The category is 'Interface - Telecom'
Interface - Telecom (18)
- All Manufacturers
- Function
- Interface
- Mounting Type
- Number of Circuits
- Operating Temperature
- Package / Case
- Part Status
- Voltage - Supply
- Packaging
- Factory Lead Time
- Moisture Sensitivity Level (MSL)
- RoHS Status
- Package / Case:
64-VFQFN Exposed Pad
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Lifecycle Status | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Usage Level | Operating Temperature | Packaging | Published | Series | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | Power (Watts) | Voltage - Supply | Terminal Position | Terminal Form | Supply Voltage | Terminal Pitch | JESD-30 Code | Function | Qualification Status | Operating Supply Voltage | Power Supplies | Interface | Number of Circuits | Operating Supply Current | uPs/uCs/Peripheral ICs Type | Current - Supply | Includes | Telecom IC Type | Max Supply Voltage (DC) | Min Supply Voltage (DC) | Hybrid | Length | Width | Radiation Hardening | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No ZL88601LDF1 | Microchip Technology | Datasheet | 1607 |
| Min: 1 Mult: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | Surface Mount | Surface Mount | 64-VFQFN Exposed Pad | Industrial grade | -40°C~85°C | Tape & Reel (TR) | Active | 1 (Unlimited) | 64 | 3.135V~3.465V | QUAD | 3.3V | 0.5mm | S-XQCC-N64 | Telecom Circuit | 3.3V | PCM | 1 | 3.465V | 3.135V | 2-4 CONVERSION | 9mm | 9mm | No | ROHS3 Compliant | ||||||||||||||||
 | Mfr Part No ZL88702LDF1 | Microchip Technology | Datasheet | 484 |
| Min: 1 Mult: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | Surface Mount | Surface Mount | 64-VFQFN Exposed Pad | -40°C~85°C | Tape & Reel (TR) | 2001 | yes | Active | 1 (Unlimited) | 3.135V~3.465V | Telecom Circuit | PCM | 1 | DIGITAL SIGNAL PROCESSOR, OTHER | ROHS3 Compliant | ||||||||||||||||||||||||||
 | Mfr Part No ZL88601LDG1 | Microchip Technology | Datasheet | 7600 |
| Min: 1 Mult: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | Surface Mount | Surface Mount | 64-VFQFN Exposed Pad | Industrial grade | -40°C~85°C | Tray | Active | 3 (168 Hours) | 64 | 3.135V~3.465V | QUAD | 3.3V | 0.5mm | S-XQCC-N64 | Telecom Circuit | 3.3V | PCM | 1 | 3.465V | 3.135V | 2-4 CONVERSION | 9mm | 9mm | No | ROHS3 Compliant | ||||||||||||||||
 | Mfr Part No ZL88801LDG1 | Microchip Technology | Datasheet | 4000 |
| Min: 1 Mult: 1 | 24 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | Surface Mount | Surface Mount | 64-VFQFN Exposed Pad | -40°C~85°C | Tray | Active | 3 (168 Hours) | 64 | 3.135V~3.465V | QUAD | 3.3V | S-XQCC-N64 | Telecom Circuit | 3.3V | PCM | 1 | 25mA | 3.465V | 3.135V | 9mm | 9mm | No | ROHS3 Compliant | ||||||||||||||||||
 | Mfr Part No ZL88801LDF1 | Microchip Technology | Datasheet | 123042 |
| Min: 1 Mult: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | Surface Mount | Surface Mount | 64-VFQFN Exposed Pad | -40°C~85°C | Tape & Reel (TR) | Active | 1 (Unlimited) | 64 | 3.135V~3.465V | QUAD | 3.3V | S-XQCC-N64 | Telecom Circuit | 3.3V | PCM | 1 | 25mA | 3.465V | 3.135V | 9mm | 9mm | No | ROHS3 Compliant | ||||||||||||||||||
 | Mfr Part No ZL88701LDG1 | Microchip Technology | Datasheet | 1244 |
| Min: 1 Mult: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | Surface Mount | Surface Mount | 64-VFQFN Exposed Pad | Industrial grade | -40°C~85°C | Tray | yes | Active | 3 (168 Hours) | 3.135V~3.465V | Telecom Circuit | 3.3V | PCM | 1 | DIGITAL SIGNAL PROCESSOR, OTHER | 3.465V | 3.135V | No | ROHS3 Compliant | ||||||||||||||||||||||
 | Mfr Part No ZL88602LDG1 | Microchip Technology | Datasheet | 2640 |
| Min: 1 Mult: 1 | 24 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | Surface Mount | Surface Mount | 64-VFQFN Exposed Pad | Industrial grade | -40°C~85°C | Tray | 2001 | Active | 3 (168 Hours) | 64 | 3.135V~3.465V | QUAD | 3.3V | 0.5mm | S-XQCC-N64 | Telecom Circuit | 3.3V | PCM | 1 | 3.465V | 3.135V | 2-4 CONVERSION | 9mm | 9mm | No | ROHS3 Compliant | |||||||||||||||
 | Mfr Part No ZL88602LDF1 | Microchip Technology | Datasheet | 2080 |
| Min: 1 Mult: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | Surface Mount | Surface Mount | 64-VFQFN Exposed Pad | Industrial grade | -40°C~85°C | Tape & Reel (TR) | Active | 1 (Unlimited) | 64 | 3.135V~3.465V | QUAD | 3.3V | 0.5mm | S-XQCC-N64 | Telecom Circuit | 3.3V | PCM | 1 | 3.465V | 3.135V | 2-4 CONVERSION | 9mm | 9mm | No | ROHS3 Compliant | ||||||||||||||||
 | Mfr Part No ZL88701LDF1 | Microchip Technology | Datasheet | 2640 |
| Min: 1 Mult: 1 | 24 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | Surface Mount | Surface Mount | 64-VFQFN Exposed Pad | Industrial grade | -40°C~85°C | Tape & Reel (TR) | 2001 | yes | Active | 1 (Unlimited) | 3.135V~3.465V | Telecom Circuit | 3.3V | PCM | 1 | DIGITAL SIGNAL PROCESSOR, OTHER | 3.465V | 3.135V | No | ROHS3 Compliant | |||||||||||||||||||||
 | Mfr Part No ZL88702LDG1 | Microchip Technology | Datasheet | 16 |
| Min: 1 Mult: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | Surface Mount | Surface Mount | 64-VFQFN Exposed Pad | 64 | Industrial grade | -40°C~85°C | Tray | 2001 | yes | Active | 3 (168 Hours) | 3.135V~3.465V | Telecom Circuit | 3.3V | PCM | 1 | DIGITAL SIGNAL PROCESSOR, OTHER | 3.465V | 3.135V | No | ROHS3 Compliant | ||||||||||||||||||||
 | Mfr Part No ZL88702LDG1 | Microsemi | Datasheet | 1664 | - | Min: 1 Mult: 1 | Surface Mount | 64-VFQFN Exposed Pad | 64-QFN (9x9) | -40°C ~ 85°C | Tray | -- | Active | 3.135 V ~ 3.465 V | Telecom Circuit | PCM | 1 | -- | -- | ||||||||||||||||||||||||||||||
| Mfr Part No ZL88601LDG1 | Microsemi | Datasheet | 40 | - | Min: 1 Mult: 1 | Surface Mount | 64-VFQFN Exposed Pad | 64-QFN (9x9) | -40°C ~ 85°C | Tray | -- | Active | 3.135 V ~ 3.465 V | Telecom Circuit | PCM | 1 | -- | -- | ||||||||||||||||||||||||||||||
| Mfr Part No ZL88701LDF1 | Microsemi | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 64-VFQFN Exposed Pad | 64-QFN (9x9) | -40°C ~ 85°C | Tape & Reel (TR) | -- | Active | 3.135 V ~ 3.465 V | Telecom Circuit | PCM | 1 | -- | -- | ||||||||||||||||||||||||||||||
| Mfr Part No ZL88801LDF1 | Microsemi | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 64-VFQFN Exposed Pad | 64-QFN (9x9) | -40°C ~ 85°C | Tape & Reel (TR) | -- | Active | 3.135 V ~ 3.465 V | Telecom Circuit | PCM | 1 | -- | -- | ||||||||||||||||||||||||||||||
| Mfr Part No ZL88801LDG1 | Microsemi | Datasheet | 520 | - | Min: 1 Mult: 1 | Surface Mount | 64-VFQFN Exposed Pad | 64-QFN (9x9) | -40°C ~ 85°C | Tray | -- | Active | 3.135 V ~ 3.465 V | Telecom Circuit | PCM | 1 | -- | -- | ||||||||||||||||||||||||||||||
| Mfr Part No ZL88601LDF1 | Microsemi | Datasheet | 1111 | - | Min: 1 Mult: 1 | Surface Mount | 64-VFQFN Exposed Pad | 64-QFN (9x9) | -40°C ~ 85°C | Tape & Reel (TR) | -- | Active | 3.135 V ~ 3.465 V | Telecom Circuit | PCM | 1 | -- | -- | ||||||||||||||||||||||||||||||
 | Mfr Part No CMX7261Q1 | CML Microcircuits | Datasheet | 423 |
| Min: 1 Mult: 1 | 10 Weeks | Surface Mount | 64-VFQFN Exposed Pad | YES | -40°C~85°C | Active | 2A (4 Weeks) | 64 | 3.5W | 3V~3.6V | QUAD | NO LEAD | 3.3V | 0.5mm | S-XQCC-N64 | Transcoder | Not Qualified | 3.3V | C-Bus | 1 | 670μA | TELECOM CIRCUIT | 9mm | 9mm | ROHS3 Compliant | ||||||||||||||||||
| Mfr Part No CMX7262Q1 | CML Microcircuits | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | Surface Mount | 64-VFQFN Exposed Pad | -40°C~85°C | Active | 2A (4 Weeks) | 3.5W | 3V~3.6V | TWELP Vocoder | Not Qualified | C-Bus | 1 | 670μA | ROHS3 Compliant |
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ZL88601LDF1
Microchip Technology
Package:Interface - Telecom
6.434402
-
ZL88702LDF1
Microchip Technology
Package:Interface - Telecom
7.641944
-
ZL88601LDG1
Microchip Technology
Package:Interface - Telecom
10.271152
-
ZL88801LDG1
Microchip Technology
Package:Interface - Telecom
10.427798
-
ZL88801LDF1
Microchip Technology
Package:Interface - Telecom
10.415959
-
ZL88701LDG1
Microchip Technology
Package:Interface - Telecom
6.299972
-
ZL88602LDG1
Microchip Technology
Package:Interface - Telecom
6.597183
-
ZL88602LDF1
Microchip Technology
Package:Interface - Telecom
6.613368
-
ZL88701LDF1
Microchip Technology
Package:Interface - Telecom
10.405267
-
ZL88702LDG1
Microchip Technology
Package:Interface - Telecom
9.708886
-
ZL88702LDG1
Microsemi
Package:Interface - Telecom
Price: please inquire
-
ZL88601LDG1
Microsemi
Package:Interface - Telecom
Price: please inquire
-
ZL88701LDF1
Microsemi
Package:Interface - Telecom
Price: please inquire
-
ZL88801LDF1
Microsemi
Package:Interface - Telecom
Price: please inquire
-
ZL88801LDG1
Microsemi
Package:Interface - Telecom
Price: please inquire
-
ZL88601LDF1
Microsemi
Package:Interface - Telecom
Price: please inquire
-
CMX7261Q1
CML Microcircuits
Package:Interface - Telecom
15.643353
-
CMX7262Q1
CML Microcircuits
Package:Interface - Telecom
Price: please inquire