The category is 'Memory'
Memory (21)
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- ECCN Code:
3A001.A.2.A
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Lifecycle Status | Mount | Mounting Type | Package / Case | Surface Mount | Mounting Feature | Number of Pins | Shell Material | Number of Terminals | Clock Frequency-Max | Contact Finish Mating | Contact Materials | Ihs Manufacturer | Manufacturer | Manufacturer Part Number | Memory Types | Mfr | Moisture Sensitivity Levels | Number of I/O Lines | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Primary Material | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | Termination | ECCN Code | Connector Type | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Color | HTS Code | Fastening Type | Subcategory | Technology | Voltage - Supply | Terminal Position | Orientation | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Supply Voltage | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Shell Finish | Pin Count | JESD-30 Code | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Interface | Max Supply Voltage | Min Supply Voltage | Max Current Rating | Memory Size | Nominal Supply Current | Speed | Operating Mode | uPs/uCs/Peripheral ICs Type | Viewing Angle | Clock Frequency | Supply Current-Max | Bit Size | Access Time | Lens Style | Has ADC | DMA Channels | Memory Format | Memory Interface | PWM Channels | Organization | DAC Channels | Test Current | Seated Height-Max | Memory Width | Write Cycle Time - Word, Page | Forward Voltage | Address Bus Width | Density | Standby Current-Max | Memory Density | On Chip Program ROM Width | Boundary Scan | Low Power Mode | Screening Level | Parallel/Serial | Format | Sync/Async | Word Size | Integrated Cache | RAM (words) | Programming Voltage | Serial Bus Type | Endurance | Write Cycle Time-Max (tWC) | Data Retention Time-Min | Write Protection | Data Polling | Toggle Bit | Number of Timers | ROM Programmability | Number of External Interrupts | Barrel Shifter | Internal Bus Architecture | On Chip Data RAM Width | Features | Test Temperature | Height | Height Seated (Max) | Length | Width | Thickness | Radiation Hardening | RoHS Status | Lead Free |
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 | Mfr Part No 25LC320A-H/SN | Microchip Technology | Datasheet | 3194 | - | Min: 1 Mult: 1 | 6 Weeks | Surface Mount | Surface Mount | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~150°C TA | Tube | 2009 | e3 | yes | Active | 1 (Unlimited) | 8 | 3A001.A.2.A | Matte Tin (Sn) - annealed | 2.5V~5.5V | DUAL | 260 | 1 | 2.7V | 1.27mm | 40 | 25LC320A | 8 | 5V | SPI, Serial | 32Kb 4K x 8 | 5mA | 5MHz | 100 ns | EEPROM | SPI | 6ms | 32 kb | SPI | 6ms | 1.5mm | 4.9mm | 3.9mm | No | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 25LC256-H/SN | Microchip Technology | Datasheet | 33 | - | Min: 1 Mult: 1 | 6 Weeks | Surface Mount | Surface Mount | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~150°C TA | Tube | 2016 | e3 | yes | Active | 3 (168 Hours) | 8 | 3A001.A.2.A | Matte Tin (Sn) | 2.5V~5.5V | DUAL | 260 | 1 | 2.7V | 1.27mm | 40 | 25LC256 | 8 | 5.5V | 2/5V | 2.5V | SPI, Serial | 256Kb 32K x 8 | 5mA | 5MHz | 100 ns | EEPROM | SPI | 6ms | 256 kb | 0.000001A | SPI | 1000000 Write/Erase Cycles | 6ms | 200 | HARDWARE/SOFTWARE | 1.5mm | 4.9mm | 3.9mm | No | ROHS3 Compliant | Lead Free | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 25LC160D-H/SN | Microchip Technology | Datasheet | 21 | - | Min: 1 Mult: 1 | 6 Weeks | Surface Mount | Surface Mount | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~150°C TA | Tube | 2013 | e3 | yes | Active | 1 (Unlimited) | 8 | 3A001.A.2.A | Matte Tin (Sn) | 2.5V~5.5V | DUAL | 260 | 1 | 2.7V | 1.27mm | 40 | 25LC160D | 8 | 5V | SPI, Serial | 16Kb 2K x 8 | 5mA | 5MHz | 100 ns | EEPROM | SPI | 8 | 6ms | 16 kb | 0.000001A | SPI | 1000000 Write/Erase Cycles | 6ms | 200 | HARDWARE/SOFTWARE | 1.75mm | 4.9mm | 3.9mm | No | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 25LC128-H/SN | Microchip Technology | Datasheet | 21 |
| Min: 1 Mult: 1 | 6 Weeks | Surface Mount | Surface Mount | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~150°C TA | Tube | 2009 | e3 | yes | Active | 3 (168 Hours) | 8 | 3A001.A.2.A | Matte Tin (Sn) | 2.5V~5.5V | DUAL | 260 | 1 | 2.7V | 1.27mm | 40 | 25LC128 | 8 | 5V | SPI, Serial | 128Kb 16K x 8 | 5mA | 5MHz | 100 ns | EEPROM | SPI | 8 | 6ms | 128 kb | SPI | 6ms | 1.75mm | 4.9mm | 3.9mm | No | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 25LC080DT-H/SN | Microchip Technology | Datasheet | 8000 | - | Min: 1 Mult: 1 | 6 Weeks | Surface Mount | Surface Mount | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~150°C TA | Tape & Reel (TR) | 2009 | e3 | yes | Active | 1 (Unlimited) | 8 | 3A001.A.2.A | Matte Tin (Sn) | 2.5V~5.5V | DUAL | 260 | 1 | 2.7V | 1.27mm | 40 | 25LC080D | 8 | 5V | SPI, Serial | 8Kb 1K x 8 | 5mA | 5MHz | 100 ns | EEPROM | SPI | 8 | 6ms | 8 kb | SPI | 6ms | 1.75mm | 4.9mm | 3.9mm | No | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 25LC320AT-H/SN | Microchip Technology | Datasheet | 1299 | - | Min: 1 Mult: 1 | 6 Weeks | Surface Mount | Surface Mount | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~150°C TA | Tape & Reel (TR) | 2009 | e3 | yes | Active | 1 (Unlimited) | 8 | 3A001.A.2.A | Matte Tin (Sn) - annealed | 2.5V~5.5V | DUAL | 260 | 1 | 2.7V | 1.27mm | 40 | 25LC320A | 8 | 5V | SPI, Serial | 32Kb 4K x 8 | 5mA | 5MHz | 100 ns | EEPROM | SPI | 8 | 6ms | 32 kb | SPI | 6ms | 1.75mm | 4.9mm | 3.9mm | No | ROHS3 Compliant | Lead Free | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 25LC160CT-H/SN | Microchip Technology | Datasheet | 5 |
| Min: 1 Mult: 1 | 6 Weeks | Surface Mount | Surface Mount | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~150°C TA | Tape & Reel (TR) | 2013 | e3 | yes | Active | 1 (Unlimited) | 8 | 3A001.A.2.A | Matte Tin (Sn) | 2.5V~5.5V | DUAL | 260 | 1 | 2.7V | 1.27mm | 40 | 25LC160C | 8 | 5V | SPI, Serial | 16Kb 2K x 8 | 5mA | 5MHz | 100 ns | EEPROM | SPI | 8 | 6ms | 16 kb | 0.000001A | SPI | 1000000 Write/Erase Cycles | 6ms | 200 | HARDWARE/SOFTWARE | 1.75mm | 4.9mm | 3.9mm | No | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 25LC160DT-H/SN | Microchip Technology | Datasheet | 35 | - | Min: 1 Mult: 1 | 6 Weeks | Surface Mount | Surface Mount | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~150°C TA | Tape & Reel (TR) | 2013 | e3 | yes | Active | 1 (Unlimited) | 8 | 3A001.A.2.A | Matte Tin (Sn) | 2.5V~5.5V | DUAL | 260 | 1 | 2.7V | 1.27mm | 40 | 25LC160D | 8 | 5V | SPI, Serial | 16Kb 2K x 8 | 5mA | 5MHz | 100 ns | EEPROM | SPI | 8 | 6ms | 16 kb | 0.000001A | SPI | 1000000 Write/Erase Cycles | 6ms | 200 | HARDWARE/SOFTWARE | 1.75mm | 4.9mm | 3.9mm | No | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 25LC256T-H/SN | Microchip Technology | Datasheet | 1595 |
| Min: 1 Mult: 1 | 6 Weeks | Surface Mount | Surface Mount | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~150°C TA | Tape & Reel (TR) | 2009 | e3 | yes | Active | 1 (Unlimited) | 8 | 3A001.A.2.A | Matte Tin (Sn) | 2.5V~5.5V | DUAL | 260 | 1 | 2.7V | 1.27mm | 40 | 25LC256 | 8 | 5.5V | 2/5V | 2.5V | SPI, Serial | 256Kb 32K x 8 | 5mA | 5MHz | 100 ns | EEPROM | SPI | 8 | 6ms | 256 kb | 0.000001A | SPI | 1000000 Write/Erase Cycles | 6ms | 200 | HARDWARE/SOFTWARE | 1.75mm | 4.9mm | 3.9mm | No | ROHS3 Compliant | Lead Free | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 25LC080D-H/SN | Microchip Technology | Datasheet | 8000 | - | Min: 1 Mult: 1 | 6 Weeks | Surface Mount | Surface Mount | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~150°C TA | Tube | 2009 | e3 | yes | Active | 1 (Unlimited) | 8 | 3A001.A.2.A | Matte Tin (Sn) | 2.5V~5.5V | DUAL | 260 | 1 | 2.7V | 1.27mm | 40 | 25LC080D | 8 | 5V | SPI, Serial | 8Kb 1K x 8 | 5mA | 5MHz | 100 ns | EEPROM | SPI | 8 | 6ms | 8 kb | SPI | 6ms | 1.75mm | 4.9mm | 3.9mm | No | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 25LC160C-H/SN | Microchip Technology | Datasheet | 35 |
| Min: 1 Mult: 1 | 6 Weeks | Surface Mount | 8-SOIC (0.154, 3.90mm Width) | YES | Non-Volatile | -40°C~150°C TA | Tube | 2009 | e3 | yes | Active | 1 (Unlimited) | 8 | 3A001.A.2.A | Matte Tin (Sn) | 8542.32.00.51 | 2.5V~5.5V | DUAL | 260 | 1 | 2.7V | 1.27mm | 40 | 25LC160C | 8 | R-PDSO-G8 | Not Qualified | 5.5V | 2/5V | 2.5V | 16Kb 2K x 8 | SYNCHRONOUS | 5MHz | EEPROM | SPI | 2KX8 | 8 | 6ms | 0.000001A | 16384 bit | SERIAL | SPI | 1000000 Write/Erase Cycles | 6ms | 200 | HARDWARE/SOFTWARE | 1.75mm | 4.9mm | 3.9mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 25LC040AT-H/SN | Microchip Technology | Datasheet | 1460 | - | Min: 1 Mult: 1 | 18 Weeks | Surface Mount | Surface Mount | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~150°C TA | Tape & Reel (TR) | 2009 | e3 | yes | Active | 1 (Unlimited) | 8 | 3A001.A.2.A | Matte Tin (Sn) - annealed | 2.5V~5.5V | DUAL | 260 | 1 | 5V | 1.27mm | 40 | 25LC040A | 8 | 5V | SPI, Serial | 4Kb 512 x 8 | 5mA | 10MHz | 160 ns | EEPROM | SPI | 8 | 5ms | 4 kb | SPI | 6ms | 1.75mm | 4.9mm | 3.9mm | No | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 25LC080CT-H/SN | Microchip Technology | Datasheet | 35 | - | Min: 1 Mult: 1 | 6 Weeks | Surface Mount | Surface Mount | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~150°C TA | Tape & Reel (TR) | 2009 | e3 | yes | Active | 1 (Unlimited) | 8 | 3A001.A.2.A | Matte Tin (Sn) - annealed | 2.5V~5.5V | DUAL | 260 | 1 | 2.7V | 1.27mm | 40 | 25LC080C | 8 | 5V | SPI, Serial | 8Kb 1K x 8 | 5mA | 5MHz | 100 ns | EEPROM | SPI | 8 | 6ms | 8 kb | SPI | 6ms | 1.75mm | 4.9mm | 3.9mm | No | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 25LC020AT-H/SN | Microchip Technology | Datasheet | 5344 |
| Min: 1 Mult: 1 | 27 Weeks | Surface Mount | Surface Mount | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~150°C TA | Tape & Reel (TR) | 2012 | e3 | yes | Active | 1 (Unlimited) | 8 | 3A001.A.2.A | Matte Tin (Sn) | 2.5V~5.5V | DUAL | 260 | 1 | 5V | 1.27mm | 40 | 25LC020A | 8 | 5.5V | 2.5V | SPI, Serial | 2Kb 256 x 8 | 5mA | 10MHz | 160 ns | EEPROM | SPI | 8 | 5ms | 2 kb | SPI | 6ms | 1.75mm | 4.9mm | 3.9mm | No | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 25LC640AT-H/SN | Microchip Technology | Datasheet | 8000 | - | Min: 1 Mult: 1 | 7 Weeks | Surface Mount | Surface Mount | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~150°C TA | Tape & Reel (TR) | 2013 | e3 | yes | Active | 1 (Unlimited) | 8 | 3A001.A.2.A | Matte Tin (Sn) - annealed | 2.5V~5.5V | DUAL | 260 | 1 | 2.7V | 1.27mm | 40 | 25LC640A | 8 | 5V | SPI, Serial | 64Kb 8K x 8 | 5mA | 5MHz | 100 ns | EEPROM | SPI | 8 | 6ms | 64 kb | SPI | 6ms | 1.75mm | 4.9mm | 3.9mm | No | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No SM28VLT32SHKN | Texas Instruments | Datasheet | 816 | - | Min: 1 Mult: 1 | ACTIVE (Last Updated: 4 days ago) | Surface Mount | 14 | FLASH | Bulk | 14 | 3A001.A.2.A | 210°C | -55°C | 8542.32.00.71 | DUAL | GULL WING | 1 | 1.9V | 1.02mm | 12MHz | 3.3V | MILITARY | SPI, Serial | 3.6V | 3V | 0.16mA | 2MX16 | 21b | 32 Mb | Synchronous | 16b | 1.8V | SPI | 1000 Write/Erase Cycles | HARDWARE | YES | YES | 3.05mm | 20mm | 8mm | 2.05mm | No | RoHS Compliant | Contains Lead | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No DSPIC33FJ16GS504T-H/TL | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 13 Weeks | Production (Last Updated: 2 years ago) | YES | 44 | MICROCHIP TECHNOLOGY INC | Microchip Technology Inc | DSPIC33FJ16GS504T-H/TL | 35 | 150 °C | -40 °C | UNSPECIFIED | HLBGA | HLBGA, LGA44,12X12,20 | LGA44,12X12,20 | SQUARE | GRID ARRAY, HEAT SINK/SLUG, LOW PROFILE | Active | 40 | 5.05 | Compliant | Yes | 3.6 V | 3 V | 3.3 V | Automotive grade | e4 | 3A001.A.2.A | Nickel/Palladium/Gold (Ni/Pd/Au) | White | 8542.31.00.01 | CMOS | BOTTOM | BUTT | 260 | 0.5 mm | compliant | S-XBGA-N44 | AUTOMOTIVE | 1 A | 20 MHz | DIGITAL SIGNAL PROCESSOR, OTHER | 120 ° | 16 | Domed | YES | NO | YES | YES | 300 mA | 1 mm | 3.3 V | 8 | YES | YES | AEC-Q100; TS 16949 | FIXED POINT | NO | 2048 | 3 | FLASH | 3 | YES | MULTIPLE | 8 | 25 °C | 1.35 mm | 6 mm | 6 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No DSPIC33FJ16GS504T-H/PT | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 16 Weeks | Production (Last Updated: 2 years ago) | YES | 44 | MICROCHIP TECHNOLOGY INC | Microchip Technology Inc | DSPIC33FJ16GS504T-H/PT | 3 | 35 | 150 °C | -40 °C | PLASTIC/EPOXY | TQFP | TQFP-44 | TQFP44,.47SQ,32 | SQUARE | FLATPACK, THIN PROFILE | Active | 40 | 5.05 | Non-Compliant | Yes | 3.6 V | 3 V | 3.3 V | Automotive grade | e3 | 3A001.A.2.A | Matte Tin (Sn) | 8542.31.00.01 | CMOS | QUAD | GULL WING | 260 | 0.8 mm | compliant | S-PQFP-G44 | AUTOMOTIVE | 20 MHz | DIGITAL SIGNAL PROCESSOR, OTHER | 16 | YES | NO | YES | YES | 1.2 mm | 8 | YES | YES | AEC-Q100; TS 16949 | FIXED POINT | NO | 2048 | 3 | FLASH | 3 | YES | MULTIPLE | 8 | 10 mm | 10 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No DSPIC33FJ128GP804T-H/ML | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 19 Weeks | Production (Last Updated: 2 years ago) | YES | 44 | 40 MHz | MICROCHIP TECHNOLOGY INC | Microchip Technology Inc | DSPIC33FJ128GP804T-H/ML | 1 | 35 | 150 °C | -40 °C | PLASTIC/EPOXY | HVQCCN | 8 X 8 MM, LEAD FREE, PLASTIC, QFN-44 | LCC44,.32SQ,25 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Active | QFN | 40 | 5.39 | Non-Compliant | Yes | 3.6 V | 3 V | 3.3 V | e3 | Yes | 3A001.A.2.A | Matte Tin (Sn) | 8542.31.00.01 | Digital Signal Processors | CMOS | QUAD | NO LEAD | 260 | 0.65 mm | compliant | 44 | S-PQCC-N44 | Not Qualified | 3.3 V | AUTOMOTIVE | 20 MHz | MICROCONTROLLER | 45 mA | 16 | YES | YES | YES | YES | 1 mm | FLOATING POINT | 8192 | FLASH | 8 mm | 8 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No DSPIC33FJ16GS502T-H/MM | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 19 Weeks | Production (Last Updated: 2 years ago) | Panel Mount, Through Hole | YES | Flange | Aluminum | 28 | Gold | Copper Alloy | MICROCHIP TECHNOLOGY INC | Microchip Technology Inc | DSPIC33FJ16GS502T-H/MM | Glenair | 1 | 21 | 150 °C | -40 °C | Retail Package | PLASTIC/EPOXY | HVQCCN | QFN-28 | LCC28,.24SQ,25 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Active | Metal | Active | 40 | 5.22 | Non-Compliant | Yes | 3.6 V | 3 V | 3.3 V | Automotive grade | -65°C ~ 175°C | 806 | e3 | Solder | 3A001.A.2.A | Receptacle, Female Sockets | Matte Tin (Sn) | Silver | 8542.31.00.01 | Threaded | CMOS | QUAD | E | NO LEAD | 260 | 0.65 mm | compliant | Nickel/PTFE | S-PQCC-N28 | AUTOMOTIVE | 20 MHz | DIGITAL SIGNAL PROCESSOR, OTHER | 16 | YES | NO | YES | YES | 1 mm | 8 | YES | YES | AEC-Q100; TS 16949 | FIXED POINT | NO | 2048 | 3 | FLASH | 3 | YES | MULTIPLE | 8 | Ground | 6 mm | 6 mm |
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25LC320A-H/SN
Microchip Technology
Package:Memory
Price: please inquire
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25LC256-H/SN
Microchip Technology
Package:Memory
Price: please inquire
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25LC160D-H/SN
Microchip Technology
Package:Memory
Price: please inquire
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25LC128-H/SN
Microchip Technology
Package:Memory
1.327710
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25LC080DT-H/SN
Microchip Technology
Package:Memory
Price: please inquire
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25LC320AT-H/SN
Microchip Technology
Package:Memory
Price: please inquire
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25LC160CT-H/SN
Microchip Technology
Package:Memory
1.258702
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25LC160DT-H/SN
Microchip Technology
Package:Memory
Price: please inquire
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25LC256T-H/SN
Microchip Technology
Package:Memory
1.556885
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25LC080D-H/SN
Microchip Technology
Package:Memory
Price: please inquire
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25LC160C-H/SN
Microchip Technology
Package:Memory
1.118088
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25LC040AT-H/SN
Microchip Technology
Package:Memory
Price: please inquire
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25LC080CT-H/SN
Microchip Technology
Package:Memory
Price: please inquire
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25LC020AT-H/SN
Microchip Technology
Package:Memory
1.193240
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25LC640AT-H/SN
Microchip Technology
Package:Memory
Price: please inquire
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SM28VLT32SHKN
Texas Instruments
Package:Memory
Price: please inquire
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DSPIC33FJ16GS504T-H/TL
Microchip
Package:Memory
Price: please inquire
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DSPIC33FJ16GS504T-H/PT
Microchip
Package:Memory
Price: please inquire
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DSPIC33FJ128GP804T-H/ML
Microchip
Package:Memory
Price: please inquire
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DSPIC33FJ16GS502T-H/MM
Microchip
Package:Memory
Price: please inquire