Interface - Telecom (6000)

-

-

Min: 1

Mult: 1

YES

8

ANALOG DEVICES INC

85 °C

-30 °C

PLASTIC/EPOXY

TSSOP

TSSOP8,.19

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Active

No

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

DUAL

GULL WING

0.635 mm

not_compliant

R-PDSO-G8

Not Qualified

OTHER

TELECOM CIRCUIT

-

-

Min: 1

Mult: 1

YES

24

CML MICROCIRCUITS LTD

85 °C

-40 °C

PLASTIC/EPOXY

QCCJ

QCCJ, LDCC24,.44SQ

LDCC24,.44SQ

SQUARE

CHIP CARRIER

Obsolete

5 V

FULL DUPLEX

QUAD

J BEND

1

1.27 mm

compliant

S-PQCC-J24

INDUSTRIAL

3.7 mm

MODEM

10.05 mm

10.05 mm

-

-

Min: 1

Mult: 1

YES

128

APPLIED MICRO CIRCUITS CORP

85 °C

-20 °C

PLASTIC/EPOXY

LFQFP

LFQFP, QFP128,.64SQ,16

QFP128,.64SQ,16

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

Obsolete

QFP

3.3 V

8542.39.00.01

QUAD

GULL WING

1

0.4 mm

compliant

128

S-PQFP-G128

Not Qualified

OTHER

548 mA

1.6 mm

ATM/SONET/SDH TRANSCEIVER

14 mm

14 mm

-

-

Min: 1

Mult: 1

YES

128

ROCHESTER ELECTRONICS LLC

85 °C

-20 °C

PLASTIC/EPOXY

HLFQFP

HLFQFP,

SQUARE

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Contact Manufacturer

3.3 V

8542.39.00.01

QUAD

GULL WING

1

0.4 mm

unknown

S-PQFP-G128

OTHER

1.6 mm

ATM/SONET/SDH TRANSCEIVER

14 mm

14 mm

-

-

Min: 1

Mult: 1

YES

8

TRIQUINT SEMICONDUCTOR INC

85 °C

-40 °C

PLASTIC/EPOXY

LSSOP

LSSOP,

RECTANGULAR

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Obsolete

SOT-23

2.8 V

8542.39.00.01

DUAL

GULL WING

1

0.65 mm

unknown

8

R-PDSO-G8

Not Qualified

INDUSTRIAL

1.45 mm

RF FRONT END CIRCUIT

2.9 mm

1.6 mm

-

-

Min: 1

Mult: 1

YES

208

TRANSWITCH CORP

85 °C

-40 °C

PLASTIC/EPOXY

FQFP

FQFP, QFP208,1.2SQ,20

QFP208,1.2SQ,20

SQUARE

FLATPACK, FINE PITCH

Obsolete

QFP

5 V

8542.39.00.01

QUAD

GULL WING

1

0.5 mm

unknown

208

S-PQFP-G208

Not Qualified

INDUSTRIAL

4.2 mm

TELECOM CIRCUIT

28 mm

28 mm

-

-

Min: 1

Mult: 1

NO

14

INFINEON TECHNOLOGIES AG

70 °C

PLASTIC/EPOXY

DIP

DIP14,.3

RECTANGULAR

IN-LINE

Obsolete

No

5 V

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

DUAL

THROUGH-HOLE

2.54 mm

not_compliant

R-PDIP-T14

Not Qualified

COMMERCIAL

MANCHESTER DECODER

-

-

Min: 1

Mult: 1

NO

18

TOSHIBA CORP

PLASTIC/EPOXY

DIP

DIP,

RECTANGULAR

IN-LINE

Obsolete

DIP

No

5 V

e0

TIN LEAD

8542.39.00.01

DUAL

THROUGH-HOLE

1

unknown

18

R-PDIP-T18

Not Qualified

7 mA

DTMF SIGNALING CIRCUIT

-

-

Min: 1

Mult: 1

YES

16

TEXAS INSTRUMENTS INC

85 °C

-40 °C

PLASTIC/EPOXY

SOP

SOP,

RECTANGULAR

SMALL OUTLINE

Obsolete

5 V

FULL DUPLEX

8542.39.00.01

DUAL

GULL WING

1

1.27 mm

unknown

R-PDSO-G16

Not Qualified

INDUSTRIAL

SYNCHRONOUS

13 mA

2.65 mm

PCM CODEC

YES

MU-LAW

-5 V

10.3 mm

7.5 mm

-

-

Min: 1

Mult: 1

YES

132

INTEL CORP

70 °C

CERAMIC, METAL-SEALED COFIRED

BGA

BGA,

SQUARE

GRID ARRAY

Obsolete

BGA

SONET;SDH

8542.39.00.01

BOTTOM

BALL

1

1 mm

compliant

132

S-CBGA-B132

Not Qualified

COMMERCIAL

2.1 mm

ATM/SONET/SDH MUX/DEMUX

-5.2 V

13 mm

13 mm

-

-

Min: 1

Mult: 1

-

-

Min: 1

Mult: 1

YES

32

RF MICRO DEVICES INC

1

85 °C

-40 °C

PLASTIC/EPOXY

QCCN

QCCN,

SQUARE

CHIP CARRIER

Obsolete

QFN

No

2.75 V

8542.39.00.01

QUAD

NO LEAD

1

0.5 mm

unknown

32

S-PQCC-N32

Not Qualified

INDUSTRIAL

0.9 mm

RF AND BASEBAND CIRCUIT

5 mm

5 mm

-

-

Min: 1

Mult: 1

NO

16

AMI SEMICONDUCTOR

70 °C

PLASTIC/EPOXY

DIP

DIP16,.3

RECTANGULAR

IN-LINE

Obsolete

No

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

DUAL

THROUGH-HOLE

2.54 mm

unknown

R-PDIP-T16

Not Qualified

COMMERCIAL

16 mA

3.58 MHz

-

-

Min: 1

Mult: 1

YES

32

RF MICRO DEVICES INC

85 °C

-40 °C

PLASTIC/EPOXY

LFQFP

LFQFP, QFP32,.28SQ,20

QFP32,.28SQ,20

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

Obsolete

QFP

No

3.6 V

e0

TIN LEAD

8542.39.00.01

QUAD

GULL WING

1

0.5 mm

unknown

32

S-PQFP-G32

Not Qualified

INDUSTRIAL

1.6 mm

TELECOM CIRCUIT

5 mm

5 mm

-

-

Min: 1

Mult: 1

-

-

Min: 1

Mult: 1

YES

48

AGILENT TECHNOLOGIES INC

PLASTIC/EPOXY

LFQFP

QFP, QFP48,.35SQ,20

QFP48,.35SQ,20

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

Obsolete

No

3 V

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

QUAD

GULL WING

1

0.5 mm

unknown

S-PQFP-G48

Not Qualified

27 mA

1.6 mm

CORDLESS TELEPHONE BASEBAND CIRCUIT

7 mm

7 mm

-

-

Min: 1

Mult: 1

YES

64

NXP SEMICONDUCTORS

85 °C

-40 °C

PLASTIC/EPOXY

LFQFP

LFQFP,

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

Obsolete

3 V

8542.39.00.01

QUAD

GULL WING

1

0.4 mm

unknown

S-PQFP-G64

Not Qualified

INDUSTRIAL

1.6 mm

RF AND BASEBAND CIRCUIT

7 mm

7 mm

-

-

Min: 1

Mult: 1

YES

256

BROADCOM CORP

PLASTIC/EPOXY

BGA

BGA,

UNSPECIFIED

GRID ARRAY

Obsolete

BGA

No

1.8 V

8542.39.00.01

BOTTOM

BALL

1

compliant

256

X-PBGA-B256

Not Qualified

TELECOM CIRCUIT

-

-

Min: 1

Mult: 1

NO

8

HOLTEK SEMICONDUCTOR INC

70 °C

-20 °C

PLASTIC/EPOXY

DIP

DIP, DIP8,.3

DIP8,.3

RECTANGULAR

IN-LINE

Obsolete

No

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

DUAL

THROUGH-HOLE

2.54 mm

unknown

R-PDIP-T8

Not Qualified

COMMERCIAL

2 mA

3.58 MHz

-

-

Min: 1

Mult: 1

UNITED MICROELECTRONICS CORP

,

Contact Manufacturer

unknown