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The category is 'Memory'

Memory (19)

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ECCN Code
HTS Code
Memory Width
Organization
Surface Mount
Terminal Pitch
Terminal Position
Access Time-Max
Ihs Manufacturer
JESD-30 Code
Memory Density
Memory IC Type

ECCN Code:
3A991.B.1.B.2

Image	Part Number	Manufacturer	Datasheet	Availability	Pricing(USD)	Quantity	RoHS	Mounting Type	Package / Case	Surface Mount	Number of Pins	Number of Terminals	Access Time-Max	Clock Frequency-Max (fCLK)	Contact Pitch	Gross Weight	Ihs Manufacturer	Memory Types	Moisture Sensitivity Levels	Number of Words	Number of Words Code	Operating Temperature-Max	Operating Temperature-Min	Package Body Material	Package Code	Package Description	Package Equivalence Code	Package Shape	Package Style	Part Life Cycle Code	Part Package Code	Rohs Code	Supply Voltage-Nom (Vsup)	Transport Package Size/Quantity	Operating Temperature	Packaging	Published	JESD-609 Code	Pbfree Code	Part Status	Moisture Sensitivity Level (MSL)	Number of Terminations	ECCN Code	Type	Terminal Finish	Additional Feature	HTS Code	Voltage - Supply	Terminal Position	Terminal Form	Peak Reflow Temperature (Cel)	Number of Functions	Supply Voltage	Terminal Pitch	Depth	Reach Compliance Code	Frequency	Time@Peak Reflow Temperature-Max (s)	Pin Count	JESD-30 Code	Qualification Status	Operating Supply Voltage	Supply Voltage-Max (Vsup)	Temperature Grade	Supply Voltage-Min (Vsup)	Memory Size	Operating Mode	Supply Current-Max	Access Time	Memory Format	Memory Interface	Organization	Seated Height-Max	Memory Width	Density	Standby Current-Max	Memory Density	Parallel/Serial	Memory IC Type	Programming Voltage	Endurance	Data Retention Time-Min	Data Polling	Toggle Bit	Command User Interface	Height Seated (Max)	Length	Width	Thickness	Radiation Hardening	RoHS Status	Lead Free
	Mfr Part No W27C512-45Z	Winbond Electronics	Datasheet	7260 In Stock	-	Min: 1 Mult: 1		Through Hole	28-DIP (0.600, 15.24mm)	NO	28							Non-Volatile																	0°C~70°C TA	Tube	2005			Obsolete	3 (168 Hours)	28	3A991.B.1.B.2				8542.32.00.51	4.75V~5.25V	DUAL			1	5V	2.54mm			45GHz		28			5V				512Kb 64K x 8			45ns	EEPROM	Parallel	64KX8		8	512 kb					12V						5.33mm	37.08mm	15.24mm		No	ROHS3 Compliant	Lead Free
	Mfr Part No XC18V512SO20C0799	AMD Xilinx	Datasheet	-	-	Min: 1 Mult: 1				YES		20	15 ns				XILINX INC			65536 words	64000	85 °C	-40 °C	PLASTIC/EPOXY	SOP	SOP,		RECTANGULAR	SMALL OUTLINE	Obsolete	SOIC		3.3 V										3A991.B.1.B.2				8542.32.00.51		DUAL	GULL WING		1		1.27 mm		unknown			20	R-PDSO-G20	Not Qualified		3.6 V	INDUSTRIAL	3 V		SYNCHRONOUS					64KX8	2.65 mm	8			524288 bit	PARALLEL/SERIAL	CONFIGURATION MEMORY								12.8 mm	7.5 mm
	Mfr Part No XC18V01PCG20C0901	AMD Xilinx	Datasheet	616 In Stock	-	Min: 1 Mult: 1				YES		20	15 ns				XILINX INC		3	131072 words	128000	85 °C	-40 °C	PLASTIC/EPOXY	QCCJ	PLASTIC, LCC-20		SQUARE	CHIP CARRIER	Obsolete	QLCC	Yes	3.3 V					e3	Yes				3A991.B.1.B.2		MATTE TIN		8542.32.00.51		QUAD	J BEND		1		1.27 mm		compliant			20	S-PQCC-J20	Not Qualified		3.6 V	INDUSTRIAL	3 V		SYNCHRONOUS					128KX8	4.572 mm	8			1048576 bit	PARALLEL/SERIAL	CONFIGURATION MEMORY								8.9662 mm	8.9662 mm
	Mfr Part No XC1801SO20C	AMD Xilinx	Datasheet	-	-	Min: 1 Mult: 1				YES		20	45 ns	15 MHz			XILINX INC		3	1048576 words	1000000	70 °C		PLASTIC/EPOXY	SOP	SOP-20	SOP20,.4	RECTANGULAR	SMALL OUTLINE	Obsolete	SOIC	No	3.3 V					e0					3A991.B.1.B.2	NOR TYPE	TIN LEAD	SERIAL MODE ALSO AVAILABLE	8542.32.00.51		DUAL	GULL WING	225	1		1.27 mm		not_compliant		30	20	R-PDSO-G20	Not Qualified		3.6 V	COMMERCIAL	3 V		SYNCHRONOUS	0.03 mA				1MX1	2.65 mm	1		0.0001 A	1048576 bit	PARALLEL	CONFIGURATION MEMORY		10000 Write/Erase Cycles	10					12.8 mm	7.5 mm
	Mfr Part No XC18V01VQ44C0799	AMD Xilinx	Datasheet	220 In Stock	-	Min: 1 Mult: 1				YES		44	15 ns				XILINX INC			131072 words	128000	85 °C	-40 °C	PLASTIC/EPOXY	TQFP	TQFP,		SQUARE	FLATPACK, THIN PROFILE	Obsolete	QFP		3.3 V										3A991.B.1.B.2				8542.32.00.51		QUAD	GULL WING		1		0.8 mm		unknown			44	S-PQFP-G44	Not Qualified		3.6 V	INDUSTRIAL	3 V		SYNCHRONOUS					128KX8	1.2 mm	8			1048576 bit	PARALLEL/SERIAL	CONFIGURATION MEMORY								10 mm	10 mm
	Mfr Part No XC18V512SOG20C0901	AMD Xilinx	Datasheet	210 In Stock	-	Min: 1 Mult: 1				YES		20	15 ns				XILINX INC		3	65536 words	64000	85 °C	-40 °C	PLASTIC/EPOXY	SOP	SOIC-20		RECTANGULAR	SMALL OUTLINE	Obsolete	SOIC	Yes	3.3 V					e3	Yes				3A991.B.1.B.2		MATTE TIN		8542.32.00.51		DUAL	GULL WING		1		1.27 mm		compliant			20	R-PDSO-G20	Not Qualified		3.6 V	INDUSTRIAL	3 V		SYNCHRONOUS					64KX8	2.65 mm	8			524288 bit	PARALLEL/SERIAL	CONFIGURATION MEMORY								12.8 mm	7.5 mm
	Mfr Part No XC18V512VQ44C0799	AMD Xilinx	Datasheet	352 In Stock	-	Min: 1 Mult: 1				YES		44	15 ns				XILINX INC			65536 words	64000	85 °C	-40 °C	PLASTIC/EPOXY	TQFP	TQFP,		SQUARE	FLATPACK, THIN PROFILE	Obsolete	QFP		3.3 V										3A991.B.1.B.2				8542.32.00.51		QUAD	GULL WING		1		0.8 mm		unknown			44	S-PQFP-G44	Not Qualified		3.6 V	INDUSTRIAL	3 V		SYNCHRONOUS					64KX8	1.2 mm	8			524288 bit	PARALLEL/SERIAL	CONFIGURATION MEMORY								10 mm	10 mm
	Mfr Part No XC18V512PC20C0901	AMD Xilinx	Datasheet	269 In Stock	-	Min: 1 Mult: 1				YES		20	15 ns				XILINX INC		3	65536 words	64000	85 °C	-40 °C	PLASTIC/EPOXY	QCCJ	QCCJ,		SQUARE	CHIP CARRIER	Obsolete	QLCC	No	3.3 V					e0					3A991.B.1.B.2		TIN LEAD		8542.32.00.51		QUAD	J BEND		1		1.27 mm		compliant			20	S-PQCC-J20	Not Qualified		3.6 V	INDUSTRIAL	3 V		SYNCHRONOUS					64KX8	4.572 mm	8			524288 bit	PARALLEL/SERIAL	CONFIGURATION MEMORY								8.9662 mm	8.9662 mm
	Mfr Part No XC18V512VQG44C0901	AMD Xilinx	Datasheet	794 In Stock	-	Min: 1 Mult: 1				YES		44	15 ns				XILINX INC		3	65536 words	64000	85 °C	-40 °C	PLASTIC/EPOXY	TQFP	PLASTIC, VQFP-44		SQUARE	FLATPACK, THIN PROFILE	Obsolete	QFP	Yes	3.3 V					e3	Yes				3A991.B.1.B.2		MATTE TIN		8542.32.00.51		QUAD	GULL WING		1		0.8 mm		compliant			44	S-PQFP-G44	Not Qualified		3.6 V	INDUSTRIAL	3 V		SYNCHRONOUS					64KX8	1.2 mm	8			524288 bit	PARALLEL/SERIAL	CONFIGURATION MEMORY								10 mm	10 mm
	Mfr Part No XC18V01SOG20C0901	AMD Xilinx	Datasheet	260 In Stock	-	Min: 1 Mult: 1				YES		20	15 ns				XILINX INC		3	131072 words	128000	85 °C	-40 °C	PLASTIC/EPOXY	SOP	SOIC-20		RECTANGULAR	SMALL OUTLINE	Obsolete	SOIC	Yes	3.3 V					e3	Yes				3A991.B.1.B.2		MATTE TIN		8542.32.00.51		DUAL	GULL WING		1		1.27 mm		compliant			20	R-PDSO-G20	Not Qualified		3.6 V	INDUSTRIAL	3 V		SYNCHRONOUS					128KX8	2.65 mm	8			1048576 bit	PARALLEL/SERIAL	CONFIGURATION MEMORY								12.8 mm	7.5 mm
	Mfr Part No XC18V512VQ44C0901	AMD Xilinx	Datasheet	539 In Stock	-	Min: 1 Mult: 1				YES		44	15 ns				XILINX INC		3	65536 words	64000	85 °C	-40 °C	PLASTIC/EPOXY	TQFP	TQFP,		SQUARE	FLATPACK, THIN PROFILE	Obsolete	QFP	No	3.3 V					e0					3A991.B.1.B.2		TIN LEAD		8542.32.00.51		QUAD	GULL WING		1		0.8 mm		compliant			44	S-PQFP-G44	Not Qualified		3.6 V	INDUSTRIAL	3 V		SYNCHRONOUS					64KX8	1.2 mm	8			524288 bit	PARALLEL/SERIAL	CONFIGURATION MEMORY								10 mm	10 mm
	Mfr Part No MX26C512APC-70	Macronix International Co Ltd	Datasheet	-	-	Min: 1 Mult: 1				NO		28	70 ns				MACRONIX INTERNATIONAL CO LTD			65536 words	64000	70 °C		PLASTIC/EPOXY	DIP	DIP, DIP28,.6	DIP28,.6	RECTANGULAR	IN-LINE	Obsolete	DIP	No	5 V					e0					3A991.B.1.B.2		TIN LEAD	100 ERASE/PROGRAM CYCLES MIN	8542.32.00.51		DUAL	THROUGH-HOLE		1		2.54 mm		unknown			28	R-PDIP-T28	Not Qualified		5.5 V	COMMERCIAL	4.5 V		ASYNCHRONOUS	0.03 mA				64KX8		8		0.0001 A	524288 bit	PARALLEL	EEPROM	12 V			NO	NO	NO
	Mfr Part No PM37LV512-70JC	Programmable Microelectronics Corp	Datasheet	-	-	Min: 1 Mult: 1				YES		32	70 ns		2.54x2.54	45.50	PROGRAMMABLE MICROELECTRONICS CORP			65536 words	64000	70 °C		PLASTIC/EPOXY	QCCJ	QCCJ, LDCC32,.5X.6	LDCC32,.5X.6	RECTANGULAR	CHIP CARRIER	Transferred				28.52119/300									3A991.B.1.B.2	ECS type prototype board			8542.32.00.51		QUAD	J BEND				1.27 mm	160 mm	unknown				R-PQCC-J32	Not Qualified			COMMERCIAL				0.015 mA				64KX8		8		0.003 A	524288 bit	PARALLEL	EEPROM				NO	NO	YES			100 mm	1.6 mm
	Mfr Part No W27E512-45	Winbond Electronics Corp	Datasheet	-	-	Min: 1 Mult: 1				NO		28	45 ns				WINBOND ELECTRONICS CORP			65536 words	64000	70 °C		PLASTIC/EPOXY	DIP	DIP, DIP28,.6	DIP28,.6	RECTANGULAR	IN-LINE	Obsolete	DIP	No	5 V					e0					3A991.B.1.B.2		TIN LEAD		8542.32.00.51		DUAL	THROUGH-HOLE		1		2.54 mm		unknown			28	R-PDIP-T28	Not Qualified		5.5 V	COMMERCIAL	4.5 V		ASYNCHRONOUS	0.03 mA				64KX8	5.33 mm	8		0.0001 A	524288 bit	PARALLEL	EEPROM	12 V			NO	NO	NO		37.08 mm	15.24 mm
	Mfr Part No XC18V01VQG44C0901	AMD Xilinx	Datasheet	475 In Stock	-	Min: 1 Mult: 1				YES		44	15 ns				XILINX INC		3	131072 words	128000	85 °C	-40 °C	PLASTIC/EPOXY	TQFP	PLASTIC, VQFP-44		SQUARE	FLATPACK, THIN PROFILE	Obsolete	QFP	Yes	3.3 V					e3	Yes				3A991.B.1.B.2		MATTE TIN		8542.32.00.51		QUAD	GULL WING		1		0.8 mm		compliant			44	S-PQFP-G44	Not Qualified		3.6 V	INDUSTRIAL	3 V		SYNCHRONOUS					128KX8	1.2 mm	8			1048576 bit	PARALLEL/SERIAL	CONFIGURATION MEMORY								10 mm	10 mm
	Mfr Part No W27E512-55	Winbond Electronics Corp	Datasheet	-	-	Min: 1 Mult: 1				NO		28	55 ns				WINBOND ELECTRONICS CORP			65536 words	64000	70 °C		PLASTIC/EPOXY	DIP	DIP, DIP28,.6	DIP28,.6	RECTANGULAR	IN-LINE	Obsolete	DIP	No	5 V					e0					3A991.B.1.B.2		TIN LEAD		8542.32.00.51		DUAL	THROUGH-HOLE		1		2.54 mm		unknown			28	R-PDIP-T28	Not Qualified		5.5 V	COMMERCIAL	4.5 V		ASYNCHRONOUS	0.03 mA				64KX8	5.33 mm	8		0.0001 A	524288 bit	PARALLEL	EEPROM	12 V			NO	NO	NO		37.08 mm	15.24 mm
	Mfr Part No XC18V512PC20C0799	AMD Xilinx	Datasheet	726 In Stock	-	Min: 1 Mult: 1				YES		20	15 ns				XILINX INC			65536 words	64000	85 °C	-40 °C	PLASTIC/EPOXY	QCCJ	QCCJ,		SQUARE	CHIP CARRIER	Obsolete	QLCC		3.3 V										3A991.B.1.B.2				8542.32.00.51		QUAD	J BEND		1		1.27 mm		unknown			20	S-PQCC-J20	Not Qualified		3.6 V	INDUSTRIAL	3 V		SYNCHRONOUS					64KX8	4.572 mm	8			524288 bit	PARALLEL/SERIAL	CONFIGURATION MEMORY								8.9662 mm	8.9662 mm
	Mfr Part No XC18V01PC20C0799	AMD Xilinx	Datasheet	725 In Stock	-	Min: 1 Mult: 1				YES		20	15 ns				XILINX INC			131072 words	128000	85 °C	-40 °C	PLASTIC/EPOXY	QCCJ	QCCJ,		SQUARE	CHIP CARRIER	Obsolete	QLCC		3.3 V										3A991.B.1.B.2				8542.32.00.51		QUAD	J BEND		1		1.27 mm		unknown			20	S-PQCC-J20	Not Qualified		3.6 V	INDUSTRIAL	3 V		SYNCHRONOUS					128KX8	4.572 mm	8			1048576 bit	PARALLEL/SERIAL	CONFIGURATION MEMORY								8.9662 mm	8.9662 mm
	Mfr Part No XC18512SO20C	AMD Xilinx	Datasheet	-	-	Min: 1 Mult: 1				YES		20	45 ns	15 MHz			XILINX INC		3	524288 words	512000	70 °C		PLASTIC/EPOXY	SOP	SOP-20	SOP20,.4	RECTANGULAR	SMALL OUTLINE	Obsolete	SOIC	No	3.3 V					e0					3A991.B.1.B.2	NOR TYPE	TIN LEAD	SERIAL MODE ALSO AVAILABLE	8542.32.00.51		DUAL	GULL WING	225	1		1.27 mm		not_compliant		30	20	R-PDSO-G20	Not Qualified		3.6 V	COMMERCIAL	3 V		SYNCHRONOUS	0.03 mA				512KX1	2.65 mm	1		0.0001 A	524288 bit	PARALLEL	CONFIGURATION MEMORY		10000 Write/Erase Cycles	10					12.8 mm	7.5 mm