The category is 'Memory'
Memory (6000)
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Lifecycle Status | Contact Plating | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Number of Terminals | Access Time-Max | Base Product Number | Brand | Clock Frequency-Max (fCLK) | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Manufacturer | Manufacturer Part Number | Memory Types | Mfr | Moisture Sensitivity Levels | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Nom (Vsup) | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Type | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Subcategory | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Supply Voltage | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Voltage | Interface | Max Supply Voltage | Min Supply Voltage | Memory Size | Number of Ports | Nominal Supply Current | Operating Mode | Clock Frequency | Supply Current-Max | Access Time | Memory Format | Memory Interface | Data Bus Width | Organization | Output Characteristics | Seated Height-Max | Memory Width | Write Cycle Time - Word, Page | Address Bus Width | Product Type | Density | Standby Current-Max | Memory Density | Max Frequency | Access Time (Max) | Parallel/Serial | I/O Type | Sync/Async | Word Size | Memory IC Type | Programming Voltage | Serial Bus Type | Endurance | Write Cycle Time-Max (tWC) | Data Retention Time-Min | Write Protection | Standby Voltage-Min | Alternate Memory Width | Data Polling | Toggle Bit | Command User Interface | Number of Sectors/Size | Sector Size | Page Size | Ready/Busy | Boot Block | Common Flash Interface | I2C Control Byte | Access Mode | Product Category | Memory Organization | Height | Height Seated (Max) | Length | Width | Radiation Hardening | RoHS Status | Lead Free |
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 | Mfr Part No M27C4001-45XF1 | STMicroelectronics | Datasheet | 2 | - | Min: 1 Mult: 1 | Through Hole | Through Hole | 32-CDIP (0.600, 15.24mm) Window | 32 | Non-Volatile | 0°C~70°C TA | Tube | e3 | Obsolete | 1 (Unlimited) | 32 | EAR99 | Matte Tin (Sn) | 4.75V~5.25V | DUAL | 245 | 1 | 5V | 2.54mm | M27C4001 | 32 | 5V | 5V | I2C, Parallel, Serial | 4Mb 512K x 8 | 50mA | 45ns | EPROM | Parallel | 512KX8 | 3-STATE | 4 Mb | 0.0001A | COMMON | 4.5mm | 42.04mm | 13.36mm | No | ROHS3 Compliant | Lead Free | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No AT28HC256E-70JC | Atmel | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No GT28F160B3BA110 | Intel | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 110 ns | NUMONYX | Numonyx Memory Solutions | GT28F160B3BA110 | 1048576 words | 1000000 | 85 °C | -40 °C | PLASTIC/EPOXY | VFBGA | MICRO, BGA-48 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Obsolete | BGA | 30 | 5.75 | 3 V | EAR99 | NOR TYPE | BOTTOM BOOT BLOCK | 8542.32.00.51 | CMOS | BOTTOM | BALL | 240 | 1 | 0.75 mm | unknown | 48 | R-PBGA-B48 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 1MX16 | 1 mm | 16 | 16777216 bit | PARALLEL | FLASH | 2.7 V | BOTTOM | 7.286 mm | 6.964 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5962-8700201UA | Renesas Electronics America Inc | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 48-LCC | 48-LCC (14.22x14.22) | 5962-8700201 | Renesas Electronics | 34 | Renesas Electronics | Volatile | Renesas Electronics America Inc | Tube | Last Time Buy | N | This product may require additional documentation to export from the United States. | -55°C ~ 125°C (TA) | Tube | - | Memory & Data Storage | 4.5V ~ 5.5V | 16Kbit | 45 ns | SRAM | Parallel | 45ns | SRAM | SRAM | 2K x 8 | 1.78 mm | 14.2 mm | 14.22 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No EDB8132B4PB-8D-F-D | Micron Technology Inc. | Datasheet | 1344 |
| Min: 1 Mult: 1 | 12 Weeks | Surface Mount | 168-WFBGA | YES | 168 | Volatile | -30°C~85°C TC | Bulk | 2014 | Active | 3 (168 Hours) | 168 | AUTO/SELF REFRESH; IT ALSO REQUIRES 1.8V NOMINAL SUPPLY | 1.14V~1.95V | BOTTOM | NOT SPECIFIED | 1 | 1.2V | 0.5mm | NOT SPECIFIED | 1.8V | 1.3V | 1.14V | 8Gb 256M x 32 | 1 | SYNCHRONOUS | DRAM | Parallel | 256MX32 | 32 | 14b | 8 Gb | 400MHz | SINGLE BANK PAGE BURST | 0.8mm | 12mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No BR24T02NUX-WTR | ROHM Semiconductor | Datasheet | 3164 |
| Min: 1 Mult: 1 | 12 Weeks | Tin | Surface Mount | Surface Mount | 8-UFDFN Exposed Pad | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2013 | e3 | yes | Active | 2 (1 Year) | 8 | 1.6V~5.5V | DUAL | 225 | 1 | 2.5V | 0.5mm | NOT SPECIFIED | BR24T02 | Not Qualified | 5.5V | 1.6V | 2-Wire, I2C, Serial | 2Kb 256 x 8 | SYNCHRONOUS | 400kHz | 900 ns | EEPROM | I2C | 8 | 5ms | 2 kb | 0.000002A | I2C | 1000000 Write/Erase Cycles | 5ms | 40 | HARDWARE | 1010DDDR | 0.6mm | 3mm | 2mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No S29AL016J70FFI012 | Cypress Semiconductor Corp | Datasheet | 33 |
| Min: 1 Mult: 1 | 12 Weeks | Surface Mount | 64-LBGA | YES | 64 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | AL-J | Active | 3 (168 Hours) | 64 | EAR99 | TOP BOOT BLOCK | 8542.32.00.51 | 2.7V~3.6V | BOTTOM | NOT SPECIFIED | 1 | 3V | 1mm | NOT SPECIFIED | Not Qualified | 3.6V | 3/3.3V | 2.7V | 16Mb 2M x 8 1M x 16 | ASYNCHRONOUS | 0.03mA | FLASH | Parallel | 1MX16 | 16 | 70ns | 0.000005A | 16777216 bit | 70 ns | 3V | 8 | YES | YES | YES | 12131 | YES | TOP | YES | 1.4mm | 9mm | 9mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No SST39VF800A-70-4C-MAQE-T | Microchip Technology | Datasheet | 20 |
| Min: 1 Mult: 1 | 7 Weeks | Surface Mount | Surface Mount | 48-WFBGA | 48 | Non-Volatile | 0°C~70°C TA | Tape & Reel (TR) | 2000 | SST39 MPF™ | e1 | yes | Active | 3 (168 Hours) | 48 | Tin/Silver/Copper (Sn/Ag/Cu) | 2.7V~3.6V | BOTTOM | 260 | 0.5mm | 40 | SST39VF800A | 3.3V | 8Mb 512K x 16 | 30mA | 70ns | FLASH | Parallel | 16b | 512KX16 | 16 | 20μs | 19b | 8 Mb | 0.00002A | Asynchronous | 16b | YES | YES | YES | 256 | 2K | YES | No | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No CYD09S18V18-200BBXC | Cypress Semiconductor Corp | Datasheet | 2080 |
| Min: 1 Mult: 1 | Surface Mount | Surface Mount | 256-LBGA | 256 | Volatile | 0°C~70°C TA | Tray | 2006 | e1 | yes | Obsolete | 4 (72 Hours) | 256 | Tin/Silver/Copper (Sn/Ag/Cu) | PIPELINED OR FLOW-THROUGH ARCHITECTURE, IT CAN ALSO OPERATES AT 1.8V | 1.42V~1.58V 1.7V~1.9V | BOTTOM | 260 | 1 | 1.5V | 1mm | unknown | 20 | CYD09S18 | 256 | Not Qualified | 1.8V | 1.58V | 9Mb 512K x 18 | 2 | 660mA | 200MHz | 3.3ns | SRAM | Parallel | 3-STATE | 18 | 19b | 9 Mb | COMMON | Synchronous | 18b | 1.4V | 1.7mm | 17mm | ROHS3 Compliant | Lead Free | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MX25L3206EXCI-12G | Macronix | Datasheet | 5 |
| Min: 1 Mult: 1 | 10 Weeks | Surface Mount | 24-TBGA, CSPBGA | YES | Non-Volatile | -40°C~85°C TA | Tray | 2011 | MX25xxx05/06 | Active | 3 (168 Hours) | 24 | 2.7V~3.6V | BOTTOM | NOT SPECIFIED | 1 | 3V | 1mm | NOT SPECIFIED | R-PBGA-B24 | Not Qualified | 3.6V | 3/3.3V | 2.7V | SPI, Serial | 32Mb 4M x 8 | SYNCHRONOUS | 86MHz | FLASH | SPI | 16MX2 | 2 | 50μs, 3ms | 0.00002A | 33554432 bit | 3.3V | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 1 | 1.2mm | 8mm | 6mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No 11LC161T-E/MNY | Microchip Technology | Datasheet | 37 |
| Min: 1 Mult: 1 | 6 Weeks | Gold | Surface Mount | Surface Mount | 8-WFDFN Exposed Pad | 8 | Non-Volatile | -40°C~125°C TA | Tape & Reel (TR) | 2009 | e4 | yes | Active | 1 (Unlimited) | 8 | EAR99 | 2.5V~5.5V | DUAL | 260 | 1 | 5V | 0.5mm | 40 | 11LC161 | 8 | Not Qualified | 5.5V | 3/5V | 2.5V | Serial | 16Kb 2K x 8 | 5mA | SYNCHRONOUS | 100kHz | EEPROM | Single Wire | 8 | 5ms | 16 kb | 0.000005A | 1-WIRE | 1000000 Write/Erase Cycles | 10ms | 200 | SOFTWARE | 3mm | 2mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No CY62126EV30LL-55ZSXET | Cypress Semiconductor Corp | Datasheet | 14 |
| Min: 1 Mult: 1 | 18 Weeks | Surface Mount | Surface Mount | 44-TSOP (0.400, 10.16mm Width) | 44 | Volatile | -40°C~125°C TA | Tape & Reel (TR) | 1998 | MoBL® | e4 | yes | Active | 3 (168 Hours) | 44 | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | 2.2V~3.6V | DUAL | 260 | 1 | 3V | 0.8mm | 30 | CY62126 | 3V | 3.6V | 2.2V | 1Mb 64K x 16 | 1 | 35mA | SRAM | Parallel | 3-STATE | 16 | 55ns | 16b | 1 Mb | 0.00003A | 55 ns | COMMON | Asynchronous | 16b | No | ROHS3 Compliant | Lead Free | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No PCA24S08ADP,118 | NXP USA Inc. | Datasheet | 3193 | - | Min: 1 Mult: 1 | 7 Weeks | Surface Mount | 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) | YES | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2003 | e3 | Obsolete | 1 (Unlimited) | 8 | Matte Tin (Sn) | 8542.32.00.51 | 2.5V~3.6V | DUAL | NOT SPECIFIED | 1 | 0.65mm | NOT SPECIFIED | PCA24S08 | 8 | S-PDSO-G8 | Not Qualified | 3.6V | 3/3.3V | 2.5V | 8Kb 1K x 8 | SYNCHRONOUS | 400kHz | 0.001mA | EEPROM | I2C | 1MX8 | 8 | 0.000018A | 8388608 bit | SERIAL | I2C | 100000 Write/Erase Cycles | 10 | HARDWARE/SOFTWARE | 10101MMR | 1.1mm | 3mm | 3mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No 93LC56CXT-I/SN | Microchip Technology | Datasheet | 28 |
| Min: 1 Mult: 1 | 6 Weeks | Tin | Surface Mount | Surface Mount | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2011 | e3 | yes | Active | 1 (Unlimited) | 8 | EAR99 | 2.5V~5.5V | DUAL | 260 | 1 | 3V | 1.27mm | 40 | 93LC56C | 8 | 5.5V | 3/5V | 2.5V | Serial | 2Kb 256 x 8 128 x 16 | 2mA | 3MHz | 200 ns | EEPROM | SPI | 16 | 6ms | 2 kb | 0.000001A | MICROWIRE | 1000000 Write/Erase Cycles | 6ms | 200 | SOFTWARE | 8 | 1.75mm | 4.9mm | 3.9mm | No | ROHS3 Compliant | Lead Free | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No SST39LF010-45-4C-MME-T | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | Surface Mount | 34-WFBGA | 34 | Non-Volatile | 0°C~70°C TA | Tape & Reel (TR) | 2010 | SST39 MPF™ | Obsolete | 3 (168 Hours) | 34 | 3V~3.6V | BOTTOM | 3.3V | 0.5mm | unknown | SST39LF010 | Not Qualified | 3.3V | 1Mb 128K x 8 | 20mA | 45ns | FLASH | Parallel | 8b | 128KX8 | 8 | 20μs | 17b | 1 Mb | 0.000015A | Asynchronous | 8b | YES | YES | YES | 32 | 4K | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No W631GG8KB-12 | Winbond Electronics | Datasheet | 40 | - | Min: 1 Mult: 1 | Surface Mount | 78-TFBGA | YES | Volatile | 0°C~95°C TC | Tray | 2010 | yes | Obsolete | 3 (168 Hours) | 78 | AUTO/SELF REFRESH | 1.425V~1.575V | BOTTOM | NOT SPECIFIED | 1 | 1.5V | 0.8mm | NOT SPECIFIED | R-PBGA-B78 | 1.5V | 1.575V | 1.425V | 1Gb 128M x 8 | 1 | 250mA | SYNCHRONOUS | 800MHz | 20ns | DRAM | Parallel | 128MX8 | 8 | 17b | 1 Gb | 1.2mm | 10.5mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No CY7C09269V-12AC | Cypress Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 100 | 12 ns | ROCHESTER ELECTRONICS LLC | Rochester Electronics LLC | CY7C09269V-12AC | 3 | 16384 words | 16000 | 70 °C | PLASTIC/EPOXY | LFQFP | PLASTIC, MS-026, TQFP-100 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Active | QFP | NOT SPECIFIED | 5.84 | No | 3.3 V | e0 | No | TIN LEAD | FLOW-THROUGH OR PIPELINED ARCHITECTURE | CMOS | QUAD | GULL WING | NOT SPECIFIED | 1 | 0.5 mm | unknown | 100 | S-PQFP-G100 | COMMERCIAL | 3.6 V | COMMERCIAL | 3 V | SYNCHRONOUS | 16KX16 | 1.6 mm | 16 | 262144 bit | PARALLEL | DUAL-PORT SRAM | 14 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M25P16-VMN3TPB | Micron | Datasheet | 482 | - | Min: 1 Mult: 1 | EOL (Last Updated: 2 years ago) | Gold | YES | 8 | 8 | 75 MHz | MICRON TECHNOLOGY INC | Micron Technology Inc | M25P16-VMN3TPB | FLASH, NOR | 2097152 words | 2000000 | 125 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP, SOP8,.25 | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | NOT SPECIFIED | 5.38 | Compliant | Yes | 3 V | Tape & Reel | Yes | EAR99 | NOR TYPE | 125 °C | -40 °C | 8542.32.00.51 | Flash Memories | CMOS | DUAL | GULL WING | NOT SPECIFIED | 1 | 1.27 mm | compliant | 75 MHz | 8 | R-PDSO-G8 | Not Qualified | 3.3 V | 3.6 V | 3/3.3 V | AUTOMOTIVE | 2.7 V | 2.7 V | Serial (SPI) | 3.6 V | 2.7 V | 1.9 MB | 8 mA | SYNCHRONOUS | 0.015 mA | 15 | 2MX8 | 1.75 mm | 8 | 1 b | 16 Mb | 0.0001 A | 16 | SERIAL | Synchronous | 8 b | FLASH | 3 V | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 256 B | 4.9 mm | 3.9 mm | No | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No TMS418160-60DZ | Texas Instruments | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AM27C010-150DI | Rochester Electronics, LLC | Datasheet | - | - | Min: 1 Mult: 1 | Through Hole | 32-CDIP (0.600", 15.24mm) | 32-CDIP | AM27C010 | Non-Volatile | Rochester Electronics, LLC | Bulk | Active | -40°C ~ 85°C (TA) | - | 4.5V ~ 5.5V | 1Mbit | 150 ns | EPROM | Parallel | - | 128K x 8 |
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M27C4001-45XF1
STMicroelectronics
Package:Memory
Price: please inquire
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AT28HC256E-70JC
Atmel
Package:Memory
Price: please inquire
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GT28F160B3BA110
Intel
Package:Memory
Price: please inquire
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5962-8700201UA
Renesas Electronics America Inc
Package:Memory
Price: please inquire
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EDB8132B4PB-8D-F-D
Micron Technology Inc.
Package:Memory
24.416557
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BR24T02NUX-WTR
ROHM Semiconductor
Package:Memory
0.338242
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S29AL016J70FFI012
Cypress Semiconductor Corp
Package:Memory
0.211951
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SST39VF800A-70-4C-MAQE-T
Microchip Technology
Package:Memory
2.840508
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CYD09S18V18-200BBXC
Cypress Semiconductor Corp
Package:Memory
118.682670
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MX25L3206EXCI-12G
Macronix
Package:Memory
1.374312
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11LC161T-E/MNY
Microchip Technology
Package:Memory
0.613058
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CY62126EV30LL-55ZSXET
Cypress Semiconductor Corp
Package:Memory
0.546603
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PCA24S08ADP,118
NXP USA Inc.
Package:Memory
Price: please inquire
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93LC56CXT-I/SN
Microchip Technology
Package:Memory
0.428409
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SST39LF010-45-4C-MME-T
Microchip Technology
Package:Memory
Price: please inquire
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W631GG8KB-12
Winbond Electronics
Package:Memory
Price: please inquire
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CY7C09269V-12AC
Cypress Semiconductor
Package:Memory
Price: please inquire
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M25P16-VMN3TPB
Micron
Package:Memory
Price: please inquire
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TMS418160-60DZ
Texas Instruments
Package:Memory
Price: please inquire
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AM27C010-150DI
Rochester Electronics, LLC
Package:Memory
Price: please inquire