The category is 'Memory'
Memory (92)
- All Manufacturers
- ECCN Code
- Number of Functions
- Terminal Pitch
- Terminal Position
- Length
- Memory Width
- Supply Voltage-Max (Vsup)
- Supply Voltage-Min (Vsup)
- Organization
- Memory Types
- Package / Case
- Moisture Sensitivity Level (MSL)
- ECCN Code:
3A991
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Number of Terminals | Access Time-Max | Base Product Number | Clock Frequency-Max (fCLK) | Data Rate Architecture | Ihs Manufacturer | Manufacturer | Manufacturer Package Code | Manufacturer Part Number | Maximum Clock Rate | Maximum Operating Supply Voltage | Memory Types | Mfr | Minimum Operating Supply Voltage | Moisture Sensitivity Levels | Mounting | Number of I/O Lines | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | Rohs Code | Supplier Package | Supply Voltage-Nom (Vsup) | Timing Type | Typical Operating Supply Voltage | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Subcategory | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Supply Voltage | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Qualification Status | Brand Name | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Interface | Max Supply Voltage | Min Supply Voltage | Memory Size | Number of Ports | Nominal Supply Current | Operating Mode | Clock Frequency | Supply Current-Max | Access Time | Memory Format | Memory Interface | Organization | Output Characteristics | Seated Height-Max | Memory Width | Write Cycle Time - Word, Page | Address Bus Width | Density | Standby Current-Max | Memory Density | Access Time (Max) | Parallel/Serial | I/O Type | Sync/Async | Word Size | Memory IC Type | Standby Voltage-Min | Refresh Cycles | Sequential Burst Length | Interleaved Burst Length | Memory Organization | Height Seated (Max) | Length | Width | Thickness | Radiation Hardening | RoHS Status | Lead Free |
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 | Mfr Part No 71V3577YS85PFG | Integrated Device Technology (IDT) | Datasheet | 909 |
| Min: 1 Mult: 1 | LQFP | YES | RAM, SRAM | 2006 | e3 | 3 (168 Hours) | 100 | 3A991 | Matte Tin (Sn) - annealed | 70°C | 0°C | FLOW THROUGH ARCHITECTURE | 8542.32.00.41 | QUAD | GULL WING | 260 | 1 | 3.3V | 0.65mm | NOT SPECIFIED | 100 | R-PQFP-G100 | Not Qualified | 3.465V | 3.3V | COMMERCIAL | 3.135V | Parallel | SYNCHRONOUS | 87MHz | 0.18mA | 128KX36 | 3-STATE | 36 | 0.03A | 4718592 bit | 8.5 ns | COMMON | 3.14V | 1.6mm | 20mm | 14mm | RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No UPD44325362BF5-E40-FQ1-A | Renesas | Datasheet | 21 |
| Min: 1 Mult: 1 | 1 Week | Surface Mount | 165-FBGA | YES | 165-FBGA (15x17) | 165 | 0.45 ns | UPD44325362 | 250 MHz | QDR | RENESAS ELECTRONICS CORP | Renesas Electronics Corporation | UPD44325362BF5-E40-FQ1-A | 250 MHz | 1.9 V | Volatile | Renesas Electronics America Inc | 1.7 V | Surface Mount | 36 Bit | 1 MWords | 1000000 | 70 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, BGA165,11X15,40 | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | Obsolete | BGA | Obsolete | 5.73 | Yes | BGA | 1.8 V | Synchronous | 1.8000 V | 0 to 70 °C | - | 3A991 | 8542.32.00.41 | SRAMs | SRAM - Synchronous, QDR II | 1.7V ~ 1.9V | BOTTOM | BALL | 1 | 1 mm | unknown | 165 | R-PBGA-B165 | Not Qualified | 1.9 V | 1.5/1.8,1.8 V | COMMERCIAL | 1.7 V | 36Mbit | 2 | SYNCHRONOUS | 250 MHz | 0.69 mA | SRAM | Parallel | 1MX36 | 3-STATE | 1.46 mm | 36 | 4ns | 19 Bit | 36 Mbit | 0.33 A | 37748736 bit | PARALLEL | SEPARATE | QDR SRAM | 1.7 V | 1M x 36 | 17 mm | 15 mm | |||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No 7007L55PF | Integrated Device Technology (IDT) | Datasheet | - | - | Min: 1 Mult: 1 | 7 Weeks | Surface Mount | TQFP | 80 | RAM, SDR, SRAM | 2010 | e3 | yes | Active | 3 (168 Hours) | 80 | 3A991 | Matte Tin (Sn) - annealed | 70°C | 0°C | QUAD | GULL WING | 260 | 1 | 5V | 0.65mm | 30 | 80 | 5V | 5V | INDUSTRIAL | Parallel | 5.5V | 4.5V | 32kB | 2 | 230mA | 55 ns | 3-STATE | 30b | 256 kb | 0.01A | COMMON | Asynchronous | 8b | 1.6mm | 14mm | 14mm | 1.4mm | No | RoHS Compliant | Contains Lead | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No 70P3519S200BCG | Integrated Device Technology (IDT) | Datasheet | - | - | Min: 1 Mult: 1 | YES | 256 | RAM, SRAM | 2009 | e1 | yes | Discontinued | 3 (168 Hours) | 256 | 3A991 | TIN SILVER COPPER | 70°C | 0°C | FLOW-THROUGH OR PIPELINED ARCHITECTURE | BOTTOM | BALL | 260 | 1 | 1.8V | 1mm | 200MHz | 30 | 256 | 1.8V | 1.9V | COMMERCIAL | 1.7V | Parallel | 2 | 18b | 9 Mb | 10 ns | 1.5mm | 17mm | 17mm | 1.4mm | No | RoHS Compliant | Lead Free | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 709369L9PFI | Integrated Device Technology | Datasheet | - | - | Min: 1 Mult: 1 | YES | 100 | 9 ns | 66 MHz | INTEGRATED DEVICE TECHNOLOGY INC | Integrated Device Technology Inc | PN100 | 709369L9PFI | 3 | 16384 words | 16000 | 85 °C | -40 °C | PLASTIC/EPOXY | LFQFP | 14 X 14 MM, 1.4 MM HEIGHT, TQFP-100 | QFP100,.63SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Obsolete | TQFP | 20 | 5.88 | No | 5 V | e0 | No | 3A991 | Tin/Lead (Sn85Pb15) | FLOW-THROUGH OR PIPELINED ARCHITECTURE | 8542.32.00.41 | SRAMs | CMOS | QUAD | GULL WING | 240 | 1 | 0.5 mm | not_compliant | 100 | S-PQFP-G100 | Not Qualified | Integrated Device Technology | 5.5 V | 5 V | INDUSTRIAL | 4.5 V | 2 | SYNCHRONOUS | 0.43 mA | 16KX18 | 3-STATE | 1.4 mm | 18 | 0.006 A | 294912 bit | PARALLEL | COMMON | DUAL-PORT SRAM | 4.5 V | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 709089S9PF | Integrated Device Technology | Datasheet | - | - | Min: 1 Mult: 1 | YES | 100 | 9 ns | 66 MHz | INTEGRATED DEVICE TECHNOLOGY INC | Integrated Device Technology Inc | PN100 | 709089S9PF | 3 | 65536 words | 64000 | 70 °C | PLASTIC/EPOXY | QFF | 14 X 14 MM, 1.4 MM HEIGHT, TQFP-100 | QFP100,.63SQ,20 | SQUARE | FLATPACK | Obsolete | TQFP | 20 | 5.28 | No | 5 V | e0 | No | 3A991 | Tin/Lead (Sn85Pb15) | FLOW-THROUGH OR PIPELINED ARCHITECTURE | 8542.32.00.41 | SRAMs | CMOS | QUAD | FLAT | 240 | 1 | 0.5 mm | not_compliant | 100 | S-PQFP-F100 | Not Qualified | Integrated Device Technology | 5.5 V | 5 V | COMMERCIAL | 4.5 V | 2 | SYNCHRONOUS | 0.39 mA | 64KX8 | 3-STATE | 1.6 mm | 8 | 0.015 A | 524288 bit | PARALLEL | COMMON | DUAL-PORT SRAM | 4.5 V | 14 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MT47H64M16HR-3 IT:H | Micron Technology Inc. | Datasheet | 4 | - | Min: 1 Mult: 1 | Surface Mount | 84-TFBGA | YES | Volatile | -40°C~95°C TC | Tray | 2011 | e1 | yes | Obsolete | 3 (168 Hours) | 84 | 3A991 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | AUTO/SELF REFRESH | 8542.32.00.32 | 1.7V~1.9V | BOTTOM | 260 | 1 | 1.8V | 0.8mm | 30 | MT47H64M16 | R-PBGA-B84 | Not Qualified | 1.9V | 1.8V | 1.7V | 1Gb 64M x 16 | 1 | SYNCHRONOUS | 333MHz | 450ps | DRAM | Parallel | 64MX16 | 3-STATE | 16 | 15ns | 0.007A | 1073741824 bit | COMMON | 8192 | 48 | 48 | 1.2mm | 12.5mm | 8mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 71V3558S200PFG8 | Integrated Device Technology | Datasheet | - | - | Min: 1 Mult: 1 | YES | 100 | 3.2 ns | 200 MHz | INTEGRATED DEVICE TECHNOLOGY INC | Integrated Device Technology Inc | PKG100 | 71V3558S200PFG8 | 3 | 262144 words | 256000 | 70 °C | PLASTIC/EPOXY | LQFP | 14 X 20 MM, 1.40 MM HEIGHT, ROHS COMPLIANT, PLASTIC, TQFP-100 | QFP100,.63X.87 | RECTANGULAR | FLATPACK, LOW PROFILE | Obsolete | TQFP | 30 | 5.24 | Yes | 3.3 V | e3 | Yes | 3A991 | Matte Tin (Sn) - annealed | 8542.32.00.41 | SRAMs | CMOS | QUAD | GULL WING | 260 | 1 | 0.65 mm | unknown | 100 | R-PQFP-G100 | Not Qualified | Integrated Device Technology | 3.465 V | 3.3 V | COMMERCIAL | 3.135 V | SYNCHRONOUS | 0.4 mA | 256KX18 | 3-STATE | 1.6 mm | 18 | 0.04 A | 4718592 bit | PARALLEL | COMMON | ZBT SRAM | 3.14 V | 20 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No 70P3519S166BCGI | Integrated Device Technology (IDT) | Datasheet | - | - | Min: 1 Mult: 1 | YES | 256 | RAM, SRAM | 2009 | e1 | yes | Discontinued | 3 (168 Hours) | 256 | 3A991 | TIN SILVER COPPER | 85°C | -40°C | FLOW-THROUGH OR PIPELINED ARCHITECTURE | BOTTOM | BALL | 260 | 1 | 1.8V | 1mm | 166MHz | 30 | 256 | 1.8V | 1.9V | INDUSTRIAL | 1.7V | Parallel | 2 | 18b | 9 Mb | 1.5mm | 17mm | 17mm | 1.4mm | No | RoHS Compliant | Lead Free | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No 70P3519S166BCG | Integrated Device Technology (IDT) | Datasheet | - | - | Min: 1 Mult: 1 | YES | 256 | RAM, SRAM | 2009 | e1 | yes | Discontinued | 3 (168 Hours) | 256 | 3A991 | TIN SILVER COPPER | 70°C | 0°C | FLOW-THROUGH OR PIPELINED ARCHITECTURE | BOTTOM | BALL | 260 | 1 | 1.8V | 1mm | 166MHz | 30 | 256 | 1.8V | 1.9V | COMMERCIAL | 1.7V | Parallel | 2 | 18b | 9 Mb | 1.5mm | 17mm | 17mm | 1.4mm | No | RoHS Compliant | Lead Free | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 70T633S10BFG8 | Integrated Device Technology (IDT) | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 208 | RAM, SRAM | Tape & Reel | 2012 | e1 | yes | 3 (168 Hours) | 208 | 3A991 | Tin/Silver/Copper (Sn/Ag/Cu) | 70°C | 0°C | BOTTOM | BALL | 260 | 1 | 2.5V | 0.8mm | 30 | 208 | 2.5V | COMMERCIAL | Parallel | 2.6V | 2.4V | 2 | 405mA | 10 ns | 3-STATE | 38b | 9 Mb | 0.01A | COMMON | Asynchronous | 18b | 15mm | 15mm | 1.4mm | No | RoHS Compliant | Lead Free | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 70T633S10BFG | Integrated Device Technology (IDT) | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 208 | RAM, SRAM | Bulk | 2012 | e1 | yes | 3 (168 Hours) | 208 | 3A991 | Tin/Silver/Copper (Sn/Ag/Cu) | 70°C | 0°C | BOTTOM | BALL | 260 | 1 | 2.5V | 0.8mm | 30 | 208 | 2.5V | COMMERCIAL | Parallel | 2.6V | 2.4V | 2 | 405mA | 10 ns | 3-STATE | 38b | 9 Mb | 0.01A | COMMON | Asynchronous | 18b | 1.7mm | 15mm | 15mm | 1.4mm | No | RoHS Compliant | Lead Free |
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71V3577YS85PFG
Integrated Device Technology (IDT)
Package:Memory
3.114063
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UPD44325362BF5-E40-FQ1-A
Renesas
Package:Memory
62.190412
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7007L55PF
Integrated Device Technology (IDT)
Package:Memory
Price: please inquire
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70P3519S200BCG
Integrated Device Technology (IDT)
Package:Memory
Price: please inquire
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709369L9PFI
Integrated Device Technology
Package:Memory
Price: please inquire
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709089S9PF
Integrated Device Technology
Package:Memory
Price: please inquire
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MT47H64M16HR-3 IT:H
Micron Technology Inc.
Package:Memory
Price: please inquire
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71V3558S200PFG8
Integrated Device Technology
Package:Memory
Price: please inquire
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70P3519S166BCGI
Integrated Device Technology (IDT)
Package:Memory
Price: please inquire
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70P3519S166BCG
Integrated Device Technology (IDT)
Package:Memory
Price: please inquire
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70T633S10BFG8
Integrated Device Technology (IDT)
Package:Memory
Price: please inquire
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70T633S10BFG
Integrated Device Technology (IDT)
Package:Memory
Price: please inquire