The category is 'Interface - Telecom'
Interface - Telecom (6000)
- All Manufacturers
- Moisture Sensitivity Level (MSL)
- Part Status
- RoHS Status
- Package / Case
- Mounting Type
- Packaging
- Factory Lead Time
- Number of Circuits
- Function
- Voltage - Supply
- Terminal Position
- Number of Terminations
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Surface Mount | Number of Terminals | Ihs Manufacturer | Manufacturer Package Code | Moisture Sensitivity Levels | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Nom | JESD-609 Code | Pbfree Code | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Temperature Grade | Supply Current-Max | Data Rate | Seated Height-Max | Telecom IC Type | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No RF2938TR13 | RF Micro Devices Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | RF MICRO DEVICES INC | 1 | 85 °C | -40 °C | PLASTIC/EPOXY | TFQFP | 9 X 9 MM, TQFP-48 | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | Obsolete | QFP | No | 3.3 V | No | 8542.39.00.01 | QUAD | GULL WING | 1 | 0.5 mm | compliant | 48 | S-PQFP-G48 | Not Qualified | INDUSTRIAL | 1.1 mm | RF AND BASEBAND CIRCUIT | 7 mm | 7 mm | |||||||||||
 | Mfr Part No MC34018G-R28-R | Unisonic Technologies Co Ltd | Datasheet | - | - | Min: 1 Mult: 1 | UNISONIC TECHNOLOGIES CO LTD | , | Active | 8542.39.00.01 | compliant | SPEAKER PHONE CIRCUIT | |||||||||||||||||||||||||||||||||||
 | Mfr Part No MC6860P | Motorola Mobility LLC | Datasheet | - | - | Min: 1 Mult: 1 | NO | 24 | MOTOROLA INC | 70 °C | PLASTIC/EPOXY | DIP | DIP, DIP24,.6 | DIP24,.6 | RECTANGULAR | IN-LINE | Obsolete | DIP | No | 5 V | e0 | TIN LEAD | HALF DUPLEX; FULL DUPLEX | 8542.39.00.01 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | 24 | R-PDIP-T24 | Not Qualified | COMMERCIAL | 5.08 mm | MODEM | 31.75 mm | 15.24 mm | ||||||||||
| Mfr Part No TCA3382A-DP | Motorola Semiconductor Products | Datasheet | - | - | Min: 1 Mult: 1 | NO | 24 | MOTOROLA INC | 60 °C | -20 °C | PLASTIC/EPOXY | DIP | DIP, | RECTANGULAR | IN-LINE | Obsolete | 8542.39.00.01 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | R-PDIP-T24 | Not Qualified | COMMERCIAL | 5.08 mm | TELEPHONE SPEECH CIRCUIT | 31.75 mm | 15.24 mm | |||||||||||||||||
 | Mfr Part No SI5018-BMR | Silicon Laboratories Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 20 | SILICON LABORATORIES INC | 85 °C | -40 °C | UNSPECIFIED | HVQCCN | HVQCCN, | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Obsolete | DFN | 3.3 V | 8542.39.00.01 | QUAD | NO LEAD | 1 | 0.5 mm | unknown | 20 | S-XQCC-N20 | Not Qualified | INDUSTRIAL | 0.9 mm | ATM/SONET/SDH CLOCK RECOVERY CIRCUIT | 4 mm | 4 mm | ||||||||||||||
| Mfr Part No RC288DPI/VFC | Conexant Systems Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 68 | CONEXANT SYSTEMS | 70 °C | PLASTIC/EPOXY | QCCJ | QCCJ, LDCC68,1.0SQ | LDCC68,1.0SQ | SQUARE | CHIP CARRIER | Transferred | No | 5 V | e0 | TIN LEAD | 8542.39.00.01 | QUAD | J BEND | 1.27 mm | compliant | S-PQCC-J68 | Not Qualified | COMMERCIAL | 0.215 mA | MODEM | ||||||||||||||||
| Mfr Part No BL1101L | Shanghai Belling Co Ltd | Datasheet | - | - | Min: 1 Mult: 1 | SHANGHAI BELLING CO LTD | , | Contact Manufacturer | unknown | |||||||||||||||||||||||||||||||||||||
 | Mfr Part No RF5521TR7 | RF Micro Devices Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 10 | RF MICRO DEVICES INC | UNSPECIFIED | HVQCCN | HVQCCN, | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Transferred | QFN | Yes | 3.3 V | 5A991.G | 8517.70.00.00 | QUAD | NO LEAD | NOT SPECIFIED | 1 | 0.4 mm | unknown | NOT SPECIFIED | 10 | S-XQCC-N10 | Not Qualified | 0.5 mm | RF FRONT END CIRCUIT | 1.75 mm | 1.75 mm | |||||||||||||
| Mfr Part No BCM89541B1BFBGT | Broadcom Limited | Datasheet | - | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||
| Mfr Part No NCV7356D1 | onsemi | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | ON SEMICONDUCTOR | 125 °C | -40 °C | PLASTIC/EPOXY | SOP | SO-8 | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | No | 16 V | e0 | No | TIN LEAD | 8542.39.00.01 | DUAL | GULL WING | 1 | 1.27 mm | compliant | 8 | R-PDSO-G8 | Not Qualified | AUTOMOTIVE | 1.75 mm | INTERFACE CIRCUIT | 4.9 mm | 3.9 mm | ||||||||||
| Mfr Part No DP83867IRRGZ | Texas Instruments | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | TEXAS INSTRUMENTS INC | 85 °C | -40 °C | PLASTIC/EPOXY | HVQCCN | HVQCCN, | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Obsolete | 1.8 V | EAR99 | 8542.39.00.01 | QUAD | NO LEAD | 1 | 0.5 mm | unknown | S-PQCC-N48 | INDUSTRIAL | 1 mm | ETHERNET TRANSCEIVER | 7 mm | 7 mm | ||||||||||||||||
 | Mfr Part No HMC737LP4 | Hittite Microwave Corp | Datasheet | - | - | Min: 1 Mult: 1 | YES | 24 | HITTITE MICROWAVE CORP | 1 | 85 °C | -40 °C | PLASTIC/EPOXY | HVQCCN | HVQCCN, | SQUARE | CHIP CARRIER | Transferred | QFN | No | 4.2 V | e0 | No | EAR99 | TIN LEAD | 8542.39.00.01 | QUAD | NO LEAD | 235 | 1 | 0.5 mm | compliant | 24 | S-PQCC-N24 | Not Qualified | INDUSTRIAL | 1 mm | TELECOM CIRCUIT | 4 mm | 4 mm | |||||||
| Mfr Part No HMC737LP4 | Analog Devices Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 24 | ANALOG DEVICES INC | 1 | 85 °C | -40 °C | PLASTIC/EPOXY | HVQCCN | QFN-24 | SQUARE | CHIP CARRIER | Active | No | 4.2 V | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | QUAD | NO LEAD | 1 | 0.5 mm | compliant | S-PQCC-N24 | Not Qualified | INDUSTRIAL | 1 mm | TELECOM CIRCUIT | 4 mm | 4 mm | |||||||||||
| Mfr Part No SI3230M-GT | Silicon Laboratories Inc | Datasheet | - | - | Min: 1 Mult: 1 | SILICON LABORATORIES INC | , | Obsolete | unknown | SLIC | ||||||||||||||||||||||||||||||||||||
| Mfr Part No TA31076F (TP1) | Toshiba America Electronic Components | Datasheet | - | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No CM8870C | California Micro Devices | Datasheet | - | - | Min: 1 Mult: 1 | NO | 18 | CALIFORNIA MICRO DEVICES CORP | 70 °C | CERAMIC, METAL-SEALED COFIRED | DIP | DIP, DIP18,.3 | DIP18,.3 | RECTANGULAR | IN-LINE | Obsolete | DIP | No | 5 V | e0 | TIN LEAD | 8542.39.00.01 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | 18 | R-CDIP-T18 | Not Qualified | COMMERCIAL | 7 mA | DTMF SIGNALING CIRCUIT | |||||||||||||
| Mfr Part No R6653-20 | Conexant Systems Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 100 | CONEXANT SYSTEMS | 70 °C | PLASTIC/EPOXY | QFP | QFP, | RECTANGULAR | FLATPACK | Obsolete | QFP | 5 V | HALF DUPLEX; FULL DUPLEX | 8542.39.00.01 | QUAD | GULL WING | 1 | 0.65 mm | unknown | 100 | R-PQFP-G100 | Not Qualified | COMMERCIAL | 2 Mbps | 3.4 mm | MODEM-SUPPORT CIRCUIT | 20 mm | 14 mm | |||||||||||||
| Mfr Part No RF6555 | RF Micro Devices Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 20 | RF MICRO DEVICES INC | UNSPECIFIED | QCCN | QCCN, | SQUARE | CHIP CARRIER | Transferred | 8542.39.00.01 | QUAD | NO LEAD | 1 | unknown | S-XQCC-N20 | TELECOM CIRCUIT | |||||||||||||||||||||||||
| Mfr Part No R8071AG | Conexant Systems Inc | Datasheet | - | - | Min: 1 Mult: 1 | NO | 68 | CONEXANT SYSTEMS | 70 °C | CERAMIC | PGA | PGA, PGA68,11X11 | PGA68,11X11 | SQUARE | GRID ARRAY | Transferred | No | 5 V | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | PERPENDICULAR | PIN/PEG | 2.54 mm | compliant | S-XPGA-P68 | Not Qualified | COMMERCIAL | ||||||||||||||||||
 | Mfr Part No PX1012AI-EL1/G | NXP Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | YES | 81 | NXP SEMICONDUCTORS | SOT-643-1 | 85 °C | -40 °C | PLASTIC/EPOXY | LFBGA | LFBGA, | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Obsolete | BGA | Yes | 1.2 V | e1 | TIN SILVER COPPER | 8542.39.00.01 | BOTTOM | BALL | 1 | 0.8 mm | unknown | 81 | S-PBGA-B81 | Not Qualified | INDUSTRIAL | 1.6 mm | INTERFACE CIRCUIT | 9 mm | 9 mm |
-
RF2938TR13
RF Micro Devices Inc
Package:Interface - Telecom
Price: please inquire
-
MC34018G-R28-R
Unisonic Technologies Co Ltd
Package:Interface - Telecom
Price: please inquire
-
MC6860P
Motorola Mobility LLC
Package:Interface - Telecom
Price: please inquire
-
TCA3382A-DP
Motorola Semiconductor Products
Package:Interface - Telecom
Price: please inquire
-
SI5018-BMR
Silicon Laboratories Inc
Package:Interface - Telecom
Price: please inquire
-
RC288DPI/VFC
Conexant Systems Inc
Package:Interface - Telecom
Price: please inquire
-
BL1101L
Shanghai Belling Co Ltd
Package:Interface - Telecom
Price: please inquire
-
RF5521TR7
RF Micro Devices Inc
Package:Interface - Telecom
Price: please inquire
-
BCM89541B1BFBGT
Broadcom Limited
Package:Interface - Telecom
Price: please inquire
-
NCV7356D1
onsemi
Package:Interface - Telecom
Price: please inquire
-
DP83867IRRGZ
Texas Instruments
Package:Interface - Telecom
Price: please inquire
-
HMC737LP4
Hittite Microwave Corp
Package:Interface - Telecom
Price: please inquire
-
HMC737LP4
Analog Devices Inc
Package:Interface - Telecom
Price: please inquire
-
SI3230M-GT
Silicon Laboratories Inc
Package:Interface - Telecom
Price: please inquire
-
TA31076F (TP1)
Toshiba America Electronic Components
Package:Interface - Telecom
Price: please inquire
-
CM8870C
California Micro Devices
Package:Interface - Telecom
Price: please inquire
-
R6653-20
Conexant Systems Inc
Package:Interface - Telecom
Price: please inquire
-
RF6555
RF Micro Devices Inc
Package:Interface - Telecom
Price: please inquire
-
R8071AG
Conexant Systems Inc
Package:Interface - Telecom
Price: please inquire
-
PX1012AI-EL1/G
NXP Semiconductors
Package:Interface - Telecom
Price: please inquire