The category is 'Interface - Telecom'
- All Manufacturers
- HTS Code
- Ihs Manufacturer
- JESD-30 Code
- Number of Terminals
- Operating Temperature-Max
- Package Body Material
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- Package Description
- Package Shape
- Package Style
- Reach Compliance Code
- Supply Current-Max
- Supply Current-Max:
200 mA
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Contact plating | Surface Mount | Number of pins | Number of Terminals | Connector | Connector pinout layout | Contacts pitch | Electrical mounting | Gross weight | Ihs Manufacturer | Kind of connector | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Row pitch | Spatial orientation | Supply Voltage-Nom | Type of connector | Operating temperature | JESD-609 Code | Terminal Finish | HTS Code | Terminal Position | Terminal Form | Number of Functions | Terminal Pitch | Reach Compliance Code | Current rating | Pin Count | JESD-30 Code | Qualification Status | Temperature Grade | Supply Current-Max | Data Rate | Seated Height-Max | Screening Level | Telecom IC Type | Number of Transceivers | Rated voltage | Profile | Length | Width | Plating thickness | Flammability rating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | Mfr Part No SJA1105PEL | NXP Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | gold-plated | YES | 10 | 159 | socket | 1x10 | 2.54mm | SMT | 0.57 g | NXP SEMICONDUCTORS | female | 105 °C | -40 °C | PLASTIC/EPOXY | LFBGA | BGA, | BGA159,14X14,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | straight | 1.2 V | pin strips | -40...163°C | 8542.39.00.01 | BOTTOM | BALL | 1 | 0.8 mm | unknown | 3A | S-PBGA-B159 | INDUSTRIAL | 200 mA | 1.5 mm | AEC-Q100; ISO 26262 | ETHERNET SWITCH | 150V | beryllium copper | 12 mm | 12 mm | 0.75µm | UL94V-0 | ||||||||||
![]() | Mfr Part No MC68160FBR2 | Freescale Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 52 | MOTOROLA SEMICONDUCTOR PRODUCTS | 70 °C | PLASTIC/EPOXY | QFP | QFP, QFP52,.47SQ | QFP52,.47SQ | SQUARE | FLATPACK | Obsolete | No | 5 V | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | QUAD | GULL WING | 0.635 mm | unknown | S-PQFP-G52 | Not Qualified | COMMERCIAL | 200 mA | 10000 Mbps | ETHERNET TRANSCEIVER | 1 | ||||||||||||||||||||||||||
![]() | Mfr Part No TXC-05101-CIPQ | Transwitch Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 144 | TRANSWITCH CORP | 85 °C | -40 °C | PLASTIC/EPOXY | QFP | QFP, | SQUARE | FLATPACK | Obsolete | QFP | 5 V | 8542.39.00.01 | QUAD | GULL WING | 1 | 0.65 mm | unknown | 144 | S-PQFP-G144 | Not Qualified | INDUSTRIAL | 200 mA | 4.1 mm | TELECOM CIRCUIT | 28 mm | 28 mm | |||||||||||||||||||||||||
![]() | Mfr Part No SJA1105QEL | NXP Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | gold-plated | YES | 34 | 159 | socket | 2x17 | 2.54mm | THT | 1.56 g | NXP SEMICONDUCTORS | female | 105 °C | -40 °C | PLASTIC/EPOXY | LFBGA | BGA, | BGA159,14X14,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | 2.54mm | straight | 1.2 V | pin strips | -40...163°C | 8542.39.00.01 | BOTTOM | BALL | 1 | 0.8 mm | unknown | 1.5A | S-PBGA-B159 | INDUSTRIAL | 200 mA | 1.5 mm | AEC-Q100; ISO 26262 | ETHERNET SWITCH | 60V | beryllium copper | 12 mm | 12 mm | 0.254µm | UL94V-0 |
SJA1105PEL
NXP Semiconductors
Package:Interface - Telecom
Price: please inquire
MC68160FBR2
Freescale Semiconductor
Package:Interface - Telecom
Price: please inquire
TXC-05101-CIPQ
Transwitch Corporation
Package:Interface - Telecom
Price: please inquire
SJA1105QEL
NXP Semiconductors
Package:Interface - Telecom
Price: please inquire
