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Memory (81)

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ECCN Code
Number of Functions
Terminal Position
Length
Terminal Pitch
Width
Memory Width
Surface Mount
Pin Count
Supply Voltage-Max (Vsup)
Supply Voltage-Min (Vsup)
Operating Mode

ECCN Code:
3A991.B.1.B.1

Part Number	Manufacturer	Datasheet	Availability	Pricing(USD)	Quantity	Mounting Type	Package / Case	Surface Mount	Number of Pins	Number of Terminals	Access Time-Max	Ihs Manufacturer	Memory Types	Moisture Sensitivity Levels	Number of Words	Number of Words Code	Operating Temperature-Max	Operating Temperature-Min	Package Body Material	Package Code	Package Description	Package Equivalence Code	Package Shape	Package Style	Part Life Cycle Code	Part Package Code	Rohs Code	Supply Voltage-Nom (Vsup)	Operating Temperature	Packaging	Published	JESD-609 Code	Pbfree Code	Part Status	Moisture Sensitivity Level (MSL)	Number of Terminations	ECCN Code	Terminal Finish	Additional Feature	HTS Code	Voltage - Supply	Terminal Position	Terminal Form	Peak Reflow Temperature (Cel)	Number of Functions	Supply Voltage	Terminal Pitch	Reach Compliance Code	Time@Peak Reflow Temperature-Max (s)	Base Part Number	Pin Count	JESD-30 Code	Qualification Status	Supply Voltage-Max (Vsup)	Power Supplies	Temperature Grade	Supply Voltage-Min (Vsup)	Voltage	Interface	Memory Size	Nominal Supply Current	Operating Mode	Clock Frequency	Supply Current-Max	Access Time	Memory Format	Memory Interface	Organization	Output Characteristics	Seated Height-Max	Memory Width	Write Cycle Time - Word, Page	Address Bus Width	Density	Standby Current-Max	Memory Density	Parallel/Serial	Sync/Async	Word Size	Memory IC Type	Programming Voltage	Serial Bus Type	Endurance	Write Cycle Time-Max (tWC)	Data Retention Time-Min	Write Protection	Data Polling	Toggle Bit	Command User Interface	Page Size	Height Seated (Max)	Length	Width	Radiation Hardening	RoHS Status
Mfr Part No M25PX16-VMW6G	Micron Technology Inc.	Datasheet	2027 In Stock	-	Min: 1 Mult: 1	Surface Mount	8-SOIC (0.209, 5.30mm Width)	YES	8				Non-Volatile																-40°C~85°C TA	Tube	2010		yes	Obsolete	3 (168 Hours)	8	3A991.B.1.B.1				2.3V~3.6V	DUAL		260	1	2.7V	1.27mm		30	M25PX16	8				2.5/3.3V			2.3V	SPI, Serial	16Mb 2M x 8	12mA		75MHz		8 ns	FLASH	SPI				8	15ms, 5ms	1b	16 Mb	0.00001A			Synchronous	8b			SPI	100000 Write/Erase Cycles	15ms	20	HARDWARE/SOFTWARE				256B	2.5mm			No	ROHS3 Compliant
Mfr Part No TC5832DC	Toshiba America Electronic Components	Datasheet	-	-	Min: 1 Mult: 1			NO		22		TOSHIBA CORP			4194304 words	4000000	55 °C		UNSPECIFIED		,		RECTANGULAR	MICROELECTRONIC ASSEMBLY	Obsolete	MODULE		5 V									3A991.B.1.B.1			8542.32.00.51		UNSPECIFIED	UNSPECIFIED		1			unknown			22	R-XXMA-X22	Not Qualified	5.5 V		COMMERCIAL	4.5 V					ASYNCHRONOUS						4MX8	3-STATE		8					33554432 bit	SERIAL			EEPROM	5 V
Mfr Part No XC17V08PCG44C	AMD Xilinx	Datasheet	388 In Stock	-	Min: 1 Mult: 1			YES		44		XILINX INC		3	1048576 words	1000000	70 °C		PLASTIC/EPOXY	QCCJ	QCCJ,		SQUARE	CHIP CARRIER	Obsolete	LCC	Yes	3.3 V				e3	Yes				3A991.B.1.B.1	Matte Tin (Sn)		8542.32.00.51		QUAD	J BEND	245	1		1.27 mm	compliant	30		44	S-PQCC-J44	Not Qualified	3.6 V		COMMERCIAL	3 V					SYNCHRONOUS						1MX8		4.57 mm	8					8388608 bit	PARALLEL/SERIAL			CONFIGURATION MEMORY												16.5862 mm	16.5862 mm
Mfr Part No XC18V02VQG44C0901	AMD Xilinx	Datasheet	16 In Stock	-	Min: 1 Mult: 1			YES		44	20 ns	XILINX INC		3	262144 words	256000	85 °C	-40 °C	PLASTIC/EPOXY	TQFP	PLASTIC, VQFP-44		SQUARE	FLATPACK, THIN PROFILE	Obsolete	QFP	Yes	3.3 V				e3	Yes				3A991.B.1.B.1	MATTE TIN		8542.32.00.51		QUAD	GULL WING		1		0.8 mm	compliant			44	S-PQFP-G44	Not Qualified	3.6 V		INDUSTRIAL	3 V					SYNCHRONOUS						256KX8		1.2 mm	8					2097152 bit	PARALLEL/SERIAL			CONFIGURATION MEMORY												10 mm	10 mm
Mfr Part No XC17V16PCG44I	AMD Xilinx	Datasheet	-	-	Min: 1 Mult: 1			YES		44		XILINX INC		3	2097152 words	2000000	85 °C	-40 °C	PLASTIC/EPOXY	QCCJ	QCCJ,		SQUARE	CHIP CARRIER	Obsolete	LCC	Yes	3.3 V				e3	Yes				3A991.B.1.B.1	Matte Tin (Sn)		8542.32.00.51		QUAD	J BEND	245	1		1.27 mm	compliant	30		44	S-PQCC-J44	Not Qualified	3.6 V		INDUSTRIAL	3 V					SYNCHRONOUS						2MX8		4.57 mm	8					16777216 bit	PARALLEL/SERIAL			CONFIGURATION MEMORY												16.5862 mm	16.5862 mm
Mfr Part No XC17V04PCG44I	AMD Xilinx	Datasheet	400 In Stock	-	Min: 1 Mult: 1			YES		44		XILINX INC		3	4194304 words	4000000	85 °C	-40 °C	PLASTIC/EPOXY	QCCJ	QCCJ,		SQUARE	CHIP CARRIER	Obsolete	LCC	Yes	3.3 V				e3	Yes				3A991.B.1.B.1	Matte Tin (Sn)		8542.32.00.51		QUAD	J BEND	245	1		1.27 mm	compliant	30		44	S-PQCC-J44	Not Qualified	3.6 V		INDUSTRIAL	3 V					SYNCHRONOUS						4MX1		4.57 mm	1					4194304 bit	SERIAL			CONFIGURATION MEMORY												16.5862 mm	16.5862 mm
Mfr Part No XC1702LPCG44C	AMD Xilinx	Datasheet	416 In Stock	-	Min: 1 Mult: 1			YES		44		XILINX INC		3	2097152 words	2000000	70 °C		PLASTIC/EPOXY	QCCJ	PLASTIC, CC-44		SQUARE	CHIP CARRIER	Obsolete	QFN	Yes	3.3 V				e3					3A991.B.1.B.1	Matte Tin (Sn)	USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS	8542.32.00.51		QUAD	J BEND	250	1		1.27 mm	compliant	40		44	S-PQCC-J44	Not Qualified	3.6 V		COMMERCIAL	3 V					SYNCHRONOUS						2MX1		4.572 mm	1					2097152 bit	SERIAL			CONFIGURATION MEMORY												16.5862 mm	16.5862 mm
Mfr Part No XC17V16VQG44I	AMD Xilinx	Datasheet	185 In Stock	-	Min: 1 Mult: 1			YES		44		XILINX INC		3	2097152 words	2000000	85 °C	-40 °C	PLASTIC/EPOXY	TQFP	TQFP,		SQUARE	FLATPACK, THIN PROFILE	Obsolete	QFP	Yes	3.3 V				e3	Yes				3A991.B.1.B.1	Matte Tin (Sn)		8542.32.00.51		QUAD	GULL WING	260	1		0.8 mm	compliant	30		44	S-PQFP-G44	Not Qualified	3.6 V		INDUSTRIAL	3 V					SYNCHRONOUS						2MX8		1.2 mm	8					16777216 bit	PARALLEL/SERIAL			CONFIGURATION MEMORY												10 mm	10 mm
Mfr Part No XC1702LVQG44I	AMD Xilinx	Datasheet	-	-	Min: 1 Mult: 1			YES		44		XILINX INC		3	2097152 words	2000000	85 °C	-40 °C	PLASTIC/EPOXY	TQFP	TQFP,		SQUARE	FLATPACK, THIN PROFILE	Obsolete	QFP	Yes	3.3 V				e3					3A991.B.1.B.1	Matte Tin (Sn)	USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS	8542.32.00.51		QUAD	GULL WING	260	1		0.8 mm	compliant	30		44	S-PQFP-G44	Not Qualified	3.6 V		INDUSTRIAL	3 V					SYNCHRONOUS						2MX1		1.2 mm	1					2097152 bit	SERIAL			CONFIGURATION MEMORY												10 mm	10 mm
Mfr Part No XC1702LPCG44I	AMD Xilinx	Datasheet	342 In Stock	-	Min: 1 Mult: 1			YES		44		XILINX INC		3	2097152 words	2000000	85 °C	-40 °C	PLASTIC/EPOXY	QCCJ	QCCJ,		SQUARE	CHIP CARRIER	Obsolete	QFN	Yes	3.3 V				e3					3A991.B.1.B.1	Matte Tin (Sn)	USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS	8542.32.00.51		QUAD	J BEND	250	1		1.27 mm	compliant	40		44	S-PQCC-J44	Not Qualified	3.6 V		INDUSTRIAL	3 V					SYNCHRONOUS						2MX1		4.572 mm	1					2097152 bit	SERIAL			CONFIGURATION MEMORY												16.5862 mm	16.5862 mm
Mfr Part No XC17S200XLPDG8I	AMD Xilinx	Datasheet	318 In Stock	-	Min: 1 Mult: 1			NO		8		XILINX INC		1	1335872 words	1335872	85 °C	-40 °C	PLASTIC/EPOXY	DIP	DIP,		RECTANGULAR	IN-LINE	Obsolete	DIP	Yes	3.3 V				e3	Yes				3A991.B.1.B.1	Matte Tin (Sn)		8542.32.00.51		DUAL	THROUGH-HOLE	250	1		2.54 mm	compliant	30		8	R-PDIP-T8	Not Qualified	3.6 V		INDUSTRIAL	3 V					SYNCHRONOUS						1335872X1		4.5974 mm	1					1335872 bit	SERIAL			CONFIGURATION MEMORY												9.3599 mm	7.62 mm
Mfr Part No XC17S200XLPD8I	AMD Xilinx	Datasheet	444 In Stock	-	Min: 1 Mult: 1			NO		8		XILINX INC		1	1335872 words	1335872	85 °C	-40 °C	PLASTIC/EPOXY	DIP	PLASTIC, DIP-8		RECTANGULAR	IN-LINE	Obsolete	DIP	No	3.3 V				e0	No				3A991.B.1.B.1	Tin/Lead (Sn85Pb15)		8542.32.00.51		DUAL	THROUGH-HOLE	225	1		2.54 mm	not_compliant	30		8	R-PDIP-T8	Not Qualified	3.6 V		INDUSTRIAL	3 V					SYNCHRONOUS						1335872X1		4.5974 mm	1					1335872 bit	SERIAL			CONFIGURATION MEMORY												9.3599 mm	7.62 mm
Mfr Part No XCF04SVOG20CES	AMD Xilinx	Datasheet	787 In Stock	-	Min: 1 Mult: 1			YES		20		XILINX INC		3	4194304 words	4000000	85 °C	-40 °C	PLASTIC/EPOXY	TSSOP	TSSOP,		RECTANGULAR	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	Obsolete	TSSOP	Yes	3.3 V				e3	Yes				3A991.B.1.B.1	MATTE TIN		8542.32.00.51		DUAL	GULL WING		1		0.65 mm	compliant			20	R-PDSO-G20	Not Qualified	3.6 V		INDUSTRIAL	3 V					SYNCHRONOUS						4MX1		1.19 mm	1					4194304 bit	SERIAL			CONFIGURATION MEMORY												6.5024 mm	4.4 mm
Mfr Part No XC17V02PCG44I	AMD Xilinx	Datasheet	189 In Stock	-	Min: 1 Mult: 1			YES		44		XILINX INC		3	2097152 words	2000000	85 °C	-40 °C	PLASTIC/EPOXY	QCCJ	QCCJ,		SQUARE	CHIP CARRIER	Obsolete	LCC	Yes	3.3 V				e3	Yes				3A991.B.1.B.1	Matte Tin (Sn)		8542.32.00.51		QUAD	J BEND	245	1		1.27 mm	compliant	30		44	S-PQCC-J44	Not Qualified	3.6 V		INDUSTRIAL	3 V					SYNCHRONOUS						2MX1		4.57 mm	1					2097152 bit	SERIAL			CONFIGURATION MEMORY												16.5862 mm	16.5862 mm
Mfr Part No XC17V16PCG44C	AMD Xilinx	Datasheet	785 In Stock	-	Min: 1 Mult: 1			YES		44		XILINX INC		3	2097152 words	2000000	70 °C		PLASTIC/EPOXY	QCCJ	QCCJ,		SQUARE	CHIP CARRIER	Obsolete	LCC	Yes	3.3 V				e3	Yes				3A991.B.1.B.1	Matte Tin (Sn)		8542.32.00.51		QUAD	J BEND	245	1		1.27 mm	compliant	30		44	S-PQCC-J44	Not Qualified	3.6 V		COMMERCIAL	3 V					SYNCHRONOUS						2MX8		4.57 mm	8					16777216 bit	PARALLEL/SERIAL			CONFIGURATION MEMORY												16.5862 mm	16.5862 mm
Mfr Part No XC18V02PCG44C0901	AMD Xilinx	Datasheet	5 In Stock	-	Min: 1 Mult: 1			YES		44	20 ns	XILINX INC		3	262144 words	256000	85 °C	-40 °C	PLASTIC/EPOXY	QCCJ	PLASTIC, LCC-44		SQUARE	CHIP CARRIER	Obsolete	LCC	Yes	3.3 V				e3	Yes				3A991.B.1.B.1	MATTE TIN		8542.32.00.51		QUAD	J BEND		1		1.27 mm	compliant			44	S-PQCC-J44	Not Qualified	3.6 V		INDUSTRIAL	3 V					SYNCHRONOUS						256KX8		4.572 mm	8					2097152 bit	PARALLEL/SERIAL			CONFIGURATION MEMORY												16.5862 mm	16.5862 mm
Mfr Part No W27C4096-12	Winbond Electronics Corp	Datasheet	-	-	Min: 1 Mult: 1			NO		40	120 ns	WINBOND ELECTRONICS CORP			262144 words	256000	50 °C		PLASTIC/EPOXY	DIP	0.600 INCH, PLASTIC, DIP-40	DIP40,.6	RECTANGULAR	IN-LINE	Obsolete	DIP	No	5 V				e0					3A991.B.1.B.1	TIN LEAD		8542.32.00.51		DUAL	THROUGH-HOLE		1		2.54 mm	not_compliant			40	R-PDIP-T40	Not Qualified	5.25 V		COMMERCIAL	4.75 V					ASYNCHRONOUS		0.03 mA				256KX16		5.33 mm	16				0.0001 A	4194304 bit	PARALLEL			EEPROM	12 V						NO	NO	NO			52.2 mm	15.24 mm
Mfr Part No XC17S200AVQG44I	AMD Xilinx	Datasheet	110 In Stock	-	Min: 1 Mult: 1			YES		44		XILINX INC		3	1335840 words	1335840	85 °C	-40 °C	PLASTIC/EPOXY	TQFP	PLASTIC, VQFP-44		SQUARE	FLATPACK, THIN PROFILE	Transferred	QFP	Yes	3.3 V				e3	Yes				3A991.B.1.B.1	Matte Tin (Sn)		8542.32.00.51		QUAD	GULL WING	260	1		0.8 mm	compliant	30		44	S-PQFP-G44	Not Qualified	3.6 V		INDUSTRIAL	3 V					SYNCHRONOUS						1335840X1		1.2 mm	1					1335840 bit	SERIAL			CONFIGURATION MEMORY												10 mm	10 mm
Mfr Part No XC17V08VQG44I	AMD Xilinx	Datasheet	-	-	Min: 1 Mult: 1			YES		44		XILINX INC		3	1048576 words	1000000	85 °C	-40 °C	PLASTIC/EPOXY	TQFP	TQFP,		SQUARE	FLATPACK, THIN PROFILE	Obsolete	QFP	Yes	3.3 V				e3	Yes				3A991.B.1.B.1	Matte Tin (Sn)		8542.32.00.51		QUAD	GULL WING	260	1		0.8 mm	compliant	30		44	S-PQFP-G44	Not Qualified	3.6 V		INDUSTRIAL	3 V					SYNCHRONOUS						1MX8		1.2 mm	8					8388608 bit	PARALLEL/SERIAL			CONFIGURATION MEMORY												10 mm	10 mm
Mfr Part No XC18V04PC44C0799	AMD Xilinx	Datasheet	-	-	Min: 1 Mult: 1			YES		44	20 ns	XILINX INC			524288 words	512000	85 °C	-40 °C	PLASTIC/EPOXY	QCCJ	QCCJ,		SQUARE	CHIP CARRIER	Obsolete	LCC		3.3 V									3A991.B.1.B.1			8542.32.00.51		QUAD	J BEND		1		1.27 mm	unknown			44	S-PQCC-J44	Not Qualified	3.6 V		INDUSTRIAL	3 V					SYNCHRONOUS						512KX8		4.572 mm	8					4194304 bit	PARALLEL/SERIAL			CONFIGURATION MEMORY												16.5862 mm	16.5862 mm

Memory (81)