The category is 'Interface - Telecom'
Interface - Telecom (6000)
- All Manufacturers
- Moisture Sensitivity Level (MSL)
- Part Status
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- Voltage - Supply
- Terminal Position
- Number of Terminations
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Surface Mount | Number of Terminals | Date Of Intro | Ihs Manufacturer | Moisture Sensitivity Levels | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Nom | JESD-609 Code | Pbfree Code | ECCN Code | Terminal Finish | Applications | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Temperature Grade | Supply Current-Max | Seated Height-Max | Telecom IC Type | Make-break Ratio | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No ADN2809XCP | Analog Devices Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | ANALOG DEVICES INC | 85 °C | -40 °C | PLASTIC/EPOXY | VQCCN | 7 X 7 MM, LFCSP-48 | LCC48,.27SQ,20 | SQUARE | CHIP CARRIER, VERY THIN PROFILE | Obsolete | QFN | No | 3.3 V | e0 | 5A991.B.3 | TIN LEAD | SDH; SONET | 8542.39.00.01 | QUAD | NO LEAD | 1 | 0.5 mm | unknown | 48 | S-PQCC-N48 | Not Qualified | INDUSTRIAL | 0.38 mA | 1 mm | ATM/SONET/SDH CLOCK RECOVERY CIRCUIT | 7 mm | 7 mm | ||||||||
| Mfr Part No TISP61089B | Bourns Inc | Datasheet | - | - | Min: 1 Mult: 1 | 2019-08-19 | BOURNS INC | , | Active | 8542.39.00.01 | unknown | SURGE PROTECTION CIRCUIT | |||||||||||||||||||||||||||||||||||
| Mfr Part No RFMD2080TR7 | RF Micro Devices Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | RF MICRO DEVICES INC | 85 °C | -40 °C | UNSPECIFIED | HVQCCN | HVQCCN, LCC32,.2SQ,20 | LCC32,.2SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Transferred | QFN | Yes | 3 V | 5A991.G | 8542.39.00.01 | QUAD | NO LEAD | 1 | 0.5 mm | unknown | 32 | S-XQCC-N32 | Not Qualified | INDUSTRIAL | 0.95 mm | MODEM-MODULATOR | 5 mm | 5 mm | ||||||||||||
| Mfr Part No TCM1501BP | Texas Instruments | Datasheet | - | - | Min: 1 Mult: 1 | NO | 8 | TEXAS INSTRUMENTS INC | 70 °C | -20 °C | PLASTIC/EPOXY | DIP | DIP, DIP8,.3 | DIP8,.3 | RECTANGULAR | IN-LINE | Obsolete | No | No | 8542.39.00.01 | DUAL | THROUGH-HOLE | NOT SPECIFIED | 1 | 2.54 mm | not_compliant | NOT SPECIFIED | R-PDIP-T8 | Not Qualified | COMMERCIAL | 0.0013 mA | 5.08 mm | TELEPHONE RINGER CIRCUIT | 9.81 mm | 7.62 mm | ||||||||||||
 | Mfr Part No AD8315ACHIPS | Analog Devices Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | ANALOG DEVICES INC | UNSPECIFIED | DIE | DIE, | RECTANGULAR | UNCASED CHIP | Active | DIE | 2.7 V | 8542.39.00.01 | UPPER | NO LEAD | 1 | compliant | R-XUUC-N | Not Qualified | TELECOM CIRCUIT | ||||||||||||||||||||||||
 | Mfr Part No RFFC2072SQ | RF Micro Devices Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | RF MICRO DEVICES INC | 85 °C | -40 °C | UNSPECIFIED | HVQCCN | HVQCCN, | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Transferred | QFN | Yes | 3 V | Yes | 5A991.G | 8517.70.00.00 | QUAD | NO LEAD | NOT SPECIFIED | 1 | 0.5 mm | compliant | NOT SPECIFIED | 32 | S-XQCC-N32 | Not Qualified | INDUSTRIAL | 1 mm | TELECOM CIRCUIT | 5 mm | 5 mm | ||||||||||
 | Mfr Part No FX613P | CML Microcircuits Plc | Datasheet | - | - | Min: 1 Mult: 1 | NO | 14 | CML MICROCIRCUITS LTD | 85 °C | -40 °C | PLASTIC/EPOXY | DIP | DIP, | RECTANGULAR | IN-LINE | Obsolete | DIP | 3.3 V | 8542.39.00.01 | DUAL | THROUGH-HOLE | 1 | unknown | 14 | R-PDIP-T14 | Not Qualified | INDUSTRIAL | 30 mA | TONE DECODER CIRCUIT | ||||||||||||||||||
 | Mfr Part No TA31025N | Toshiba America Electronic Components | Datasheet | - | - | Min: 1 Mult: 1 | NO | 24 | TOSHIBA CORP | 85 °C | -30 °C | PLASTIC/EPOXY | SDIP | SDIP, | RECTANGULAR | IN-LINE, SHRINK PITCH | Active | DIP | No | e0 | No | TIN LEAD | 8542.39.00.01 | DUAL | THROUGH-HOLE | 1 | 1.778 mm | unknown | 24 | R-PDIP-T24 | Not Qualified | OTHER | 4.5 mm | TELEPHONE SPEECH CIRCUIT | 22 mm | 7.62 mm | ||||||||||||
 | Mfr Part No SY87701ALZI | Micrel Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 28 | MICREL INC | 1 | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP, SOP28,.4 | SOP28,.4 | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | No | 3.3 V | e0 | Tin/Lead (Sn75Pb25) | ATM; SDH; SONET | 8542.39.00.01 | DUAL | GULL WING | 240 | 1 | 1.27 mm | not_compliant | 30 | 28 | R-PDSO-G28 | Not Qualified | INDUSTRIAL | 0.16 mA | 2.65 mm | ATM/SONET/SDH CLOCK RECOVERY CIRCUIT | 17.93 mm | 7.52 mm | ||||||
| Mfr Part No RTL8812FR-CG | TDK Corporation | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No RFDA0057SQ | RF Micro Devices Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | RF MICRO DEVICES INC | 3 | 85 °C | -40 °C | UNSPECIFIED | BCC | BCC, | SQUARE | CHIP CARRIER | Transferred | MCM | Yes | 5 V | Yes | 5A991.G | 8542.33.00.01 | BOTTOM | BUTT | 1 | 0.7 mm | compliant | 32 | S-XBCC-B32 | INDUSTRIAL | 1.25 mm | RF AND BASEBAND CIRCUIT | 7 mm | 7 mm | ||||||||||||
| Mfr Part No NE5750N | YAGEO Corporation | Datasheet | - | - | Min: 1 Mult: 1 | NO | 24 | PHILIPS COMPONENTS | PLASTIC/EPOXY | , | RECTANGULAR | IN-LINE | Obsolete | 8542.39.00.01 | DUAL | THROUGH-HOLE | 1 | unknown | R-PDIP-T24 | Not Qualified | COMMERCIAL | TELECOM CIRCUIT | |||||||||||||||||||||||||
| Mfr Part No PEB2050NVB1 | Siemens | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No TQM8M9076 | TriQuint Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | TRIQUINT SEMICONDUCTOR INC | 85 °C | -40 °C | UNSPECIFIED | HQCCN | HQCCN, | SQUARE | CHIP CARRIER, HEAT SINK/SLUG | Transferred | QFN | 5 V | e4 | GOLD OVER NICKEL | 8542.39.00.01 | QUAD | NO LEAD | 1 | 0.5 mm | unknown | 32 | S-XQCC-N32 | INDUSTRIAL | RF AND BASEBAND CIRCUIT | 5 mm | 5 mm | |||||||||||||||
| Mfr Part No AW-CU300 V3 | AzureWave Technologies | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No PEF2035N | Infineon Technologies AG | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No PEF2035N | Siemens | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No WM8595GEFL/RS | Cirrus Logic | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No TP53190N | National Semiconductor Corporation | Datasheet | - | - | Min: 1 Mult: 1 | NO | 20 | NATIONAL SEMICONDUCTOR CORP | 70 °C | -30 °C | PLASTIC/EPOXY | DIP | DIP, DIP20,.3 | DIP20,.3 | RECTANGULAR | IN-LINE | Obsolete | No | 3 V | e0 | TIN LEAD | SELECTABLE MAKE/BREAK RATIO 1:1.5;1:1.6;1:2 | 8542.39.00.01 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | R-PDIP-T20 | Not Qualified | OTHER | 0.3 mA | 5.08 mm | TELEPHONE DIALER CIRCUIT | 1:1 | 26.075 mm | 7.62 mm | ||||||||||
| Mfr Part No TP53190N | Texas Instruments | Datasheet | - | - | Min: 1 Mult: 1 | NO | 20 | NATIONAL SEMICONDUCTOR CORP | 70 °C | -30 °C | PLASTIC/EPOXY | DIP | DIP, DIP20,.3 | DIP20,.3 | RECTANGULAR | IN-LINE | Obsolete | No | 3 V | e0 | TIN LEAD | SELECTABLE MAKE/BREAK RATIO 1:1.5;1:1.6;1:2 | 8542.39.00.01 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | R-PDIP-T20 | Not Qualified | OTHER | 0.3 mA | 5.08 mm | TELEPHONE DIALER CIRCUIT | 1:1 | 26.075 mm | 7.62 mm |
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ADN2809XCP
Analog Devices Inc
Package:Interface - Telecom
Price: please inquire
-
TISP61089B
Bourns Inc
Package:Interface - Telecom
Price: please inquire
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RFMD2080TR7
RF Micro Devices Inc
Package:Interface - Telecom
Price: please inquire
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TCM1501BP
Texas Instruments
Package:Interface - Telecom
Price: please inquire
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AD8315ACHIPS
Analog Devices Inc
Package:Interface - Telecom
Price: please inquire
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RFFC2072SQ
RF Micro Devices Inc
Package:Interface - Telecom
Price: please inquire
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FX613P
CML Microcircuits Plc
Package:Interface - Telecom
Price: please inquire
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TA31025N
Toshiba America Electronic Components
Package:Interface - Telecom
Price: please inquire
-
SY87701ALZI
Micrel Inc
Package:Interface - Telecom
Price: please inquire
-
RTL8812FR-CG
TDK Corporation
Package:Interface - Telecom
Price: please inquire
-
RFDA0057SQ
RF Micro Devices Inc
Package:Interface - Telecom
Price: please inquire
-
NE5750N
YAGEO Corporation
Package:Interface - Telecom
Price: please inquire
-
PEB2050NVB1
Siemens
Package:Interface - Telecom
Price: please inquire
-
TQM8M9076
TriQuint Semiconductor
Package:Interface - Telecom
Price: please inquire
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AW-CU300 V3
AzureWave Technologies
Package:Interface - Telecom
Price: please inquire
-
PEF2035N
Infineon Technologies AG
Package:Interface - Telecom
Price: please inquire
-
PEF2035N
Siemens
Package:Interface - Telecom
Price: please inquire
-
WM8595GEFL/RS
Cirrus Logic
Package:Interface - Telecom
Price: please inquire
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TP53190N
National Semiconductor Corporation
Package:Interface - Telecom
Price: please inquire
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TP53190N
Texas Instruments
Package:Interface - Telecom
Price: please inquire