The category is 'Memory'
Memory (403)
- All Manufacturers
- ECCN Code
- Terminal Position
- Memory Width
- Organization
- HTS Code
- Terminal Pitch
- Surface Mount
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- Number of Functions
- Ihs Manufacturer
- JESD-30 Code
- Part Life Cycle Code
- ECCN Code:
3A001.A.2.C
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Surface Mount | Number of Terminals | Access Time-Max | Clock Frequency-Max (fCLK) | Ihs Manufacturer | Moisture Sensitivity Levels | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Nom (Vsup) | JESD-609 Code | Pbfree Code | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Temperature Grade | Supply Voltage-Min (Vsup) | Number of Ports | Operating Mode | Supply Current-Max | Organization | Output Characteristics | Seated Height-Max | Memory Width | Standby Current-Max | Memory Density | Screening Level | Parallel/Serial | I/O Type | Memory IC Type | Programming Voltage | Standby Voltage-Min | Data Polling | Toggle Bit | Command User Interface | Output Enable | Total Dose | Length | Width |
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 | Mfr Part No PDM41024L55L32B | Paradigm Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | 55 ns | PARADIGM TECHNOLOGY INC | 131072 words | 128000 | 125 °C | -55 °C | CERAMIC | QCCN | QCCN, LCC32,.45X.55 | LCC32,.45X.55 | RECTANGULAR | CHIP CARRIER | Obsolete | No | 5 V | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 8542.32.00.41 | QUAD | NO LEAD | 1.27 mm | unknown | R-XQCC-N32 | Not Qualified | MILITARY | ASYNCHRONOUS | 0.18 mA | 128KX8 | 3-STATE | 8 | 0.0005 A | 1048576 bit | 38535Q/M;38534H;883B | PARALLEL | COMMON | STANDARD SRAM | 2 V | ||||||||||||||||||||||
| Mfr Part No IDT8M824S45CB | Integrated Device Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | NO | 32 | 45 ns | INTEGRATED DEVICE TECHNOLOGY INC | 131072 words | 128000 | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | DIP | DIP32,.6 | RECTANGULAR | MICROELECTRONIC ASSEMBLY | Obsolete | No | 5 V | e0 | 3A001.A.2.C | TIN LEAD | TTL COMPATIBLE INPUTS/OUTPUTS | 8542.32.00.41 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | not_compliant | R-CDMA-T32 | Not Qualified | 5.5 V | MILITARY | 4.5 V | ASYNCHRONOUS | 0.265 mA | 128KX8 | 3-STATE | 8 | 0.08 A | 1048576 bit | 38535Q/M;38534H;883B | PARALLEL | COMMON | SRAM MODULE | 4.5 V | |||||||||||||||||||
 | Mfr Part No AS5C512K8F-20 | Micross Components | Datasheet | - | - | Min: 1 Mult: 1 | YES | 36 | 20 ns | MICROSS COMPONENTS | 524288 words | 512000 | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | DFP | DFP, | RECTANGULAR | FLATPACK | Active | DFP | No | 5 V | e0 | No | 3A001.A.2.C | TIN LEAD | 8542.32.00.41 | DUAL | FLAT | 1 | 1.27 mm | compliant | 36 | R-CDFP-F36 | Not Qualified | 5.5 V | MILITARY | 4.5 V | ASYNCHRONOUS | 0.09 mA | 512KX8 | 3.175 mm | 8 | 4194304 bit | MIL-STD-883 | PARALLEL | STANDARD SRAM | 23.368 mm | 12.954 mm | ||||||||||||||||||
| Mfr Part No AM27512-25/BXA | AMD | Datasheet | - | - | Min: 1 Mult: 1 | NO | 28 | 250 ns | ADVANCED MICRO DEVICES INC | 65536 words | 64000 | 125 °C | -55 °C | CERAMIC | DIP | DIP, DIP28,.6 | DIP28,.6 | RECTANGULAR | IN-LINE | Obsolete | No | 5 V | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 8542.32.00.61 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | R-XDIP-T28 | Not Qualified | MILITARY | ASYNCHRONOUS | 0.15 mA | 64KX8 | 3-STATE | 8 | 524288 bit | 38535Q/M;38534H;883B | PARALLEL | COMMON | UVPROM | |||||||||||||||||||||||
 | Mfr Part No AM2130-10/BXC | AMD | Datasheet | 720 | - | Min: 1 Mult: 1 | NO | 48 | 100 ns | ADVANCED MICRO DEVICES INC | 1024 words | 1000 | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | DIP | DIP, DIP48,.6 | DIP48,.6 | RECTANGULAR | IN-LINE | Obsolete | DIP | No | 5 V | e0 | No | 3A001.A.2.C | TIN LEAD | INTERRUPT FLAG | 8542.32.00.41 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | 48 | R-CDIP-T48 | Not Qualified | 5.5 V | MILITARY | 4.5 V | 2 | ASYNCHRONOUS | 0.185 mA | 1KX8 | 3-STATE | 4.445 mm | 8 | 8192 bit | 38535Q/M;38534H;883B | PARALLEL | COMMON | MULTI-PORT SRAM | YES | 60.96 mm | 15.24 mm | ||||||||||||
| Mfr Part No IDT8M624S45CB | Integrated Device Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | NO | 40 | 45 ns | INTEGRATED DEVICE TECHNOLOGY INC | 65536 words | 64000 | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | DIP | DIP40,.6 | RECTANGULAR | MICROELECTRONIC ASSEMBLY | Obsolete | No | 5 V | e0 | 3A001.A.2.C | TIN LEAD | TTL COMPATIBLE INPUTS/OUTPUTS | 8542.32.00.41 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | not_compliant | R-CDMA-T40 | Not Qualified | 5.5 V | MILITARY | 4.5 V | ASYNCHRONOUS | 0.34 mA | 64KX16 | 3-STATE | 16 | 0.08 A | 1048576 bit | MIL-STD-883 Class B (Modified) | PARALLEL | COMMON | SRAM MODULE | 4.5 V | |||||||||||||||||||
 | Mfr Part No SMJ27C512-30JM | Texas Instruments | Datasheet | - | - | Min: 1 Mult: 1 | NO | 28 | 300 ns | TEXAS INSTRUMENTS INC | 65536 words | 64000 | 125 °C | -55 °C | CERAMIC, GLASS-SEALED | WDIP | WDIP, DIP28,.6 | DIP28,.6 | RECTANGULAR | IN-LINE, WINDOW | Obsolete | DIP | No | 5 V | 3A001.A.2.C | 8542.32.00.61 | DUAL | THROUGH-HOLE | NOT SPECIFIED | 1 | 2.54 mm | not_compliant | NOT SPECIFIED | 28 | R-GDIP-T28 | Not Qualified | 5.5 V | MILITARY | 4.5 V | ASYNCHRONOUS | 0.05 mA | 64KX8 | 3-STATE | 4.91 mm | 8 | 0.000325 A | 524288 bit | 38535Q/M;38534H;883B | PARALLEL | COMMON | UVPROM | 36.83 mm | 15.24 mm | |||||||||||||||
 | Mfr Part No XC1701-PCG20M | AMD Xilinx | Datasheet | 772 | - | Min: 1 Mult: 1 | YES | 20 | 45 ns | XILINX INC | 3 | 1048576 words | 1000000 | 125 °C | -55 °C | PLASTIC/EPOXY | QCCJ | PLASTIC, LCC-20 | SQUARE | CHIP CARRIER | Transferred | QLCC | Yes | 5 V | e3 | Yes | 3A001.A.2.C | MATTE TIN | 8542.32.00.51 | QUAD | J BEND | 1 | 1.27 mm | compliant | 20 | S-PQCC-J20 | Not Qualified | 5.5 V | MILITARY | 4.5 V | SYNCHRONOUS | 1MX1 | 4.57 mm | 1 | 1048576 bit | PARALLEL | CONFIGURATION MEMORY | 8.9662 mm | 8.9662 mm | |||||||||||||||||||
 | Mfr Part No AM91L22-45/DMC | AMD | Datasheet | 476 | - | Min: 1 Mult: 1 | NO | 22 | 45 ns | ADVANCED MICRO DEVICES INC | 256 words | 256 | 125 °C | -55 °C | CERAMIC, GLASS-SEALED | DIP | DIP, DIP22,.4 | DIP22,.4 | RECTANGULAR | IN-LINE | Obsolete | DIP | No | 5 V | e0 | No | 3A001.A.2.C | TIN LEAD | 8542.32.00.41 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | 22 | R-GDIP-T22 | Not Qualified | 5.5 V | MILITARY | 4.5 V | 1 | ASYNCHRONOUS | 0.09 mA | 256X4 | 3-STATE | 5.08 mm | 4 | 1024 bit | MIL-STD-883 Class B (Modified) | PARALLEL | SEPARATE | STANDARD SRAM | YES | 27.4955 mm | 7.62 mm | |||||||||||||
 | Mfr Part No AS5C512K8ECJ-45L | Micross Components | Datasheet | - | - | Min: 1 Mult: 1 | YES | 36 | 45 ns | MICROSS COMPONENTS | 524288 words | 512000 | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | SOJ | SOJ, | RECTANGULAR | SMALL OUTLINE | Active | SOJ | No | 5 V | e0 | No | 3A001.A.2.C | TIN LEAD | 8542.32.00.41 | DUAL | J BEND | 1 | 1.27 mm | compliant | 36 | R-CDSO-J36 | Not Qualified | 5.5 V | MILITARY | 4.5 V | ASYNCHRONOUS | 0.07 mA | 512KX8 | 4.064 mm | 8 | 4194304 bit | MIL-STD-883 | PARALLEL | STANDARD SRAM | 23.4823 mm | 11.3538 mm | ||||||||||||||||||
 | Mfr Part No AS27C256-17ECAM | Micross Components | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | 170 ns | MICROSS COMPONENTS | 32768 words | 32000 | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | QCCN | 0.450 X 0.550 INCH, CERAMIC, LCC-32 | LCC32,.45X.55 | RECTANGULAR | CHIP CARRIER | Active | QFJ | 5 V | e4 | 3A001.A.2.C | PALLADIUM GOLD | 8542.32.00.61 | QUAD | NO LEAD | 1 | 1.27 mm | compliant | 32 | R-CQCC-N32 | Not Qualified | 5.5 V | MILITARY | 4.5 V | ASYNCHRONOUS | 0.025 mA | 32KX8 | 3-STATE | 3.048 mm | 8 | 0.0003 A | 262144 bit | 38535Q/M;38534H;883B | PARALLEL | COMMON | UVPROM | 12.5 V | 13.97 mm | 11.43 mm | |||||||||||||||
| Mfr Part No 27C256/BXA-20 | Philips Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | NO | 28 | 200 ns | PHILIPS SEMICONDUCTORS | 32768 words | 32000 | 125 °C | -55 °C | CERAMIC | DIP | DIP, DIP28,.6 | DIP28,.6 | RECTANGULAR | IN-LINE | Transferred | No | 5 V | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 8542.32.00.61 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-XDIP-T28 | Not Qualified | MILITARY | 0.03 mA | 32KX8 | 3-STATE | 8 | 0.0001 A | 262144 bit | 38535Q/M;38534H;883B | COMMON | 12.5 V | |||||||||||||||||||||||||
 | Mfr Part No 5962-9951401QYX | AMD Xilinx | Datasheet | 722 | - | Min: 1 Mult: 1 | YES | 44 | 45 ns | 15 MHz | XILINX INC | 1048576 words | 1000000 | 125 °C | -55 °C | CERAMIC, GLASS-SEALED | QCCJ | QCCJ, | SQUARE | CHIP CARRIER | Obsolete | LCC | 3.3 V | 3A001.A.2.C | 8542.32.00.51 | QUAD | J BEND | 1 | unknown | 44 | S-GQCC-J44 | Not Qualified | 3.6 V | MILITARY | 3 V | SYNCHRONOUS | 0.01 mA | 1MX1 | 1 | 0.00005 A | 1048576 bit | MIL-PRF-38535 Class Q | SERIAL | CONFIGURATION MEMORY | 3.3 V | |||||||||||||||||||||||
| Mfr Part No XQR1701LCCG44M | AMD Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 44 | 15 MHz | XILINX INC | 1048576 words | 1000000 | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | QCCJ | QCCJ, | SQUARE | CHIP CARRIER | Transferred | LCC | Yes | 3.3 V | e3 | Yes | 3A001.A.2.C | MATTE TIN | 8542.32.00.51 | QUAD | J BEND | 1 | 1.27 mm | compliant | 44 | S-CQCC-J44 | Not Qualified | 3.6 V | MILITARY | 3 V | SYNCHRONOUS | 1MX1 | 4.826 mm | 1 | 1048576 bit | SERIAL | CONFIGURATION MEMORY | 50k Rad(Si) V | 16.51 mm | 16.51 mm | |||||||||||||||||||
| Mfr Part No X2816AND-35 | Xicor Inc | Datasheet | - | - | Min: 1 Mult: 1 | NO | 24 | 350 ns | XICOR INC | 2048 words | 2000 | 125 °C | -55 °C | CERAMIC | DIP | DIP24,.6 | RECTANGULAR | IN-LINE | Obsolete | No | 5 V | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 8542.32.00.51 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-XDIP-T24 | Not Qualified | MILITARY | 0.11 mA | 2KX8 | 8 | 0.04 A | 16384 bit | PARALLEL | EEPROM | NO | NO | NO | |||||||||||||||||||||||||
| Mfr Part No P4C187-25CMB | Pyramid Semiconductor Corporation | Datasheet | - | - | Min: 1 Mult: 1 | NO | 22 | 25 ns | PYRAMID SEMICONDUCTOR CORP | 65536 words | 64000 | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | DIP | 0.300 INCH, SIDE BRAZED, CERAMIC, DIP-22 | RECTANGULAR | IN-LINE | Active | DIP | No | 5 V | e0 | No | 3A001.A.2.C | TIN LEAD | 8542.32.00.41 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | compliant | 22 | R-CDIP-T22 | Not Qualified | 5.5 V | MILITARY | 4.5 V | ASYNCHRONOUS | 0.155 mA | 64KX1 | 5.08 mm | 1 | 65536 bit | MIL-STD-883 Class B | PARALLEL | STANDARD SRAM | 29.337 mm | 7.62 mm | ||||||||||||||||||
 | Mfr Part No 5962-87515123A | Cypress Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 28 | 25 ns | CYPRESS SEMICONDUCTOR CORP | 8192 words | 8000 | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | WQCCN | WQCCN, | SQUARE | CHIP CARRIER, WINDOW | Obsolete | QLCC | 5 V | e0 | 3A001.A.2.C | TIN LEAD | POWER SWITCHED PROM | 8542.32.00.61 | QUAD | NO LEAD | 1 | 1.27 mm | unknown | 28 | S-CQCC-N28 | Not Qualified | 5.5 V | MILITARY | 4.5 V | ASYNCHRONOUS | 0.1 mA | 8KX8 | 3-STATE | 2.8956 mm | 8 | 65536 bit | PARALLEL | UVPROM | 11.43 mm | 11.43 mm | |||||||||||||||||||
| Mfr Part No 5962-87515123A | QP Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 28 | 25 ns | QP SEMICONDUCTOR INC | 8192 words | 8000 | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | WQCCN | WQCCN, | SQUARE | CHIP CARRIER, WINDOW | Transferred | 5 V | e0 | 3A001.A.2.C | TIN LEAD | POWER SWITCHED PROM | 8542.32.00.61 | QUAD | NO LEAD | 1 | 1.27 mm | unknown | S-CQCC-N28 | Not Qualified | 5.5 V | MILITARY | 4.5 V | ASYNCHRONOUS | 8KX8 | 2.8956 mm | 8 | 65536 bit | PARALLEL | UVPROM | 11.43 mm | 11.43 mm | |||||||||||||||||||||||
| Mfr Part No EDI88512CA20N36B | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 36 | 20 ns | MICROSEMI CORP | 524288 words | 512000 | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | SOJ | CERAMIC, SOJ-36 | RECTANGULAR | SMALL OUTLINE | Transferred | SOJ | No | 5 V | 3A001.A.2.C | TTL COMPATIBLE INPUTS/OUTPUTS | 8542.32.00.41 | DUAL | J BEND | NOT SPECIFIED | 1 | 1.27 mm | unknown | NOT SPECIFIED | 36 | R-CDSO-J36 | Not Qualified | 5.5 V | MILITARY | 4.5 V | ASYNCHRONOUS | 512KX8 | 3.937 mm | 8 | 4194304 bit | MIL-STD-883 | PARALLEL | STANDARD SRAM | 23.622 mm | 11.1506 mm | |||||||||||||||||||
| Mfr Part No SMJ27C256-20JM | Texas Instruments | Datasheet | - | - | Min: 1 Mult: 1 | NO | 28 | 200 ns | TEXAS INSTRUMENTS INC | 32768 words | 32000 | 125 °C | -55 °C | CERAMIC, GLASS-SEALED | WDIP | WDIP, DIP28,.6 | DIP28,.6 | RECTANGULAR | IN-LINE, WINDOW | Transferred | DIP | No | 5 V | 3A001.A.2.C | 8542.32.00.61 | DUAL | THROUGH-HOLE | NOT SPECIFIED | 1 | 2.54 mm | not_compliant | NOT SPECIFIED | 28 | R-GDIP-T28 | Not Qualified | 5.5 V | MILITARY | 4.5 V | ASYNCHRONOUS | 0.025 mA | 32KX8 | 3-STATE | 4.91 mm | 8 | 0.0003 A | 262144 bit | 38535Q/M;38534H;883B | PARALLEL | COMMON | UVPROM | 12.5 V | 36.83 mm | 15.24 mm |
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PDM41024L55L32B
Paradigm Technology Inc
Package:Memory
Price: please inquire
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IDT8M824S45CB
Integrated Device Technology Inc
Package:Memory
Price: please inquire
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AS5C512K8F-20
Micross Components
Package:Memory
Price: please inquire
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AM27512-25/BXA
AMD
Package:Memory
Price: please inquire
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AM2130-10/BXC
AMD
Package:Memory
Price: please inquire
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IDT8M624S45CB
Integrated Device Technology Inc
Package:Memory
Price: please inquire
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SMJ27C512-30JM
Texas Instruments
Package:Memory
Price: please inquire
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XC1701-PCG20M
AMD Xilinx
Package:Memory
Price: please inquire
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AM91L22-45/DMC
AMD
Package:Memory
Price: please inquire
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AS5C512K8ECJ-45L
Micross Components
Package:Memory
Price: please inquire
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AS27C256-17ECAM
Micross Components
Package:Memory
Price: please inquire
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27C256/BXA-20
Philips Semiconductors
Package:Memory
Price: please inquire
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5962-9951401QYX
AMD Xilinx
Package:Memory
Price: please inquire
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XQR1701LCCG44M
AMD Xilinx
Package:Memory
Price: please inquire
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X2816AND-35
Xicor Inc
Package:Memory
Price: please inquire
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P4C187-25CMB
Pyramid Semiconductor Corporation
Package:Memory
Price: please inquire
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5962-87515123A
Cypress Semiconductor
Package:Memory
Price: please inquire
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5962-87515123A
QP Semiconductor
Package:Memory
Price: please inquire
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EDI88512CA20N36B
Microsemi Corporation
Package:Memory
Price: please inquire
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SMJ27C256-20JM
Texas Instruments
Package:Memory
Price: please inquire