The category is 'Interface - Telecom'
Interface - Telecom (6000)
- All Manufacturers
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- Part Status
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- Number of Circuits
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- Voltage - Supply
- Terminal Position
- Number of Terminations
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Surface Mount | Number of Terminals | Carrier Type (2) | Ihs Manufacturer | Manufacturer Package Code | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Nom | JESD-609 Code | Pbfree Code | ECCN Code | Terminal Finish | Applications | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Temperature Grade | Supply Current-Max | Data Rate | Seated Height-Max | Screening Level | Telecom IC Type | Number of Transceivers | Filter | Companding Law | Neg Supply Voltage-Nom | Gain Tolerance-Max | Linear Coding | Carrier Type | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No HM9100A1 | Hualon Microelectronics Corp | Datasheet | - | - | Min: 1 Mult: 1 | HUALON MICROELECTRONICS CORP | , | Contact Manufacturer | unknown | ||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MCP2104-X002B-C | ATGBICS | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No S2020A | Desco Industries Inc | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MC145029P | Freescale Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | NO | 16 | MOTOROLA SEMICONDUCTOR PRODUCTS | 85 °C | -40 °C | PLASTIC/EPOXY | DIP | DIP, DIP16,.3 | DIP16,.3 | RECTANGULAR | IN-LINE | Obsolete | No | e0 | Tin/Lead (Sn/Pb) | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-PDIP-T16 | Not Qualified | INDUSTRIAL | TELECOMM CIRCUIT | |||||||||||||||||||||||||||
| Mfr Part No R8070J | Conexant Systems Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 68 | T-1(DS1) | CONEXANT SYSTEMS | 70 °C | PLASTIC/EPOXY | QCCJ | QCCJ, LDCC68,1.0SQ | LDCC68,1.0SQ | SQUARE | CHIP CARRIER | Obsolete | No | 5 V | e0 | TIN LEAD | 8542.39.00.01 | QUAD | J BEND | 1.27 mm | compliant | S-PQCC-J68 | Not Qualified | COMMERCIAL | 0.019 mA | CEPT PCM-30/E-1 | ||||||||||||||||||||||||
 | Mfr Part No 88E1111-XX-BAB1C000 | Marvell Technology Group Ltd | Datasheet | - | - | Min: 1 Mult: 1 | YES | 117 | MARVELL SEMICONDUCTOR INC | PLASTIC/EPOXY | LBGA | LBGA, BGA117,9X13,40 | BGA117,9X13,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | Active | BGA | Yes | 1 V | Yes | IT ALSO REQUIRES 2.5V DIGITAL SUPPLY | 8542.39.00.01 | BOTTOM | BALL | 1 | 1 mm | compliant | 117 | R-PBGA-B117 | Not Qualified | 1000000 Mbps | 1.54 mm | ETHERNET TRANSCEIVER | 1 | 14 mm | 10 mm | ||||||||||||||||||||
| Mfr Part No PT8A976BW | Pericom Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 16 | PERICOM TECHNOLOGY INC | 40 °C | -10 °C | PLASTIC/EPOXY | SOP | SOP, SOP16,.25 | SOP16,.25 | RECTANGULAR | SMALL OUTLINE | Transferred | 4 V | 8542.39.00.01 | DUAL | GULL WING | 1.27 mm | unknown | R-PDSO-G16 | Not Qualified | COMMERCIAL | TELECOM CIRCUIT | ||||||||||||||||||||||||||||
| Mfr Part No LAN88730BM-C | Microchip Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | MICROCHIP TECHNOLOGY INC | 105 °C | -40 °C | PLASTIC/EPOXY | HVQCCN | HVQCCN, | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Active | Yes | 1.2 V | e3 | MATTE TIN | 8542.39.00.01 | QUAD | NO LEAD | 1 | 0.5 mm | compliant | S-PQCC-N32 | INDUSTRIAL | 0.9 mm | TS 16949 | ETHERNET TRANSCEIVER | 5 mm | 5 mm | ||||||||||||||||||||||
| Mfr Part No MSM7570-TS-K-01 | LAPIS Semiconductor Co Ltd | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | LAPIS SEMICONDUCTOR CO LTD | 70 °C | -25 °C | PLASTIC/EPOXY | TSSOP | TSSOP, TSSOP32,.56,20 | TSSOP32,.56,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | No | 5 V | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | DUAL | GULL WING | 1 | 0.5 mm | unknown | R-PDSO-G32 | Not Qualified | OTHER | 28 mA | PCM CODEC | YES | MU-LAW | 1.2 dB | NOT AVAILABLE | |||||||||||||||||||
| Mfr Part No RFFM4501FTR7 | RF Micro Devices Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 16 | RF MICRO DEVICES INC | 85 °C | -20 °C | UNSPECIFIED | , | SQUARE | MICROELECTRONIC ASSEMBLY | Transferred | 3.3 V | 5A991.G | 8517.62.00.50 | QUAD | NO LEAD | 1 | 0.5 mm | unknown | S-XQMA-N16 | OTHER | 1.05 mm | TELECOM CIRCUIT | 3 mm | 3 mm | ||||||||||||||||||||||||||
| Mfr Part No AK26060002 | TXC Corporation | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No RJG-LP11H | Methode Electronics Inc | Datasheet | - | - | Min: 1 Mult: 1 | NO | 10 | METHODE ELECTRONICS INC | 85 °C | -40 °C | UNSPECIFIED | RECTANGULAR | FIBER OPTIC | Contact Manufacturer | 3.3 V | 8542.39.00.01 | UNSPECIFIED | THROUGH-HOLE | 1 | unknown | R-XXFO-T10 | Not Qualified | INDUSTRIAL | TELECOM CIRCUIT | |||||||||||||||||||||||||||||||
| Mfr Part No MC1420232FU | NXP Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | YES | 44 | NXP SEMICONDUCTORS | 85 °C | -40 °C | PLASTIC/EPOXY | QFP | QFP44,.47SQ,32 | SQUARE | FLATPACK | Active | 3.3 V | 8542.39.00.01 | QUAD | GULL WING | 1 | 0.8 mm | compliant | S-PQFP-G44 | Not Qualified | INDUSTRIAL | PCM CODEC | YES | A/MU-LAW | 1 dB | |||||||||||||||||||||||||
| Mfr Part No SKY13730-11 | Skyworks Solutions Inc | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No RF7241 | RF Micro Devices Inc | Datasheet | - | - | Min: 1 Mult: 1 | NO | 10 | RF MICRO DEVICES INC | 85 °C | -30 °C | UNSPECIFIED | , | SQUARE | MICROELECTRONIC ASSEMBLY | Transferred | MODULE | 3.4 V | 8542.39.00.01 | DUAL | NO LEAD | 1 | 0.6 mm | unknown | 10 | S-XDMA-N10 | Not Qualified | OTHER | 1.05 mm | TELECOM CIRCUIT | 3 mm | 3 mm | ||||||||||||||||||||||||
| Mfr Part No OQ2535HP | Intel Corporation | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No OQ2535HP | NXP Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | YES | 100 | NXP SEMICONDUCTORS | 85 °C | -40 °C | PLASTIC/EPOXY | HLFQFP | HLFQFP, QFP100,.63SQ,20 | QFP100,.63SQ,20 | SQUARE | FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH | Obsolete | QFP | No | 3.3 V | SDH; SONET | 8542.39.00.01 | QUAD | GULL WING | 1 | 0.5 mm | unknown | 100 | S-PQFP-G100 | Not Qualified | INDUSTRIAL | 364 mA | 1.6 mm | ATM/SONET/SDH MUX/DEMUX | -4.5 V | 14 mm | 14 mm | ||||||||||||||||||
 | Mfr Part No SIW3500DIF1-T13 | RF Micro Devices Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 94 | RF MICRO DEVICES INC | 85 °C | -40 °C | PLASTIC/EPOXY | VFBGA | VFBGA, | SQUARE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Obsolete | DIE | Yes | 1.8 V | e1 | TIN SILVER COPPER | 8542.39.00.01 | BOTTOM | BALL | 1 | compliant | 94 | S-PBGA-B94 | Not Qualified | INDUSTRIAL | 0.415 mm | TELECOM CIRCUIT | 3.7 mm | 3.7 mm | |||||||||||||||||||||
| Mfr Part No MC145611P | Freescale Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | NO | 20 | MOTOROLA SEMICONDUCTOR PRODUCTS | PLASTIC/EPOXY | DIP | DIP, DIP20,.3 | DIP20,.3 | RECTANGULAR | IN-LINE | Obsolete | No | 5 V | e0 | Tin/Lead (Sn/Pb) | DUAL | THROUGH-HOLE | NOT SPECIFIED | 1 | 2.54 mm | unknown | NOT SPECIFIED | R-PDIP-T20 | Not Qualified | 4.57 mm | CONFERENCING CIRCUIT | 26.415 mm | 7.62 mm | |||||||||||||||||||||||
| Mfr Part No TCP-3068N-DT | onsemi | Datasheet | - | - | Min: 1 Mult: 1 | YES | 12 | ON SEMICONDUCTOR | 567KE | 85 °C | -30 °C | PLASTIC/EPOXY | VFBGA | VFBGA, | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Obsolete | Yes | Yes | 8542.39.00.01 | BOTTOM | BALL | 1 | compliant | R-PBGA-B12 | OTHER | 0.611 mm | TELECOM CIRCUIT | 1.179 mm | 0.722 mm |
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HM9100A1
Hualon Microelectronics Corp
Package:Interface - Telecom
Price: please inquire
-
MCP2104-X002B-C
ATGBICS
Package:Interface - Telecom
Price: please inquire
-
S2020A
Desco Industries Inc
Package:Interface - Telecom
Price: please inquire
-
MC145029P
Freescale Semiconductor
Package:Interface - Telecom
Price: please inquire
-
R8070J
Conexant Systems Inc
Package:Interface - Telecom
Price: please inquire
-
88E1111-XX-BAB1C000
Marvell Technology Group Ltd
Package:Interface - Telecom
Price: please inquire
-
PT8A976BW
Pericom Technology Inc
Package:Interface - Telecom
Price: please inquire
-
LAN88730BM-C
Microchip Technology Inc
Package:Interface - Telecom
Price: please inquire
-
MSM7570-TS-K-01
LAPIS Semiconductor Co Ltd
Package:Interface - Telecom
Price: please inquire
-
RFFM4501FTR7
RF Micro Devices Inc
Package:Interface - Telecom
Price: please inquire
-
AK26060002
TXC Corporation
Package:Interface - Telecom
Price: please inquire
-
RJG-LP11H
Methode Electronics Inc
Package:Interface - Telecom
Price: please inquire
-
MC1420232FU
NXP Semiconductors
Package:Interface - Telecom
Price: please inquire
-
SKY13730-11
Skyworks Solutions Inc
Package:Interface - Telecom
Price: please inquire
-
RF7241
RF Micro Devices Inc
Package:Interface - Telecom
Price: please inquire
-
OQ2535HP
Intel Corporation
Package:Interface - Telecom
Price: please inquire
-
OQ2535HP
NXP Semiconductors
Package:Interface - Telecom
Price: please inquire
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SIW3500DIF1-T13
RF Micro Devices Inc
Package:Interface - Telecom
Price: please inquire
-
MC145611P
Freescale Semiconductor
Package:Interface - Telecom
Price: please inquire
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TCP-3068N-DT
onsemi
Package:Interface - Telecom
Price: please inquire