The category is 'Memory'
Memory (6000)
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- RoHS Status
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- Moisture Sensitivity Level (MSL)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Contact Plating | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Number of Terminals | Clock Frequency-Max (fCLK) | Ihs Manufacturer | Manufacturer | Manufacturer Part Number | Memory Types | Moisture Sensitivity Levels | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Supply Voltage-Nom (Vsup) | Watchdog Timers | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Subcategory | Max Power Dissipation | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Supply Voltage | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Voltage | Interface | Max Supply Voltage | Min Supply Voltage | Memory Size | Number of Ports | Nominal Supply Current | RAM Size | Operating Mode | Max Supply Current | Clock Frequency | Supply Current-Max | Access Time | Memory Format | Memory Interface | Data Bus Width | Organization | Output Characteristics | Seated Height-Max | Memory Width | Number of Timers/Counters | Write Cycle Time - Word, Page | Address Bus Width | Density | Standby Current-Max | Memory Density | Core Architecture | Max Frequency | Access Time (Max) | Parallel/Serial | I/O Type | Number of Programmable I/O | Sync/Async | Word Size | Memory IC Type | Programming Voltage | Serial Bus Type | Endurance | Write Cycle Time-Max (tWC) | Data Retention Time-Min | Write Protection | Standby Voltage-Min | Alternate Memory Width | Page Size | Refresh Cycles | I2C Control Byte | Sequential Burst Length | Interleaved Burst Length | Reverse Pinout | Height | Height Seated (Max) | Length | Width | Radiation Hardening | REACH SVHC | RoHS Status | Lead Free |
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 | Mfr Part No W25Q80EWSNIG | Winbond Electronics | Datasheet | 1460 | - | Min: 1 Mult: 1 | 10 Weeks | Surface Mount | 8-SOIC (0.154, 3.90mm Width) | YES | Non-Volatile | -40°C~85°C TA | Tube | 2016 | SpiFlash® | Active | 3 (168 Hours) | 8 | 1.65V~1.95V | DUAL | 1 | 1.8V | 1.27mm | R-PDSO-G8 | Not Qualified | 1.95V | 1.8V | 1.65V | SPI, Serial | 8Mb 1M x 8 | SYNCHRONOUS | 104MHz | FLASH | SPI | 8MX1 | 1 | 800μs | 0.0000075A | 8388608 bit | 1.8V | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 1.75mm | 4.85mm | 3.9mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No 34AA02-E/ST | Microchip Technology | Datasheet | 28 |
| Min: 1 Mult: 1 | 12 Weeks | Tin | Surface Mount | Surface Mount | 8-TSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | -40°C~125°C TA | Tube | 2011 | e3 | yes | Active | 1 (Unlimited) | 8 | EAR99 | 1.7V~5.5V | DUAL | 260 | 1 | 2.5V | 0.65mm | 40 | 34AA02 | 8 | Not Qualified | 5V | 1.7V | I2C, Serial | 2Kb 256 x 8 | 3mA | SYNCHRONOUS | 400kHz | 900ns | EEPROM | I2C | 5ms | 2 kb | 0.000005A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE/SOFTWARE | 1010DDDR | 1.05mm | 4.5mm | 3.1mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No BR25L160FVT-WE2 | ROHM Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | Tin | Surface Mount | Surface Mount | 8-TSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2005 | e2 | yes | Not For New Designs | 1 (Unlimited) | 8 | EAR99 | 1.8V~5.5V | DUAL | 260 | 1 | 2.5V | 0.65mm | 10 | BR25L160 | 8 | 5V | SPI, Serial | 16Kb 2K x 8 | 3mA | 5MHz | 70 ns | EEPROM | SPI | 8 | 5ms | 16 kb | 0.000002A | SPI | 1000000 Write/Erase Cycles | 5ms | 40 | HARDWARE/SOFTWARE | 1.25mm | 4.4mm | 3mm | No | ROHS3 Compliant | Lead Free | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No IS42S16160G-6TL | ISSI, Integrated Silicon Solution Inc | Datasheet | 24 |
| Min: 1 Mult: 1 | 6 Weeks | Surface Mount | Surface Mount | 54-TSOP (0.400, 10.16mm Width) | 54 | Volatile | 0°C~70°C TA | Tray | Active | 3 (168 Hours) | 54 | EAR99 | AUTO/SELF REFRESH | 3V~3.6V | DUAL | NOT SPECIFIED | 1 | 3.3V | 0.8mm | NOT SPECIFIED | 54 | Not Qualified | 3.3V | 3.6V | 3V | 256Mb 16M x 16 | 1 | 160mA | SYNCHRONOUS | 160mA | 166MHz | 5.4ns | DRAM | Parallel | 16b | 16MX16 | 3-STATE | 16 | 15b | 256 Mb | 0.004A | COMMON | 8192 | 1248FP | 1248 | 1.2mm | 22.22mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No CY7C194BN-15PC | Cypress Semiconductor Corp | Datasheet | 34 |
| Min: 1 Mult: 1 | Through Hole | Through Hole | 24-DIP (0.300, 7.62mm) | 24 | Volatile | 0°C~70°C TA | Tube | 2003 | e0 | no | Obsolete | 1 (Unlimited) | 24 | EAR99 | Tin/Lead (Sn/Pb) | 4.5V~5.5V | DUAL | 1 | 5V | 2.54mm | CY7C194 | 24 | 5V | 5V | 256Kb 64K x 4 | 1 | 80mA | SRAM | Parallel | 64KX4 | 3-STATE | 4 | 15ns | 16b | 256 kb | COMMON | Asynchronous | 4b | 4.826mm | No | Non-RoHS Compliant | Contains Lead | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No CY7C144E-55AXC | Cypress Semiconductor Corp | Datasheet | 32 |
| Min: 1 Mult: 1 | 1 Weeks | Surface Mount | Surface Mount | 64-LQFP | 64 | Volatile | 0°C~70°C TA | Tray | 1996 | e4 | yes | Obsolete | 3 (168 Hours) | 64 | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | 4.5V~5.5V | QUAD | 260 | 1 | 5V | 0.8mm | 30 | 64 | 5V | 5V | 64Kb 8K x 8 | 2 | 275mA | SRAM | Parallel | 8KX8 | 3-STATE | 8 | 55ns | 26b | 64 kb | 0.0005A | 55 ns | COMMON | Asynchronous | 8b | 1.6mm | 14mm | No | ROHS3 Compliant | Lead Free | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MX25L25645GZNI-08G | Macronix | Datasheet | 4685 |
| Min: 1 Mult: 1 | 10 Weeks | Surface Mount | 8-WDFN Exposed Pad | Non-Volatile | -40°C~85°C TA | Tray | 2017 | MXSMIO™ | Active | 3 (168 Hours) | 2.7V~3.6V | NOT SPECIFIED | NOT SPECIFIED | 256Mb 32M x 8 | 120MHz | FLASH | SPI | 30μs, 750μs | RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No S25FL064P0XBHI020 | Cypress Semiconductor Corp | Datasheet | 44 |
| Min: 1 Mult: 1 | 11 Weeks | Surface Mount | Surface Mount | 24-TBGA | 24 | Non-Volatile | -40°C~85°C TA | Tray | 2013 | FL-P | Obsolete | 3 (168 Hours) | 24 | 3A991.B.1.A | 8542.32.00.51 | 2.7V~3.6V | BOTTOM | 1 | 3V | 1.2mm | 3.6V | 3/3.3V | 2.7V | SPI, Serial | 64Mb 8M x 8 | 26mA | 104MHz | 8 ns | FLASH | SPI - Quad I/O | 8b | 64MX1 | 1 | 5μs, 3ms | 1b | 64 Mb | 0.00001A | Synchronous | 1b | 3V | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 256B | 1mm | 8mm | No | No SVHC | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No 24LC01B-E/MS | Microchip Technology | Datasheet | 4000 | - | Min: 1 Mult: 1 | 7 Weeks | Tin | Surface Mount | Surface Mount | 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) | 8 | Non-Volatile | -40°C~125°C TA | Tube | 2007 | e3 | yes | Active | 1 (Unlimited) | 8 | EAR99 | 2.5V~5.5V | DUAL | 260 | 1 | 0.65mm | 40 | 24LC01B | 8 | 5V | I2C, Serial | 1Kb 128 x 8 | 3mA | 400kHz | 3500ns | EEPROM | I2C | 8 | 5ms | 1 kb | 0.000005A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010XXXR | NO | 1.1mm | 3mm | 3mm | No | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No CY14V101Q3-SFXI | Cypress Semiconductor Corp | Datasheet | 206 |
| Min: 1 Mult: 1 | 16 Weeks | Gold | Surface Mount | Surface Mount | 16-SOIC (0.295, 7.50mm Width) | 16 | Non-Volatile | -40°C~85°C TA | Tube | 2008 | e3 | Active | 3 (168 Hours) | 16 | 3A991.B.2.A | MATTE TIN (800) | 8542.32.00.41 | 2.7V~3.6V | DUAL | 260 | 1 | 3.3V | 1.27mm | 40 | CY14V101 | Not Qualified | 3.3V | 3.6V | 3V | SPI, Serial | 1Mb 128K x 8 | 10mA | SYNCHRONOUS | 30MHz | 12 ns | NVSRAM | SPI | 8b | 128KX8 | 8 | 1 Mb | 0.005A | 8b | 2.667mm | 10.2865mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No IS42S83200G-7TL | ISSI, Integrated Silicon Solution Inc | Datasheet | 8 |
| Min: 1 Mult: 1 | 8 Weeks | Surface Mount | Surface Mount | 54-TSOP (0.400, 10.16mm Width) | 54 | Volatile | 0°C~70°C TA | Tray | Active | 3 (168 Hours) | 54 | EAR99 | AUTO/SELF REFRESH | 3V~3.6V | DUAL | NOT SPECIFIED | 1 | 3.3V | 0.8mm | NOT SPECIFIED | 54 | Not Qualified | 3.3V | 3.6V | 3V | 256Mb 32M x 8 | 1 | 130mA | SYNCHRONOUS | 143MHz | 5.4ns | DRAM | Parallel | 8b | 32MX8 | 3-STATE | 8 | 15b | 256 Mb | 0.004A | COMMON | 8192 | 1248FP | 1248 | 1.2mm | 22.22mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No AT21CS01-SSHM15-T | Microchip Technology | Datasheet | 2609 |
| Min: 1 Mult: 1 | 16 Weeks | Surface Mount | 8-SOIC (0.154, 3.90mm Width) | YES | 8 | Non-Volatile | -40°C~85°C TC | Tape & Reel (TR) | 2014 | e4 | yes | Active | 3 (168 Hours) | 8 | Nickel/Palladium/Gold (Ni/Pd/Au) | 1.7V~3.6V | DUAL | 260 | 1 | 1.8V | 1.27mm | 40 | AT21CS01 | 3.6V | 1.7V | 1Kb 128 x 8 | SYNCHRONOUS | 125kHz | EEPROM | I2C, Single Wire | 8 | 5ms | 1024 bit | SERIAL | 1-WIRE | 5ms | 1.75mm | 4.9mm | 3.9mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No W25Q64JVZEIQ | Winbond Electronics | Datasheet | 3200 | - | Min: 1 Mult: 1 | 10 Weeks | Surface Mount | 8-WDFN Exposed Pad | YES | Non-Volatile | -40°C~85°C TA | Tube | 2016 | SpiFlash® | Active | 3 (168 Hours) | 8 | 3A991.B.1.A | 8542.32.00.51 | 2.7V~3.6V | DUAL | NOT SPECIFIED | 1 | 3V | 1.27mm | NOT SPECIFIED | R-PDSO-N8 | 3.6V | 2.7V | SPI, Serial | 64Mb 8M x 8 | SYNCHRONOUS | 133MHz | FLASH | SPI - Quad I/O | 64MX1 | 1 | 3ms | 67108864 bit | 2.7V | 0.8mm | 8mm | 6mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MX25L8006EZUI-12G | Macronix | Datasheet | 9 |
| Min: 1 Mult: 1 | 16 Weeks | Surface Mount | 8-UDFN Exposed Pad | YES | Non-Volatile | -40°C~85°C TA | Tray | 2010 | MX25xxx05/06 | Not For New Designs | 3 (168 Hours) | 8 | EAR99 | 8542.32.00.51 | 2.7V~3.6V | DUAL | NOT SPECIFIED | 1 | 3V | 0.8mm | NOT SPECIFIED | 8 | S-PDSO-N8 | Not Qualified | 3.6V | 3/3.3V | 2.7V | SPI, Serial | 8Mb 1M x 8 | SYNCHRONOUS | 86MHz | FLASH | SPI | 4MX2 | 2 | 50μs, 3ms | 8 Mb | 0.00001A | 2.7V | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 1 | 0.6mm | 4mm | 4mm | ROHS3 Compliant | Lead Free | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No CY7C1021BNV33L-15ZXIT | Cypress Semiconductor Corp | Datasheet | 1521 | - | Min: 1 Mult: 1 | 8 Weeks | Surface Mount | Surface Mount | 44-TSOP (0.400, 10.16mm Width) | 44 | Volatile | -40°C~85°C TA | Tape & Reel (TR) | 1996 | e4 | yes | Obsolete | 3 (168 Hours) | 44 | Nickel/Palladium/Gold (Ni/Pd/Au) | 3V~3.6V | DUAL | 1 | 3.3V | 0.8mm | CY7C1021 | 3.3V | 3.6V | 3V | 1Mb 64K x 16 | 1 | 160mA | SRAM | Parallel | 3-STATE | 16 | 15ns | 16b | 1 Mb | COMMON | Asynchronous | 16b | 2V | No | ROHS3 Compliant | Lead Free | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No N25Q032A13E1240E | Micron Technology Inc. | Datasheet | 448 |
| Min: 1 Mult: 1 | 15 Weeks | Surface Mount | 24-TBGA | YES | 24 | Non-Volatile | -40°C~85°C TA | Tray | 2012 | e1 | yes | Obsolete | 3 (168 Hours) | 24 | 3A991.B.1.A | TIN SILVER COPPER | 8542.32.00.51 | 2.7V~3.6V | BOTTOM | 260 | 1 | 3V | 1mm | 30 | N25Q032 | 24 | 3/3.3V | 2.7V | SPI, Serial | 32Mb 8M x 4 | 20mA | 108MHz | 7 ns | FLASH | SPI | 32MX1 | 1 | 8ms, 5ms | 22b | 32 Mb | 0.0001A | Synchronous | 8b | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 256B | 1.2mm | 8mm | No | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No 93AA56-I/SN | Microchip Technology | Datasheet | 5280 | - | Min: 1 Mult: 1 | 29 Weeks | Surface Mount | Surface Mount | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | Yes | -40°C~85°C TA | Tube | 2004 | e3 | yes | Active | 1 (Unlimited) | 8 | EAR99 | Matte Tin (Sn) | 800mW | 1.8V~5.5V | DUAL | 260 | 1 | 3V | 40 | 93AA56 | 8 | 5.5V | Serial | 2Kb 256 x 8 128 x 16 | 3mA | 25B | 2MHz | 2 μs | EEPROM | SPI | 8b | 16 | 1 | 10ms | 2 kb | PIC | 12 | MICROWIRE | 8 | 4.9mm | No | ROHS3 Compliant | Lead Free | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 24C02C-E/ST | Microchip Technology | Datasheet | 1600 | - | Min: 1 Mult: 1 | 12 Weeks | Tin | Surface Mount | Surface Mount | 8-TSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | -40°C~125°C TA | Tube | 2005 | e3 | yes | Active | 1 (Unlimited) | 8 | EAR99 | DATA RETENTION > 200 YEARS, 1000000 ERASE/WRITE CYCLES GUARANTEED | 4.5V~5.5V | DUAL | 260 | 1 | 5V | 0.65mm | 40 | 24C02C | 8 | 5V | 5V | I2C, Serial | 2Kb 256 x 8 | 3mA | 100kHz | 3500ns | EEPROM | I2C | 8 | 1.5ms | 2 kb | 0.00005A | I2C | 1000000 Write/Erase Cycles | 1.5ms | 200 | HARDWARE | 1010DDDR | 1.2mm | 4.4mm | 3mm | No | ROHS3 Compliant | Lead Free | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No 24AA025-I/STG | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | 8 | 0.4 MHz | MICROCHIP TECHNOLOGY INC | Microchip Technology Inc | 24AA025-I/STG | 1 | 256 words | 256 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | 4.40 MM, ROHS COMPLIANT, PLASTIC, TSSOP-8 | TSSOP8,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Active | SOIC | 40 | 5.42 | Compliant | Yes | 2.5 V | Bulk | e3 | Yes | EAR99 | Matte Tin (Sn) | 85 °C | -40 °C | 8542.32.00.51 | EEPROMs | CMOS | DUAL | GULL WING | 260 | 1 | 0.65 mm | compliant | 8 | R-PDSO-G8 | Not Qualified | 5.5 V | 2/5 V | INDUSTRIAL | 1.7 V | I2C, Serial | 5.5 V | 1.7 V | 256 B | SYNCHRONOUS | 0.003 mA | 900 ns | 256X8 | 1.2 mm | 8 | 2 kb | 0.000001 A | 2048 bit | 400 kHz | SERIAL | EEPROM | I2C | 1000000 Write/Erase Cycles | 5 ms | 200 | 1010DDDR | 4.4 mm | 3 mm | No | Lead Free | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No 25AA160/P | Microchip Technology | Datasheet | 28 |
| Min: 1 Mult: 1 | 7 Weeks | Tin | Through Hole | 8-DIP (0.300, 7.62mm) | 8 | 8-PDIP | Non-Volatile | 0°C~70°C TA | Tube | 2004 | Active | 1 (Unlimited) | 70°C | 0°C | 1.8V~5.5V | 1MHz | 25AA160 | SPI, Serial | 5.5V | 1.8V | 16Kb 2K x 8 | 5mA | 1MHz | 475 ns | EEPROM | SPI | 5ms | 16 kb | 1MHz | No | ROHS3 Compliant | Lead Free |
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W25Q80EWSNIG
Winbond Electronics
Package:Memory
Price: please inquire
-
34AA02-E/ST
Microchip Technology
Package:Memory
0.428097
-
BR25L160FVT-WE2
ROHM Semiconductor
Package:Memory
Price: please inquire
-
IS42S16160G-6TL
ISSI, Integrated Silicon Solution Inc
Package:Memory
4.519469
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CY7C194BN-15PC
Cypress Semiconductor Corp
Package:Memory
6.262294
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CY7C144E-55AXC
Cypress Semiconductor Corp
Package:Memory
3.442422
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MX25L25645GZNI-08G
Macronix
Package:Memory
1.815911
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S25FL064P0XBHI020
Cypress Semiconductor Corp
Package:Memory
0.101432
-
24LC01B-E/MS
Microchip Technology
Package:Memory
Price: please inquire
-
CY14V101Q3-SFXI
Cypress Semiconductor Corp
Package:Memory
1.274540
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IS42S83200G-7TL
ISSI, Integrated Silicon Solution Inc
Package:Memory
6.000255
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AT21CS01-SSHM15-T
Microchip Technology
Package:Memory
0.687193
-
W25Q64JVZEIQ
Winbond Electronics
Package:Memory
Price: please inquire
-
MX25L8006EZUI-12G
Macronix
Package:Memory
0.907405
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CY7C1021BNV33L-15ZXIT
Cypress Semiconductor Corp
Package:Memory
Price: please inquire
-
N25Q032A13E1240E
Micron Technology Inc.
Package:Memory
3.122892
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93AA56-I/SN
Microchip Technology
Package:Memory
Price: please inquire
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24C02C-E/ST
Microchip Technology
Package:Memory
Price: please inquire
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24AA025-I/STG
Microchip
Package:Memory
Price: please inquire
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25AA160/P
Microchip Technology
Package:Memory
1.804101