The category is 'Interface - Telecom'
- All Manufacturers
- Ihs Manufacturer
- JESD-30 Code
- JESD-609 Code
- Number of Functions
- Number of Terminals
- Operating Temperature-Max
- Operating Temperature-Min
- Package Body Material
- Package Code
- Package Description
- Package Shape
- Supply Current-Max
- Supply Current-Max:
0.0087 mA
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Surface Mount | Number of Terminals | Ihs Manufacturer | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Rohs Code | Supply Voltage-Nom | JESD-609 Code | Terminal Finish | HTS Code | Terminal Position | Terminal Form | Number of Functions | Terminal Pitch | Reach Compliance Code | JESD-30 Code | Qualification Status | Temperature Grade | Supply Current-Max | Seated Height-Max | Telecom IC Type | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | Mfr Part No T5744-TKS | Temic Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | YES | 20 | TEMIC SEMICONDUCTORS | 105 °C | -40 °C | PLASTIC/EPOXY | SSOP | SSO-20 | SSOP20,.25 | RECTANGULAR | SMALL OUTLINE | Transferred | No | 5 V | e0 | Tin/Lead (Sn/Pb) | DUAL | GULL WING | 1 | 0.635 mm | unknown | R-PDSO-G20 | Not Qualified | INDUSTRIAL | 0.0087 mA | TELECOM CIRCUIT | |||||
![]() | Mfr Part No T5744-TKS | Microchip Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 20 | MICROCHIP TECHNOLOGY INC | 105 °C | -40 °C | PLASTIC/EPOXY | LSSOP | SSO-20 | SSOP20,.25 | RECTANGULAR | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | Obsolete | No | 5 V | e0 | TIN LEAD | 8542.39.00.01 | DUAL | GULL WING | 1 | 0.65 mm | unknown | R-PDSO-G20 | Not Qualified | INDUSTRIAL | 0.0087 mA | 1.45 mm | TELECOM CIRCUIT | 6.625 mm | 4.4 mm |

