The category is 'Interface - Telecom'
Interface - Telecom (6000)
- All Manufacturers
- Moisture Sensitivity Level (MSL)
- Part Status
- RoHS Status
- Package / Case
- Mounting Type
- Packaging
- Factory Lead Time
- Number of Circuits
- Function
- Voltage - Supply
- Terminal Position
- Number of Terminations
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Surface Mount | Number of Terminals | Date Of Intro | Ihs Manufacturer | Moisture Sensitivity Levels | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Nom | JESD-609 Code | Terminal Finish | HTS Code | Terminal Position | Terminal Form | Number of Functions | Terminal Pitch | Reach Compliance Code | Pin Count | JESD-30 Code | Qualification Status | Temperature Grade | Supply Current-Max | Data Rate | Seated Height-Max | Telecom IC Type | Neg Supply Voltage-Nom | Standard | ISDN Access Rate | Reference Point | Crystal Frequency | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No YM7405 | Yamaha LSI | Datasheet | - | - | Min: 1 Mult: 1 | YES | 80 | YAMAHA CORP | 70 °C | PLASTIC/EPOXY | QFP | QFP, QFP80,.75X1,32 | QFP80,.75X1,32 | RECTANGULAR | FLATPACK | Contact Manufacturer | No | 5 V | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | QUAD | GULL WING | 0.8 mm | unknown | R-PQFP-G80 | Not Qualified | COMMERCIAL | 192 Mbps | CCITT I.430 | BASIC | U | ||||||||||||||
| Mfr Part No PCD4415P | Philips Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | NO | 18 | PHILIPS SEMICONDUCTORS | 70 °C | -25 °C | PLASTIC/EPOXY | DIP | DIP, DIP18,.3 | DIP18,.3 | RECTANGULAR | IN-LINE | Obsolete | No | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-PDIP-T18 | Not Qualified | OTHER | 0.9 mA | 3.58 MHz | ||||||||||||||||
| Mfr Part No PCD3316T | Philips Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | YES | 16 | PHILIPS SEMICONDUCTORS | 70 °C | -25 °C | PLASTIC/EPOXY | SOP | SOP16,.4 | RECTANGULAR | SMALL OUTLINE | Transferred | No | 3.3 V | e0 | Tin/Lead (Sn85Pb15) | 8542.39.00.01 | DUAL | GULL WING | 1.27 mm | not_compliant | R-PDSO-G16 | Not Qualified | OTHER | 2.3 mA | |||||||||||||||||
| Mfr Part No SIM5320AS2-104BW-Z0K3D | Simtek Corporation | Datasheet | - | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MDBT40-P256RV3 | Raytec Corporation | Datasheet | - | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||
| Mfr Part No PEF24624E | Infineon Technologies AG | Datasheet | - | - | Min: 1 Mult: 1 | YES | 324 | INFINEON TECHNOLOGIES AG | 85 °C | -40 °C | PLASTIC/EPOXY | BGA | 19 X 19 MM, PLASTIC, LBGA-324 | SQUARE | GRID ARRAY | Obsolete | 1.8 V | 8542.39.00.01 | BOTTOM | BALL | 1 | unknown | S-PBGA-B324 | INDUSTRIAL | TELECOM CIRCUIT | |||||||||||||||||||||
| Mfr Part No PEF24624E | Lantiq | Datasheet | - | - | Min: 1 Mult: 1 | YES | 324 | LANTIQ | 85 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Obsolete | 1.8 V | 8542.39.00.01 | BOTTOM | BALL | 1 | compliant | S-PBGA-B324 | INDUSTRIAL | TELECOM CIRCUIT | |||||||||||||||||||||
| Mfr Part No R8075J | Conexant Systems Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 28 | CONEXANT SYSTEMS | 70 °C | PLASTIC/EPOXY | QCCJ | QCCJ, LDCC28,.5SQ | LDCC28,.5SQ | SQUARE | CHIP CARRIER | Transferred | No | 5 V | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | QUAD | J BEND | 1.27 mm | compliant | S-PQCC-J28 | Not Qualified | COMMERCIAL | ||||||||||||||||||
 | Mfr Part No ATA5746-PXPW | Atmel Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 24 | ATMEL CORP | 105 °C | -40 °C | UNSPECIFIED | HVQCCN | HVQCCN, LCC24,.2SQ,25 | LCC24,.2SQ,25 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Obsolete | QFN | Yes | 3 V | 8542.39.00.01 | QUAD | NO LEAD | 1 | 0.65 mm | compliant | 24 | S-XQCC-N24 | Not Qualified | INDUSTRIAL | 0.01 mA | 1 mm | TELECOM CIRCUIT | 5 mm | 5 mm | |||||||||||
| Mfr Part No MH88634K | Zarlink Semiconductor Inc | Datasheet | - | - | Min: 1 Mult: 1 | NO | 21 | ZARLINK SEMICONDUCTOR INC | 70 °C | PLASTIC/EPOXY | SIP | SIP, SIP21,.13 | SIP21,.13 | RECTANGULAR | IN-LINE | Obsolete | No | 5 V | e0 | TIN LEAD | 8542.39.00.01 | SINGLE | THROUGH-HOLE | 1 | 2.54 mm | unknown | R-PSIP-T21 | Not Qualified | COMMERCIAL | 0.013 mA | 15.9 mm | SLIC | -5 V | |||||||||||||
| Mfr Part No R8050P | Rockwell Automation | Datasheet | - | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||
| Mfr Part No QCA4531-BL3B | Qualcomm | Datasheet | - | - | Min: 1 Mult: 1 | 2019-10-21 | QUALCOMM INC | Active | unknown | WIRELESS LAN CIRCUIT | ||||||||||||||||||||||||||||||||||||
 | Mfr Part No GA9102-2MC | TriQuint Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 28 | TRIQUINT SEMICONDUCTOR INC | 1 | 70 °C | PLASTIC/EPOXY | QCCJ | QCCJ, LDCC28,.5SQ | LDCC28,.5SQ | SQUARE | CHIP CARRIER | Obsolete | QFN | No | 5 V | 8542.39.00.01 | QUAD | J BEND | 1.27 mm | unknown | 28 | S-PQCC-J28 | Not Qualified | COMMERCIAL | 0.18 mA | 4.3688 mm | ATM/SONET/SDH RECEIVER | 11.303 mm | 11.303 mm | ||||||||||||
| Mfr Part No SARA-U270-53S-00 | u-blox AG | Datasheet | - | - | Min: 1 Mult: 1 | YES | 96 | U-BLOX AG | 4 | 55 °C | -20 °C | UNSPECIFIED | PACKAGE-96 | RECTANGULAR | MICROELECTRONIC ASSEMBLY | Obsolete | Yes | 3.8 V | 8542.39.00.01 | UNSPECIFIED | NO LEAD | 1 | unknown | R-XXMA-N96 | OTHER | 3.25 mm | TELECOM CIRCUIT | 26 mm | 16 mm | |||||||||||||||||
 | Mfr Part No SK70707PE | Intel Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 68 | INTEL CORP | 85 °C | -40 °C | PLASTIC/EPOXY | QCCJ | PLASTIC, LCC-68 | LDCC68,1.0SQ | SQUARE | CHIP CARRIER | Obsolete | LCC | 5 V | 8542.39.00.01 | QUAD | J BEND | 1 | 1.27 mm | compliant | 68 | S-PQCC-J68 | Not Qualified | INDUSTRIAL | 175 mA | 1168 Mbps | 4.57 mm | DIGITAL SLIC | 24.2316 mm | 24.2316 mm | |||||||||||
| Mfr Part No MLC-25-3-1-TL | Methode Electronics Inc | Datasheet | - | - | Min: 1 Mult: 1 | NO | METHODE ELECTRONICS INC | 70 °C | UNSPECIFIED | , | RECTANGULAR | FIBER OPTIC | Contact Manufacturer | 3.3 V | 8542.39.00.01 | UNSPECIFIED | UNSPECIFIED | 1 | unknown | R-XXFO-X | Not Qualified | COMMERCIAL | ATM/SONET/SDH TRANSCEIVER | |||||||||||||||||||||||
| Mfr Part No LXT9781BC | Inphi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 272 | INPHI CORP | 70 °C | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Transferred | 3.3 V | 8542.39.00.01 | BOTTOM | BALL | 1 | 1.27 mm | compliant | S-PBGA-B272 | Not Qualified | COMMERCIAL | 2.32 mm | ETHERNET TRANSCEIVER | 27 mm | 27 mm | |||||||||||||||||
| Mfr Part No ML5824EM | RF Micro Devices Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 28 | SIRENZA MICRODEVICES INC | 70 °C | -10 °C | PLASTIC/EPOXY | HVQCCN | HVQCCN, | RECTANGULAR | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Transferred | QFN | 3.2 V | 8542.39.00.01 | QUAD | NO LEAD | 1 | 0.5 mm | unknown | 28 | R-PQCC-N28 | Not Qualified | COMMERCIAL | 1 mm | TELECOM CIRCUIT | 5 mm | 4 mm | ||||||||||||||
 | Mfr Part No CX28395-19 | Conexant Systems Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 318 | CONEXANT SYSTEMS | 1 | 85 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Obsolete | BGA | No | 3.3 V | 8542.39.00.01 | BOTTOM | BALL | 16 | 1.27 mm | compliant | 318 | S-PBGA-B318 | Not Qualified | INDUSTRIAL | 310 mA | 2.44 mm | FRAMER | 27 mm | 27 mm | |||||||||||
| Mfr Part No PSB4400T | Infineon Technologies AG | Datasheet | - | - | Min: 1 Mult: 1 | YES | 20 | INFINEON TECHNOLOGIES AG | 70 °C | PLASTIC/EPOXY | SOP | SOP20,.4 | RECTANGULAR | SMALL OUTLINE | Obsolete | No | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | DUAL | GULL WING | 1.27 mm | not_compliant | R-PDSO-G20 | Not Qualified | COMMERCIAL | 1.45 mA |
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YM7405
Yamaha LSI
Package:Interface - Telecom
Price: please inquire
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PCD4415P
Philips Semiconductors
Package:Interface - Telecom
Price: please inquire
-
PCD3316T
Philips Semiconductors
Package:Interface - Telecom
Price: please inquire
-
SIM5320AS2-104BW-Z0K3D
Simtek Corporation
Package:Interface - Telecom
Price: please inquire
-
MDBT40-P256RV3
Raytec Corporation
Package:Interface - Telecom
Price: please inquire
-
PEF24624E
Infineon Technologies AG
Package:Interface - Telecom
Price: please inquire
-
PEF24624E
Lantiq
Package:Interface - Telecom
Price: please inquire
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R8075J
Conexant Systems Inc
Package:Interface - Telecom
Price: please inquire
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ATA5746-PXPW
Atmel Corporation
Package:Interface - Telecom
Price: please inquire
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MH88634K
Zarlink Semiconductor Inc
Package:Interface - Telecom
Price: please inquire
-
R8050P
Rockwell Automation
Package:Interface - Telecom
Price: please inquire
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QCA4531-BL3B
Qualcomm
Package:Interface - Telecom
Price: please inquire
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GA9102-2MC
TriQuint Semiconductor
Package:Interface - Telecom
Price: please inquire
-
SARA-U270-53S-00
u-blox AG
Package:Interface - Telecom
Price: please inquire
-
SK70707PE
Intel Corporation
Package:Interface - Telecom
Price: please inquire
-
MLC-25-3-1-TL
Methode Electronics Inc
Package:Interface - Telecom
Price: please inquire
-
LXT9781BC
Inphi Corporation
Package:Interface - Telecom
Price: please inquire
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ML5824EM
RF Micro Devices Inc
Package:Interface - Telecom
Price: please inquire
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CX28395-19
Conexant Systems Inc
Package:Interface - Telecom
Price: please inquire
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PSB4400T
Infineon Technologies AG
Package:Interface - Telecom
Price: please inquire