The category is 'Interface - Telecom'
Interface - Telecom (6000)
- All Manufacturers
- Moisture Sensitivity Level (MSL)
- Part Status
- RoHS Status
- Package / Case
- Mounting Type
- Packaging
- Factory Lead Time
- Number of Circuits
- Function
- Voltage - Supply
- Terminal Position
- Number of Terminations
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Surface Mount | Number of Terminals | Ihs Manufacturer | Moisture Sensitivity Levels | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Nom | JESD-609 Code | Pbfree Code | Terminal Finish | Applications | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Temperature Grade | Supply Current-Max | Data Rate | Seated Height-Max | Telecom IC Type | Output Low Current-Max | Filter | Companding Law | Neg Supply Voltage-Nom | Standard | Gain Tolerance-Max | Linear Coding | ISDN Access Rate | Reference Point | Output High Voltage-Min | Output Low Voltage-Max | Make-break Ratio | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No TM266HCB2 | Pulse Electronics Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 16 | PULSE ELECTRONICS CORP | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP, SOP16,.4 | SOP16,.4 | RECTANGULAR | SMALL OUTLINE | Active | No | 3.3 V | 8542.39.00.01 | DUAL | GULL WING | 1.27 mm | compliant | R-PDSO-G16 | Not Qualified | INDUSTRIAL | ATM/SONET/SDH TRANSCEIVER | |||||||||||||||||||||||||||||
| Mfr Part No PEB2084 | Infineon Technologies AG | Datasheet | - | - | Min: 1 Mult: 1 | YES | 44 | INFINEON TECHNOLOGIES AG | 70 °C | PLASTIC/EPOXY | QFP | QFP44,.5SQ,32 | SQUARE | FLATPACK | Obsolete | No | 5 V | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | QUAD | GULL WING | 0.8 mm | not_compliant | S-PQFP-G44 | Not Qualified | COMMERCIAL | 192 Mbps | 0.007 A | ANSI T1.605 | BASIC | S/T | 2.4 V | 0.45 V | |||||||||||||||||||||||
| Mfr Part No MSM6999RS | LAPIS Semiconductor Co Ltd | Datasheet | - | - | Min: 1 Mult: 1 | NO | 16 | LAPIS SEMICONDUCTOR CO LTD | 70 °C | PLASTIC/EPOXY | DIP | DIP, DIP16,.3 | DIP16,.3 | RECTANGULAR | IN-LINE | Obsolete | 5 V | 8542.39.00.01 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | R-PDIP-T16 | Not Qualified | COMMERCIAL | 14 mA | PCM CODEC | YES | MU-LAW | -5 V | 0.8 dB | NOT AVAILABLE | ||||||||||||||||||||||||
 | Mfr Part No PEB4264 | Lantiq | Datasheet | - | - | Min: 1 Mult: 1 | YES | 20 | LANTIQ | 70 °C | PLASTIC/EPOXY | SOP | SOP, | RECTANGULAR | SMALL OUTLINE | Transferred | SOIC | No | 5 V | e0 | No | TIN LEAD | 8542.39.00.01 | DUAL | GULL WING | 1 | 1.27 mm | unknown | 20 | R-PDSO-G20 | Not Qualified | COMMERCIAL | 3.7 mm | SLIC | 15.9 mm | 11 mm | ||||||||||||||||||||||
| Mfr Part No PEB4264 | Intel Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 20 | INTEL CORP | 70 °C | PLASTIC/EPOXY | SOP | SOP, | RECTANGULAR | SMALL OUTLINE | Contact Manufacturer | No | 5 V | e0 | TIN LEAD | 8542.39.00.01 | DUAL | GULL WING | 1 | 1.27 mm | compliant | R-PDSO-G20 | Not Qualified | COMMERCIAL | 3.7 mm | SLIC | 15.9 mm | 11 mm | |||||||||||||||||||||||||
| Mfr Part No RFFM6403 | RF Micro Devices Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 28 | RF MICRO DEVICES INC | 3 | 85 °C | -40 °C | UNSPECIFIED | HLGA | HLGA, LCC28,.24SQ,28 | LCC28,.24SQ,28 | SQUARE | GRID ARRAY, HEAT SINK/SLUG | Transferred | Yes | 3.6 V | 8542.39.00.01 | BOTTOM | BUTT | 1 | 0.7 mm | unknown | S-XBGA-B28 | Not Qualified | INDUSTRIAL | 1.5 mA | 1.05 mm | TELECOM CIRCUIT | 6 mm | 6 mm | |||||||||||||||||||||||
 | Mfr Part No PMB2240 | Infineon Technologies AG | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | INFINEON TECHNOLOGIES AG | 85 °C | -30 °C | PLASTIC/EPOXY | TFQFP | TFQFP, | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | Obsolete | QFP | 8542.39.00.01 | QUAD | GULL WING | 1 | 0.5 mm | unknown | 48 | S-PQFP-G48 | Not Qualified | OTHER | 1.1 mm | RF AND BASEBAND CIRCUIT | 7 mm | 7 mm | ||||||||||||||||||||||||||
| Mfr Part No PMB2240 | Siemens | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | SIEMENS A G | 85 °C | -30 °C | PLASTIC/EPOXY | , | SQUARE | FLATPACK | Transferred | QFP | 8542.39.00.01 | QUAD | GULL WING | 1 | unknown | 48 | S-PQFP-G48 | Not Qualified | OTHER | RF AND BASEBAND CIRCUIT | |||||||||||||||||||||||||||||||
| Mfr Part No SY88823VKG | Micrel Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 10 | MICREL INC | 1 | 85 °C | -40 °C | PLASTIC/EPOXY | HTSSOP | LEAD FREE, MSOP-10 | TSSOP10,.19,20 | SQUARE | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | Transferred | Yes | 3.3 V | e4 | Nickel/Palladium/Gold (Ni/Pd/Au) | SDH; SONET | DUAL | GULL WING | 260 | 1 | 0.5 mm | compliant | 40 | S-PDSO-G10 | Not Qualified | INDUSTRIAL | 0.065 mA | 1.1 mm | ATM/SONET/SDH SUPPORT CIRCUIT | 3 mm | 3 mm | |||||||||||||||||||
| Mfr Part No SY88823VKG | Microchip Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 10 | MICROCHIP TECHNOLOGY INC | 3 | 85 °C | -40 °C | PLASTIC/EPOXY | HTSSOP | LEAD FREE, MSOP-10 | SQUARE | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | Active | Yes | 3.3 V | e4 | NICKEL PALLADIUM GOLD | 8542.39.00.01 | DUAL | GULL WING | 1 | 0.5 mm | compliant | S-PDSO-G10 | Not Qualified | INDUSTRIAL | 1.1 mm | ATM/SONET/SDH SUPPORT CIRCUIT | 3 mm | 3 mm | |||||||||||||||||||||||
| Mfr Part No MCP25625T-E/SSVAO | Microchip Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No OCT-30 | Eaton Cutler-Hammer | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No HM9102C | Hualon Microelectronics Corp | Datasheet | - | - | Min: 1 Mult: 1 | NO | 18 | HUALON MICROELECTRONICS CORP | 70 °C | -25 °C | PLASTIC/EPOXY | DIP | DIP, | RECTANGULAR | IN-LINE | Contact Manufacturer | DIP | 5 V | SELECTABLE MAKE BREAK RATIO 1:2 | 8542.39.00.01 | DUAL | THROUGH-HOLE | 1 | unknown | 18 | R-PDIP-T18 | Not Qualified | OTHER | 2 mA | TELEPHONE DIALER CIRCUIT | 1:1.5 | ||||||||||||||||||||||||||
| Mfr Part No ELLA-W163-00A-00 | u-blox AG | Datasheet | - | - | Min: 1 Mult: 1 | U-BLOX AG | , | Obsolete | Yes | 8542.39.00.01 | unknown | ||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No BCM5464 | Broadcom Limited | Datasheet | - | - | Min: 1 Mult: 1 | YES | 354 | BROADCOM CORP | PLASTIC/EPOXY | BGA | BGA, | UNSPECIFIED | GRID ARRAY | Transferred | No | 8542.39.00.01 | BOTTOM | BALL | 1 | compliant | X-PBGA-B354 | ETHERNET TRANSCEIVER | |||||||||||||||||||||||||||||||||||
| Mfr Part No PCD3360P | NXP Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | NO | 16 | NXP SEMICONDUCTORS | 70 °C | -25 °C | PLASTIC/EPOXY | DIP | DIP, DIP16,.3 | DIP16,.3 | RECTANGULAR | IN-LINE | Obsolete | DIP | No | 6 V | 8542.39.00.01 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | 16 | R-PDIP-T16 | Not Qualified | OTHER | 0.14 mA | 4.2 mm | TELEPHONE RINGER CIRCUIT | 19.025 mm | 7.62 mm | ||||||||||||||||||||||
| Mfr Part No PCD3360P | Philips Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | NO | 16 | PHILIPS SEMICONDUCTORS | 70 °C | -25 °C | PLASTIC/EPOXY | DIP | DIP, DIP16,.3 | DIP16,.3 | RECTANGULAR | IN-LINE | Transferred | No | 6 V | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-PDIP-T16 | Not Qualified | OTHER | 0.14 mA | |||||||||||||||||||||||||||
| Mfr Part No ATA5279C-WGQW-V04 | Microchip Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No BCM5208C0KPF | Broadcom Limited | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No NCV7356D | onsemi | Datasheet | - | - | Min: 1 Mult: 1 | YES | 14 | ON SEMICONDUCTOR | 125 °C | -40 °C | PLASTIC/EPOXY | SOP | SOIC-14 | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | No | 16 V | e0 | TIN LEAD | 8542.39.00.01 | DUAL | GULL WING | 1 | 1.27 mm | compliant | 14 | R-PDSO-G14 | Not Qualified | AUTOMOTIVE | 1.75 mm | INTERFACE CIRCUIT | 8.65 mm | 3.9 mm |
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TM266HCB2
Pulse Electronics Corporation
Package:Interface - Telecom
Price: please inquire
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PEB2084
Infineon Technologies AG
Package:Interface - Telecom
Price: please inquire
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MSM6999RS
LAPIS Semiconductor Co Ltd
Package:Interface - Telecom
Price: please inquire
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PEB4264
Lantiq
Package:Interface - Telecom
Price: please inquire
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PEB4264
Intel Corporation
Package:Interface - Telecom
Price: please inquire
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RFFM6403
RF Micro Devices Inc
Package:Interface - Telecom
Price: please inquire
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PMB2240
Infineon Technologies AG
Package:Interface - Telecom
Price: please inquire
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PMB2240
Siemens
Package:Interface - Telecom
Price: please inquire
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SY88823VKG
Micrel Inc
Package:Interface - Telecom
Price: please inquire
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SY88823VKG
Microchip Technology Inc
Package:Interface - Telecom
Price: please inquire
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MCP25625T-E/SSVAO
Microchip Technology Inc
Package:Interface - Telecom
Price: please inquire
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OCT-30
Eaton Cutler-Hammer
Package:Interface - Telecom
Price: please inquire
-
HM9102C
Hualon Microelectronics Corp
Package:Interface - Telecom
Price: please inquire
-
ELLA-W163-00A-00
u-blox AG
Package:Interface - Telecom
Price: please inquire
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BCM5464
Broadcom Limited
Package:Interface - Telecom
Price: please inquire
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PCD3360P
NXP Semiconductors
Package:Interface - Telecom
Price: please inquire
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PCD3360P
Philips Semiconductors
Package:Interface - Telecom
Price: please inquire
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ATA5279C-WGQW-V04
Microchip Technology Inc
Package:Interface - Telecom
Price: please inquire
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BCM5208C0KPF
Broadcom Limited
Package:Interface - Telecom
Price: please inquire
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NCV7356D
onsemi
Package:Interface - Telecom
Price: please inquire