The category is 'Interface - Telecom'
Interface - Telecom (6000)
- All Manufacturers
- Moisture Sensitivity Level (MSL)
- Part Status
- RoHS Status
- Package / Case
- Mounting Type
- Packaging
- Factory Lead Time
- Number of Circuits
- Function
- Voltage - Supply
- Terminal Position
- Number of Terminations
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Surface Mount | Number of Terminals | Ihs Manufacturer | Moisture Sensitivity Levels | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Nom | JESD-609 Code | Pbfree Code | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Temperature Grade | Operating Mode | Supply Current-Max | Seated Height-Max | Telecom IC Type | Filter | Companding Law | Neg Supply Voltage-Nom | Battery Feed | PSRR-Min | Hybrid | Battery Supply | Noise-Max | Make-break Ratio | Length | Width |
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 | Mfr Part No TEA1067/C2 | NXP Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | NO | 18 | NXP SEMICONDUCTORS | 75 °C | -25 °C | PLASTIC/EPOXY | DIP | DIP, | RECTANGULAR | IN-LINE | Obsolete | DIP | 2.8 V | 8542.39.00.01 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | 18 | R-PDIP-T18 | Not Qualified | COMMERCIAL EXTENDED | 4.7 mm | TELEPHONE SPEECH CIRCUIT | 21.6 mm | 7.62 mm | ||||||||||||||||||||||
 | Mfr Part No PBL38772/1SOA | Ericsson | Datasheet | - | - | Min: 1 Mult: 1 | YES | 28 | ERICSSON POWER MODULES AB | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP, SOP28,.4 | SOP28,.4 | RECTANGULAR | SMALL OUTLINE | Transferred | SOIC | No | 5 V | e0 | TIN LEAD | 8542.39.00.01 | DUAL | GULL WING | 1 | 1.27 mm | unknown | 28 | R-PDSO-G28 | Not Qualified | INDUSTRIAL | 2.64 mm | SLIC | CONSTANT CURRENT/RESISTIVE | 28.5 dB | 2-4 CONVERSION | -80 V | 12 dBrnC | 17.83 mm | 7.5 mm | |||||||||||||
| Mfr Part No TP13064ADWR | Texas Instruments | Datasheet | - | - | Min: 1 Mult: 1 | YES | 20 | TEXAS INSTRUMENTS INC | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP, | RECTANGULAR | SMALL OUTLINE | Obsolete | 5 V | FULL DUPLEX | 8542.39.00.01 | DUAL | GULL WING | 1 | 1.27 mm | unknown | R-PDSO-G20 | Not Qualified | INDUSTRIAL | SYNCHRONOUS/ASYNCHRONOUS | 11 mA | 2.65 mm | PCM CODEC | YES | MU-LAW | -5 V | 12.8 mm | 7.5 mm | ||||||||||||||||||
| Mfr Part No AD6426XB | Analog Devices Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 144 | ANALOG DEVICES INC | 85 °C | -25 °C | PLASTIC/EPOXY | BGA | BGA144,12X12,40 | SQUARE | GRID ARRAY | Obsolete | No | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 1 mm | unknown | S-PBGA-B144 | Not Qualified | OTHER | |||||||||||||||||||||||||||
| Mfr Part No UM91272 | United Microelectronics Corporation | Datasheet | - | - | Min: 1 Mult: 1 | NO | 28 | UNITED MICROELECTRONICS CORP | 70 °C | -20 °C | PLASTIC/EPOXY | , | RECTANGULAR | IN-LINE | Obsolete | 3.5 V | SELECTABLE MAKE/BREAK RATIO 1:2 | 8542.39.00.01 | DUAL | THROUGH-HOLE | 1 | unknown | R-PDIP-T28 | Not Qualified | COMMERCIAL | 1 mA | TELEPHONE DIALER CIRCUIT | 1:1.5 | ||||||||||||||||||||||||||
| Mfr Part No PHY1078-01QS-BR | Maxim Integrated Products | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | MAXIM INTEGRATED PRODUCTS INC | 95 °C | -40 °C | UNSPECIFIED | HVQCCN | HVQCCN, | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Obsolete | No | 3.3 V | 8542.39.00.01 | QUAD | NO LEAD | NOT SPECIFIED | 1 | 0.5 mm | unknown | NOT SPECIFIED | S-XQCC-N32 | INDUSTRIAL | 0.8 mm | TELECOM CIRCUIT | 5 mm | 5 mm | ||||||||||||||||||||||
| Mfr Part No RFFM8202SB | RF Micro Devices Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 16 | RF MICRO DEVICES INC | 85 °C | -40 °C | UNSPECIFIED | HVQCCN | HVQCCN, | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Transferred | 3.3 V | 5A991.G | 8517.62.00.50 | QUAD | NO LEAD | 1 | 0.5 mm | unknown | S-XQCC-N16 | INDUSTRIAL | 0.45 mm | TELECOM CIRCUIT | 2.6 mm | 2.6 mm | ||||||||||||||||||||||||
 | Mfr Part No TH72031 | Melexis Microelectronic Integrated Systems | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | MELEXIS N V | 125 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP, | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | 3 V | 8542.39.00.01 | DUAL | GULL WING | 1 | 1.27 mm | compliant | 8 | R-PDSO-G8 | Not Qualified | AUTOMOTIVE | 1.72 mm | TELECOM CIRCUIT | 4.9 mm | 3.9 mm | ||||||||||||||||||||||
| Mfr Part No DP83846ALQA56A | Texas Instruments | Datasheet | - | - | Min: 1 Mult: 1 | YES | 56 | NATIONAL SEMICONDUCTOR CORP | 70 °C | PLASTIC/EPOXY | VQCCN | VQCCN, | SQUARE | CHIP CARRIER, VERY THIN PROFILE | Obsolete | 3.3 V | 8542.39.00.01 | QUAD | NO LEAD | 1 | 0.5 mm | unknown | S-PQCC-N56 | Not Qualified | COMMERCIAL | 0.8 mm | ETHERNET TRANSCEIVER | 9 mm | 9 mm | |||||||||||||||||||||||||
| Mfr Part No PEB2096 | Intel Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 44 | INTEL CORP | 70 °C | PLASTIC/EPOXY | QFP | QFP, | SQUARE | FLATPACK | Contact Manufacturer | 5 V | 8542.39.00.01 | QUAD | GULL WING | 1 | 0.8 mm | compliant | S-PQFP-G44 | Not Qualified | COMMERCIAL | 2.45 mm | DIGITAL SLIC | 10 mm | 10 mm | |||||||||||||||||||||||||
| Mfr Part No BCM54994EB0IFSBG | Broadcom Limited | Datasheet | - | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No RFVA1027TR13 | RF Micro Devices Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | RF MICRO DEVICES INC | 3 | 85 °C | -40 °C | UNSPECIFIED | QCCN | QCCN, | SQUARE | CHIP CARRIER | Transferred | QFN | Yes | 5 V | Yes | 5A991.G | 8542.33.00.01 | QUAD | NO LEAD | 1 | compliant | 8 | S-XQCC-N8 | INDUSTRIAL | RF AND BASEBAND CIRCUIT | 7 mm | 7 mm | |||||||||||||||||||||
| Mfr Part No RF7303 | RF Micro Devices Inc | Datasheet | - | - | Min: 1 Mult: 1 | NO | 10 | RF MICRO DEVICES INC | UNSPECIFIED | , | SQUARE | MICROELECTRONIC ASSEMBLY | Transferred | Yes | 8542.39.00.01 | DUAL | NO LEAD | NOT SPECIFIED | 1 | unknown | NOT SPECIFIED | S-XDMA-N10 | BASEBAND CIRCUIT | |||||||||||||||||||||||||||||||
| Mfr Part No SX1272IMLTRT-CUT | Semtech Corporation | Datasheet | - | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No LE75183CFSC | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 28 | MICROSEMI CORP | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP, | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | Yes | 5 V | e3 | MATTE TIN | 8542.39.00.01 | DUAL | GULL WING | 1 | 1.27 mm | compliant | 28 | R-PDSO-G28 | Not Qualified | INDUSTRIAL | 2.65 mm | TELECOM CIRCUIT | 17.9 mm | 7.5 mm | |||||||||||||||||||
| Mfr Part No SC5272-M4 | Hangzhou Silan Microelectronics CO LTD | Datasheet | - | - | Min: 1 Mult: 1 | NO | 18 | HANGZHOU SILAN MICROELECTRONICS CO LTD | 70 °C | -20 °C | PLASTIC/EPOXY | DIP | DIP, DIP18,.3 | DIP18,.3 | RECTANGULAR | IN-LINE | Contact Manufacturer | Yes | 5 V | 8542.39.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | compliant | R-PDIP-T18 | Not Qualified | COMMERCIAL | TELECOM CIRCUIT | ||||||||||||||||||||||||||
| Mfr Part No TP1321 | Teledyne Defense Electronics | Datasheet | - | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No TXC-05804AIOG-D | Transwitch Corporation | Datasheet | - | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No TCM1532BP | Texas Instruments | Datasheet | - | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No BCM5675 | Broadcom Limited | Datasheet | - | - | Min: 1 Mult: 1 | YES | 600 | BROADCOM CORP | PLASTIC/EPOXY | BGA | BGA, | UNSPECIFIED | GRID ARRAY | Transferred | BGA | No | 8542.39.00.01 | BOTTOM | BALL | 1 | compliant | 600 | X-PBGA-B600 | Not Qualified | TELECOM CIRCUIT |
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TEA1067/C2
NXP Semiconductors
Package:Interface - Telecom
Price: please inquire
-
PBL38772/1SOA
Ericsson
Package:Interface - Telecom
Price: please inquire
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TP13064ADWR
Texas Instruments
Package:Interface - Telecom
Price: please inquire
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AD6426XB
Analog Devices Inc
Package:Interface - Telecom
Price: please inquire
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UM91272
United Microelectronics Corporation
Package:Interface - Telecom
Price: please inquire
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PHY1078-01QS-BR
Maxim Integrated Products
Package:Interface - Telecom
Price: please inquire
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RFFM8202SB
RF Micro Devices Inc
Package:Interface - Telecom
Price: please inquire
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TH72031
Melexis Microelectronic Integrated Systems
Package:Interface - Telecom
Price: please inquire
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DP83846ALQA56A
Texas Instruments
Package:Interface - Telecom
Price: please inquire
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PEB2096
Intel Corporation
Package:Interface - Telecom
Price: please inquire
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BCM54994EB0IFSBG
Broadcom Limited
Package:Interface - Telecom
Price: please inquire
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RFVA1027TR13
RF Micro Devices Inc
Package:Interface - Telecom
Price: please inquire
-
RF7303
RF Micro Devices Inc
Package:Interface - Telecom
Price: please inquire
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SX1272IMLTRT-CUT
Semtech Corporation
Package:Interface - Telecom
Price: please inquire
-
LE75183CFSC
Microsemi Corporation
Package:Interface - Telecom
Price: please inquire
-
SC5272-M4
Hangzhou Silan Microelectronics CO LTD
Package:Interface - Telecom
Price: please inquire
-
TP1321
Teledyne Defense Electronics
Package:Interface - Telecom
Price: please inquire
-
TXC-05804AIOG-D
Transwitch Corporation
Package:Interface - Telecom
Price: please inquire
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TCM1532BP
Texas Instruments
Package:Interface - Telecom
Price: please inquire
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BCM5675
Broadcom Limited
Package:Interface - Telecom
Price: please inquire