The category is 'Interface - Specialized'
- All Manufacturers
- Interface
- Moisture Sensitivity Level (MSL)
- Number of Terminations
- Part Status
- Power Supplies
- Published
- Qualification Status
- RoHS Status
- Temperature Grade
- Terminal Form
- Terminal Position
- Packaging
- Power Supplies:
1.22.53.3V
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Contact Plating | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Operating Temperature (Max.) | Operating Temperature (Min.) | Packaging | Published | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Applications | HTS Code | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Interface | uPs/uCs/Peripheral ICs Type | Clock Frequency | Supply Current-Max | Bus Compatibility | Data Transfer Rate-Max | Height | Height Seated (Max) | Length | Width | Thickness | RoHS Status | Lead Free |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | Mfr Part No PX1011AI-EL1/G,551 | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 81-LFBGA | YES | 85°C | -40°C | Tray | 2006 | Obsolete | 3 (168 Hours) | 81 | PCI Express MAX to PCI Express PHY | 1.2V | BOTTOM | BALL | 0.8mm | PX1011 | S-PBGA-B81 | Not Qualified | 1.22.53.3V | INDUSTRIAL | IEEE 1149.1 | 25mA | ROHS3 Compliant | |||||||||||||||||||||||||||||
![]() | Mfr Part No PX1011A-EL1,551 | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 81-LFBGA | YES | 70°C | Tray | 2006 | Obsolete | 3 (168 Hours) | 81 | PCI Express MAX to PCI Express PHY | 1.2V | BOTTOM | BALL | 0.8mm | unknown | PX1011 | S-PBGA-B81 | Not Qualified | 1.22.53.3V | COMMERCIAL | IEEE 1149.1 | 25mA | ROHS3 Compliant | |||||||||||||||||||||||||||||
![]() | Mfr Part No PX1012AI-EL1/G,551 | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 81-LFBGA | YES | 85°C | -40°C | Tray | 2006 | Obsolete | 3 (168 Hours) | 81 | PCI Express MAX to PCI Express PHY | 1.2V | BOTTOM | BALL | 0.8mm | PX1012 | S-PBGA-B81 | Not Qualified | 1.22.53.3V | INDUSTRIAL | IEEE 1149.1 | 25mA | ROHS3 Compliant | |||||||||||||||||||||||||||||
![]() | Mfr Part No 89HPES16T4G2ZABXG | Integrated Device Technology (IDT) | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | Copper, Silver, Tin | Surface Mount | 288 | 1999 | e1 | yes | Active | 3 (168 Hours) | 288 | EAR99 | TIN SILVER COPPER | 70°C | 0°C | 8542.39.00.01 | BOTTOM | BALL | 260 | 1V | 30 | 288 | Not Qualified | 1.1V | 1.22.53.3V | COMMERCIAL | 0.9V | PCI Express | BUS CONTROLLER, PCI | 125MHz | PCI | 1.7mm | 23mm | 23mm | 1.1mm | RoHS Compliant | Lead Free | ||||||||||||||||
![]() | Mfr Part No 89HPES16T4G2ZABXG8 | Integrated Device Technology (IDT) | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | Copper, Silver, Tin | Surface Mount | 288 | Tape & Reel (TR) | 1999 | e1 | yes | Active | 3 (168 Hours) | 288 | EAR99 | TIN SILVER COPPER | 70°C | 0°C | 8542.39.00.01 | BOTTOM | BALL | 260 | 1V | NOT SPECIFIED | 288 | Not Qualified | 1.1V | 1.22.53.3V | COMMERCIAL | 0.9V | PCI Express | BUS CONTROLLER, PCI | 125MHz | PCI; SMBUS | 16000 MBps | 1.7mm | 23mm | 23mm | 1.1mm | RoHS Compliant | Lead Free | ||||||||||||||
![]() | Mfr Part No 89HPES16T4G2ZABX | Integrated Device Technology (IDT) | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | Lead, Tin | Surface Mount | 288 | 1999 | e0 | no | Active | 3 (168 Hours) | 288 | EAR99 | Tin/Lead (Sn63Pb37) | 70°C | 0°C | 8542.39.00.01 | BOTTOM | BALL | 225 | 1V | not_compliant | 20 | 288 | Not Qualified | 1.1V | 1.22.53.3V | COMMERCIAL | 0.9V | PCI Express | BUS CONTROLLER, PCI | 125MHz | PCI | 1.1mm | 23mm | 23mm | 1.1mm | Non-RoHS Compliant | Contains Lead | |||||||||||||||
![]() | Mfr Part No 89HPES16T4G2ZABX8 | Integrated Device Technology (IDT) | Datasheet | - | - | Min: 1 Mult: 1 | Lead, Tin | Surface Mount | 288 | Tape & Reel (TR) | 1999 | e0 | no | Active | 3 (168 Hours) | 288 | EAR99 | Tin/Lead (Sn63Pb37) | 70°C | 0°C | 8542.39.00.01 | BOTTOM | BALL | 225 | 1V | not_compliant | NOT SPECIFIED | 288 | Not Qualified | 1.1V | 1.22.53.3V | COMMERCIAL | 0.9V | PCI Express | BUS CONTROLLER, PCI | 125MHz | PCI; SMBUS | 16000 MBps | 1.7mm | 23mm | 23mm | 1.1mm | Non-RoHS Compliant | Contains Lead |
PX1011AI-EL1/G,551
NXP USA Inc.
Package:Interface - Specialized
Price: please inquire
PX1011A-EL1,551
NXP USA Inc.
Package:Interface - Specialized
Price: please inquire
PX1012AI-EL1/G,551
NXP USA Inc.
Package:Interface - Specialized
Price: please inquire
89HPES16T4G2ZABXG
Integrated Device Technology (IDT)
Package:Interface - Specialized
Price: please inquire
89HPES16T4G2ZABXG8
Integrated Device Technology (IDT)
Package:Interface - Specialized
Price: please inquire
89HPES16T4G2ZABX
Integrated Device Technology (IDT)
Package:Interface - Specialized
Price: please inquire
89HPES16T4G2ZABX8
Integrated Device Technology (IDT)
Package:Interface - Specialized
Price: please inquire
