The category is 'Memory'
Memory (12)
- All Manufacturers
- ECCN Code
- Factory Lead Time
- Length
- Terminal Pitch
- Terminal Position
- Width
- Peak Reflow Temperature (Cel)
- JESD-609 Code
- Pin Count
- Power Supplies
- Memory Format
- Memory Interface
- ECCN Code:
3A991.A.2
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Lifecycle Status | Contact Plating | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Number of Terminals | Clock Frequency-Max | Ihs Manufacturer | Manufacturer | Manufacturer Part Number | Memory Types | Model | Moisture Sensitivity Levels | Number of contacts as change-over contact | Number of contacts as normally closed contact | Number of contacts as normally open contact | Number of I/O Lines | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | RAM(byte) | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | ROM(word) | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Type of electric connection | Voltage type for actuating | With light source | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | HTS Code | Subcategory | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Supply Voltage | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Interface | Memory Size | Nominal Supply Current | Speed | Operating Mode | uPs/uCs/Peripheral ICs Type | Clock Frequency | Supply Current-Max | Bit Size | Access Time | Has ADC | DMA Channels | Memory Format | Memory Interface | PWM Channels | Organization | DAC Channels | Seated Height-Max | Memory Width | Write Cycle Time - Word, Page | Density | Standby Current-Max | Memory Density | On Chip Program ROM Width | CPU Family | Access Time (Max) | External Data Bus Width | Format | RAM (words) | Serial Bus Type | Endurance | Write Cycle Time-Max (tWC) | Data Retention Time-Min | Write Protection | ROM Programmability | I2C Control Byte | Height | Height Seated (Max) | Length | Width | Radiation Hardening | RoHS Status | Lead Free |
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 | Mfr Part No 24FC64-I/P | Microchip Technology | Datasheet | 16000 | - | Min: 1 Mult: 1 | 5 Weeks | Tin | Through Hole | Through Hole | 8-DIP (0.300, 7.62mm) | 8 | Non-Volatile | -40°C~85°C TA | Tube | e3 | yes | Active | 1 (Unlimited) | 8 | 3A991.A.2 | 1.7V~5.5V | DUAL | 1 | 2.5V | 2.54mm | 24FC64 | 8 | 5.5V | 2/5V | 1.7V | I2C, Serial | 64Kb 8K x 8 | 3mA | 1MHz | 400ns | EEPROM | I2C | 5ms | 64 kb | 0.000001A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010DDDR | 195μm | 400μm | 280μm | No | ROHS3 Compliant | Lead Free | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No 24FC64-I/SN | Microchip Technology | Datasheet | 371 | - | Min: 1 Mult: 1 | 6 Weeks | Tin | Surface Mount | Surface Mount | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2010 | e3 | yes | Active | 3 (168 Hours) | 8 | 3A991.A.2 | 1.7V~5.5V | DUAL | 260 | 1 | 2.5V | 1.27mm | 40 | 24FC64 | 8 | 5.5V | 2/5V | 1.7V | I2C, Serial | 64Kb 8K x 8 | 3mA | 1MHz | 400ns | EEPROM | I2C | 5ms | 64 kb | 0.000001A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010DDDR | 1.5mm | 4.9mm | 3.9mm | No | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No 24FC64-I/MS | Microchip Technology | Datasheet | 4000 | - | Min: 1 Mult: 1 | 6 Weeks | Tin | Surface Mount | Surface Mount | 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2010 | e3 | yes | Active | 3 (168 Hours) | 8 | 3A991.A.2 | 1.7V~5.5V | DUAL | 260 | 1 | 2.5V | 0.65mm | 40 | 24FC64 | 8 | 5.5V | 2/5V | 1.7V | I2C, Serial | 64Kb 8K x 8 | 3mA | 1MHz | 400ns | EEPROM | I2C | 8 | 5ms | 64 kb | 0.000001A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010DDDR | 1.1mm | 3mm | 3mm | No | ROHS3 Compliant | Lead Free | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No 24FC64T-I/MC | Microchip Technology | Datasheet | 24048 | - | Min: 1 Mult: 1 | 7 Weeks | Tin | Surface Mount | Surface Mount | 8-VFDFN Exposed Pad | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2010 | e3 | yes | Active | 3 (168 Hours) | 8 | 3A991.A.2 | 1.7V~5.5V | DUAL | 260 | 1 | 2.5V | 0.5mm | 40 | 24FC64 | 8 | 5.5V | 2/5V | 1.7V | I2C, Serial | 64Kb 8K x 8 | 3mA | 1MHz | 400ns | EEPROM | I2C | 8 | 5ms | 64 kb | 0.000001A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010DDDR | 1mm | 3mm | 2mm | No | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No 24FC64-I/ST | Microchip Technology | Datasheet | 535 | - | Min: 1 Mult: 1 | 6 Weeks | Tin | Surface Mount | Surface Mount | 8-TSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2007 | e3 | yes | Active | 1 (Unlimited) | 8 | 3A991.A.2 | 1.7V~5.5V | DUAL | 260 | 1 | 2.5V | 0.65mm | 40 | 24FC64 | 8 | Not Qualified | 5.5V | 2/5V | 1.7V | I2C, Serial | 64Kb 8K x 8 | 3mA | SYNCHRONOUS | 1MHz | 400ns | EEPROM | I2C | 8 | 5ms | 64 kb | 0.000001A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010DDDR | 1.2mm | 4.4mm | 3mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No CY14B116N-BA25XI | Cypress Semiconductor Corp | Datasheet | 29 |
| Min: 1 Mult: 1 | 26 Weeks | Surface Mount | 60-LFBGA | YES | Non-Volatile | -40°C~85°C TA | Tray | Active | 3 (168 Hours) | 60 | 3A991.A.2 | 8542.90.00.00 | 2.7V~3.6V | BOTTOM | NOT SPECIFIED | 1 | 3V | 0.75mm | NOT SPECIFIED | R-PBGA-B60 | 3.6V | 2.7V | 16Mb 1M x 16 | ASYNCHRONOUS | NVSRAM | Parallel | 1MX16 | 16 | 25ns | 16777216 bit | 25 ns | 1.2mm | 18mm | 10mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No DSPIC33FJ16MC304T-E/ML | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 19 Weeks | YES | 44 | 40 MHz | MICROCHIP TECHNOLOGY INC | Microchip Technology Inc | DSPIC33FJ16MC304T-E/ML | 1 | 35 | 125 °C | -40 °C | PLASTIC/EPOXY | HVQCCN | 8 X 8 MM, LEAD FREE, PLASTIC, QFN-44 | LCC44,.32SQ,25 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Active | QFN | 40 | 5.22 | Yes | 3.6 V | 3 V | 3.3 V | e3 | Yes | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | Digital Signal Processors | CMOS | QUAD | NO LEAD | 260 | 0.65 mm | compliant | 44 | S-PQCC-N44 | Not Qualified | 3.3 V | AUTOMOTIVE | 40 MHz | MICROCONTROLLER | 80 mA | 16 | YES | NO | YES | NO | 1 mm | FLOATING POINT | 1024 | FLASH | 8 mm | 8 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No DSPIC33FJ16GP102T-E/ML | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 19 Weeks | Production (Last Updated: 2 years ago) | YES | 28 | 32 MHz | MICROCHIP TECHNOLOGY INC | Microchip Technology Inc | DSPIC33FJ16GP102T-E/ML | 1 | 21 | 125 °C | -40 °C | PLASTIC/EPOXY | HVQCCN | 6 X 6 MM, LEAD FREE, PLASTIC, QFN-28 | LCC28,.24SQ,25 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Active | QFN | 1024 | 40 | 5.4 | Non-Compliant | Yes | 5461 | 3.6 V | 3 V | 3.3 V | DC | Yes | e3 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | Digital Signal Processors | CMOS | QUAD | NO LEAD | 260 | 0.65 mm | compliant | 28 | S-PQCC-N28 | Not Qualified | 3.3 V | AUTOMOTIVE | 16 MHz | MICROCONTROLLER | 21 mA | 16 | YES | NO | YES | NO | 1 mm | 24 | 16 | FIXED POINT | 1024 | FLASH | 6 mm | 6 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No DSPIC33FJ16GP304T-E/ML | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 19 Weeks | YES | 44 | 40 MHz | MICROCHIP TECHNOLOGY INC | Microchip Technology Inc | DSPIC33FJ16GP304T-E/ML | 1 | 35 | 125 °C | -40 °C | PLASTIC/EPOXY | HVQCCN | 8 X 8 MM, LEAD FREE, PLASTIC, QFN-44 | LCC44,.32SQ,25 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Active | QFN | 2048 | 40 | 5.22 | Yes | 16384 | 3.6 V | 3 V | 3.3 V | e3 | Yes | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | Microcontrollers | CMOS | QUAD | NO LEAD | 260 | 0.65 mm | compliant | 44 | S-PQCC-N44 | Not Qualified | 3.3 V | AUTOMOTIVE | 40 MHz | MICROCONTROLLER | 80 mA | 16 | YES | NO | YES | NO | 1 mm | PIC | FLASH | 8 mm | 8 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No DSPIC33FJ16MC304T-E/PT | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 19 Weeks | YES | 44 | 40 MHz | MICROCHIP TECHNOLOGY INC | Microchip Technology Inc | DSPIC33FJ16MC304T-E/PT | Top mounting | 3 | 0 | 1 | 3 | 35 | 125 °C | -40 °C | PLASTIC/EPOXY | TQFP | 10 X 10 MM, 1 MM HEIGHT, LEAD FREE, PLASTIC, TQFP-44 | TQFP44,.47SQ,32 | SQUARE | FLATPACK, THIN PROFILE | Active | QFP | 40 | 5.22 | Yes | 3.6 V | 3 V | 3.3 V | Spring clamp connection | e3 | Yes | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | Digital Signal Processors | CMOS | QUAD | GULL WING | 260 | 0.8 mm | compliant | 44 | S-PQFP-G44 | Not Qualified | 3.3 V | AUTOMOTIVE | 40 MHz | MICROCONTROLLER | 80 mA | 16 | YES | NO | YES | NO | 1.2 mm | FLOATING POINT | 1024 | FLASH | 10 mm | 10 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No CY15B064Q-SXAT | Cypress Semiconductor Corp | Datasheet | 37 |
| Min: 1 Mult: 1 | 6 Weeks | Surface Mount | 8-SOIC (0.154, 3.90mm Width) | YES | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | Automotive, AEC-Q100, F-RAM™ | Active | 3 (168 Hours) | 8 | 3A991.A.2 | 8542.90.00.00 | 2.7V~3.65V | DUAL | NOT SPECIFIED | 1 | 3.3V | 1.27mm | NOT SPECIFIED | R-PDSO-G8 | 3.65V | 2.7V | 64Kb 8K x 8 | SYNCHRONOUS | 20MHz | FRAM | SPI | 8KX8 | 8 | 65536 bit | 1.727mm | 4.889mm | 3.8985mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No CY14B116N-BA25XIT | Cypress Semiconductor Corp | Datasheet | 29 |
| Min: 1 Mult: 1 | 26 Weeks | Surface Mount | 60-LFBGA | YES | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | Active | 3 (168 Hours) | 60 | 3A991.A.2 | 8542.90.00.00 | 2.7V~3.6V | BOTTOM | NOT SPECIFIED | 1 | 3V | 0.75mm | NOT SPECIFIED | R-PBGA-B60 | 3.6V | 2.7V | 16Mb 1M x 16 | ASYNCHRONOUS | NVSRAM | Parallel | 1MX16 | 16 | 25ns | 16777216 bit | 25 ns | 1.2mm | 18mm | 10mm | ROHS3 Compliant |
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24FC64-I/P
Microchip Technology
Package:Memory
Price: please inquire
-
24FC64-I/SN
Microchip Technology
Package:Memory
Price: please inquire
-
24FC64-I/MS
Microchip Technology
Package:Memory
Price: please inquire
-
24FC64T-I/MC
Microchip Technology
Package:Memory
Price: please inquire
-
24FC64-I/ST
Microchip Technology
Package:Memory
Price: please inquire
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CY14B116N-BA25XI
Cypress Semiconductor Corp
Package:Memory
68.055793
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DSPIC33FJ16MC304T-E/ML
Microchip
Package:Memory
Price: please inquire
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DSPIC33FJ16GP102T-E/ML
Microchip
Package:Memory
Price: please inquire
-
DSPIC33FJ16GP304T-E/ML
Microchip
Package:Memory
Price: please inquire
-
DSPIC33FJ16MC304T-E/PT
Microchip
Package:Memory
Price: please inquire
-
CY15B064Q-SXAT
Cypress Semiconductor Corp
Package:Memory
0.424616
-
CY14B116N-BA25XIT
Cypress Semiconductor Corp
Package:Memory
8.537774