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Memory (403)

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ECCN Code
Terminal Position
Memory Width
Organization
HTS Code
Terminal Pitch
Surface Mount
Reach Compliance Code
Number of Functions
Ihs Manufacturer
JESD-30 Code
Part Life Cycle Code

ECCN Code:
3A001.A.2.C

Part Number	Manufacturer	Datasheet	Availability	Pricing(USD)	Quantity	Surface Mount	Number of Terminals	Access Time-Max	Clock Frequency-Max (fCLK)	Ihs Manufacturer	Number of Words	Number of Words Code	Operating Temperature-Max	Operating Temperature-Min	Package Body Material	Package Code	Package Description	Package Equivalence Code	Package Shape	Package Style	Part Life Cycle Code	Part Package Code	Rohs Code	Supply Voltage-Nom (Vsup)	JESD-609 Code	Pbfree Code	ECCN Code	Terminal Finish	Additional Feature	HTS Code	Terminal Position	Terminal Form	Peak Reflow Temperature (Cel)	Number of Functions	Terminal Pitch	Reach Compliance Code	Time@Peak Reflow Temperature-Max (s)	Pin Count	JESD-30 Code	Qualification Status	Supply Voltage-Max (Vsup)	Temperature Grade	Supply Voltage-Min (Vsup)	Number of Ports	Operating Mode	Supply Current-Max	Organization	Output Characteristics	Seated Height-Max	Memory Width	Standby Current-Max	Memory Density	Screening Level	Parallel/Serial	I/O Type	Memory IC Type	Programming Voltage	Write Cycle Time-Max (tWC)	Standby Voltage-Min	Alternate Memory Width	Output Enable	Length	Width
Mfr Part No STK14C88-5C35M	Simtek Corporation	Datasheet	-	-	Min: 1 Mult: 1	NO	32	35 ns		SIMTEK CORP	32768 words	32000	125 °C	-55 °C	CERAMIC, METAL-SEALED COFIRED	DIP	0.300 INCH, CERAMIC, DIP-32	DIP28,.3	RECTANGULAR	IN-LINE	Transferred		No	5 V	e0		3A001.A.2.C	TIN LEAD		8542.32.00.41	DUAL	THROUGH-HOLE	240	1	2.54 mm	unknown			R-CDIP-T32	Not Qualified	5.5 V	MILITARY	4.5 V	1	ASYNCHRONOUS	0.085 mA	32KX8	3-STATE	4.12 mm	8	0.0015 A	262144 bit		PARALLEL	COMMON	NON-VOLATILE SRAM			4.5 V		YES	40.635 mm	7.62 mm
Mfr Part No WS512K32-55G2UMA	Microsemi Corporation	Datasheet	-	-	Min: 1 Mult: 1	YES	68	55 ns		MICROSEMI CORP	524288 words	512000	125 °C	-55 °C	CERAMIC, METAL-SEALED COFIRED	QFP	22.40 X 22.40 MM, 3.56 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68		SQUARE	FLATPACK	Transferred	QFP	No	5 V		No	3A001.A.2.C		USER CONFIGURABLE AS 2M X 8	8542.32.00.41	QUAD	GULL WING	NOT SPECIFIED	1	1.27 mm	unknown	NOT SPECIFIED	68	S-CQFP-G68	Not Qualified	5.5 V	MILITARY	4.5 V		ASYNCHRONOUS		512KX32		3.51 mm	32		16777216 bit	MIL-STD-883	PARALLEL		SRAM MODULE				16		22.36 mm	22.36 mm
Mfr Part No CY7C128A-45LMB	Cypress Semiconductor	Datasheet	-	-	Min: 1 Mult: 1	YES	24	45 ns		CYPRESS SEMICONDUCTOR CORP	2048 words	2000	125 °C	-55 °C	CERAMIC, METAL-SEALED COFIRED	QCCN	LCC-24	LCC24,.3X.4	RECTANGULAR	CHIP CARRIER	Obsolete	LCC	No	5 V	e0		3A001.A.2.C	TIN LEAD	AUTOMATIC POWER-DOWN	8542.32.00.41	QUAD	NO LEAD		1	1.27 mm	not_compliant		24	R-CQCC-N24	Not Qualified	5.5 V	MILITARY	4.5 V	1	ASYNCHRONOUS	0.125 mA	2KX8	3-STATE	1.9812 mm	8	0.02 A	16384 bit	38535Q/M;38534H;883B	PARALLEL	COMMON	STANDARD SRAM			4.5 V		YES	10.16 mm	7.62 mm
Mfr Part No 5962-9561701MPX	AMD Xilinx	Datasheet	393 In Stock	-	Min: 1 Mult: 1	NO	8		12.5 MHz	XILINX INC	262144 words	256000	125 °C	-55 °C	CERAMIC, GLASS-SEALED	DIP	DIP,		RECTANGULAR	IN-LINE	Obsolete	DIP		5 V			3A001.A.2.C			8542.32.00.51	DUAL	THROUGH-HOLE		1		unknown		8	R-GDIP-T8	Not Qualified	5.5 V	MILITARY	4.5 V		SYNCHRONOUS		256KX1			1		262144 bit	MIL-STD-883	SERIAL		CONFIGURATION MEMORY
Mfr Part No IDT8M624S60CB	Integrated Device Technology Inc	Datasheet	-	-	Min: 1 Mult: 1	NO	40	60 ns		INTEGRATED DEVICE TECHNOLOGY INC	65536 words	64000	125 °C	-55 °C	CERAMIC, METAL-SEALED COFIRED	DIP		DIP40,.6	RECTANGULAR	MICROELECTRONIC ASSEMBLY	Obsolete		No	5 V	e0		3A001.A.2.C	TIN LEAD	TTL COMPATIBLE INPUTS/OUTPUTS	8542.32.00.41	DUAL	THROUGH-HOLE		1	2.54 mm	not_compliant			R-CDMA-T40	Not Qualified	5.5 V	MILITARY	4.5 V		ASYNCHRONOUS	0.34 mA	64KX16	3-STATE		16	0.08 A	1048576 bit	MIL-STD-883 Class B (Modified)	PARALLEL	COMMON	SRAM MODULE			4.5 V
Mfr Part No AS5C4008ECJ-12L	Micross Components	Datasheet	-	-	Min: 1 Mult: 1	YES	32	12 ns		MICROSS COMPONENTS	524288 words	512000	125 °C	-55 °C	CERAMIC, METAL-SEALED COFIRED	SOJ	CERAMIC, SOJ-32	SOJ32,.44	RECTANGULAR	SMALL OUTLINE	Active	SOJ	No	5 V	e0	No	3A001.A.2.C	TIN LEAD		8542.32.00.41	DUAL	J BEND		1	1.27 mm	compliant		32	R-CDSO-J32	Not Qualified	5.5 V	MILITARY	4.5 V		ASYNCHRONOUS	0.18 mA	512KX8	3-STATE	4.064 mm	8	0.0045 A	4194304 bit	38535Q/M;38534H;883B	PARALLEL	COMMON	STANDARD SRAM			2 V			20.955 mm	11.1506 mm
Mfr Part No AT27C256R-20DM/883	Atmel Corporation	Datasheet	-	-	Min: 1 Mult: 1	NO	28	200 ns		ATMEL CORP	32768 words	32000	125 °C	-55 °C	CERAMIC, GLASS-SEALED	WDIP	WDIP, DIP28,.6	DIP28,.6	RECTANGULAR	IN-LINE, WINDOW	Obsolete	DIP	No	5 V	e0	No	3A001.A.2.C	TIN LEAD		8542.32.00.61	DUAL	THROUGH-HOLE		1	2.54 mm	unknown		28	R-GDIP-T28	Not Qualified	5.5 V	MILITARY	4.5 V		ASYNCHRONOUS	0.025 mA	32KX8	3-STATE	5.72 mm	8	0.0002 A	262144 bit	38535Q/M;38534H;883B	PARALLEL	COMMON	UVPROM	13 V					37.25 mm	15.24 mm
Mfr Part No 5962-9951401QXA	AMD Xilinx	Datasheet	-	-	Min: 1 Mult: 1	YES	20			XILINX INC	1048576 words	1000000	125 °C	-55 °C	PLASTIC/EPOXY	SOP	SOP,		RECTANGULAR	SMALL OUTLINE	Obsolete	SOIC	No	3.3 V	e0		3A001.A.2.C	TIN LEAD		8542.32.00.51	DUAL	GULL WING		1	1.27 mm	compliant		20	R-PDSO-G20	Not Qualified	3.6 V	MILITARY	3 V		SYNCHRONOUS		1MX1		2.65 mm	1		1048576 bit	MIL-PRF-38535 Class Q			CONFIGURATION MEMORY						12.8 mm	7.5 mm
Mfr Part No CY7C132-35LMB	Cypress Semiconductor	Datasheet	-	-	Min: 1 Mult: 1	YES	48	35 ns		CYPRESS SEMICONDUCTOR CORP	2048 words	2000	125 °C	-55 °C	CERAMIC, METAL-SEALED COFIRED	QCCN	CERAMIC, LCC-48	LCC48,.56SQ,40	SQUARE	CHIP CARRIER	Obsolete	LCC	No	5 V	e0	No	3A001.A.2.C	TIN LEAD	AUTOMATIC POWER-DOWN; ARBITER	8542.32.00.41	QUAD	NO LEAD		1	1 mm	not_compliant		48	S-CQCC-N48	Not Qualified	5.5 V	MILITARY	4.5 V	2	ASYNCHRONOUS	0.17 mA	2KX8	3-STATE		8	0.015 A	16384 bit	38535Q/M;38534H;883B	PARALLEL	COMMON	MULTI-PORT SRAM			4.5 V		YES
Mfr Part No IDT7198L45CB	Integrated Device Technology Inc	Datasheet	-	-	Min: 1 Mult: 1	NO	24	45 ns		INTEGRATED DEVICE TECHNOLOGY INC	16384 words	16000	125 °C	-55 °C	CERAMIC, METAL-SEALED COFIRED	DIP	0.300 INCH, SIDE BRAZED, DIP-24	DIP24,.3	RECTANGULAR	IN-LINE	Obsolete	DIP	No	5 V	e0	No	3A001.A.2.C	TIN LEAD		8542.32.00.41	DUAL	THROUGH-HOLE		1	2.54 mm	not_compliant		24	R-CDIP-T24	Not Qualified	5.5 V	MILITARY	4.5 V	1	ASYNCHRONOUS	0.11 mA	16KX4	3-STATE	5.08 mm	4	0.0006 A	65536 bit	38535Q/M;38534H;883B	PARALLEL	COMMON	STANDARD SRAM			2 V		YES	30.607 mm	7.62 mm
Mfr Part No SN54S301J	Texas Instruments	Datasheet	-	-	Min: 1 Mult: 1	NO	16	85 ns		TEXAS INSTRUMENTS INC	256 words	256	125 °C	-55 °C	CERAMIC	DIP	DIP, DIP16,.3	DIP16,.3	RECTANGULAR	IN-LINE	Obsolete		No	5 V			3A001.A.2.C			8542.32.00.41	DUAL	THROUGH-HOLE	NOT SPECIFIED		2.54 mm	not_compliant	NOT SPECIFIED		R-XDIP-T16	Not Qualified		MILITARY			ASYNCHRONOUS	0.14 mA	256X1	OPEN-COLLECTOR		1				PARALLEL		STANDARD SRAM
Mfr Part No X28C512DMB-25	Rochester Electronics LLC	Datasheet	-	-	Min: 1 Mult: 1	NO	32	250 ns		ROCHESTER ELECTRONICS LLC	65536 words	64000	125 °C	-55 °C	CERAMIC, METAL-SEALED COFIRED	DIP	DIP,		RECTANGULAR	IN-LINE	Obsolete			5 V			3A001.A.2.C		LG_MAX	8542.32.00.51	DUAL	THROUGH-HOLE		1	2.54 mm	unknown			R-CDIP-T32		5.5 V	MILITARY	4.5 V		ASYNCHRONOUS	0.05 mA	64KX8		5.9 mm	8		524288 bit	MIL-STD-883	PARALLEL		EEPROM	5 V	10 ms				42.95 mm	15.24 mm
Mfr Part No AM27C1024-250LEB	AMD	Datasheet	676 In Stock	-	Min: 1 Mult: 1	YES	44	250 ns		ADVANCED MICRO DEVICES INC	65536 words	64000	125 °C	-55 °C	CERAMIC, METAL-SEALED COFIRED	WQCCN	WQCCN, LCC44,.65SQ	LCC44,.65SQ	SQUARE	CHIP CARRIER, WINDOW	Obsolete	LCC	No	5 V	e0		3A001.A.2.C	Tin/Lead (Sn/Pb)		8542.32.00.61	QUAD	NO LEAD		1	1.27 mm	unknown		44	S-CQCC-N44	Not Qualified	5.5 V	MILITARY	4.5 V		ASYNCHRONOUS	0.06 mA	64KX16	3-STATE	3.556 mm	16	0.00024 A	1048576 bit		PARALLEL	COMMON	UVPROM						16.51 mm	16.51 mm
Mfr Part No STK12C68-5C40M	Cypress Semiconductor	Datasheet	-	-	Min: 1 Mult: 1	NO	28	40 ns		SIMTEK CORP	8192 words	8000	125 °C	-55 °C	CERAMIC, METAL-SEALED COFIRED	DIP	DIP,		RECTANGULAR	IN-LINE	Obsolete	DIP		5 V			3A001.A.2.C			8542.32.00.41	DUAL	THROUGH-HOLE		1	2.54 mm	unknown		28	R-CDIP-T28	Not Qualified	5.5 V	MILITARY	4.5 V		ASYNCHRONOUS		8KX8		4.14 mm	8		65536 bit		PARALLEL		NON-VOLATILE SRAM						35.56 mm	7.62 mm
Mfr Part No STK12C68-5C40M	Simtek Corporation	Datasheet	-	-	Min: 1 Mult: 1	NO	28	40 ns		SIMTEK CORP	8192 words	8000	125 °C	-55 °C	CERAMIC, METAL-SEALED COFIRED	DIP	DIP,		RECTANGULAR	IN-LINE	Obsolete			5 V			3A001.A.2.C			8542.32.00.41	DUAL	THROUGH-HOLE		1	2.54 mm	unknown			R-CDIP-T28	Not Qualified	5.5 V	MILITARY	4.5 V		ASYNCHRONOUS		8KX8		4.14 mm	8		65536 bit		PARALLEL		NON-VOLATILE SRAM						35.56 mm	7.62 mm
Mfr Part No MM54C920J	Texas Instruments	Datasheet	-	-	Min: 1 Mult: 1	NO	22	275 ns		NATIONAL SEMICONDUCTOR CORP	256 words	256	125 °C	-55 °C	CERAMIC	DIP	DIP, DIP22,.4	DIP22,.4	RECTANGULAR	IN-LINE	Obsolete		No	5 V	e0		3A001.A.2.C	Tin/Lead (Sn/Pb)		8542.32.00.41	DUAL	THROUGH-HOLE			2.54 mm	unknown			R-XDIP-T22	Not Qualified		MILITARY			SYNCHRONOUS		256X4	3-STATE		4		1024 bit		PARALLEL		STANDARD SRAM
Mfr Part No MM54C920J	National Semiconductor Corporation	Datasheet	-	-	Min: 1 Mult: 1	NO	22	275 ns		NATIONAL SEMICONDUCTOR CORP	256 words	256	125 °C	-55 °C	CERAMIC	DIP	DIP, DIP22,.4	DIP22,.4	RECTANGULAR	IN-LINE	Obsolete		No	5 V	e0		3A001.A.2.C	Tin/Lead (Sn/Pb)		8542.32.00.41	DUAL	THROUGH-HOLE			2.54 mm	compliant			R-XDIP-T22	Not Qualified		MILITARY			SYNCHRONOUS		256X4	3-STATE		4		1024 bit		PARALLEL		STANDARD SRAM
Mfr Part No IDT7198S35DB	Integrated Device Technology Inc	Datasheet	-	-	Min: 1 Mult: 1	NO	24	35 ns		INTEGRATED DEVICE TECHNOLOGY INC	16384 words	16000	125 °C	-55 °C	CERAMIC, GLASS-SEALED	DIP	0.300 INCH, CERDIP-24	DIP24,.3	RECTANGULAR	IN-LINE	Obsolete	DIP	No	5 V	e0		3A001.A.2.C	Tin/Lead (Sn/Pb)		8542.32.00.41	DUAL	THROUGH-HOLE		1	2.54 mm	not_compliant		24	R-GDIP-T24	Not Qualified	5.5 V	MILITARY	4.5 V	1	ASYNCHRONOUS	0.14 mA	16KX4	3-STATE	5.08 mm	4	0.02 A	65536 bit	38535Q/M;38534H;883B	PARALLEL	COMMON	STANDARD SRAM			4.5 V		YES	32.004 mm	7.62 mm
Mfr Part No 5962-8700206ZC	Integrated Device Technology Inc	Datasheet	-	-	Min: 1 Mult: 1	NO		90 ns		INTEGRATED DEVICE TECHNOLOGY INC	2048 words	2000	125 °C	-55 °C	CERAMIC, GLASS-SEALED	DIP	DIP,			IN-LINE	Obsolete	DIP		5 V	e0		3A001.A.2.C	TIN LEAD		8542.32.00.41	DUAL	THROUGH-HOLE		1		unknown		48		Not Qualified	5.5 V	MILITARY	4.5 V		ASYNCHRONOUS		2KX8			8		16384 bit		PARALLEL		MULTI-PORT SRAM
Mfr Part No AS8S128K32PN-45	Micross Components	Datasheet	-	-	Min: 1 Mult: 1	NO	66	45 ns		MICROSS COMPONENTS	131072 words	128000	125 °C	-55 °C	CERAMIC	PGA	PGA, PGA66,11X11	PGA66,11X11	SQUARE	GRID ARRAY	Active		No	5 V			3A001.A.2.C			8542.32.00.41	PERPENDICULAR	PIN/PEG	NOT SPECIFIED	1	2.54 mm	compliant	NOT SPECIFIED		S-XPGA-P66	Not Qualified		MILITARY			ASYNCHRONOUS	0.5 mA	128KX32	3-STATE		32	0.04 A	4194304 bit		PARALLEL	COMMON	SRAM MODULE			4.5 V			27.305 mm	27.305 mm

Memory (403)