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ECCN Code
Number of Functions
Terminal Position
Length
Terminal Pitch
Width
Memory Width
Surface Mount
Pin Count
Supply Voltage-Max (Vsup)
Supply Voltage-Min (Vsup)
Operating Mode

ECCN Code:
3A991.B.1.B.1

Part Number	Manufacturer	Datasheet	Availability	Pricing(USD)	Quantity	Surface Mount	Number of Terminals	Access Time-Max	Clock Frequency-Max (fCLK)	Ihs Manufacturer	Manufacturer Part Number	Moisture Sensitivity Levels	Number of Words	Number of Words Code	Operating Temperature-Max	Operating Temperature-Min	Package Body Material	Package Code	Package Description	Package Equivalence Code	Package Shape	Package Style	Part Life Cycle Code	Part Package Code	Risk Rank	Rohs Code	Supply Voltage-Nom (Vsup)	JESD-609 Code	Pbfree Code	ECCN Code	Type	Terminal Finish	Additional Feature	HTS Code	Terminal Position	Terminal Form	Peak Reflow Temperature (Cel)	Number of Functions	Terminal Pitch	Reach Compliance Code	Time@Peak Reflow Temperature-Max (s)	Pin Count	JESD-30 Code	Qualification Status	Supply Voltage-Max (Vsup)	Power Supplies	Temperature Grade	Supply Voltage-Min (Vsup)	Operating Mode	Supply Current-Max	Organization	Output Characteristics	Seated Height-Max	Memory Width	Standby Current-Max	Memory Density	Parallel/Serial	Memory IC Type	Programming Voltage	Serial Bus Type	Endurance	Write Cycle Time-Max (tWC)	Data Retention Time-Min	Write Protection	Alternate Memory Width	Data Polling	Toggle Bit	Command User Interface	Number of Sectors/Size	Sector Size	Page Size	Ready/Busy	I2C Control Byte	Reverse Pinout	Length	Width
Mfr Part No TC58DVM72F1FT00	Toshiba America Electronic Components	Datasheet	-	-	Min: 1 Mult: 1	YES	48			TOSHIBA CORP			8388608 words	8000000	70 °C		PLASTIC/EPOXY	TSOP1	TSOP1,		RECTANGULAR	SMALL OUTLINE, THIN PROFILE	Obsolete	TSOP1		No	3.3 V	e0		3A991.B.1.B.1		TIN LEAD		8542.32.00.51	DUAL	GULL WING		1	0.5 mm	unknown		48	R-PDSO-G48	Not Qualified	3.6 V		COMMERCIAL	2.7 V	ASYNCHRONOUS		8MX16		1.2 mm	16		134217728 bit	SERIAL	EEPROM	3 V						8										18.4 mm	12 mm
Mfr Part No TC58DVM72A1FTI0	Toshiba America Electronic Components	Datasheet	-	-	Min: 1 Mult: 1	YES	48			TOSHIBA CORP			16777216 words	16000000	85 °C	-40 °C	PLASTIC/EPOXY	TSOP1	TSOP1,		RECTANGULAR	SMALL OUTLINE, THIN PROFILE	Obsolete	TSOP1		No	3.3 V	e0		3A991.B.1.B.1		TIN LEAD		8542.32.00.51	DUAL	GULL WING		1	0.5 mm	unknown		48	R-PDSO-G48	Not Qualified	3.6 V		INDUSTRIAL	2.7 V	ASYNCHRONOUS		16MX8		1.2 mm	8		134217728 bit	SERIAL	EEPROM	3 V																18.4 mm	12 mm
Mfr Part No XC17V04PCG20I	AMD Xilinx	Datasheet	-	-	Min: 1 Mult: 1	YES	20			XILINX INC		3	4194304 words	4000000	85 °C	-40 °C	PLASTIC/EPOXY	QCCJ	QCCJ,		SQUARE	CHIP CARRIER	Obsolete	QLCC		Yes	3.3 V	e3	Yes	3A991.B.1.B.1		Matte Tin (Sn)		8542.32.00.51	QUAD	J BEND	245	1	1.27 mm	compliant	30	20	S-PQCC-J20	Not Qualified	3.6 V		INDUSTRIAL	3 V	SYNCHRONOUS		4MX1		4.572 mm	1		4194304 bit	SERIAL	CONFIGURATION MEMORY																	8.9662 mm	8.9662 mm
Mfr Part No AT24C16BU3-UU-T	Microchip	Datasheet	-	-	Min: 1 Mult: 1	YES	8		1 MHz	ATMEL CORP	AT24C16BU3-UU-T		2097152 words	2000000	85 °C	-40 °C	PLASTIC/EPOXY	VFBGA	VFBGA, BGA8,2X4,40/20	BGA8,2X4,40/20	RECTANGULAR	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	Obsolete	BGA	7.88	Yes	2.5 V			3A991.B.1.B.1				8542.32.00.51	BOTTOM	BALL		1	0.5 mm	unknown		8	R-PBGA-B8	Not Qualified	3.6 V	2/5 V	INDUSTRIAL	1.8 V	SYNCHRONOUS	0.003 mA	2MX8		0.91 mm	8	0.000001 A	16777216 bit	SERIAL	EEPROM		I2C	1000000 Write/Erase Cycles	5 ms	100	HARDWARE									1010MMMR		2 mm	1.5 mm
Mfr Part No AT24C16BD3-DH-T	Microchip	Datasheet	-	-	Min: 1 Mult: 1	YES	8		1 MHz	ATMEL CORP	AT24C16BD3-DH-T		2097152 words	2000000	85 °C	-40 °C	UNSPECIFIED	VSON	VSON, SOLCC8,.08,16	SOLCC8,.08,16	RECTANGULAR	SMALL OUTLINE, VERY THIN PROFILE	Transferred	SOIC	5.68	Yes	2.5 V	e4		3A991.B.1.B.1		Nickel/Palladium/Gold (Ni/Pd/Au)		8542.32.00.51	DUAL	NO LEAD		1	0.4 mm	compliant		8	R-XDSO-N8	Not Qualified	3.6 V	2/5 V	INDUSTRIAL	1.8 V	SYNCHRONOUS	0.003 mA	2MX8		0.4 mm	8	0.000001 A	16777216 bit	SERIAL	EEPROM		I2C	1000000 Write/Erase Cycles	5 ms	100	HARDWARE									1010MMMR		2.2 mm	1.8 mm
Mfr Part No W27C020-90	Winbond Electronics Corp	Datasheet	-	-	Min: 1 Mult: 1	NO	32	90 ns		WINBOND ELECTRONICS CORP			262144 words	256000	70 °C		PLASTIC/EPOXY	DIP	0.600 INCH, PLASTIC, DIP-32	DIP32,.6	RECTANGULAR	IN-LINE	Obsolete	DIP		No	5 V	e0		3A991.B.1.B.1		TIN LEAD		8542.32.00.51	DUAL	THROUGH-HOLE		1	2.54 mm	not_compliant		32	R-PDIP-T32	Not Qualified	5.25 V		COMMERCIAL	4.75 V	ASYNCHRONOUS	0.03 mA	256KX8		5.33 mm	8	0.0001 A	2097152 bit	PARALLEL	EEPROM	12 V							NO	NO	NO							41.91 mm	15.24 mm
Mfr Part No TC58512FTI	Toshiba America Electronic Components	Datasheet	-	-	Min: 1 Mult: 1	YES	48	35 ns		TOSHIBA CORP			67108864 words	64000000	70 °C	-40 °C	PLASTIC/EPOXY	TSOP1	TSOP1, TSSOP48,.8,20	TSSOP48,.8,20	RECTANGULAR	SMALL OUTLINE, THIN PROFILE	Obsolete	TSOP1			3.3 V	e0		3A991.B.1.B.1	NAND TYPE	TIN LEAD		8542.32.00.51	DUAL	GULL WING		1	0.5 mm	unknown		48	R-PDSO-G48	Not Qualified	3.6 V		OTHER	2.7 V	ASYNCHRONOUS	0.03 mA	64MX8		1.2 mm	8	0.0001 A	536870912 bit	SERIAL	EEPROM	3 V							NO	NO	YES	4K	16K	512 words	YES			18.4 mm	12 mm
Mfr Part No XC17V02VQG44C	AMD Xilinx	Datasheet	154 In Stock	-	Min: 1 Mult: 1	YES	44			XILINX INC		3	2097152 words	2000000	70 °C		PLASTIC/EPOXY	TQFP	TQFP,		SQUARE	FLATPACK, THIN PROFILE	Obsolete	QFP		Yes	3.3 V	e3	Yes	3A991.B.1.B.1		Matte Tin (Sn)		8542.32.00.51	QUAD	GULL WING	260	1	0.8 mm	compliant	30	44	S-PQFP-G44	Not Qualified	3.6 V		COMMERCIAL	3 V	SYNCHRONOUS		2MX1		1.2 mm	1		2097152 bit	SERIAL	CONFIGURATION MEMORY																	10 mm	10 mm
Mfr Part No M95M02-DRCS6TPKF	STMicroelectronics	Datasheet	-	-	Min: 1 Mult: 1	YES	8		5 MHz	STMICROELECTRONICS			262144 words	256000	85 °C	-40 °C	UNSPECIFIED	VFBGA		BGA8(UNSPEC)	RECTANGULAR	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	Active			Yes	2.5 V			3A991.B.1.B.1				8542.32.00.51	BOTTOM	BALL		1		unknown			R-XBGA-B8		5.5 V			1.8 V	SYNCHRONOUS	0.003 mA	256KX8	3-STATE	0.58 mm	8	0.000003 A	2097152 bit	SERIAL	EEPROM	2.5 V	SPI	4000000 Write/Erase Cycles	10 ms	200	HARDWARE/SOFTWARE		NO	NO	NO			256 words			NO	3.556 mm	2.011 mm
Mfr Part No XC17S200XLPD8C	AMD Xilinx	Datasheet	376 In Stock	-	Min: 1 Mult: 1	NO	8			XILINX INC		1	1335872 words	1335872	70 °C		PLASTIC/EPOXY	DIP	PLASTIC, DIP-8		RECTANGULAR	IN-LINE	Obsolete	DIP		No	3.3 V	e0	No	3A991.B.1.B.1		Tin/Lead (Sn85Pb15)		8542.32.00.51	DUAL	THROUGH-HOLE	225	1	2.54 mm	not_compliant	30	8	R-PDIP-T8	Not Qualified	3.6 V		COMMERCIAL	3 V	SYNCHRONOUS		1335872X1		4.5974 mm	1		1335872 bit	SERIAL	CONFIGURATION MEMORY																	9.3599 mm	7.62 mm
Mfr Part No XC17V02PCG20I	AMD Xilinx	Datasheet	5 In Stock	-	Min: 1 Mult: 1	YES	20			XILINX INC		3	2097152 words	2000000	85 °C	-40 °C	PLASTIC/EPOXY	QCCJ	QCCJ,		SQUARE	CHIP CARRIER	Obsolete	QLCC		Yes	3.3 V	e3	Yes	3A991.B.1.B.1		Matte Tin (Sn)		8542.32.00.51	QUAD	J BEND	245	1	1.27 mm	compliant	30	20	S-PQCC-J20	Not Qualified	3.6 V		INDUSTRIAL	3 V	SYNCHRONOUS		2MX1		4.572 mm	1		2097152 bit	SERIAL	CONFIGURATION MEMORY																	8.9662 mm	8.9662 mm
Mfr Part No TC58DVM82F1FT00	Toshiba America Electronic Components	Datasheet	-	-	Min: 1 Mult: 1	YES	48			TOSHIBA CORP			33554432 words	32000000	70 °C		PLASTIC/EPOXY	TSOP1	TSOP1,		RECTANGULAR	SMALL OUTLINE, THIN PROFILE	Obsolete	TSOP1		No	3.3 V	e0		3A991.B.1.B.1		TIN LEAD		8542.32.00.51	DUAL	GULL WING		1	0.5 mm	unknown		48	R-PDSO-G48	Not Qualified	3.6 V		COMMERCIAL	2.7 V	ASYNCHRONOUS		32MX8		1.2 mm	8		268435456 bit	SERIAL	EEPROM	3 V																18.4 mm	12 mm
Mfr Part No XC17S200XLSO20I	AMD Xilinx	Datasheet	85 In Stock	-	Min: 1 Mult: 1	YES	20			XILINX INC		3	1335872 words	1335872	85 °C	-40 °C	PLASTIC/EPOXY	SOP	PLASTIC, SOIC-20		RECTANGULAR	SMALL OUTLINE	Obsolete	SOIC		No	3.3 V	e0	No	3A991.B.1.B.1		Tin/Lead (Sn85Pb15)		8542.32.00.51	DUAL	GULL WING	225	1	1.27 mm	not_compliant	30	20	R-PDSO-G20	Not Qualified	3.6 V		INDUSTRIAL	3 V	SYNCHRONOUS		1335872X1		2.65 mm	1		1335872 bit	SERIAL	CONFIGURATION MEMORY																	12.8 mm	7.5 mm
Mfr Part No XC17V04VQG44I	AMD Xilinx	Datasheet	227 In Stock	-	Min: 1 Mult: 1	YES	44			XILINX INC		3	4194304 words	4000000	85 °C	-40 °C	PLASTIC/EPOXY	TQFP	TQFP,		SQUARE	FLATPACK, THIN PROFILE	Obsolete	QFP		Yes	3.3 V	e3	Yes	3A991.B.1.B.1		Matte Tin (Sn)		8542.32.00.51	QUAD	GULL WING	260	1	0.8 mm	compliant	30	44	S-PQFP-G44	Not Qualified	3.6 V		INDUSTRIAL	3 V	SYNCHRONOUS		4MX1		1.2 mm	1		4194304 bit	SERIAL	CONFIGURATION MEMORY																	10 mm	10 mm
Mfr Part No XC1704LPCG44I	AMD Xilinx	Datasheet	-	-	Min: 1 Mult: 1	YES	44			XILINX INC		3	4194304 words	4000000	85 °C	-40 °C	PLASTIC/EPOXY	QCCJ	QCCJ,		SQUARE	CHIP CARRIER	Obsolete	QFN		Yes	3.3 V	e3		3A991.B.1.B.1		Matte Tin (Sn)	USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS	8542.32.00.51	QUAD	J BEND	245	1	1.27 mm	compliant	30	44	S-PQCC-J44	Not Qualified	3.6 V		INDUSTRIAL	3 V	SYNCHRONOUS		4MX1		4.572 mm	1		4194304 bit	SERIAL	CONFIGURATION MEMORY																	16.5862 mm	16.5862 mm
Mfr Part No XC18V02PCG44C0936	AMD Xilinx	Datasheet	-	-	Min: 1 Mult: 1	YES	44	20 ns		XILINX INC		3	262144 words	256000	85 °C	-40 °C	PLASTIC/EPOXY	QCCJ	QCCJ,		SQUARE	CHIP CARRIER	Obsolete	LCC		Yes	3.3 V	e3	Yes	3A991.B.1.B.1		MATTE TIN		8542.32.00.51	QUAD	J BEND		1	1.27 mm	compliant		44	S-PQCC-J44	Not Qualified	3.6 V		INDUSTRIAL	3 V	SYNCHRONOUS		256KX8		4.572 mm	8		2097152 bit	PARALLEL/SERIAL	CONFIGURATION MEMORY																	16.5862 mm	16.5862 mm
Mfr Part No XC1704LPCG44C	AMD Xilinx	Datasheet	561 In Stock	-	Min: 1 Mult: 1	YES	44			XILINX INC		3	4194304 words	4000000	70 °C		PLASTIC/EPOXY	QCCJ	QCCJ,		SQUARE	CHIP CARRIER	Obsolete	QFN		Yes	3.3 V	e3		3A991.B.1.B.1		Matte Tin (Sn)	USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS	8542.32.00.51	QUAD	J BEND	250	1	1.27 mm	compliant	40	44	S-PQCC-J44	Not Qualified	3.6 V		COMMERCIAL	3 V	SYNCHRONOUS		4MX1		4.572 mm	1		4194304 bit	SERIAL	CONFIGURATION MEMORY																	16.5862 mm	16.5862 mm
Mfr Part No XC1704LVQG44C	AMD Xilinx	Datasheet	-	-	Min: 1 Mult: 1	YES	44			XILINX INC		3	4194304 words	4000000	70 °C		PLASTIC/EPOXY	TQFP	TQFP,		SQUARE	FLATPACK, THIN PROFILE	Obsolete	QFP		Yes	3.3 V	e3		3A991.B.1.B.1		Matte Tin (Sn)	USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS	8542.32.00.51	QUAD	GULL WING	260	1	0.8 mm	compliant	30	44	S-PQFP-G44	Not Qualified	3.6 V		COMMERCIAL	3 V	SYNCHRONOUS		4MX1		1.2 mm	1		4194304 bit	SERIAL	CONFIGURATION MEMORY																	10 mm	10 mm
Mfr Part No TC584000FT	Toshiba America Electronic Components	Datasheet	-	-	Min: 1 Mult: 1	YES	40	15000 ns		TOSHIBA CORP			524288 words	512000	70 °C		PLASTIC/EPOXY	TSOP2	TSOP2,		RECTANGULAR	SMALL OUTLINE, THIN PROFILE	Obsolete	TSOP2		No	5 V	e0	No	3A991.B.1.B.1		TIN LEAD	BULK ERASE; BLOCK ERASE	8542.32.00.51	DUAL	GULL WING		1	0.8 mm	unknown		44	R-PDSO-G40	Not Qualified	5.25 V		COMMERCIAL	4.75 V	ASYNCHRONOUS		512KX8		1.2 mm	8		4194304 bit	PARALLEL	EEPROM	5 V																18.41 mm	10.16 mm
Mfr Part No XC17V08VQG44C	AMD Xilinx	Datasheet	-	-	Min: 1 Mult: 1	YES	44			XILINX INC		3	1048576 words	1000000	70 °C		PLASTIC/EPOXY	TQFP	TQFP,		SQUARE	FLATPACK, THIN PROFILE	Obsolete	QFP		Yes	3.3 V	e3	Yes	3A991.B.1.B.1		Matte Tin (Sn)		8542.32.00.51	QUAD	GULL WING	260	1	0.8 mm	compliant	30	44	S-PQFP-G44	Not Qualified	3.6 V		COMMERCIAL	3 V	SYNCHRONOUS		1MX8		1.2 mm	8		8388608 bit	PARALLEL/SERIAL	CONFIGURATION MEMORY																	10 mm	10 mm

Memory (81)