The category is 'Memory'
Memory (403)
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- ECCN Code
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- Memory Width
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- ECCN Code:
3A001.A.2.C
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Surface Mount | Number of Terminals | Access Time-Max | Ihs Manufacturer | Moisture Sensitivity Levels | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Nom (Vsup) | JESD-609 Code | Pbfree Code | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Temperature Grade | Supply Voltage-Min (Vsup) | Number of Ports | Operating Mode | Supply Current-Max | Organization | Output Characteristics | Seated Height-Max | Memory Width | Standby Current-Max | Memory Density | Screening Level | Parallel/Serial | I/O Type | Memory IC Type | Programming Voltage | Endurance | Write Cycle Time-Max (tWC) | Standby Voltage-Min | Data Polling | Toggle Bit | Command User Interface | Output Enable | Page Size | Ready/Busy | Length | Width |
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 | Mfr Part No XQR1704LCC44M | AMD Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 44 | XILINX INC | 4194304 words | 4000000 | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | QCCJ | CC-44 | SQUARE | CHIP CARRIER | Obsolete | LCC | No | 3.3 V | e0 | No | 3A001.A.2.C | TIN LEAD | 8542.32.00.51 | QUAD | J BEND | 1 | 1.27 mm | compliant | 44 | S-CQCC-J44 | Not Qualified | 3.6 V | MILITARY | 3 V | SYNCHRONOUS | 4MX1 | 4.826 mm | 1 | 4194304 bit | MIL-PRF-38535 | SERIAL | CONFIGURATION MEMORY | 16.51 mm | 16.51 mm | ||||||||||||||||||||||
 | Mfr Part No XC17256D-DDG8M | AMD Xilinx | Datasheet | 293 | - | Min: 1 Mult: 1 | NO | 8 | XILINX INC | 262144 words | 256000 | 125 °C | -55 °C | CERAMIC, GLASS-SEALED | DIP | DIP, | RECTANGULAR | IN-LINE | Obsolete | DIP | Yes | 5 V | e3 | Yes | 3A001.A.2.C | MATTE TIN | USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS | 8542.32.00.51 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | compliant | 8 | R-GDIP-T8 | Not Qualified | 5.5 V | MILITARY | 4.5 V | SYNCHRONOUS | 256KX1 | 3-STATE | 4.318 mm | 1 | 262144 bit | SERIAL | CONFIGURATION MEMORY | 9.906 mm | 7.62 mm | |||||||||||||||||||||
| Mfr Part No XQ1704LCCG44B | AMD Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 44 | XILINX INC | 4194304 words | 4000000 | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | QCCJ | QCCJ, | SQUARE | CHIP CARRIER | Obsolete | LCC | Yes | 3.3 V | e3 | Yes | 3A001.A.2.C | MATTE TIN | 8542.32.00.51 | QUAD | J BEND | 1 | 1.27 mm | compliant | 44 | S-CQCC-J44 | Not Qualified | 3.6 V | MILITARY | 3 V | SYNCHRONOUS | 4MX1 | 4.826 mm | 1 | 4194304 bit | MIL-PRF-38535 | CONFIGURATION MEMORY | 16.51 mm | 16.51 mm | |||||||||||||||||||||||
 | Mfr Part No IDT7025L25PFB | Integrated Device Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 100 | 25 ns | INTEGRATED DEVICE TECHNOLOGY INC | 3 | 8192 words | 8000 | 125 °C | -55 °C | PLASTIC/EPOXY | LFQFP | LFQFP, | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Obsolete | QFP | No | 5 V | e0 | No | 3A001.A.2.C | Tin/Lead (Sn85Pb15) | CONFIGURABLE AS 8K X 16 | 8542.32.00.41 | QUAD | GULL WING | 240 | 1 | 0.5 mm | not_compliant | 20 | 100 | S-PQFP-G100 | Not Qualified | 5.5 V | MILITARY | 4.5 V | ASYNCHRONOUS | 8KX16 | 1.6 mm | 16 | 131072 bit | MIL-PRF-38535 | PARALLEL | DUAL-PORT SRAM | 14 mm | 14 mm | |||||||||||||||||
| Mfr Part No SN5489J | AMD | Datasheet | - | - | Min: 1 Mult: 1 | NO | 16 | ADVANCED MICRO DEVICES INC | 16 words | 16 | 125 °C | -55 °C | CERAMIC | DIP | DIP, DIP16,.3 | DIP16,.3 | RECTANGULAR | IN-LINE | Obsolete | No | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 8542.32.00.41 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-XDIP-T16 | Not Qualified | MILITARY | ASYNCHRONOUS | 16X4 | OPEN-COLLECTOR | 4 | PARALLEL | STANDARD SRAM | ||||||||||||||||||||||||||||||||
| Mfr Part No IDT6116SA120L32B | Integrated Device Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | 120 ns | INTEGRATED DEVICE TECHNOLOGY INC | 2048 words | 2000 | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | QCCN | LCC-32 | LCC32,.45X.55 | RECTANGULAR | CHIP CARRIER | Obsolete | QFJ | No | 5 V | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 8542.32.00.41 | QUAD | NO LEAD | 1 | 1.27 mm | not_compliant | 32 | R-CQCC-N32 | Not Qualified | 5.5 V | MILITARY | 4.5 V | 1 | ASYNCHRONOUS | 0.1 mA | 2KX8 | 3-STATE | 3.048 mm | 8 | 0.01 A | 16384 bit | 38535Q/M;38534H;883B | PARALLEL | COMMON | STANDARD SRAM | 4.5 V | YES | 13.97 mm | 11.43 mm | ||||||||||||||
| Mfr Part No CY7C254-65WMB | Cypress Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | NO | 28 | 65 ns | CYPRESS SEMICONDUCTOR CORP | 16384 words | 16000 | 125 °C | -55 °C | CERAMIC, GLASS-SEALED | DIP | 0.600 INCH, CERDIP-28 | DIP28,.6 | RECTANGULAR | IN-LINE | Obsolete | DIP | No | 5 V | e0 | 3A001.A.2.C | TIN LEAD | 8542.32.00.61 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | not_compliant | 28 | R-GDIP-T28 | Not Qualified | 5.5 V | MILITARY | 4.5 V | ASYNCHRONOUS | 0.12 mA | 16KX8 | 3-STATE | 5.715 mm | 8 | 0.12 A | 131072 bit | MIL-STD-883 | PARALLEL | UVPROM | 37.338 mm | 15.24 mm | ||||||||||||||||||
| Mfr Part No EDI88512CA20CB | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | NO | 32 | 20 ns | MICROSEMI CORP | 524288 words | 512000 | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | DIP | 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 | RECTANGULAR | IN-LINE | Transferred | DIP | No | 5 V | No | 3A001.A.2.C | TTL COMPATIBLE INPUTS/OUTPUTS | 8542.32.00.41 | DUAL | THROUGH-HOLE | NOT SPECIFIED | 1 | 2.54 mm | unknown | NOT SPECIFIED | 32 | R-CDIP-T32 | Not Qualified | 5.5 V | MILITARY | 4.5 V | ASYNCHRONOUS | 512KX8 | 3.937 mm | 8 | 4194304 bit | MIL-STD-883 | PARALLEL | STANDARD SRAM | 40.64 mm | 15.24 mm | ||||||||||||||||||||
| Mfr Part No EDI88512CA20CB | White Microelectronics | Datasheet | - | - | Min: 1 Mult: 1 | NO | 32 | 20 ns | WHITE MICROELECTRONICS | 524288 words | 512000 | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | DIP | 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 | RECTANGULAR | IN-LINE | Transferred | 5 V | 3A001.A.2.C | 8542.32.00.41 | DUAL | THROUGH-HOLE | 1 | unknown | R-CDIP-T32 | Not Qualified | 5.5 V | MILITARY | 4.5 V | ASYNCHRONOUS | 512KX8 | 8 | 4194304 bit | PARALLEL | STANDARD SRAM | ||||||||||||||||||||||||||||||||
| Mfr Part No AT28C64-35DM | Atmel Corporation | Datasheet | - | - | Min: 1 Mult: 1 | NO | 28 | 350 ns | ATMEL CORP | 8192 words | 8000 | 125 °C | -55 °C | CERAMIC | DIP | DIP, DIP28,.6 | DIP28,.6 | RECTANGULAR | IN-LINE | Obsolete | No | 5 V | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 8542.32.00.51 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-XDIP-T28 | Not Qualified | MILITARY | 0.045 mA | 8KX8 | 8 | 0.003 A | 65536 bit | PARALLEL | EEPROM | 1 ms | YES | NO | NO | YES | ||||||||||||||||||||||||
 | Mfr Part No X28HC64DMB-70 | Intersil Corporation | Datasheet | - | - | Min: 1 Mult: 1 | NO | 28 | 70 ns | INTERSIL CORP | 8192 words | 8000 | 125 °C | -55 °C | CERAMIC, GLASS-SEALED | DIP | CERDIP-28 | DIP28,.6 | RECTANGULAR | IN-LINE | Obsolete | DIP | No | 5 V | e0 | 3A001.A.2.C | TIN LEAD | 8542.32.00.51 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | not_compliant | 28 | R-GDIP-T28 | Not Qualified | 5.5 V | MILITARY | 4.5 V | ASYNCHRONOUS | 0.04 mA | 8KX8 | 5.92 mm | 8 | 0.0002 A | 65536 bit | MIL-STD-883 | PARALLEL | EEPROM | 5 V | 1000000 Write/Erase Cycles | 5 ms | YES | YES | NO | 64 words | 15.24 mm | |||||||||||||
| Mfr Part No AT27C256R-90DM | Atmel Corporation | Datasheet | - | - | Min: 1 Mult: 1 | NO | 28 | 90 ns | ATMEL CORP | 32768 words | 32000 | 125 °C | -55 °C | CERAMIC, GLASS-SEALED | WDIP | WDIP, DIP28,.6 | DIP28,.6 | RECTANGULAR | IN-LINE, WINDOW | Obsolete | DIP | No | 5 V | e0 | No | 3A001.A.2.C | TIN LEAD | 8542.32.00.61 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | 28 | R-GDIP-T28 | Not Qualified | 5.5 V | MILITARY | 4.5 V | ASYNCHRONOUS | 0.025 mA | 32KX8 | 3-STATE | 5.72 mm | 8 | 0.0001 A | 262144 bit | PARALLEL | COMMON | UVPROM | 13 V | 37.25 mm | 15.24 mm | ||||||||||||||||
| Mfr Part No CY27C256-150WMB | Rochester Electronics LLC | Datasheet | - | - | Min: 1 Mult: 1 | NO | 28 | 150 ns | ROCHESTER ELECTRONICS LLC | 32768 words | 32000 | 125 °C | -55 °C | CERAMIC, GLASS-SEALED | DIP | DIP, | RECTANGULAR | IN-LINE | Contact Manufacturer | 5 V | e0 | 3A001.A.2.C | TIN LEAD | 8542.32.00.61 | DUAL | THROUGH-HOLE | 1 | unknown | R-GDIP-T28 | 5.5 V | MILITARY | 4.5 V | ASYNCHRONOUS | 0.055 mA | 32KX8 | 8 | 262144 bit | PARALLEL | UVPROM | ||||||||||||||||||||||||||||||
| Mfr Part No MT5C1005C-45/883C | Micross Components | Datasheet | - | - | Min: 1 Mult: 1 | NO | 28 | 45 ns | AUSTIN SEMICONDUCTOR INC | 262144 words | 256000 | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | DIP | DIP, DIP28,.4 | DIP28,.4 | RECTANGULAR | IN-LINE | Obsolete | DIP | No | 5 V | e0 | No | 3A001.A.2.C | TIN LEAD | 8542.32.00.41 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | 28 | R-CDIP-T28 | Not Qualified | 5.5 V | MILITARY | 4.5 V | 1 | ASYNCHRONOUS | 0.18 mA | 256KX4 | 3-STATE | 4.318 mm | 4 | 0.016 A | 1048576 bit | MIL-STD-883 Class C | PARALLEL | COMMON | STANDARD SRAM | 4.5 V | YES | 35.56 mm | 10.16 mm | |||||||||||||
| Mfr Part No MT5C1005C-45/883C | Micron Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | NO | 28 | 45 ns | MICRON TECHNOLOGY INC | 262144 words | 256000 | 125 °C | -55 °C | CERAMIC | DIP | DIP28,.4 | RECTANGULAR | IN-LINE | Obsolete | No | 5 V | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 8542.32.00.41 | DUAL | THROUGH-HOLE | 2.54 mm | not_compliant | R-XDIP-T28 | Not Qualified | MILITARY | ASYNCHRONOUS | 0.115 mA | 256KX4 | 3-STATE | 4 | 0.01 A | 1048576 bit | 38535Q/M;38534H;883B | PARALLEL | COMMON | STANDARD SRAM | 4.5 V | |||||||||||||||||||||||||
| Mfr Part No AT27C256R-15DM/883 | Atmel Corporation | Datasheet | - | - | Min: 1 Mult: 1 | NO | 28 | 150 ns | ATMEL CORP | 32768 words | 32000 | 125 °C | -55 °C | CERAMIC, GLASS-SEALED | WDIP | WDIP, DIP28,.6 | DIP28,.6 | RECTANGULAR | IN-LINE, WINDOW | Obsolete | DIP | No | 5 V | e0 | No | 3A001.A.2.C | TIN LEAD | 8542.32.00.61 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | 28 | R-GDIP-T28 | Not Qualified | 5.5 V | MILITARY | 4.5 V | ASYNCHRONOUS | 0.025 mA | 32KX8 | 3-STATE | 5.72 mm | 8 | 0.0001 A | 262144 bit | 38535Q/M;38534H;883B | PARALLEL | COMMON | UVPROM | 13 V | 37.25 mm | 15.24 mm | |||||||||||||||
 | Mfr Part No MT5C1008C-45/883C | Micross Components | Datasheet | - | - | Min: 1 Mult: 1 | NO | 32 | 45 ns | MICROSS COMPONENTS | 131072 words | 128000 | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | DIP | DIP, DIP32,.4 | DIP32,.4 | RECTANGULAR | IN-LINE | End Of Life | DIP | No | 5 V | e0 | No | 3A001.A.2.C | TIN LEAD | LG-MAX | 8542.32.00.41 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | compliant | 32 | R-CDIP-T32 | Not Qualified | 5.5 V | MILITARY | 4.5 V | ASYNCHRONOUS | 0.115 mA | 128KX8 | 3-STATE | 5.8928 mm | 8 | 0.01 A | 1048576 bit | MIL-STD-883 Class C | PARALLEL | COMMON | STANDARD SRAM | 4.5 V | 43.18 mm | 10.16 mm | ||||||||||||||
| Mfr Part No MM54C910J | National Semiconductor Corporation | Datasheet | - | - | Min: 1 Mult: 1 | NO | 18 | 860 ns | NATIONAL SEMICONDUCTOR CORP | 64 words | 64 | 125 °C | -55 °C | CERAMIC, GLASS-SEALED | DIP | DIP, DIP18,.3 | DIP18,.3 | RECTANGULAR | IN-LINE | Obsolete | No | 5 V | e0 | 3A001.A.2.C | TIN LEAD | INPUT ADDRESS REGISTER | 8542.32.00.41 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | R-GDIP-T18 | Not Qualified | 5.5 V | MILITARY | 4.5 V | 1 | ASYNCHRONOUS | 64X4 | 3-STATE | 5.08 mm | 4 | 256 bit | PARALLEL | SEPARATE | STANDARD SRAM | NO | 7.62 mm | ||||||||||||||||||||
| Mfr Part No 28C010TRTFI-15 | Maxwell Technologies | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | 150 ns | MAXWELL TECHNOLOGIES INC | 131072 words | 128000 | 125 °C | -55 °C | UNSPECIFIED | DFP | DFP, | RECTANGULAR | FLATPACK | Transferred | DFP | 5 V | 3A001.A.2.C | 8542.32.00.51 | DUAL | FLAT | 1 | 1.27 mm | unknown | 32 | R-XDFP-F32 | Not Qualified | 5.5 V | MILITARY | 4.5 V | ASYNCHRONOUS | 128KX8 | 3.175 mm | 8 | 1048576 bit | PARALLEL | EEPROM | 5 V | 10 ms | 20.828 mm | 12.192 mm | ||||||||||||||||||||||||
| Mfr Part No IDT7M4048S55CB | Integrated Device Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | NO | 32 | 55 ns | INTEGRATED DEVICE TECHNOLOGY INC | 524288 words | 512000 | 125 °C | -55 °C | UNSPECIFIED | DIP | DIP32,.6 | RECTANGULAR | MICROELECTRONIC ASSEMBLY | Obsolete | No | 5 V | e0 | 3A001.A.2.C | TIN LEAD | 8542.32.00.41 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | not_compliant | R-XDMA-T32 | Not Qualified | 5.5 V | MILITARY | 4.5 V | 1 | ASYNCHRONOUS | 0.24 mA | 512KX8 | 3-STATE | 8 | 0.06 A | 4194304 bit | MIL-STD-883 Class B (Modified) | PARALLEL | COMMON | SRAM MODULE | 4.5 V | YES |
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XQR1704LCC44M
AMD Xilinx
Package:Memory
Price: please inquire
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XC17256D-DDG8M
AMD Xilinx
Package:Memory
Price: please inquire
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XQ1704LCCG44B
AMD Xilinx
Package:Memory
Price: please inquire
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IDT7025L25PFB
Integrated Device Technology Inc
Package:Memory
Price: please inquire
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SN5489J
AMD
Package:Memory
Price: please inquire
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IDT6116SA120L32B
Integrated Device Technology Inc
Package:Memory
Price: please inquire
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CY7C254-65WMB
Cypress Semiconductor
Package:Memory
Price: please inquire
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EDI88512CA20CB
Microsemi Corporation
Package:Memory
Price: please inquire
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EDI88512CA20CB
White Microelectronics
Package:Memory
Price: please inquire
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AT28C64-35DM
Atmel Corporation
Package:Memory
Price: please inquire
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X28HC64DMB-70
Intersil Corporation
Package:Memory
Price: please inquire
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AT27C256R-90DM
Atmel Corporation
Package:Memory
Price: please inquire
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CY27C256-150WMB
Rochester Electronics LLC
Package:Memory
Price: please inquire
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MT5C1005C-45/883C
Micross Components
Package:Memory
Price: please inquire
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MT5C1005C-45/883C
Micron Technology Inc
Package:Memory
Price: please inquire
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AT27C256R-15DM/883
Atmel Corporation
Package:Memory
Price: please inquire
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MT5C1008C-45/883C
Micross Components
Package:Memory
Price: please inquire
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MM54C910J
National Semiconductor Corporation
Package:Memory
Price: please inquire
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28C010TRTFI-15
Maxwell Technologies
Package:Memory
Price: please inquire
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IDT7M4048S55CB
Integrated Device Technology Inc
Package:Memory
Price: please inquire