C TA | Tube | 2011 | SpiFlash® | Obsolete | 3 (168 Hours) | 16 | 3A991.B.1.A | 8542.32.00.51 | 2.7V~3.6V | DUAL | 1 | 3V | 1.27mm | 16 | 3.3V | 3.6V | 2.7V | SPI, Serial | 64Mb 8M x 8 | 18mA | 80MHz | 7 ns | FLASH | SPI - Quad I/O | 8MX8 | 8 | 50μs, 3ms | 24b | 64 Mb | 0.000005A | Synchronous | 8b | 2.7V | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 256B | 2.64mm | 10.31mm | No | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No IS21ES04G-JCLI | ISSI, Integrated Silicon Solution Inc | Datasheet | 1600 | - | Min: 1 Mult: 1 | 8 Weeks | Surface Mount | 153-VFBGA | YES | 153 | Non-Volatile | -40°C~85°C TA | Tray | e1 | Active | 3 (168 Hours) | 153 | Tin/Silver/Copper (Sn/Ag/Cu) | 2.7V~3.6V | BOTTOM | NOT SPECIFIED | 1 | 3.3V | 0.5mm | NOT SPECIFIED | 3.6V | 2.7V | 32Gb 4G x 8 | SYNCHRONOUS | 200MHz | FLASH | eMMC | 4GX8 | 8 | 34359738368 bit | PARALLEL | 3.3V | 1mm | 13mm | 11.5mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No AT28HC256E-12TU | Microchip Technology | Datasheet | 211 | - | Min: 1 Mult: 1 | 16 Weeks | Tin | Surface Mount | Surface Mount | 28-TSSOP (0.465, 11.80mm Width) | 28 | Non-Volatile | -40°C~85°C TC | Tray | 1997 | e3 | yes | Active | 3 (168 Hours) | 28 | 4.5V~5.5V | DUAL | NOT SPECIFIED | 1 | 5V | 0.55mm | NOT SPECIFIED | AT28HC256 | Not Qualified | 5V | 5V | 256Kb 32K x 8 | 80mA | ASYNCHRONOUS | 120ns | EEPROM | Parallel | 32KX8 | 8 | 10ms | 256 kb | 0.0003A | 5V | 100000 Write/Erase Cycles | 10ms | YES | YES | NO | 64words | 1.2mm | 11.8mm | 8mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No LE24CB642MC-AE | ON Semiconductor | Datasheet | 769 | - | Min: 1 Mult: 1 | 4 Weeks | Surface Mount | Surface Mount | 8-SOIC (0.173, 4.40mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | Active | 1 (Unlimited) | 2.7V~5.5V | 2-Wire, I2C, Serial | 64Kb 8K x 8 | 400kHz | 900ns | EEPROM | I2C | 10ms | 64 kb | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No W25Q128FVEIG | Winbond Electronics | Datasheet | 16000 | - | Min: 1 Mult: 1 | Surface Mount | Surface Mount | 8-WDFN Exposed Pad | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2016 | SpiFlash® | Discontinued | 3 (168 Hours) | 8 | 3A991.B.1.A | 2.7V~3.6V | DUAL | 1 | 3V | 1.27mm | 8 | 3.6V | 3/3.3V | 2.7V | SPI, Serial | 128Mb 16M x 8 | 20mA | 104MHz | 7 ns | FLASH | SPI - Quad I/O, QPI | 1 | 50μs, 3ms | 24b | 128 Mb | 0.00002A | Synchronous | 8b | 3V | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | No | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No S70FL01GSAGMFI013 | Cypress Semiconductor Corp | Datasheet | 13 |
| Min: 1 Mult: 1 | 13 Weeks | Tin | Surface Mount | Surface Mount | 16-SOIC (0.295, 7.50mm Width) | 16 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2016 | FL-S | Active | 3 (168 Hours) | 16 | 8542.32.00.51 | 2.7V~3.6V | DUAL | 1 | 3V | 1.27mm | 3V | 3.6V | 2.7V | SPI | 1Gb 128M x 8 | 133MHz | 0.1mA | 8 ns | FLASH | SPI - Quad I/O | 1GX1 | 1 | 32b | 1 Gb | 0.0002A | SERIAL | 3V | SPI | 1000000 Write/Erase Cycles | 100 | HARDWARE/SOFTWARE | 512B | 2.65mm | 10.3mm | No | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No S29GL512N11TFI020 | Cypress Semiconductor Corp | Datasheet | 240 |
| Min: 1 Mult: 1 | Surface Mount | Surface Mount | 56-TFSOP (0.724, 18.40mm Width) | 56 | Non-Volatile | -40°C~85°C TA | Tray | GL-N | e3 | Obsolete | 3 (168 Hours) | 56 | Matte Tin (Sn) | 2.7V~3.6V | DUAL | NOT SPECIFIED | 1 | 3V | 0.5mm | NOT SPECIFIED | 3.6V | 2.7V | 512Mb 64M x 8 32M x 16 | 90mA | FLASH | Parallel | 32MX16 | 16 | 110ns | 512 Mb | 110 ns | Asynchronous | 3V | 8 | 1.2mm | 18.4mm | 14mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No 93AA66BX-I/SN | Microchip Technology | Datasheet | 32 |
| Min: 1 Mult: 1 | 6 Weeks | Tin | Surface Mount | Surface Mount | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2003 | e3 | yes | Active | 1 (Unlimited) | 8 | EAR99 | 1.8V~5.5V | DUAL | 260 | 1 | 2.5V | 1.27mm | 40 | 93AA66B | 8 | 5.5V | 2/5V | Serial | 4Kb 256 x 16 | 2mA | 2MHz | 250 ns | EEPROM | SPI | 256X16 | 16 | 6ms | 4 kb | 0.000001A | MICROWIRE | 1000000 Write/Erase Cycles | 6ms | 200 | SOFTWARE | 1.75mm | 4.9mm | 3.9mm | No | ROHS3 Compliant | Lead Free | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No 24LC024H-E/ST | Microchip Technology | Datasheet | 5600 | - | Min: 1 Mult: 1 | 12 Weeks | Tin | Surface Mount | Surface Mount | 8-TSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | -40°C~125°C TA | Tube | 2008 | e3 | Active | 1 (Unlimited) | 8 | EAR99 | 2.5V~5.5V | DUAL | 260 | 1 | 4.5V | 0.65mm | 40 | 24LC024H | 8 | Not Qualified | 5V | I2C, Serial | 2Kb 256 x 8 | 3mA | SYNCHRONOUS | 1MHz | 400ns | EEPROM | I2C | 8 | 5ms | 2 kb | I2C | 5ms | 1.2mm | 4.4mm | 3mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AT88SC0104C-SU | Atmel | Datasheet | 40 | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No S25FL127SABNFI101 | Cypress Semiconductor Corp | Datasheet | - |
| Min: 1 Mult: 1 | 13 Weeks | Surface Mount | 8-WDFN Exposed Pad | 8 | 8-WSON (6x5) | Non-Volatile | -40°C~85°C TA | Tube | 2014 | FL-S | Active | 3 (168 Hours) | 85°C | -40°C | 2.7V~3.6V | 108MHz | SPI, Serial | 3.6V | 2.7V | 128Mb 16M x 8 | 108MHz | FLASH | SPI - Quad I/O | 8b | 128 Mb | 108MHz | No | No SVHC | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No S25FL256SAGMFB000 | Cypress Semiconductor Corp | Datasheet | 2838 |
| Min: 1 Mult: 1 | 13 Weeks | Surface Mount | 16-SOIC (0.295, 7.50mm Width) | YES | 16 | Non-Volatile | Automotive grade | -40°C~105°C TA | Tray | 2013 | FL-S | Active | 3 (168 Hours) | 16 | ALSO CONFIGURABLE AS 256M X 1 | 8542.32.00.51 | 2.7V~3.6V | DUAL | NOT SPECIFIED | 1 | 3V | 1.27mm | NOT SPECIFIED | 3.6V | 2.7V | SPI, Serial | 256Mb 32M x 8 | SYNCHRONOUS | 133MHz | FLASH | SPI - Quad I/O | 64MX4 | 4 | 268435456 bit | AEC-Q100 | 3V | 500ms | 2 | 2.65mm | 10.3mm | 7.5mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No CY62136EV30LL-45BVXIT | Cypress Semiconductor Corp | Datasheet | 5 |
| Min: 1 Mult: 1 | 6 Weeks | Surface Mount | Surface Mount | 48-VFBGA | 48 | Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2001 | MoBL® | e1 | yes | Active | 3 (168 Hours) | 48 | Tin/Silver/Copper (Sn/Ag/Cu) | 2.2V~3.6V | BOTTOM | 260 | 1 | 3V | 0.75mm | 30 | CY62136 | 3.6V | 2.5/3.3V | 2.2V | 2Mb 128K x 16 | 1 | 20mA | SRAM | Parallel | 3-STATE | 16 | 45ns | 17b | 2 Mb | 0.000003A | 45 ns | COMMON | Asynchronous | 16b | 1V | 8mm | No | ROHS3 Compliant | Lead Free | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No S29GL01GP11FFIR20 | Cypress Semiconductor Corp | Datasheet | 16346 |
| Min: 1 Mult: 1 | Copper, Silver, Tin | Surface Mount | Surface Mount | 64-LBGA | 64 | Non-Volatile | -40°C~85°C TA | Tray | 2012 | GL-P | e1 | Obsolete | 3 (168 Hours) | 64 | 3A991.B.1.A | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 8542.32.00.51 | 3V~3.6V | BOTTOM | 260 | 1 | 3.3V | 1mm | 40 | 3.6V | 3.3V | 3V | 1Gb 128M x 8 | 110mA | FLASH | Parallel | 8b | 1GX1 | 1 | 110ns | 1 Gb | 0.000005A | 110 ns | Asynchronous | 3V | 8 | YES | YES | YES | 1K | 128K | 8/16words | YES | YES | 1.4mm | 13mm | No | Unknown | ROHS3 Compliant | Lead Free |
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S25FL216K0PMFI011
Cypress Semiconductor Corp
Package:Memory
Price: please inquire
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M95010-RMN6TP
STMicroelectronics
Package:Memory
Price: please inquire
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S34ML08G201TFI000
Cypress Semiconductor Corp
Package:Memory
Price: please inquire
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24AA08T-I/STG
Microchip
Package:Memory
Price: please inquire
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CY7C2644KV18-300BZXI
Cypress Semiconductor Corp
Package:Memory
288.213589
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AT28LV010-20TU-235
Microchip Technology
Package:Memory
21.000507
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W25Q64CVSFIG
Winbond Electronics
Package:Memory
Price: please inquire
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IS21ES04G-JCLI
ISSI, Integrated Silicon Solution Inc
Package:Memory
Price: please inquire
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AT28HC256E-12TU
Microchip Technology
Package:Memory
Price: please inquire
-
LE24CB642MC-AE
ON Semiconductor
Package:Memory
Price: please inquire
-
W25Q128FVEIG
Winbond Electronics
Package:Memory
Price: please inquire
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S70FL01GSAGMFI013
Cypress Semiconductor Corp
Package:Memory
1.263661
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S29GL512N11TFI020
Cypress Semiconductor Corp
Package:Memory
0.963685
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93AA66BX-I/SN
Microchip Technology
Package:Memory
0.449163
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24LC024H-E/ST
Microchip Technology
Package:Memory
Price: please inquire
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AT88SC0104C-SU
Atmel
Package:Memory
Price: please inquire
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S25FL127SABNFI101
Cypress Semiconductor Corp
Package:Memory
8.638760
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S25FL256SAGMFB000
Cypress Semiconductor Corp
Package:Memory
0.725391
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CY62136EV30LL-45BVXIT
Cypress Semiconductor Corp
Package:Memory
0.371933
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S29GL01GP11FFIR20
Cypress Semiconductor Corp
Package:Memory
19.325262