The category is 'Interface - Telecom'
Interface - Telecom (119)
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HOTlink II™
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Number of Terminals | Base Product Number | Ihs Manufacturer | Manufacturer | Manufacturer Part Number | Maximum Operating Temperature | Mfr | Minimum Operating Temperature | Moisture Sensitivity Levels | Mounting | Mounting Styles | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | Terminal Finish | Subcategory | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Supply Voltage | Terminal Pitch | Depth | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Function | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Number of Channels | Interface | Number of Circuits | Nominal Supply Current | Current - Supply | Data Rate | Seated Height-Max | Product Type | Max Frequency | Telecom IC Type | Number of Transceivers | Overall Length | Product | Nominal Input Voltage (AC) | Height Seated (Max) | Length | Width | Radiation Hardening | RoHS Status | Lead Free |
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 | Mfr Part No CYP15G0401RB-BGI | Infineon | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 256-BGA Exposed Pad | YES | 256-L2BGA (27x27) | 256 | CYP15G0401 | ROCHESTER ELECTRONICS LLC | Rochester Electronics LLC | CYP15G0401RB-BGI | Infineon Technologies | NOT SPECIFIED | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | 27 X 27 MM, 1.57 MM HEIGHT, BGA-256 | SQUARE | GRID ARRAY | Active | BGA | Obsolete | NOT SPECIFIED | 5.67 | No | 3.3 V | -40°C ~ 85°C | HOTlink II™ | e0 | No | TIN LEAD | BICMOS | 3.135V ~ 3.465V | BOTTOM | BALL | NOT SPECIFIED | 1 | 1.27 mm | unknown | 256 | S-PBGA-B256 | Receiver | COMMERCIAL | INDUSTRIAL | LVTTL | 4 | 640mA | 1.745 mm | TELECOM CIRCUIT | 27 mm | 27 mm | |||||||||||||||||||||||||||||||||||
| Mfr Part No CYV15G0402DXB-BGC | Infineon | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 256-BGA Exposed Pad | 256-L2BGA (27x27) | CYV15G0402 | Infineon Technologies | Tray | Obsolete | 0°C ~ 70°C | HOTlink II™ | 3.135V ~ 3.465V | - | LVTTL | 4 | 830mA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No CYP15G0403DXB-BGXC | Infineon | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 256-BGA Exposed Pad | 256-L2BGA (27x27) | CYP15G0403 | Infineon Technologies | Tray | Obsolete | 0°C ~ 70°C | HOTlink II™ | 3.135V ~ 3.465V | Transceiver | LVTTL | 4 | 900mA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No CYW15G0201DXB-BBC | Infineon | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 196-LBGA | 196-FBGA (15x15) | CYW15G0201 | Infineon Technologies | Tray | Obsolete | 0°C ~ 70°C | HOTlink II™ | 3.135V ~ 3.465V | Transceiver | LVTTL | 2 | 570mA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No CYW15G0201DXB-BBI | Infineon | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 196-LBGA | 196-FBGA (15x15) | CYW15G0201 | Johnson Controls | YK170121B-S0000 | Infineon Technologies | Panel | JHSN_DRIV_YK-YM | Obsolete | -40°C ~ 85°C | HOTlink II™ | 3.135V ~ 3.465V | 21.11 | Transceiver | LVTTL | 2 | 570mA | 320 Hz | 208 VAC | 22.88 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No CYV15G0401DXB-BGC | Infineon | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 256-BGA Exposed Pad | 256-L2BGA (27x27) | CYV15G0401 | Infineon Technologies | Tray | Obsolete | 0°C ~ 70°C | HOTlink II™ | 3.135V ~ 3.465V | Transceiver | LVTTL | 4 | 870mA | 120mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No CYW15G0401DXB-BGI | Infineon | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 256-BGA Exposed Pad | 256-L2BGA (27x27) | CYW15G0401 | Infineon Technologies | Tray | Obsolete | Yes | -40°C ~ 85°C | HOTlink II™ | 3.135V ~ 3.465V | Transceiver | LVTTL | 4 | 830mA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No CYP15G0401DXB-BGXI | Infineon | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 256-BGA Exposed Pad | 16 | 256-L2BGA (27x27) | CYP15G0401 | + 85 C | Infineon Technologies | - 40 C | SMD/SMT | Tray | Obsolete | Compliant | 3.135 V | 3.135 V | -40°C ~ 85°C | HOTlink II™ | Interface ICs | 3.135V ~ 3.465V | Transceiver | 4 Channel | LVTTL | 4 | 830mA | Telecom Interface ICs | HOTLink Transceivers | Lead Free | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No CYV15G0403DXB-BGI | Infineon | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 256-BGA Exposed Pad | 256-L2BGA (27x27) | CYV15G0403 | Infineon Technologies | Tray | Obsolete | -40°C ~ 85°C | HOTlink II™ | 3.135V ~ 3.465V | Transceiver | LVTTL | 4 | 900mA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No CYP15G0401TB-BGXC | Infineon | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 256-BGA Exposed Pad | 256-L2BGA (27x27) | CYP15G0401 | Infineon Technologies | Tray | Obsolete | 0°C ~ 70°C | HOTlink II™ | 3.135V ~ 3.465V | Driver | LVTTL | 4 | 590mA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No CYV15G0404DXB-BGXC | Infineon | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 256-BGA Exposed Pad | 256-L2BGA (27x27) | CYV15G0404 | Infineon Technologies | Tray | Obsolete | 0°C ~ 70°C | HOTlink II™ | 3.135V ~ 3.465V | - | LVTTL | 4 | 900mA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No CYV15G0403DXB-BGC | Infineon | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 256-BGA Exposed Pad | 256-L2BGA (27x27) | CYV15G0403 | Infineon Technologies | Tray | Obsolete | 0°C ~ 70°C | HOTlink II™ | 3.135V ~ 3.465V | Transceiver | LVTTL | 4 | 900mA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No CYP15G0403DXB-BGC | Infineon | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 256-BGA Exposed Pad | 256-L2BGA (27x27) | CYP15G0403 | Infineon Technologies | Tray | Obsolete | 0°C ~ 70°C | HOTlink II™ | 3.135V ~ 3.465V | Transceiver | LVTTL | 4 | 900mA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No CYW15G0401DXB-BGXC | Cypress Semiconductor Corp | Datasheet | 6016 |
| Min: 1 Mult: 1 | Surface Mount | Surface Mount | 256-LBGA Exposed Pad | 256 | 0°C~70°C | Tray | 2003 | HOTlink II™ | e1 | Obsolete | 3 (168 Hours) | 256 | Tin/Silver/Copper (Sn/Ag/Cu) | 3.135V~3.465V | BOTTOM | BALL | 260 | 3.3V | 1.27mm | not_compliant | 20 | CY*15G04 | Transceiver | Not Qualified | 3.3V | LVTTL | 4 | 1.06A | 830mA | 1500000 Mbps | TELECOM CIRCUIT | 4 | 27mm | 27mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No CYP15G0401RB-BGI | Cypress Semiconductor Corp | Datasheet | 4000 |
| Min: 1 Mult: 1 | Surface Mount | Surface Mount | 256-LBGA Exposed Pad | 256 | -40°C~85°C | Tray | 2005 | HOTlink II™ | e0 | Obsolete | 3 (168 Hours) | 256 | Tin/Lead (Sn/Pb) | 3.135V~3.465V | BOTTOM | BALL | 225 | 3.3V | 1.27mm | not_compliant | 30 | CY*15G04 | Receiver | Not Qualified | LVTTL | 4 | 740mA | 640mA | TELECOM CIRCUIT | 27mm | 27mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No CYP15G0403DXB-BGI | Cypress Semiconductor Corp | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | Surface Mount | 256-LBGA Exposed Pad | 256 | -40°C~85°C | Tray | 2003 | HOTlink II™ | e0 | Obsolete | 3 (168 Hours) | 256 | Tin/Lead (Sn/Pb) | 3.135V~3.465V | BOTTOM | BALL | 225 | 3.3V | 1.27mm | not_compliant | 30 | CY*15G04 | Transceiver | Not Qualified | 3.3V | LVTTL | 4 | 1.32A | 900mA | 1500000 Mbps | 4 | 27mm | 27mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No CYW15G0401DXB-BGC | Cypress Semiconductor Corp | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | Surface Mount | 256-LBGA Exposed Pad | 256 | 0°C~70°C | Tray | 2005 | HOTlink II™ | e0 | Obsolete | 3 (168 Hours) | 256 | Tin/Lead (Sn/Pb) | 3.135V~3.465V | BOTTOM | BALL | 225 | 3.3V | 1.27mm | not_compliant | 30 | CY*15G04 | Transceiver | Not Qualified | 3.3V | LVTTL | 4 | 1.06A | 830mA | 1500000 Mbps | 4 | 27mm | 27mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No CYW15G0401DXB-BGI | Cypress Semiconductor Corp | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | Surface Mount | 256-LBGA Exposed Pad | 256 | -40°C~85°C | Tray | 2005 | HOTlink II™ | e0 | Obsolete | 3 (168 Hours) | 256 | Tin/Lead (Sn/Pb) | 3.135V~3.465V | BOTTOM | BALL | 225 | 3.3V | 1.27mm | not_compliant | 30 | CY*15G04 | Transceiver | Not Qualified | 3.3V | LVTTL | 4 | 1.1A | 830mA | 1500000 Mbps | 4 | 27mm | 27mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No CYW15G0201DXB-BBI | Cypress Semiconductor Corp | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | Surface Mount | 196-LBGA | 196 | -40°C~85°C | Tray | 2005 | HOTlink II™ | e0 | Obsolete | 3 (168 Hours) | 196 | Tin/Lead (Sn/Pb) | 3.135V~3.465V | BOTTOM | BALL | 240 | 3.3V | 1mm | 30 | CY*15G02 | Transceiver | 3.3V | LVTTL | 2 | 710mA | 570mA | 1500000 Mbps | TELECOM CIRCUIT | 2 | 1.5mm | 15mm | 15mm | No | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No CYV15G0402DXB-BGC | Cypress Semiconductor Corp | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | Surface Mount | 256-LBGA Exposed Pad | 256 | 0°C~70°C | Tray | 2005 | HOTlink II™ | e0 | Obsolete | 5 (48 Hours) | 256 | Tin/Lead (Sn/Pb) | 3.135V~3.465V | BOTTOM | BALL | 225 | 1 | 3.3V | 1.27mm | not_compliant | 30 | CY*15G04 | 256 | Not Qualified | 3.3V | LVTTL | 4 | 1.06A | 830mA | 1.5 Gbps | TELECOM CIRCUIT | 4 | 27mm | 27mm | Non-RoHS Compliant |
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CYP15G0401RB-BGI
Infineon
Package:Interface - Telecom
Price: please inquire
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CYV15G0402DXB-BGC
Infineon
Package:Interface - Telecom
Price: please inquire
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CYP15G0403DXB-BGXC
Infineon
Package:Interface - Telecom
Price: please inquire
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CYW15G0201DXB-BBC
Infineon
Package:Interface - Telecom
Price: please inquire
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CYW15G0201DXB-BBI
Infineon
Package:Interface - Telecom
Price: please inquire
-
CYV15G0401DXB-BGC
Infineon
Package:Interface - Telecom
Price: please inquire
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CYW15G0401DXB-BGI
Infineon
Package:Interface - Telecom
Price: please inquire
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CYP15G0401DXB-BGXI
Infineon
Package:Interface - Telecom
Price: please inquire
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CYV15G0403DXB-BGI
Infineon
Package:Interface - Telecom
Price: please inquire
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CYP15G0401TB-BGXC
Infineon
Package:Interface - Telecom
Price: please inquire
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CYV15G0404DXB-BGXC
Infineon
Package:Interface - Telecom
Price: please inquire
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CYV15G0403DXB-BGC
Infineon
Package:Interface - Telecom
Price: please inquire
-
CYP15G0403DXB-BGC
Infineon
Package:Interface - Telecom
Price: please inquire
-
CYW15G0401DXB-BGXC
Cypress Semiconductor Corp
Package:Interface - Telecom
73.301996
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CYP15G0401RB-BGI
Cypress Semiconductor Corp
Package:Interface - Telecom
33.882331
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CYP15G0403DXB-BGI
Cypress Semiconductor Corp
Package:Interface - Telecom
Price: please inquire
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CYW15G0401DXB-BGC
Cypress Semiconductor Corp
Package:Interface - Telecom
Price: please inquire
-
CYW15G0401DXB-BGI
Cypress Semiconductor Corp
Package:Interface - Telecom
Price: please inquire
-
CYW15G0201DXB-BBI
Cypress Semiconductor Corp
Package:Interface - Telecom
Price: please inquire
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CYV15G0402DXB-BGC
Cypress Semiconductor Corp
Package:Interface - Telecom
Price: please inquire