The category is 'Interface - Telecom'
Interface - Telecom (6000)
- All Manufacturers
- Moisture Sensitivity Level (MSL)
- Part Status
- RoHS Status
- Package / Case
- Mounting Type
- Packaging
- Factory Lead Time
- Number of Circuits
- Function
- Voltage - Supply
- Terminal Position
- Number of Terminations
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Surface Mount | Number of Terminals | Ihs Manufacturer | Moisture Sensitivity Levels | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Nom | JESD-609 Code | Pbfree Code | ECCN Code | Terminal Finish | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Temperature Grade | Operating Mode | Supply Current-Max | Seated Height-Max | Telecom IC Type | Filter | Companding Law | Neg Supply Voltage-Nom | Gain Tolerance-Max | Linear Coding | Crystal Frequency | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No ADN2816XCPZ | Analog Devices Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | ANALOG DEVICES INC | 85 °C | -40 °C | UNSPECIFIED | HVQCCN | HVQCCN, | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Obsolete | QFN | Yes | 3.3 V | e3 | Yes | 5A991.B.3 | MATTE TIN | 8542.39.00.01 | QUAD | NO LEAD | 1 | 0.5 mm | compliant | 32 | S-XQCC-N32 | Not Qualified | INDUSTRIAL | 1 mm | ATM/SONET/SDH CLOCK RECOVERY CIRCUIT | 5 mm | 5 mm | |||||||||||||
 | Mfr Part No SARA-G350 | u-blox AG | Datasheet | - | - | Min: 1 Mult: 1 | U-BLOX AG | Obsolete | unknown | TELECOM CIRCUIT | |||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No ADN2821XCHIP-10KWP | Analog Devices Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 17 | ANALOG DEVICES INC | 95 °C | -40 °C | UNSPECIFIED | DIE | DIE, DIE OR CHIP | DIE OR CHIP | RECTANGULAR | UNCASED CHIP | Obsolete | DIE | No | 3.3 V | 8542.39.00.01 | UPPER | NO LEAD | NOT SPECIFIED | 1 | unknown | NOT SPECIFIED | 17 | R-XUUC-N17 | Not Qualified | INDUSTRIAL | TELECOM CIRCUIT | ||||||||||||||||||
 | Mfr Part No RF7170TR7 | RF Micro Devices Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 23 | RF MICRO DEVICES INC | 5A | UNSPECIFIED | BCC | BCC, LCC22,.2X.26,40/36 | LCC22,.2X.26,40/36 | RECTANGULAR | CHIP CARRIER | Transferred | QFN | Yes | 3.5 V | 5A991.G | 8517.62.00.50 | BOTTOM | BUTT | 1 | 0.91 mm | compliant | 22 | R-XBCC-B23 | Not Qualified | 0.00008 mA | 1.015 mm | RF AND BASEBAND CIRCUIT | 6.63 mm | 5.24 mm | ||||||||||||||||
 | Mfr Part No MM1512 | Mitsumi Electric Co Ltd | Datasheet | - | - | Min: 1 Mult: 1 | YES | 6 | MITSUMI ELECTRIC CO LTD | PLASTIC/EPOXY | LSSOP | LSSOP, | RECTANGULAR | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | Contact Manufacturer | SOT | 8542.39.00.01 | DUAL | GULL WING | 1 | 0.95 mm | unknown | 6 | R-PDSO-G6 | Not Qualified | 1.4 mm | TELECOM CIRCUIT | 2.9 mm | 1.6 mm | ||||||||||||||||||||||
| Mfr Part No PEB2035N | Siemens | Datasheet | - | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MT8962AY | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 24 | ZARLINK SEMICONDUCTOR INC | 70 °C | PLASTIC/EPOXY | QCCN | QCCN, LCC24,.4SQ | LCC24,.4SQ | SQUARE | CHIP CARRIER | Obsolete | No | 5 V | e0 | TIN LEAD | 8542.39.00.01 | QUAD | NO LEAD | 260 | 1 | 1.27 mm | unknown | S-PQCC-N24 | Not Qualified | COMMERCIAL | 0.008 mA | PCM CODEC | YES | MU-LAW | -5 V | 0.25 dB | NOT AVAILABLE | |||||||||||||
| Mfr Part No MT8962AY | Zarlink Semiconductor Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 24 | ZARLINK SEMICONDUCTOR INC | 70 °C | PLASTIC/EPOXY | QCCN | QCCN, LCC24,.4SQ | LCC24,.4SQ | SQUARE | CHIP CARRIER | Obsolete | No | 5 V | e0 | TIN LEAD | 8542.39.00.01 | QUAD | NO LEAD | 260 | 1 | 1.27 mm | unknown | S-PQCC-N24 | Not Qualified | COMMERCIAL | 0.008 mA | PCM CODEC | YES | MU-LAW | -5 V | 0.25 dB | NOT AVAILABLE | |||||||||||||
| Mfr Part No BCM43794B0KFFBG | Broadcom Limited | Datasheet | - | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No T5744-TKS | Temic Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | YES | 20 | TEMIC SEMICONDUCTORS | 105 °C | -40 °C | PLASTIC/EPOXY | SSOP | SSO-20 | SSOP20,.25 | RECTANGULAR | SMALL OUTLINE | Transferred | No | 5 V | e0 | Tin/Lead (Sn/Pb) | DUAL | GULL WING | 1 | 0.635 mm | unknown | R-PDSO-G20 | Not Qualified | INDUSTRIAL | 0.0087 mA | TELECOM CIRCUIT | |||||||||||||||||||
 | Mfr Part No MC145567DWR2 | Motorola Mobility LLC | Datasheet | - | - | Min: 1 Mult: 1 | YES | 20 | MOTOROLA INC | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP, | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | 5 V | 8542.39.00.01 | DUAL | GULL WING | 1 | 1.27 mm | unknown | 20 | R-PDSO-G20 | Not Qualified | INDUSTRIAL | ASYNCHRONOUS | 2.65 mm | PCM CODEC | YES | A-LAW | -5 V | 12.8 mm | 7.5 mm | ||||||||||||||
| Mfr Part No BCM4307KPF | Broadcom Limited | Datasheet | - | - | Min: 1 Mult: 1 | BROADCOM INC | Active | compliant | ||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No HT9315FD | Holtek Semiconductor Inc | Datasheet | - | - | Min: 1 Mult: 1 | NO | 20 | HOLTEK SEMICONDUCTOR INC | 70 °C | -20 °C | PLASTIC/EPOXY | DIP | DIP, DIP20(UNSPEC) | DIP20(UNSPEC) | RECTANGULAR | IN-LINE | Active | No | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | DUAL | THROUGH-HOLE | unknown | R-PDIP-T20 | Not Qualified | COMMERCIAL | 2 mA | 3.58 MHz | |||||||||||||||||||||
 | Mfr Part No ALT6714RM45P9 | ANADIGICS Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 10 | ANADIGICS INC | 3 | UNSPECIFIED | HTSON | HTSON, | SQUARE | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE | Transferred | SON | Yes | 3.4 V | 8542.39.00.01 | DUAL | NO LEAD | 1 | 0.6 mm | unknown | 10 | S-XDSO-N10 | Not Qualified | 1.13 mm | RF FRONT END CIRCUIT | 3 mm | 3 mm | |||||||||||||||||||
| Mfr Part No ALT6714RM45P9 | Coherent Thermal Solutions | Datasheet | - | - | Min: 1 Mult: 1 | YES | 10 | II-VI INC | 3 | UNSPECIFIED | HTSON | 3 X 3 MM, 1 MM HEIGHT, ROHS COMPLIANT PACKAGE-10 | SQUARE | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE | Obsolete | Yes | 3.4 V | 8542.39.00.01 | DUAL | NO LEAD | 1 | 0.6 mm | unknown | S-XDSO-N10 | Not Qualified | 1.13 mm | RF FRONT END CIRCUIT | 3 mm | 3 mm | |||||||||||||||||||||
| Mfr Part No RFPA5201ESB | RF Micro Devices Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 14 | RF MICRO DEVICES INC | 85 °C | -40 °C | UNSPECIFIED | HTSON | HTSON, | SQUARE | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE | Transferred | 5 V | 5A991.G | 8542.33.00.01 | DUAL | NO LEAD | 1 | unknown | S-XDSO-N14 | INDUSTRIAL | 1.05 mm | TELECOM CIRCUIT | 7 mm | 7 mm | |||||||||||||||||||||
| Mfr Part No SM8213AM | Nippon Precision Circuits Inc | Datasheet | - | - | Min: 1 Mult: 1 | NIPPON PRECISION CIRCUITS INC | , | Transferred | No | unknown | ||||||||||||||||||||||||||||||||||||||||
| Mfr Part No WM8972LEFL | Cirrus Logic | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | CIRRUS LOGIC INC | 85 °C | -25 °C | PLASTIC/EPOXY | HVQCCN | HVQCCN, | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Active | 2 V | 8542.39.00.01 | QUAD | NO LEAD | 1 | 0.5 mm | compliant | S-PQCC-N32 | OTHER | SYNCHRONOUS | 1 mm | PCM CODEC | YES | 5 mm | 5 mm | |||||||||||||||||||
 | Mfr Part No EF2A51A031E10B-T10 | Thin Film Technology Corp (TFT) | Datasheet | - | - | Min: 1 Mult: 1 | YES | 2 | THIN FILM TECHNOLOGY CORP | 85 °C | -40 °C | PLASTIC/EPOXY | VSON | VSON, | RECTANGULAR | SMALL OUTLINE, VERY THIN PROFILE | Obsolete | SOIC | e4 | GOLD OVER NICKEL | 8542.39.00.01 | DUAL | NO LEAD | 1 | unknown | 2 | R-PDSO-N2 | Not Qualified | INDUSTRIAL | 0.35 mm | LINE EQUALIZER | 1.52 mm | 0.76 mm | ||||||||||||||||||
| Mfr Part No SAA3049T | Philips Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | YES | 20 | PHILIPS SEMICONDUCTORS | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP, SOP20,.4 | SOP20,.4 | RECTANGULAR | SMALL OUTLINE | Transferred | No | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | DUAL | GULL WING | 1.27 mm | unknown | R-PDSO-G20 | Not Qualified | INDUSTRIAL | TELECOM CIRCUIT |
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ADN2816XCPZ
Analog Devices Inc
Package:Interface - Telecom
Price: please inquire
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SARA-G350
u-blox AG
Package:Interface - Telecom
Price: please inquire
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ADN2821XCHIP-10KWP
Analog Devices Inc
Package:Interface - Telecom
Price: please inquire
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RF7170TR7
RF Micro Devices Inc
Package:Interface - Telecom
Price: please inquire
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MM1512
Mitsumi Electric Co Ltd
Package:Interface - Telecom
Price: please inquire
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PEB2035N
Siemens
Package:Interface - Telecom
Price: please inquire
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MT8962AY
Microsemi Corporation
Package:Interface - Telecom
Price: please inquire
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MT8962AY
Zarlink Semiconductor Inc
Package:Interface - Telecom
Price: please inquire
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BCM43794B0KFFBG
Broadcom Limited
Package:Interface - Telecom
Price: please inquire
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T5744-TKS
Temic Semiconductors
Package:Interface - Telecom
Price: please inquire
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MC145567DWR2
Motorola Mobility LLC
Package:Interface - Telecom
Price: please inquire
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BCM4307KPF
Broadcom Limited
Package:Interface - Telecom
Price: please inquire
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HT9315FD
Holtek Semiconductor Inc
Package:Interface - Telecom
Price: please inquire
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ALT6714RM45P9
ANADIGICS Inc
Package:Interface - Telecom
Price: please inquire
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ALT6714RM45P9
Coherent Thermal Solutions
Package:Interface - Telecom
Price: please inquire
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RFPA5201ESB
RF Micro Devices Inc
Package:Interface - Telecom
Price: please inquire
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SM8213AM
Nippon Precision Circuits Inc
Package:Interface - Telecom
Price: please inquire
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WM8972LEFL
Cirrus Logic
Package:Interface - Telecom
Price: please inquire
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EF2A51A031E10B-T10
Thin Film Technology Corp (TFT)
Package:Interface - Telecom
Price: please inquire
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SAA3049T
Philips Semiconductors
Package:Interface - Telecom
Price: please inquire