The category is 'Interface - Telecom'
Interface - Telecom (6000)
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- Moisture Sensitivity Level (MSL)
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- Voltage - Supply
- Terminal Position
- Number of Terminations
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Surface Mount | Number of Terminals | Date Of Intro | Ihs Manufacturer | Manufacturer Package Code | Moisture Sensitivity Levels | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Nom | Supply Voltage-Nom (Vsup) | Threshold Voltage-Nom | JESD-609 Code | ECCN Code | Terminal Finish | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Temperature Grade | Supply Voltage-Min (Vsup) | Number of Channels | Analog IC - Other Type | Operating Mode | Adjustable Threshold | Supply Current-Max | Data Rate | Seated Height-Max | Screening Level | Telecom IC Type | Number of Transceivers | Filter | Companding Law | Neg Supply Voltage-Nom | Gain Tolerance-Max | Linear Coding | Length | Width |
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![]() | Mfr Part No TJA1043TK | NXP Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | YES | 14 | NXP SEMICONDUCTORS | PLASTIC/EPOXY | HVSON | HVSON, DILCC14,.12x0.18,25 | DILCC14,.12x0.18,25 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | Active | Yes | 5 V | EAR99 | 8542.39.00.01 | DUAL | NO LEAD | 1 | 0.65 mm | compliant | R-PDSO-N14 | 109 mA | 5000 Mbps | 1 mm | AEC-Q100 | INTERFACE CIRCUIT | 1 | 4.5 mm | 3 mm | ||||||||||||||||||||||||||||
![]() | Mfr Part No AMMP-6429-TR1G | Broadcom Limited | Datasheet | - | - | Min: 1 Mult: 1 | BROADCOM LTD | , | Obsolete | 8542.39.00.01 | compliant | RF AND BASEBAND CIRCUIT | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No TJA1029TK | NXP Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | NXP SEMICONDUCTORS | 1 | PLASTIC/EPOXY | HVSON | HVSON, | SQUARE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | Active | Yes | 12 V | EAR99 | 8542.39.00.01 | DUAL | NO LEAD | NOT SPECIFIED | 1 | 0.65 mm | compliant | NOT SPECIFIED | S-PDSO-N8 | 1 mm | AEC-Q100 | INTERFACE CIRCUIT | 3 mm | 3 mm | |||||||||||||||||||||||||||||
![]() | Mfr Part No TJA1049TK/3 | NXP Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | NXP SEMICONDUCTORS | PLASTIC/EPOXY | HVSON | HVSON, | SQUARE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | Active | 5 V | EAR99 | 8542.39.00.01 | DUAL | NO LEAD | 1 | 0.65 mm | unknown | S-PDSO-N8 | 1 mm | AEC-Q100 | INTERFACE CIRCUIT | 3 mm | 3 mm | |||||||||||||||||||||||||||||||||
![]() | Mfr Part No TP3070V-XG | National Semiconductor Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 28 | NATIONAL SEMICONDUCTOR CORP | 3 | 85 °C | -40 °C | PLASTIC/EPOXY | QCCJ | PLASTIC, LCC-28 | LDCC28,.5SQ | SQUARE | CHIP CARRIER | Transferred | No | 5 V | e0 | Tin/Lead (Sn85Pb15) | 8542.39.00.01 | QUAD | J BEND | 220 | 1 | 1.27 mm | not_compliant | 30 | S-PQCC-J28 | Not Qualified | INDUSTRIAL | SYNCHRONOUS | 0.013 mA | 4.57 mm | PROGRAMMABLE CODEC | YES | A/MU-LAW | -5 V | 0.15 dB | NOT AVAILABLE | 11.43 mm | 11.43 mm | |||||||||||||||||
![]() | Mfr Part No SI32280-A-ZM2R | Silicon Laboratories Inc | Datasheet | - | - | Min: 1 Mult: 1 | 2019-10-25 | SILICON LABORATORIES INC | , | Transferred | 8542.39.00.01 | unknown | DIGITAL SLIC | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No QN9021/DY | NXP Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | 4 Weeks | NXP SEMICONDUCTORS | SOT617-13 | 3 | Obsolete | Yes | 5A992 | 8542.31.00.01 | 260 | compliant | NOT SPECIFIED | TELECOM CIRCUIT | ||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MWCT1001AVLH | NXP Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | 4 Weeks | YES | 64 | NXP SEMICONDUCTORS | 3 | 105 °C | -40 °C | PLASTIC/EPOXY | LQFP | LQFP-64 | QFP64,.47SQ,20 | SQUARE | FLATPACK, LOW PROFILE | Not Recommended | Yes | 3.3 V | +2.73V | e3 | 3A991.A.2 | Tin (Sn) | 8542.31.00.01 | DUAL | GULL WING | 260 | 1 | 0.5 mm | compliant | 40 | S-PQFP-G64 | 3.6 V | 2.7 V | 54 | POWER SUPPLY MANAGEMENT CIRCUIT | YES | 1.6 mm | AEC-Q100 | 10 mm | 10 mm | ||||||||||||||||||
![]() | Mfr Part No TISP61089BDR | Power Innovations International, Inc. | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | POWER INNOVATIONS LTD | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP, | RECTANGULAR | SMALL OUTLINE | Transferred | 8542.39.00.01 | DUAL | GULL WING | 1 | 1.27 mm | unknown | R-PDSO-G8 | Not Qualified | INDUSTRIAL | 1.75 mm | SURGE PROTECTION CIRCUIT | 4.9 mm | 3.905 mm | ||||||||||||||||||||||||||||||||
![]() | Mfr Part No TISP61089BDR | JW Miller | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | POWER INNOVATIONS LTD | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP, | RECTANGULAR | SMALL OUTLINE | Transferred | SOIC | 8542.39.00.01 | DUAL | GULL WING | 1 | 1.27 mm | unknown | 8 | R-PDSO-G8 | Not Qualified | INDUSTRIAL | 1.75 mm | SURGE PROTECTION CIRCUIT | 4.9 mm | 3.905 mm | ||||||||||||||||||||||||||||||
![]() | Mfr Part No PEF4265VV22 | Intel Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 2017-10-28 | INTEL CORP | , | Obsolete | compliant | SLIC | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No TJA1057GTK/3 | NXP Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | NXP SEMICONDUCTORS | 150 °C | -40 °C | PLASTIC/EPOXY | HVSON | HVSON, | SOLCC8,.12,25 | SQUARE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | Active | Yes | 5 V | 8542.39.00.01 | DUAL | NO LEAD | NOT SPECIFIED | 1 | 0.65 mm | compliant | NOT SPECIFIED | S-PDSO-N8 | 70 mA | 5000 Mbps | 1 mm | AEC-Q100 | CAN FD TRANSCEIVER | 1 | 3 mm | 3 mm | |||||||||||||||||||||||||
![]() | Mfr Part No WPCS4223C.A2-900369 | Marvell Technology Group Ltd | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AK2301A-E1 | Asahi Kasei Microsystems Corporation | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No FX102LG | CML Innovative Technologies | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No D-1633N | Intel Corporation | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No TJA1100HN | Nexperia | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No BCM84898B0KFEBG | Broadcom Limited | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No SIM7600SA-H-PCIE | SIMCom | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No BCM15KA1HH0H285D | Broadcom Limited | Datasheet | - | - | Min: 1 Mult: 1 |
TJA1043TK
NXP Semiconductors
Package:Interface - Telecom
Price: please inquire
AMMP-6429-TR1G
Broadcom Limited
Package:Interface - Telecom
Price: please inquire
TJA1029TK
NXP Semiconductors
Package:Interface - Telecom
Price: please inquire
TJA1049TK/3
NXP Semiconductors
Package:Interface - Telecom
Price: please inquire
TP3070V-XG
National Semiconductor Corporation
Package:Interface - Telecom
Price: please inquire
SI32280-A-ZM2R
Silicon Laboratories Inc
Package:Interface - Telecom
Price: please inquire
QN9021/DY
NXP Semiconductors
Package:Interface - Telecom
Price: please inquire
MWCT1001AVLH
NXP Semiconductors
Package:Interface - Telecom
Price: please inquire
TISP61089BDR
Power Innovations International, Inc.
Package:Interface - Telecom
Price: please inquire
TISP61089BDR
JW Miller
Package:Interface - Telecom
Price: please inquire
PEF4265VV22
Intel Corporation
Package:Interface - Telecom
Price: please inquire
TJA1057GTK/3
NXP Semiconductors
Package:Interface - Telecom
Price: please inquire
WPCS4223C.A2-900369
Marvell Technology Group Ltd
Package:Interface - Telecom
Price: please inquire
AK2301A-E1
Asahi Kasei Microsystems Corporation
Package:Interface - Telecom
Price: please inquire
FX102LG
CML Innovative Technologies
Package:Interface - Telecom
Price: please inquire
D-1633N
Intel Corporation
Package:Interface - Telecom
Price: please inquire
TJA1100HN
Nexperia
Package:Interface - Telecom
Price: please inquire
BCM84898B0KFEBG
Broadcom Limited
Package:Interface - Telecom
Price: please inquire
SIM7600SA-H-PCIE
SIMCom
Package:Interface - Telecom
Price: please inquire
BCM15KA1HH0H285D
Broadcom Limited
Package:Interface - Telecom
Price: please inquire
