The category is 'Interface - Telecom'
- All Manufacturers
- HTS Code
- Ihs Manufacturer
- JESD-30 Code
- Number of Terminals
- Operating Temperature-Max
- Operating Temperature-Min
- Package Body Material
- Package Code
- Package Description
- Package Shape
- Part Life Cycle Code
- Supply Current-Max
- Supply Current-Max:
0.4 mA
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Surface Mount | Number of Terminals | Ihs Manufacturer | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Rohs Code | Supply Voltage-Nom | JESD-609 Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Number of Functions | Terminal Pitch | Reach Compliance Code | JESD-30 Code | Qualification Status | Temperature Grade | Supply Current-Max | Seated Height-Max | Telecom IC Type | Make-break Ratio | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No PCD3327CP | NXP Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | NO | 18 | NXP SEMICONDUCTORS | 70 °C | -25 °C | PLASTIC/EPOXY | DIP | DIP, | RECTANGULAR | IN-LINE | Obsolete | 3 V | SELECTABLE MAKE/BREAK RATIO 1:2 | 8542.39.00.01 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | R-PDIP-T18 | Not Qualified | OTHER | 0.4 mA | 4.7 mm | TELEPHONE DIALER CIRCUIT | 1:1.5 | 21.6 mm | 7.62 mm | |||||
| Mfr Part No PCD3327CP | Philips Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | NO | 18 | PHILIPS SEMICONDUCTORS | 70 °C | -25 °C | PLASTIC/EPOXY | DIP | DIP, DIP18,.3 | DIP18,.3 | RECTANGULAR | IN-LINE | Transferred | No | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-PDIP-T18 | Not Qualified | OTHER | 0.4 mA | |||||||||
| Mfr Part No PCD3322CT | Philips Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | YES | 20 | PHILIPS SEMICONDUCTORS | 70 °C | -25 °C | PLASTIC/EPOXY | SOP | SOP, SOP20,.4 | SOP20,.4 | RECTANGULAR | SMALL OUTLINE | Transferred | No | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | DUAL | GULL WING | 1.27 mm | unknown | R-PDSO-G20 | Not Qualified | OTHER | 0.4 mA | |||||||||
| Mfr Part No PCD3322CT | NXP Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | YES | 20 | NXP SEMICONDUCTORS | 70 °C | -25 °C | PLASTIC/EPOXY | SOP | SOP, | RECTANGULAR | SMALL OUTLINE | Obsolete | 3 V | SELECTABLE MAKE/BREAK RATIO 1:2 | 8542.39.00.01 | DUAL | GULL WING | 1 | 1.27 mm | unknown | R-PDSO-G20 | Not Qualified | OTHER | 0.4 mA | 2.65 mm | TELEPHONE DIALER CIRCUIT | 1:1.5 | 12.8 mm | 7.5 mm |
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PCD3327CP
NXP Semiconductors
Package:Interface - Telecom
Price: please inquire
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PCD3327CP
Philips Semiconductors
Package:Interface - Telecom
Price: please inquire
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PCD3322CT
Philips Semiconductors
Package:Interface - Telecom
Price: please inquire
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PCD3322CT
NXP Semiconductors
Package:Interface - Telecom
Price: please inquire