The category is 'Interface - Telecom'
Interface - Telecom (6000)
- All Manufacturers
- Moisture Sensitivity Level (MSL)
- Part Status
- RoHS Status
- Package / Case
- Mounting Type
- Packaging
- Factory Lead Time
- Number of Circuits
- Function
- Voltage - Supply
- Terminal Position
- Number of Terminations
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Surface Mount | Number of Terminals | Ihs Manufacturer | Moisture Sensitivity Levels | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Nom | JESD-609 Code | Pbfree Code | Terminal Finish | Applications | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Temperature Grade | Operating Mode | Supply Current-Max | Data Rate | Seated Height-Max | Telecom IC Type | Number of Transceivers | Filter | Companding Law | Make-break Ratio | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No PM8373-NGI | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 196 | MICROSEMI CORP | 3 | 125 °C | -40 °C | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Obsolete | Yes | 1.8 V | 8542.39.00.01 | BOTTOM | BALL | 1 | 1 mm | compliant | S-PBGA-B196 | Not Qualified | AUTOMOTIVE | 1.5 mm | INTERFACE CIRCUIT | 15 mm | 15 mm | |||||||||||||||||
| Mfr Part No PT8A991P | Pericom Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | NO | 22 | PERICOM TECHNOLOGY INC | 70 °C | PLASTIC/EPOXY | DIP | DIP, DIP22(UNSPEC) | DIP22(UNSPEC) | RECTANGULAR | IN-LINE | Transferred | No | 4 V | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | DUAL | THROUGH-HOLE | unknown | R-PDIP-T22 | Not Qualified | COMMERCIAL | TELECOM CIRCUIT | |||||||||||||||||||||
| Mfr Part No UBA1707TS | Philips Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | YES | 28 | PHILIPS SEMICONDUCTORS | 70 °C | -25 °C | PLASTIC/EPOXY | SSOP | SSOP, SSOP28,.3 | SSOP28,.3 | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | Transferred | No | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | DUAL | GULL WING | 0.635 mm | unknown | R-PDSO-G28 | Not Qualified | OTHER | |||||||||||||||||||||
| Mfr Part No PMB27201 | Infineon Technologies AG | Datasheet | - | - | Min: 1 Mult: 1 | YES | 128 | INFINEON TECHNOLOGIES AG | 85 °C | -30 °C | PLASTIC/EPOXY | , | SQUARE | FLATPACK | Obsolete | 5 V | 8542.39.00.01 | QUAD | GULL WING | 1 | unknown | S-PQFP-G128 | Not Qualified | OTHER | TELECOM CIRCUIT | ||||||||||||||||||||||||
| Mfr Part No TDA5664 | Siemens | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No SE5503A | Skyworks Solutions Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 24 | SKYWORKS SOLUTIONS INC | 85 °C | -10 °C | PLASTIC/EPOXY | TFLGA | TFLGA, | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | LGA | 3.3 V | 8542.39.00.01 | BOTTOM | BUTT | 1 | 0.5 mm | unknown | 24 | S-PBGA-B24 | OTHER | 1.06 mm | TELECOM CIRCUIT | 4 mm | 4 mm | ||||||||||||||||||
| Mfr Part No PBL3726/11 | STMicroelectronics | Datasheet | - | - | Min: 1 Mult: 1 | NO | 18 | STMICROELECTRONICS | 70 °C | -40 °C | PLASTIC/EPOXY | DIP | DIP18,.3 | RECTANGULAR | IN-LINE | Obsolete | No | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | not_compliant | R-PDIP-T18 | Not Qualified | OTHER | 100 mA | |||||||||||||||||||||
| Mfr Part No TK14588VTL-G | TOKO Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 16 | TOKO INC | 85 °C | -30 °C | PLASTIC/EPOXY | TSSOP | TSSOP, | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Transferred | Yes | 3 V | 8542.39.00.01 | DUAL | GULL WING | NOT SPECIFIED | 1 | 0.65 mm | unknown | NOT SPECIFIED | R-PDSO-G16 | Not Qualified | OTHER | 1.2 mm | TELECOM CIRCUIT | 5 mm | 4.4 mm | ||||||||||||||||
| Mfr Part No TNETE2201PJD | Rochester Electronics LLC | Datasheet | - | - | Min: 1 Mult: 1 | YES | 64 | ROCHESTER ELECTRONICS LLC | NOT SPECIFIED | 70 °C | PLASTIC/EPOXY | HTFQFP | 10 X 10 MM, POWERPAD, PLASTIC, HTQFP-64 | SQUARE | FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH | Active | QFP | No | 3.3 V | e0 | No | TIN LEAD | QUAD | GULL WING | NOT SPECIFIED | 1 | 0.5 mm | unknown | NOT SPECIFIED | 64 | S-PQFP-G64 | COMMERCIAL | COMMERCIAL | 1.2 mm | ETHERNET TRANSCEIVER | 10 mm | 10 mm | ||||||||||||
 | Mfr Part No TNETE2201PJD | Texas Instruments | Datasheet | - | - | Min: 1 Mult: 1 | YES | 64 | TEXAS INSTRUMENTS INC | 70 °C | PLASTIC/EPOXY | HTFQFP | HTFQFP, TQFP64,.47SQ | TQFP64,.47SQ | SQUARE | FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH | Obsolete | QFP | No | 3.3 V | No | 8542.39.00.01 | QUAD | GULL WING | NOT SPECIFIED | 1 | 0.5 mm | not_compliant | NOT SPECIFIED | 64 | S-PQFP-G64 | Not Qualified | COMMERCIAL | 330 mA | 1250000 Mbps | 1.2 mm | ETHERNET TRANSCEIVER | 1 | 10 mm | 10 mm | ||||||||||
| Mfr Part No BCM89107B0BFBGT | Broadcom Limited | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No ADN2865ACP-RL | Analog Devices Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 56 | ANALOG DEVICES INC | 1 | 85 °C | -40 °C | UNSPECIFIED | HVQCCN | 8 X 8 MM, MO-220-VLLD-2, LFCSP-56 | LCC56,.31SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Active | QFN | No | 3.3 V | SDH; SONET | 8542.39.00.01 | QUAD | NO LEAD | 1 | 0.5 mm | compliant | 56 | S-XQCC-N56 | Not Qualified | INDUSTRIAL | 350 mA | 1 mm | ATM/SONET/SDH CLOCK RECOVERY CIRCUIT | 8 mm | 8 mm | ||||||||||||
| Mfr Part No STLC5460FN | STMicroelectronics | Datasheet | - | - | Min: 1 Mult: 1 | STMICROELECTRONICS | , | Obsolete | unknown | ||||||||||||||||||||||||||||||||||||||||
| Mfr Part No BCM43143KMLGT | Infineon Technologies AG | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No UE910-NAR | Telit | Datasheet | - | - | Min: 1 Mult: 1 | YES | TELIT COMMUNICATIONS PLC | UNSPECIFIED | LGA | LGA, | SQUARE | GRID ARRAY | Active | Yes | 3.8 V | 8542.39.00.01 | BOTTOM | BUTT | NOT SPECIFIED | 1 | unknown | NOT SPECIFIED | S-XBGA-B | 2.2 mm | TELECOM CIRCUIT | 28.2 mm | 28.2 mm | ||||||||||||||||||||||
 | Mfr Part No BCM1115 | Broadcom Limited | Datasheet | - | - | Min: 1 Mult: 1 | YES | 256 | BROADCOM CORP | 1 | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Obsolete | BGA | No | 1.8 V | 8542.39.00.01 | BOTTOM | BALL | 1 | compliant | 256 | S-PBGA-B256 | Not Qualified | TELECOM CIRCUIT | ||||||||||||||||||||||
| Mfr Part No AK4671EG | Asahi Kasei Microsystems Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 57 | ASAHI KASEI MICRODEVICES CORP | 85 °C | -30 °C | PLASTIC/EPOXY | VFBGA | VFBGA, | SQUARE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Obsolete | BGA | 3.3 V | e1 | TIN SILVER COPPER | 8542.39.00.01 | BOTTOM | BALL | 1 | 0.5 mm | unknown | 57 | S-PBGA-B57 | Not Qualified | OTHER | SYNCHRONOUS | 1 mm | ADPCM CODEC | YES | A/MU-LAW | 5 mm | 5 mm | ||||||||||||
| Mfr Part No BU8325K | ROHM Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | ROHM CO LTD | 60 °C | -10 °C | PLASTIC/EPOXY | LQFP | LQFP, | SQUARE | FLATPACK, LOW PROFILE | Obsolete | QFP | 3 V | 8542.39.00.01 | QUAD | GULL WING | 1 | 0.8 mm | unknown | 32 | S-PQFP-G32 | Not Qualified | COMMERCIAL | 1.6 mm | TELEPHONE DIALER CIRCUIT | 1.1:1 | 7 mm | 7 mm | ||||||||||||||||
| Mfr Part No SM9103M | Nippon Precision Circuits Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 36 | NIPPON PRECISION CIRCUITS INC | 70 °C | PLASTIC/EPOXY | SSOP | SSOP, SOP36,.4,32 | SOP36,.4,32 | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | Transferred | No | 5 V | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | DUAL | GULL WING | 1 | 0.8 mm | unknown | R-PDSO-G36 | Not Qualified | COMMERCIAL | 30 mA | |||||||||||||||||||
| Mfr Part No RM024-S50-C | Laird, A DuPont Business | Datasheet | - | - | Min: 1 Mult: 1 |
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PM8373-NGI
Microsemi Corporation
Package:Interface - Telecom
Price: please inquire
-
PT8A991P
Pericom Technology Inc
Package:Interface - Telecom
Price: please inquire
-
UBA1707TS
Philips Semiconductors
Package:Interface - Telecom
Price: please inquire
-
PMB27201
Infineon Technologies AG
Package:Interface - Telecom
Price: please inquire
-
TDA5664
Siemens
Package:Interface - Telecom
Price: please inquire
-
SE5503A
Skyworks Solutions Inc
Package:Interface - Telecom
Price: please inquire
-
PBL3726/11
STMicroelectronics
Package:Interface - Telecom
Price: please inquire
-
TK14588VTL-G
TOKO Inc
Package:Interface - Telecom
Price: please inquire
-
TNETE2201PJD
Rochester Electronics LLC
Package:Interface - Telecom
Price: please inquire
-
TNETE2201PJD
Texas Instruments
Package:Interface - Telecom
Price: please inquire
-
BCM89107B0BFBGT
Broadcom Limited
Package:Interface - Telecom
Price: please inquire
-
ADN2865ACP-RL
Analog Devices Inc
Package:Interface - Telecom
Price: please inquire
-
STLC5460FN
STMicroelectronics
Package:Interface - Telecom
Price: please inquire
-
BCM43143KMLGT
Infineon Technologies AG
Package:Interface - Telecom
Price: please inquire
-
UE910-NAR
Telit
Package:Interface - Telecom
Price: please inquire
-
BCM1115
Broadcom Limited
Package:Interface - Telecom
Price: please inquire
-
AK4671EG
Asahi Kasei Microsystems Corporation
Package:Interface - Telecom
Price: please inquire
-
BU8325K
ROHM Semiconductor
Package:Interface - Telecom
Price: please inquire
-
SM9103M
Nippon Precision Circuits Inc
Package:Interface - Telecom
Price: please inquire
-
RM024-S50-C
Laird, A DuPont Business
Package:Interface - Telecom
Price: please inquire