The category is 'Interface - Telecom'
Interface - Telecom (119)
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HOTlink II™
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Material | Number of Terminals | Base Product Number | Ihs Manufacturer | Manufacturer | Manufacturer Part Number | Mfr | Model | Moisture Sensitivity Levels | Nominal cross section | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Supply Voltage-Nom | Surface protection | Operating Temperature | Packaging | Published | Series | Size / Dimension | Tolerance | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Capacitance | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Supply Voltage | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Function | Qualification Status | Operating Supply Voltage | Temperature Grade | Number of Channels | Voltage | Interface | Number of Circuits | Max Supply Voltage | Min Supply Voltage | Nominal Supply Current | Current - Supply | Data Rate | Seated Height-Max | Insulation | Telecom IC Type | Number of Transceivers | Height Seated (Max) | Length | Width | Radiation Hardening | RoHS Status | Lead Free |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No CYV15G0201DXB-BBXI | Cypress Semiconductor Corp | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | Surface Mount | 196-LBGA | 196 | -40°C~85°C | Tray | 2005 | HOTlink II™ | e1 | Obsolete | 5 (48 Hours) | 196 | Tin/Silver/Copper (Sn/Ag/Cu) | 3.135V~3.465V | BOTTOM | BALL | 260 | 3.3V | 1mm | unknown | 20 | CY*15G02 | Transceiver | Not Qualified | 3.3V | LVTTL | 2 | 710mA | 570μA | 1500000 Mbps | 2 | 1.5mm | 15mm | 15mm | ROHS3 Compliant | Lead Free | ||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No CYP15G0401RB-BGXC | Cypress Semiconductor Corp | Datasheet | 8 |
| Min: 1 Mult: 1 | Surface Mount | Surface Mount | 256-LBGA Exposed Pad | 256 | 256-BGA (27x27) | 0°C~70°C | Tray | 2005 | HOTlink II™ | Obsolete | 3 (168 Hours) | 70°C | 0°C | 3.135V~3.465V | CY*15G04 | Receiver | 3.3V | 4 | LVTTL | 4 | 3.465V | 3.135V | 690mA | 640mA | No | ROHS3 Compliant | Lead Free | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No CYV15G0101DXB-BBC | Cypress Semiconductor Corp | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | Surface Mount | 100-LBGA | 100 | 0°C~70°C | Tray | 2005 | HOTlink II™ | e0 | Obsolete | 3 (168 Hours) | 100 | Tin/Lead (Sn/Pb) | 3.135V~3.465V | BOTTOM | BALL | 225 | 3.3V | not_compliant | NOT SPECIFIED | CY*15G01 | Transceiver | Not Qualified | 3.3V | 1 | LVTTL | 500mA | 390mA | TELECOM CIRCUIT | 1 | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No CYV15G0401DXB-BGXC | Cypress Semiconductor Corp | Datasheet | 2019 |
| Min: 1 Mult: 1 | Surface Mount | Surface Mount | 256-LBGA Exposed Pad | 256 | 0°C~70°C | Tray | 2003 | HOTlink II™ | e1 | yes | Active | 3 (168 Hours) | 256 | 5A991.B.1 | Tin/Silver/Copper (Sn/Ag/Cu) | 3.135V~3.465V | BOTTOM | BALL | 260 | 3.3V | 1.27mm | 30 | CY*15G04 | Transceiver | 3.3V | LVTTL | 4 | 1.06A | 830mA | 1500000 Mbps | 4 | 27mm | 27mm | No | ROHS3 Compliant | Lead Free | ||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No CYP15G0401RB-BGC | Cypress Semiconductor Corp | Datasheet | 12 |
| Min: 1 Mult: 1 | Surface Mount | Surface Mount | 256-LBGA Exposed Pad | 256 | 0°C~70°C | Tray | 2005 | HOTlink II™ | e0 | Obsolete | 3 (168 Hours) | 256 | Tin/Lead (Sn/Pb) | 3.135V~3.465V | BOTTOM | BALL | 225 | 3.3V | 1.27mm | not_compliant | 30 | CY*15G04 | Receiver | Not Qualified | 3.3V | LVTTL | 4 | 690mA | 640mA | TELECOM CIRCUIT | 27mm | 27mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No CYP15G0401TB-BGC | Cypress Semiconductor Corp | Datasheet | 4000 |
| Min: 1 Mult: 1 | Surface Mount | Surface Mount | 256-LBGA Exposed Pad | 256 | 0°C~70°C | Tray | 2005 | HOTlink II™ | e0 | Obsolete | 3 (168 Hours) | 256 | Tin/Lead (Sn/Pb) | 3.135V~3.465V | BOTTOM | BALL | 225 | 3.3V | 1.27mm | 30 | CY*15G04 | Driver | 3.3V | LVTTL | 4 | 770mA | 590mA | TELECOM CIRCUIT | 27mm | 27mm | No | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No CYV15G0403DXB-BGI | Cypress Semiconductor Corp | Datasheet | 8 |
| Min: 1 Mult: 1 | Surface Mount | Surface Mount | 256-LBGA Exposed Pad | 256 | -40°C~85°C | Tray | 2003 | HOTlink II™ | e0 | Obsolete | 3 (168 Hours) | 256 | Tin/Lead (Sn/Pb) | 3.135V~3.465V | BOTTOM | BALL | 225 | 3.3V | 1.27mm | not_compliant | 30 | CY*15G04 | Transceiver | Not Qualified | 3.3V | LVTTL | 4 | 1.32A | 900mA | 1500000 Mbps | 4 | 27mm | 27mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No CYV15G0401DXB-BGC | Cypress Semiconductor Corp | Datasheet | 8 |
| Min: 1 Mult: 1 | Surface Mount | Surface Mount | 256-LBGA Exposed Pad | 256 | 0°C~70°C | Tray | 2005 | HOTlink II™ | e0 | Obsolete | 5 (48 Hours) | 256 | Tin/Lead (Sn/Pb) | 3.135V~3.465V | BOTTOM | BALL | 225 | 3.3V | 1.27mm | not_compliant | 30 | CY*15G04 | Transceiver | Not Qualified | 3.3V | LVTTL | 4 | 1.06A | 870mA | 1500000 Mbps | 4 | 27mm | 27mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No CYV15G0404RB-BGXC | Cypress Semiconductor Corp | Datasheet | 2019 |
| Min: 1 Mult: 1 | Surface Mount | Surface Mount | 256-LBGA Exposed Pad | 0°C~70°C | Tray | 2005 | HOTlink II™ | e1 | Obsolete | 5 (48 Hours) | 256 | Tin/Silver/Copper (Sn/Ag/Cu) | 3.135V~3.465V | BOTTOM | BALL | 260 | 3.3V | 1.27mm | not_compliant | 20 | CY*15G04 | S-PBGA-B256 | Deserializer | Not Qualified | 3.465V | LVTTL | 4 | 1.27A | 900mA | TELECOM CIRCUIT | 27mm | 27mm | ROHS3 Compliant | Lead Free | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No CYP15G0402DXB-BGC | Cypress Semiconductor Corp | Datasheet | 8 |
| Min: 1 Mult: 1 | Surface Mount | Surface Mount | 256-LBGA Exposed Pad | 256 | 0°C~70°C | Tray | 2005 | HOTlink II™ | e0 | Obsolete | 3 (168 Hours) | 256 | Tin/Lead (Sn/Pb) | 3.135V~3.465V | BOTTOM | BALL | 225 | 1 | 3.3V | 1.27mm | unknown | 30 | CY*15G04 | 256 | Not Qualified | 3.3V | LVTTL | 4 | 1.06A | 830mA | 1.5 Gbps | TELECOM CIRCUIT | 4 | 27mm | 27mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No CYP15G0402DXB-BGXC | Infineon | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 256-BGA Exposed Pad | YES | 256-L2BGA (27x27) | Copper | 256 | CYP15G0402 | ROCHESTER ELECTRONICS LLC | Rochester Electronics LLC | CYP15G0402DXB-BGXC | Infineon Technologies | Standard version | NOT SPECIFIED | 4 - 4 | 70 °C | Tray | PLASTIC/EPOXY | BGA | 27 X 27 MM, 1.57 MM HEIGHT, LEAD FREE, TBGA-256 | SQUARE | GRID ARRAY | Active | BGA | Obsolete | 20 | 5.13 | Yes | 3.3 V | Tinned | 0°C ~ 70°C | HOTlink II™ | e1 | Yes | TIN SILVER COPPER | BICMOS | 3.135V ~ 3.465V | BOTTOM | BALL | 260 | 1 | 1.27 mm | unknown | 256 | S-PBGA-B256 | - | COMMERCIAL | COMMERCIAL | LVTTL | 4 | 830mA | 1.745 mm | None | TELECOM CIRCUIT | 27 mm | 27 mm | |||||||||||||||||||||||||||||||
| Mfr Part No CYP15G0201DXB-BBXI | Infineon | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 196-LBGA | 196-FBGA (15x15) | CYP15G0201 | Infineon Technologies | Tray | Last Time Buy | -40°C ~ 65°C | HOTlink II™ | 3.135V ~ 3.465V | Transceiver | LVTTL | 2 | 570mA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No CYV15G0404DXB-BGC | Infineon | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 256-BGA Exposed Pad | 256-L2BGA (27x27) | CYV15G0404 | Infineon Technologies | Tray | Obsolete | 0°C ~ 70°C | HOTlink II™ | 3.135V ~ 3.465V | - | LVTTL | 4 | 900mA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No CYV15G0403DXB-BGXC | Infineon | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 256-BGA Exposed Pad | 256-L2BGA (27x27) | CYV15G0403 | Infineon Technologies | Tray | Obsolete | Yes | 0°C ~ 70°C | HOTlink II™ | 3.135V ~ 3.465V | Transceiver | LVTTL | 4 | 900mA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No CYP15G0401RB-BGC | Infineon | Datasheet | - | - | Min: 1 Mult: 1 | Dual .25in Quick-Connect w/Resistor & Lead Wires | 256-BGA Exposed Pad | YES | 256-L2BGA (27x27) | 256 | CYP15G0401 | ROCHESTER ELECTRONICS LLC | BARKER MICROFARADS INC | CYP15G0401RB-BGC | Infineon Technologies | NOT SPECIFIED | 70 °C | Tray | PLASTIC/EPOXY | BGA | 27 X 27 MM, 1.57 MM HEIGHT, BGA-256 | SQUARE | GRID ARRAY | Active | BGA | Obsolete | NOT SPECIFIED | 5.08 | No | 3.3 V | 0°C ~ 70°C | Case Code - 1 | HOTlink II™ | 1.437in W | -0%/+20% | e0 | No | TIN LEAD | 64uF | BICMOS | 3.135V ~ 3.465V | BOTTOM | BALL | NOT SPECIFIED | 1 | 1.27 mm | unknown | 256 | S-PBGA-B256 | Receiver | COMMERCIAL | COMMERCIAL | 125V | LVTTL | 4 | 640mA | 1.745 mm | TELECOM CIRCUIT | 2.750in | 27 mm | 27 mm | ||||||||||||||||||||||||||||||
| Mfr Part No CYP15G0401TB-BGI | Infineon | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 256-BGA Exposed Pad | YES | 256-L2BGA (27x27) | 256 | CYP15G0401 | ROCHESTER ELECTRONICS LLC | TANSITOR ELECTRONICS COMPANY | CYP15G0401TB-BGI | Infineon Technologies | NOT SPECIFIED | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | 27 X 27 MM, 1.57 MM HEIGHT, TBGA-256 | SQUARE | GRID ARRAY | Active | BGA | Obsolete | NOT SPECIFIED | 5.67 | YES | No | 3.3 V | -40°C ~ 85°C | HOTlink II™ | e0 | No | TIN LEAD | BICMOS | 3.135V ~ 3.465V | BOTTOM | BALL | NOT SPECIFIED | 1 | 1.27 mm | unknown | 256 | S-PBGA-B256 | Driver | COMMERCIAL | INDUSTRIAL | LVTTL | 4 | 590mA | 1.745 mm | TELECOM CIRCUIT | 27 mm | 27 mm | ||||||||||||||||||||||||||||||||||
| Mfr Part No CYP15G0101DXB-BBXI | Infineon | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 100-LBGA | 100-TBGA (11x11) | CYP15G0101 | Infineon Technologies | Tray | Discontinued at Digi-Key | -40°C ~ 85°C | HOTlink II™ | 3.135V ~ 3.465V | Transceiver | LVTTL | 390mA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No CYV15G0201DXB-BBC | Infineon | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 196-LBGA | 196-FBGA (15x15) | CYV15G0201 | Infineon Technologies | Tray | Obsolete | 0°C ~ 70°C | HOTlink II™ | 3.135V ~ 3.465V | Transceiver | LVTTL | 2 | 570mA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No CYV15G0404RB-BGXC | Infineon | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 256-BGA Exposed Pad | 256-L2BGA (27x27) | CYV15G0404 | Infineon Technologies | Tray | Obsolete | 0°C ~ 70°C | HOTlink II™ | 3.135V ~ 3.465V | Deserializer | LVTTL | 4 | 900mA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No CYP15G0402DXB-BGC | Infineon | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 256-BGA Exposed Pad | 256-L2BGA (27x27) | CYP15G0402 | Infineon Technologies | Tray | Obsolete | 0°C ~ 70°C | HOTlink II™ | 3.135V ~ 3.465V | - | LVTTL | 4 | 830mA |
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CYV15G0201DXB-BBXI
Cypress Semiconductor Corp
Package:Interface - Telecom
Price: please inquire
-
CYP15G0401RB-BGXC
Cypress Semiconductor Corp
Package:Interface - Telecom
65.232660
-
CYV15G0101DXB-BBC
Cypress Semiconductor Corp
Package:Interface - Telecom
Price: please inquire
-
CYV15G0401DXB-BGXC
Cypress Semiconductor Corp
Package:Interface - Telecom
16.058869
-
CYP15G0401RB-BGC
Cypress Semiconductor Corp
Package:Interface - Telecom
54.210930
-
CYP15G0401TB-BGC
Cypress Semiconductor Corp
Package:Interface - Telecom
27.053304
-
CYV15G0403DXB-BGI
Cypress Semiconductor Corp
Package:Interface - Telecom
100.157306
-
CYV15G0401DXB-BGC
Cypress Semiconductor Corp
Package:Interface - Telecom
43.218701
-
CYV15G0404RB-BGXC
Cypress Semiconductor Corp
Package:Interface - Telecom
75.091189
-
CYP15G0402DXB-BGC
Cypress Semiconductor Corp
Package:Interface - Telecom
27.186635
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CYP15G0402DXB-BGXC
Infineon
Package:Interface - Telecom
Price: please inquire
-
CYP15G0201DXB-BBXI
Infineon
Package:Interface - Telecom
Price: please inquire
-
CYV15G0404DXB-BGC
Infineon
Package:Interface - Telecom
Price: please inquire
-
CYV15G0403DXB-BGXC
Infineon
Package:Interface - Telecom
Price: please inquire
-
CYP15G0401RB-BGC
Infineon
Package:Interface - Telecom
Price: please inquire
-
CYP15G0401TB-BGI
Infineon
Package:Interface - Telecom
Price: please inquire
-
CYP15G0101DXB-BBXI
Infineon
Package:Interface - Telecom
Price: please inquire
-
CYV15G0201DXB-BBC
Infineon
Package:Interface - Telecom
Price: please inquire
-
CYV15G0404RB-BGXC
Infineon
Package:Interface - Telecom
Price: please inquire
-
CYP15G0402DXB-BGC
Infineon
Package:Interface - Telecom
Price: please inquire