The category is 'Interface - Telecom'
Interface - Telecom (6000)
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- Voltage - Supply
- Terminal Position
- Number of Terminations
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Mounting type | Surface Mount | Material | Housing material | Weight | Number of Terminals | Application area | Bending radius | Capacitors series | Case | Case - inch | Case - mm | Diameter after shrink | Diameter before shrink | Dielectric strength | External height | External width | Gross weight | Gross Weight | Ihs Manufacturer | Internal height | Internal width | Kind of capacitor | Kind of interface | Kind of memory | Maximum current | Memory | Mounting | Nominal diameter | Operating conditions | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Permissible load | Purpose | Rated coil voltage | Rohs Code | Shipping Package Size/Quantity | Supply Voltage-Nom | Switching scheme | Transport package size/quantity | Transport packaging size/quantity | Type of cable accessories | Type of capacitor | Type of integrated circuit | Version | Wall thickness before shrink | Weight gross | Operating temperature | Packaging | Tolerance | JESD-609 Code | ECCN Code | Type | Terminal Finish | Composition | Color | Additional Feature | HTS Code | Capacitance | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Depth | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Number of contacts | Dielectric | Power Supplies | Contact resistance | Temperature Grade | Operating Mode | Supply Current-Max | Data Rate | Seated Height-Max | Tool type | Operating temperature range | Rated current | Switching voltage | Screening Level | Telecom IC Type | Number of Transceivers | Shrink temperature | Power | Rated voltage | Filter | Companding Law | Saturation Current | Neg Supply Voltage-Nom | Operating voltage | Gain Tolerance-Max | Linear Coding | Shrink ratio | Diameter | Height | Length | Width |
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![]() | Mfr Part No BCM4330FKUBG | Infineon Technologies AG | Datasheet | - | - | Min: 1 Mult: 1 | YES | 133 | 13.10 | INFINEON TECHNOLOGIES AG | 85 °C | -30 °C | PLASTIC/EPOXY | VFBGA | WLBGA-133 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Active | 42*28*18.5/500 | 1.2 V | BOTTOM | BALL | 1 | 0.4 mm | compliant | R-PBGA-B133 | OTHER | 0.55 mm | TELECOM CIRCUIT | 5.33 mm | 4.89 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No BCM4330FKUBG | Cypress Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 133 | 8.12 | CYPRESS SEMICONDUCTOR CORP | 85 °C | -30 °C | PLASTIC/EPOXY | VFBGA | WLBGA-133 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Transferred | 1.2 V | 45*38*20/500 | 8542.39.00.01 | BOTTOM | BALL | 1 | 0.4 mm | compliant | R-PBGA-B133 | OTHER | 0.55 mm | TELECOM CIRCUIT | 5.33 mm | 4.89 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No DS856 | Euvis Inc | Datasheet | - | - | Min: 1 Mult: 1 | EUVIS INC | UNSPECIFIED | PACKAGE | UNSPECIFIED | Contact Manufacturer | Yes | UNSPECIFIED | 1 | unknown | TELECOM CIRCUIT | -5 V | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MC2833P | Freescale Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | NO | 16 | MOTOROLA SEMICONDUCTOR PRODUCTS | 70 °C | -30 °C | PLASTIC/EPOXY | DIP | DIP, DIP16,.3 | DIP16,.3 | RECTANGULAR | IN-LINE | Obsolete | No | 4 V | e0 | Tin/Lead (Sn/Pb) | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-PDIP-T16 | Not Qualified | 4 V | OTHER | 4.3 mA | TELECOMM CIRCUIT | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No LM567CMX | National Semiconductor Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | NATIONAL SEMICONDUCTOR CORP | 70 °C | PLASTIC/EPOXY | SOP | SOP-8 | RECTANGULAR | SMALL OUTLINE | Transferred | No | 5 V | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | DUAL | GULL WING | 235 | 1 | 1.27 mm | not_compliant | 30 | R-PDSO-G8 | Not Qualified | COMMERCIAL | 15 mA | 1.753 mm | TONE DECODER CIRCUIT | 1 | 4.9 mm | 3.9 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No TP3067WMX | Texas Instruments | Datasheet | - | - | Min: 1 Mult: 1 | YES | 20 | NATIONAL SEMICONDUCTOR CORP | 70 °C | PLASTIC/EPOXY | SOP | SOP, | RECTANGULAR | SMALL OUTLINE | Obsolete | 5 V | 8542.39.00.01 | DUAL | GULL WING | 1 | 1.27 mm | unknown | R-PDSO-G20 | Not Qualified | COMMERCIAL | SYNCHRONOUS/ASYNCHRONOUS | 10 mA | 2.65 mm | PCM CODEC | YES | A-LAW | -5 V | 12.8 mm | 7.5 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No LM567CN/NOPB | National Semiconductor Corporation | Datasheet | - | - | Min: 1 Mult: 1 | NO | 8 | NATIONAL SEMICONDUCTOR CORP | 70 °C | PLASTIC/EPOXY | DIP | PLASTIC, DIP-8 | RECTANGULAR | IN-LINE | Transferred | Yes | 5 V | e3 | EAR99 | Matte Tin (Sn) | 8542.39.00.01 | DUAL | THROUGH-HOLE | 260 | 1 | 2.54 mm | compliant | 40 | R-PDIP-T8 | Not Qualified | COMMERCIAL | 15 mA | 5.08 mm | TONE DECODER CIRCUIT | 1 | 9.817 mm | 7.62 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No TJA1044GT | NXP Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | 200mm | 50mm | 92.5mm | 1220 g | NXP SEMICONDUCTORS | 35mm | 76mm | 150 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP, | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | Active | Yes | 5 V | cable chain | frames openable from inner radius | ESD on pins CANH and CANL ESD is 8kV | 8542.39.00.01 | DUAL | GULL WING | NOT SPECIFIED | 1 | 1.27 mm | compliant | NOT SPECIFIED | R-PDSO-G8 | 110 mA | 5000 Mbps | 1.75 mm | AEC-Q100 | INTERFACE CIRCUIT | 1 | 4.9 mm | 3.9 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No RF9802TR13 | RF Micro Devices Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 23 | RF MICRO DEVICES INC | 85 °C | -30 °C | UNSPECIFIED | BCC | BCC, LCC22,.2X.26,40/36 | LCC22,.2X.26,40/36 | RECTANGULAR | CHIP CARRIER | Transferred | QMA | Yes | 3.5 V | 5A991.G | 8517.62.00.50 | BOTTOM | BUTT | 1 | 0.91 mm | unknown | 22 | R-XBCC-B23 | Not Qualified | OTHER | 0.00001 mA | 1.05 mm | RF AND BASEBAND CIRCUIT | 5A | 6.63 mm | 5.24 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No GRF4005 | Guerrilla RF | Datasheet | - | - | Min: 1 Mult: 1 | YES | fiberglass rod in blue plastic cover | 6 | 138.67 | GUERRILLA RF INC | maximum bending radius - 30mm | 105 °C | -40 °C | PLASTIC/EPOXY | HSON | HSON, | SQUARE | SMALL OUTLINE, HEAT SINK/SLUG | Contact Manufacturer | static tensile forces - not more than 2 kN; crushing forces - not more than 0.5 kN/cm | for cable pulling in cable channels, boxes, pipes, etc. | 5 V | 39*39*37/50 | in coil | Fiberglass rod | blue | 8542.39.00.01 | DUAL | NO LEAD | 1 | unknown | S-PDSO-N6 | INDUSTRIAL | Cable channel preparation device (CCPD) | -20…+50 °C | TELECOM CIRCUIT | 1 | external on the cover - 4mm | 5m | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No RF5722TR7 | RF Micro Devices Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | polyolefin | 8 | 4 mm | 12 mm | RF MICRO DEVICES INC | 12 mm | 85 °C | -30 °C | UNSPECIFIED | HVQCCN | 2.20 X 2.20 MM, 0.45 MM HEIGHT, GREEN, QFN-8 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Transferred | Yes | 3.3 V | 103*26*26/200 | 0.68 mm | 39.25 | supplied in 1.0 m lengths | e3 | 5A991.G | Heat shrink tubing with adhesive layer | MATTE TIN | green | 8517.70.00.00 | QUAD | NO LEAD | 260 | 1 | 0.65 mm | unknown | 30 | S-XQCC-N8 | OTHER | 0.5 mm | -55…+125 degrees C | TELECOM CIRCUIT | 100 degrees C | 2 | ≤1500 V | 3 : 1 | 1000 mm | 2.2 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AWT6621RM45Q7 | Coherent Thermal Solutions | Datasheet | - | - | Min: 1 Mult: 1 | YES | 10 | II-VI INC | PLASTIC/EPOXY | HTSON | 3 X 3 MM, 1 MM HEIGHT, ROHS COMPLIANT, PACKAGE-10 | SQUARE | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE | Obsolete | Yes | 3.4 V | 8542.39.00.01 | DUAL | NO LEAD | 1 | 0.6 mm | unknown | S-PDSO-N10 | Not Qualified | 1.13 mm | RF AND BASEBAND CIRCUIT | 3 | 3 mm | 3 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AWT6621RM45Q7 | ANADIGICS Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 10 | FBGA153 | 0.5 g | ANADIGICS INC | serial | eMMC | 32GB FLASH | SMD | PLASTIC/EPOXY | HTSON | 3 X 3 MM, 1 MM HEIGHT, ROHS COMPLIANT, PACKAGE-10 | SQUARE | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE | Transferred | SOIC | Yes | 3.4 V | FLASH memory | -40...85°C | 8542.39.00.01 | DUAL | NO LEAD | 1 | 0.6 mm | unknown | 10 | S-PDSO-N10 | Not Qualified | 1.13 mm | RF AND BASEBAND CIRCUIT | 3 | 2.7...3.6V | 3 mm | 3 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No DP83865BVH | National Semiconductor Corporation | Datasheet | - | - | Min: 1 Mult: 1 | NATIONAL SEMICONDUCTOR CORP | 70 °C | Obsolete | Yes | 1.8 V | 1 | unknown | Not Qualified | COMMERCIAL | 1000000 Mbps | ETHERNET TRANSCEIVER | 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No LMV225SDX | National Semiconductor Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 6 | NATIONAL SEMICONDUCTOR CORP | 85 °C | -40 °C | UNSPECIFIED | HVSON | 2.20 X 2.50 MM, 0.80 MM HEIGHT, LLP-6 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | Transferred | No | 2.7 V | e0 | TIN LEAD | 8542.39.00.01 | DUAL | NO LEAD | 260 | 1 | 0.65 mm | not_compliant | 40 | R-XDSO-N6 | Not Qualified | INDUSTRIAL | 0.8 mm | RF AND BASEBAND CIRCUIT | 1 | 2.5 mm | 2.2 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No TJA1040T | NXP Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | YES | plastic, removable cover | 38 g | 8 | between open contacts - 1200 VAC, 1 min. V | 36.67 | NXP SEMICONDUCTORS | 5 (240 VAC; 28 VDC) A | PLASTIC/EPOXY | SOP | 3.90 MM, PLASTIC, MS-012, SOT96-1, SOP-8 | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | Not Recommended | SOIC | 220 AC V | Yes | 5 V | 3PDT; form 3C | 42*28*23.5/60 | e4 | REK78 series electromagnetic relay | Nickel/Palladium/Gold (Ni/Pd/Au) | 8542.39.00.01 | DUAL | GULL WING | 260 | 1 | 1.27 mm | 27.3 mm | compliant | 40 | 8 | R-PDSO-G8 | Not Qualified | 50 mOhm max | 0.07 mA | 1000 Mbps | 1.75 mm | -25...+55 °C | 240 (AC)/ 28 (DC) V | INTERFACE CIRCUIT | 1 | coil - 1.2 VA | 35.2 mm | 4.9 mm | 3.9 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No TP3067WM | National Semiconductor Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 20 | NATIONAL SEMICONDUCTOR CORP | 70 °C | PLASTIC/EPOXY | SOP | PLASTIC, SO-16 | SOP20,.4 | RECTANGULAR | SMALL OUTLINE | Transferred | No | 5 V | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | DUAL | GULL WING | 220 | 1 | 1.27 mm | not_compliant | 30 | R-PDSO-G20 | Not Qualified | COMMERCIAL | SYNCHRONOUS/ASYNCHRONOUS | 10 mA | 2.65 mm | PCM CODEC | YES | A-LAW | 4 | -5 V | 0.15 dB | NOT AVAILABLE | 12.8 mm | 7.5 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No TDA8060TS | Philips Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | in panel | YES | metal/plastic | 24 | for cars | 0402 | 1005 | 31.10 | PHILIPS SEMICONDUCTORS | MLCC | SMD | 70 °C | PLASTIC/EPOXY | SSOP | SSOP, SSOP24,.3 | SSOP24,.3 | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | Transferred | Yes | 5 V | 42*28*18.5/100 | ceramic | -55...125°C | ±20% | Socket for car lighter with flange and cover | black | 8542.39.00.01 | 1µF | DUAL | GULL WING | 260 | 0.635 mm | 32 mm | unknown | R-PDSO-G24 | Not Qualified | 2 poles | X7T | COMMERCIAL | 5 A | 12 V | 2.5V | 60 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No GS9074ACNE3 | Gennum Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 16 | KGM | 1206 | 3216 | 0.067 g | GENNUM CORP | MLCC | SMD | 70 °C | PLASTIC/EPOXY | QCCN | LCC16,.16SQ,25 | SQUARE | CHIP CARRIER | Transferred | Yes | 3.3 V | ceramic | -55...125°C | ±5% | 8542.39.00.01 | 1.8nF | QUAD | NO LEAD | 0.635 mm | unknown | S-PQCC-N16 | Not Qualified | C0G (NP0) | COMMERCIAL | 100V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No TCM3105NL | Texas Instruments | Datasheet | - | - | Min: 1 Mult: 1 | NO | 16 | TEXAS INSTRUMENTS INC | 70 °C | PLASTIC/EPOXY | DIP | 0.300 INCH, PLASTIC, DIP-16 | DIP16,.3 | RECTANGULAR | IN-LINE | Obsolete | DIP | No | 5 V | FULL DUPLEX | 8542.39.00.01 | DUAL | THROUGH-HOLE | NOT SPECIFIED | 1 | 2.54 mm | not_compliant | NOT SPECIFIED | 16 | R-PDIP-T16 | Not Qualified | COMMERCIAL | 12 mA | 5.08 mm | MODEM | 19.304 mm | 7.62 mm |
BCM4330FKUBG
Infineon Technologies AG
Package:Interface - Telecom
Price: please inquire
BCM4330FKUBG
Cypress Semiconductor
Package:Interface - Telecom
Price: please inquire
DS856
Euvis Inc
Package:Interface - Telecom
Price: please inquire
MC2833P
Freescale Semiconductor
Package:Interface - Telecom
Price: please inquire
LM567CMX
National Semiconductor Corporation
Package:Interface - Telecom
Price: please inquire
TP3067WMX
Texas Instruments
Package:Interface - Telecom
Price: please inquire
LM567CN/NOPB
National Semiconductor Corporation
Package:Interface - Telecom
Price: please inquire
TJA1044GT
NXP Semiconductors
Package:Interface - Telecom
Price: please inquire
RF9802TR13
RF Micro Devices Inc
Package:Interface - Telecom
Price: please inquire
GRF4005
Guerrilla RF
Package:Interface - Telecom
Price: please inquire
RF5722TR7
RF Micro Devices Inc
Package:Interface - Telecom
Price: please inquire
AWT6621RM45Q7
Coherent Thermal Solutions
Package:Interface - Telecom
Price: please inquire
AWT6621RM45Q7
ANADIGICS Inc
Package:Interface - Telecom
Price: please inquire
DP83865BVH
National Semiconductor Corporation
Package:Interface - Telecom
Price: please inquire
LMV225SDX
National Semiconductor Corporation
Package:Interface - Telecom
Price: please inquire
TJA1040T
NXP Semiconductors
Package:Interface - Telecom
Price: please inquire
TP3067WM
National Semiconductor Corporation
Package:Interface - Telecom
Price: please inquire
TDA8060TS
Philips Semiconductors
Package:Interface - Telecom
Price: please inquire
GS9074ACNE3
Gennum Corporation
Package:Interface - Telecom
Price: please inquire
TCM3105NL
Texas Instruments
Package:Interface - Telecom
Price: please inquire
