The category is 'Interface - Telecom'
Interface - Telecom (6000)
- All Manufacturers
- Moisture Sensitivity Level (MSL)
- Part Status
- RoHS Status
- Package / Case
- Mounting Type
- Packaging
- Factory Lead Time
- Number of Circuits
- Function
- Voltage - Supply
- Terminal Position
- Number of Terminations
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Surface Mount | Number of Terminals | Ihs Manufacturer | Moisture Sensitivity Levels | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Nom | JESD-609 Code | Pbfree Code | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Temperature Grade | Operating Mode | Supply Current-Max | Data Rate | Seated Height-Max | Screening Level | Telecom IC Type | Number of Transceivers | Filter | Linear Coding | Make-break Ratio | Length | Width |
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 | Mfr Part No TXC-06112AICB | Transwitch Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 474 | TRANSWITCH CORP | 85 °C | -40 °C | CERAMIC, METAL-SEALED COFIRED | BGA | BGA, BGA474,19X25,50 | BGA474,19X25,50 | RECTANGULAR | GRID ARRAY | Obsolete | BGA | 3.3 V | 8542.39.00.01 | BOTTOM | BALL | 1 | 1.27 mm | unknown | 474 | R-CBGA-B474 | Not Qualified | INDUSTRIAL | 1110 mA | 5.9 mm | ATM/SONET/SDH TERMINATOR | 32.5 mm | 25 mm | |||||||||||||||||
 | Mfr Part No BCM89883B1BFBGT | Broadcom Limited | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No FX806ALS | CML Microcircuits Plc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 24 | CML MICROCIRCUITS LTD | 85 °C | -40 °C | PLASTIC/EPOXY | QCCJ | QCCJ, | SQUARE | CHIP CARRIER | Obsolete | LCC | Yes | 5 V | e2 | Yes | TIN SILVER | 8542.39.00.01 | QUAD | J BEND | 260 | 1 | 1.27 mm | compliant | 40 | 24 | S-PQCC-J24 | Not Qualified | INDUSTRIAL | 3.7 mm | TELECOM CIRCUIT | 10.16 mm | 10.16 mm | |||||||||||||
| Mfr Part No MDBT40-256V3 | Raytec Corporation | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No TISP61060D | JW Miller | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | POWER INNOVATIONS LTD | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP, | RECTANGULAR | SMALL OUTLINE | Transferred | SOIC | 8542.39.00.01 | DUAL | GULL WING | 1 | 1.27 mm | unknown | 8 | R-PDSO-G8 | Not Qualified | INDUSTRIAL | 1.75 mm | SURGE PROTECTION CIRCUIT | 4.9 mm | 3.9 mm | ||||||||||||||||||||
| Mfr Part No RF3225 | RF Micro Devices Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 17 | RF MICRO DEVICES INC | 5A | 85 °C | -30 °C | PLASTIC/EPOXY | HTSON | HTSON, | SQUARE | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE | Transferred | SOIC | Yes | 3.6 V | Yes | 5A991.G | 8542.33.00.01 | DUAL | NO LEAD | 1 | compliant | 17 | S-PDSO-N17 | Not Qualified | OTHER | 1.05 mm | RF AND BASEBAND CIRCUIT | 5 mm | 5 mm | ||||||||||||||||
 | Mfr Part No PCD5032T | NXP Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | YES | 28 | NXP SEMICONDUCTORS | 70 °C | -25 °C | PLASTIC/EPOXY | SOP | SOP, | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | 8542.39.00.01 | DUAL | GULL WING | 1 | 1.27 mm | unknown | 28 | R-PDSO-G28 | Not Qualified | OTHER | SYNCHRONOUS | 2.65 mm | ADPCM CODEC | YES | 17.9 mm | 7.5 mm | ||||||||||||||||||
| Mfr Part No PCD5032T | Philips Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | YES | 28 | PHILIPS SEMICONDUCTORS | 70 °C | -25 °C | PLASTIC/EPOXY | SOP | SOP, SOP28,.4 | SOP28,.4 | RECTANGULAR | SMALL OUTLINE | Transferred | No | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | DUAL | GULL WING | 1 | 1.27 mm | unknown | R-PDSO-G28 | Not Qualified | OTHER | 14 mA | PCM CODEC | YES | 14-BIT | ||||||||||||||||||
| Mfr Part No PSB4506 | Infineon Technologies AG | Datasheet | - | - | Min: 1 Mult: 1 | NO | 28 | INFINEON TECHNOLOGIES AG | 70 °C | -20 °C | PLASTIC/EPOXY | DIP | DIP28,.6 | RECTANGULAR | IN-LINE | Obsolete | No | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | not_compliant | R-PDIP-T28 | Not Qualified | COMMERCIAL | 60 mA | |||||||||||||||||||||||
| Mfr Part No SN65HVD230QDQ1 | Texas Instruments | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | TEXAS INSTRUMENTS INC | 1 | 125 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP, SOP8,.25 | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | Yes | 3.3 V | e4 | Yes | NICKEL PALLADIUM GOLD | 8542.39.00.01 | DUAL | GULL WING | 260 | 1 | 1.27 mm | unknown | 30 | 8 | R-PDSO-G8 | Not Qualified | AUTOMOTIVE | 0.017 mA | 1000 Mbps | 1.75 mm | AEC-Q100 | INTERFACE CIRCUIT | 1 | 4.9 mm | 3.9 mm | |||||||
| Mfr Part No TEA1095T | Philips Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | YES | 24 | PHILIPS SEMICONDUCTORS | 70 °C | -25 °C | PLASTIC/EPOXY | SOP | SOP, SOP24,.4 | SOP24,.4 | RECTANGULAR | SMALL OUTLINE | Transferred | No | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | DUAL | GULL WING | 1.27 mm | unknown | R-PDSO-G24 | Not Qualified | OTHER | 3.8 mA | SPEAKER PHONE CIRCUIT | |||||||||||||||||||||
| Mfr Part No SIM7600G-H R2 S2-1097D-Z31E3 | SIMCom | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MC34117P | Freescale Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | NO | 8 | MOTOROLA SEMICONDUCTOR PRODUCTS | PLASTIC/EPOXY | DIP | DIP, DIP8,.3 | DIP8,.3 | RECTANGULAR | IN-LINE | Obsolete | No | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-PDIP-T8 | Not Qualified | ||||||||||||||||||||||||||
| Mfr Part No MC14409L | Motorola Semiconductor Products | Datasheet | - | - | Min: 1 Mult: 1 | NO | 16 | MOTOROLA INC | 85 °C | -40 °C | CERAMIC, GLASS-SEALED | DIP | DIP, DIP16,.3 | DIP16,.3 | RECTANGULAR | IN-LINE | Obsolete | No | 5 V | e0 | TIN LEAD | SELECTABLE MAKE/BREAK RATIO 1:2 | 8542.39.00.01 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | R-GDIP-T16 | Not Qualified | INDUSTRIAL | 1.25 mA | 4.19 mm | TELEPHONE DIALER CIRCUIT | 1:1.5 | 19.3 mm | 7.62 mm | ||||||||||||||
| Mfr Part No MC14409L | Freescale Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | NO | 16 | MOTOROLA SEMICONDUCTOR PRODUCTS | 85 °C | -40 °C | CERAMIC | DIP | DIP, DIP16,.3 | DIP16,.3 | RECTANGULAR | IN-LINE | Obsolete | No | e0 | Tin/Lead (Sn/Pb) | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-XDIP-T16 | Not Qualified | INDUSTRIAL | ||||||||||||||||||||||||
| Mfr Part No T83-A150X | TDK Corporation | Datasheet | - | - | Min: 1 Mult: 1 | NO | 3 | TDK CORP | 90 °C | -40 °C | UNSPECIFIED | , | ROUND | SPECIAL SHAPE | Active | 8542.39.00.01 | UNSPECIFIED | WIRE | 1 | unknown | O-XXSS-W3 | INDUSTRIAL | GAS DISCHARGE TUBE SUPPRESSOR | ||||||||||||||||||||||||||||
| Mfr Part No SC8206A4 | Hangzhou Silan Microelectronics CO LTD | Datasheet | - | - | Min: 1 Mult: 1 | NO | 18 | HANGZHOU SILAN MICROELECTRONICS CO LTD | 70 °C | -10 °C | PLASTIC/EPOXY | DIP | DIP, DIP18,.3 | DIP18,.3 | RECTANGULAR | IN-LINE | Contact Manufacturer | Yes | 5 V | 8542.39.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | compliant | R-PDIP-T18 | Not Qualified | COMMERCIAL | TELECOM CIRCUIT | |||||||||||||||||||||||
| Mfr Part No TJA1028TK/3V3/20 | NXP Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | NXP SEMICONDUCTORS | 150 °C | -40 °C | PLASTIC/EPOXY | HVSON | HVSON, | SOLCC8,.12,25 | SQUARE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | Active | SON | 12 V | 8542.39.00.01 | DUAL | NO LEAD | 1 | 0.65 mm | unknown | 8 | S-PDSO-N8 | 1 mm | AEC-Q100 | LIN TRANSCEIVER | 1 | 3 mm | 3 mm | ||||||||||||||||||
 | Mfr Part No RF6539 | RF Micro Devices Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 28 | RF MICRO DEVICES INC | 3 | 70 °C | -30 °C | UNSPECIFIED | QCCN | QCCN, | RECTANGULAR | CHIP CARRIER | Transferred | QFN | Yes | 3.6 V | Yes | 5A991.G | 8542.39.00.01 | QUAD | NO LEAD | 1 | compliant | 28 | R-XQCC-N28 | Not Qualified | OTHER | 1.215 mm | TELECOM CIRCUIT | 5.5 mm | 5 mm | ||||||||||||||||
| Mfr Part No MDX-19-6-1-T-F | Methode Electronics Inc | Datasheet | - | - | Min: 1 Mult: 1 | NO | METHODE ELECTRONICS INC | 70 °C | UNSPECIFIED | RECTANGULAR | FIBER OPTIC | Contact Manufacturer | 5 V | 8542.39.00.01 | UNSPECIFIED | UNSPECIFIED | 1 | unknown | R-XXFO-X | Not Qualified | COMMERCIAL | TELECOM CIRCUIT |
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TXC-06112AICB
Transwitch Corporation
Package:Interface - Telecom
Price: please inquire
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BCM89883B1BFBGT
Broadcom Limited
Package:Interface - Telecom
Price: please inquire
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FX806ALS
CML Microcircuits Plc
Package:Interface - Telecom
Price: please inquire
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MDBT40-256V3
Raytec Corporation
Package:Interface - Telecom
Price: please inquire
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TISP61060D
JW Miller
Package:Interface - Telecom
Price: please inquire
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RF3225
RF Micro Devices Inc
Package:Interface - Telecom
Price: please inquire
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PCD5032T
NXP Semiconductors
Package:Interface - Telecom
Price: please inquire
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PCD5032T
Philips Semiconductors
Package:Interface - Telecom
Price: please inquire
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PSB4506
Infineon Technologies AG
Package:Interface - Telecom
Price: please inquire
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SN65HVD230QDQ1
Texas Instruments
Package:Interface - Telecom
Price: please inquire
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TEA1095T
Philips Semiconductors
Package:Interface - Telecom
Price: please inquire
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SIM7600G-H R2 S2-1097D-Z31E3
SIMCom
Package:Interface - Telecom
Price: please inquire
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MC34117P
Freescale Semiconductor
Package:Interface - Telecom
Price: please inquire
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MC14409L
Motorola Semiconductor Products
Package:Interface - Telecom
Price: please inquire
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MC14409L
Freescale Semiconductor
Package:Interface - Telecom
Price: please inquire
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T83-A150X
TDK Corporation
Package:Interface - Telecom
Price: please inquire
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SC8206A4
Hangzhou Silan Microelectronics CO LTD
Package:Interface - Telecom
Price: please inquire
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TJA1028TK/3V3/20
NXP Semiconductors
Package:Interface - Telecom
Price: please inquire
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RF6539
RF Micro Devices Inc
Package:Interface - Telecom
Price: please inquire
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MDX-19-6-1-T-F
Methode Electronics Inc
Package:Interface - Telecom
Price: please inquire