The category is 'Interface - Telecom'
Interface - Telecom (13)
- All Manufacturers
- Base Part Number
- Function
- Interface
- Mounting Type
- Number of Circuits
- Operating Temperature
- Package / Case
- Packaging
- Part Status
- Voltage - Supply
- Current - Supply
- Moisture Sensitivity Level (MSL)
- Package / Case:
552-BGA
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | Terminal Finish | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Function | Qualification Status | Operating Supply Voltage | Interface | Number of Circuits | Operating Supply Current | Current - Supply | Data Rate | Includes | Height Seated (Max) | Length | Width | Radiation Hardening | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No ZL50110GAG2 | Microchip Technology | Datasheet | 96 |
| Min: 1 Mult: 1 | 8 Weeks | Surface Mount | Surface Mount | 552-BGA | 552 | -40°C~85°C | Tray | 2009 | yes | Active | 3 (168 Hours) | 552 | 1.65V~1.95V | BOTTOM | BALL | 1.8V | ZL50110 | Telecom Circuit | 1.8V | TDM | 1 | 950mA | 1 Gbps | 2.53mm | 35mm | 35mm | No | ROHS3 Compliant | ||||||||||||
 | Mfr Part No ZL50114GAG2 | Microchip Technology | Datasheet | 1095 |
| Min: 1 Mult: 1 | 8 Weeks | Surface Mount | Surface Mount | 552-BGA | 552 | -40°C~85°C | Tray | 2009 | e1 | Active | 3 (168 Hours) | 552 | TIN SILVER COPPER | 1.65V~1.95V | BOTTOM | BALL | 1.8V | ZL50114 | Telecom Circuit | 1.8V | TDM | 1 | 950mA | 1 Gbps | 2.53mm | 35mm | 35mm | No | ROHS3 Compliant | |||||||||||
| Mfr Part No ZL50111GAG2 | Microchip Technology | Datasheet | 4000 | - | Min: 1 Mult: 1 | 8 Weeks | Surface Mount | 552-BGA | 552-PBGA (35x35) | -40°C~85°C | Tray | Active | 3 (168 Hours) | 1.65V~1.95V | ZL50111 | Telecom Circuit | TDM | 1 | 950mA | ROHS3 Compliant | |||||||||||||||||||||||||
| Mfr Part No ZL50112GAG2 | Microchip Technology | Datasheet | 4 | - | Min: 1 Mult: 1 | 8 Weeks | Surface Mount | Surface Mount | 552-BGA | 552 | -40°C~85°C | Tray | 2009 | e1 | Active | 3 (168 Hours) | 552 | TIN SILVER COPPER | 1.65V~1.95V | BOTTOM | BALL | 1.8V | ZL50112 | Telecom Circuit | 1.8V | TDM | 1 | 950mA | 1 Gbps | 2.53mm | 35mm | 35mm | No | ROHS3 Compliant | |||||||||||
| Mfr Part No ZL50110GAG | Microsemi | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 552-BGA | 552-PBGA (35x35) | -40°C ~ 85°C | Tray | -- | Obsolete | 1.65 V ~ 1.95 V | ZL50110 | Telecom Circuit | TDM | 1 | 950mA | -- | ||||||||||||||||||||||||||
| Mfr Part No ZL50112GAG2 | Microsemi | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 552-BGA | 552-PBGA (35x35) | -40°C ~ 85°C | Tray | -- | Active | 1.65 V ~ 1.95 V | ZL50112 | Telecom Circuit | TDM | 1 | 950mA | -- | ||||||||||||||||||||||||||
| Mfr Part No ZL50114GAG2 | Microsemi | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 552-BGA | 552-PBGA (35x35) | -40°C ~ 85°C | Tray | -- | Active | 1.65 V ~ 1.95 V | ZL50114 | Telecom Circuit | TDM | 1 | 950mA | -- | ||||||||||||||||||||||||||
| Mfr Part No ZL50110GAG2 | Microsemi | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 552-BGA | 552-PBGA (35x35) | -40°C ~ 85°C | Tray | -- | Active | 1.65 V ~ 1.95 V | ZL50110 | Telecom Circuit | TDM | 1 | 950mA | -- | ||||||||||||||||||||||||||
| Mfr Part No ZL50111GAG | Microsemi | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 552-BGA | 552-PBGA (35x35) | -40°C ~ 85°C | Tray | -- | Obsolete | 1.65 V ~ 1.95 V | ZL50111 | Telecom Circuit | TDM | 1 | 950mA | -- | ||||||||||||||||||||||||||
| Mfr Part No ZL50114GAG | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 552-BGA | YES | -40°C~85°C | Tray | e0 | no | Obsolete | 3 (168 Hours) | 552 | TIN LEAD | 1.65V~1.95V | BOTTOM | BALL | 225 | 1.8V | 30 | ZL50114 | S-PBGA-B552 | Telecom Circuit | Not Qualified | TDM | 1 | 950mA | 2.53mm | 35mm | 35mm | Non-RoHS Compliant | ||||||||||||
| Mfr Part No ZL50111GAG | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 552-BGA | YES | -40°C~85°C | Tray | e0 | no | Obsolete | 3 (168 Hours) | 552 | TIN LEAD | 1.65V~1.95V | BOTTOM | BALL | 225 | 1.8V | 30 | ZL50111 | S-PBGA-B552 | Telecom Circuit | Not Qualified | TDM | 1 | 950mA | 2.53mm | 35mm | 35mm | Non-RoHS Compliant | ||||||||||||
| Mfr Part No ZL50110GAG | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 552-BGA | YES | -40°C~85°C | Tray | 2009 | e0 | no | Obsolete | 3 (168 Hours) | 552 | TIN LEAD | 1.65V~1.95V | BOTTOM | BALL | 225 | 1.8V | 30 | ZL50110 | S-PBGA-B552 | Telecom Circuit | Not Qualified | TDM | 1 | 950mA | 2.53mm | 35mm | 35mm | Non-RoHS Compliant | |||||||||||
| Mfr Part No ZL50112GAG | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | Surface Mount | 552-BGA | 552 | -40°C~85°C | Tray | Obsolete | 3 (168 Hours) | 552 | 1.65V~1.95V | BOTTOM | BALL | 1.8V | ZL50112 | Telecom Circuit | Not Qualified | 1.8V | TDM | 1 | 950mA | 1 Gbps | 2.53mm | 35mm | 35mm | Non-RoHS Compliant |
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ZL50110GAG2
Microchip Technology
Package:Interface - Telecom
83.995074
-
ZL50114GAG2
Microchip Technology
Package:Interface - Telecom
63.054930
-
ZL50111GAG2
Microchip Technology
Package:Interface - Telecom
Price: please inquire
-
ZL50112GAG2
Microchip Technology
Package:Interface - Telecom
Price: please inquire
-
ZL50110GAG
Microsemi
Package:Interface - Telecom
Price: please inquire
-
ZL50112GAG2
Microsemi
Package:Interface - Telecom
Price: please inquire
-
ZL50114GAG2
Microsemi
Package:Interface - Telecom
Price: please inquire
-
ZL50110GAG2
Microsemi
Package:Interface - Telecom
Price: please inquire
-
ZL50111GAG
Microsemi
Package:Interface - Telecom
Price: please inquire
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ZL50114GAG
Microchip Technology
Package:Interface - Telecom
Price: please inquire
-
ZL50111GAG
Microchip Technology
Package:Interface - Telecom
Price: please inquire
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ZL50110GAG
Microchip Technology
Package:Interface - Telecom
Price: please inquire
-
ZL50112GAG
Microsemi Corporation
Package:Interface - Telecom
Price: please inquire