The category is 'Memory'
Memory (3135)
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- ECCN Code:
3A991.B.2.A
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Material | Housing Material | Shape | Package Cooled | Material Finish | Number of Terminals | Access Time-Max | Approvals | Base Product Number | Clock Frequency-Max (fCLK) | Conductor category | Conductor surface | Contact Materials | Core colour | Core identification | Current-IEC | Flame retardant | Ihs Manufacturer | Insulator Material | Lead Free Status / RoHS Status | Low smoke (according to EN 61034-2) | Manufacturer | Manufacturer Part Number | Material core insulation | Memory Types | Mfr | Moisture Sensitivity Levels | MSL | Nominal voltage U | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Outer diameter approx. | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Permitted cable outer temperature after assembling without vibration | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Supply Voltage-Nom (Vsup) | Torque-Screw | Operating Temperature | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | ECCN Code | Type | Number of Positions | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Color | Additional Feature | HTS Code | Subcategory | Pitch | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Ingress Protection | Terminal Pitch | Insulation Height | Reach Compliance Code | Current Rating | Frequency | Pin Count | Shell Size - Insert | Termination Style | JESD-30 Code | Qualification Status | Output Voltage | Output Type | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Note | Voltage | Contact Tail Length | Interface | Max Supply Voltage | Min Supply Voltage | Memory Size | Attachment Method | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Number of Levels | Number of Ports | Operating Mode | Clock Frequency | Supply Current-Max | Contact Mating Finish | Access Time | Memory Format | Memory Interface | Wire Gauge or Range - AWG | Organization | Output Characteristics | Positions Per Level | Seated Height-Max | Memory Width | Plug Wire Entry | Header Orientation | Write Cycle Time - Word, Page | Wire Gauge or Range - mm² | Wire Strip Length | Standby Current-Max | Memory Density | Screw Size | Parallel/Serial | I/O Type | Memory IC Type | Standby Voltage-Min | Large Diameter Recovered | Large Diameter Supplied | Small Diameter Recovered | Small Diameter Supplied | Large Recovered Length | Total Length Recovered | Small Recovered Length | Thermal Resistance @ Natural | Power Dissipation @ Temperature Rise | Connection Type | Features | Input Voltage | Total Length Supplied | Memory Organization | Diameter | Length | Width | Material Flammability Rating | Lead Free |
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![]() | Mfr Part No CY7C4022KV13-933FCXI | Infineon | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 361-BBGA, FCBGA | YES | 361-FCBGA (21x21) | Polyolefin (PO), Semi-Flexible | 361 | CY7C4022 | CYPRESS SEMICONDUCTOR CORP | -- | Cypress Semiconductor | CY7C4022KV13-933FCXI | Volatile | Infineon Technologies | 4194304 words | 4000000 | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | HBGA | HBGA, | SQUARE | GRID ARRAY, HEAT SINK/SLUG | Active | Active | NOT SPECIFIED | 5.79 | Yes | 1.3 V | -40°C ~ 85°C (TA) | Thermofit 322A1 | Active | -- | 3A991.B.2.A | Boot, Transition - Breakout, 2:1 (T) | Black | 8542.32.00.41 | SRAM - Synchronous, QDR IV | 1.26V ~ 1.34V | BOTTOM | BALL | NOT SPECIFIED | 1 | 1 mm | compliant | 34 | S-PBGA-B361 | 1.34 V | INDUSTRIAL | 1.26 V | 72Mbit | SYNCHRONOUS | 933 MHz | SRAM | Parallel | 4MX18 | 2.765 mm | 18 | - | 75497472 bit | PARALLEL | QDR SRAM | 0.500 (12.70mm) | 1.060 (26.92mm) | 0.230 (5.84mm) | 0.520 (13.21mm) | 2.118 (53.80mm) | 4.240 (107.70mm) | 1.520 (38.61mm) | -- | -- | 4M x 18 | 21 mm | 21 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No IDT70V657S12BF | Renesas | Datasheet | - | - | Min: 1 Mult: 1 | Cable | YES | 208 | 12 ns | INTEGRATED DEVICE TECHNOLOGY INC | Integrated Device Technology Inc | IDT70V657S12BF | 3 | 32768 words | 32000 | 70 °C | PLASTIC/EPOXY | TFBGA | TFBGA, BGA208,17X17,32 | BGA208,17X17,32 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | BGA | 20 | 5.14 | Compliant | No | 3.3 V | e0 | No | 3A991.B.2.A | Tin/Lead (Sn63Pb37) | White | 8542.32.00.41 | SRAMs | CMOS | BOTTOM | BALL | 225 | 1 | 0.8 mm | not_compliant | 208 | S-PBGA-B208 | Not Qualified | 3.45 V | 2.5/3.3,3.3 V | COMMERCIAL | 3.15 V | 2 | ASYNCHRONOUS | 0.465 mA | 32KX36 | 3-STATE | 1.2 mm | 36 | 0.015 A | 1179648 bit | PARALLEL | COMMON | DUAL-PORT SRAM | 3.15 V | 15 mm | 15 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No CY7C4042KV13-106FCXC | Infineon | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 361-BBGA, FCBGA | YES | 361-FCBGA (21x21) | 361 | CY7C4042 | CYPRESS SEMICONDUCTOR CORP | Cypress Semiconductor | CY7C4042KV13-106FCXC | Volatile | Infineon Technologies | 2097152 words | 2000000 | 70 °C | Tray | PLASTIC/EPOXY | HBGA | HBGA, | SQUARE | GRID ARRAY, HEAT SINK/SLUG | Active | Active | NOT SPECIFIED | 5.76 | Yes | 1.3 V | 0°C ~ 70°C (TA) | - | 3A991.B.2.A | 8542.32.00.41 | SRAM - Synchronous, QDR IV | 1.26V ~ 1.34V | BOTTOM | BALL | NOT SPECIFIED | 1 | 1 mm | compliant | S-PBGA-B361 | 1.34 V | COMMERCIAL | 1.26 V | 72Mbit | SYNCHRONOUS | 1.066 GHz | SRAM | Parallel | 2MX36 | 2.765 mm | 36 | - | 75497472 bit | PARALLEL | QDR SRAM | 2M x 36 | 21 mm | 21 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AS7C32098A-12TI | Alliance Memory | Datasheet | - | - | Min: 1 Mult: 1 | - | YES | - | 44 | 12 ns | ELFH211 | - | - | ALLIANCE MEMORY INC | Alliance Memory Inc | AS7C32098A-12TI | Amphenol PCD | 131072 words | 128000 | 85 °C | -40 °C | Bulk | PLASTIC/EPOXY | TSOP2 | TSOP2, TSOP44,.46,32 | TSOP44,.46,32 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Obsolete | TSOP2 | Active | 30 | 5.49 | No | 3.3 V | - | - | - | e0 | No | 3A991.B.2.A | - | - | TIN LEAD | - | 8542.32.00.41 | SRAMs | - | CMOS | DUAL | GULL WING | 240 | 1 | - | 0.8 mm | - | compliant | 44 | - | R-PDSO-G44 | Not Qualified | 3.6 V | 3.3 V | INDUSTRIAL | 3 V | - | - | ASYNCHRONOUS | 0.16 mA | - | - | 128KX16 | 3-STATE | - | 1.2 mm | 16 | - | - | - | - | 0.008 A | 2097152 bit | - | PARALLEL | COMMON | STANDARD SRAM | 3 V | - | 18.415 mm | 10.16 mm | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 71V416L12PHI | Renesas | Datasheet | - | - | Min: 1 Mult: 1 | YES | 44 | 12 ns | INTEGRATED DEVICE TECHNOLOGY INC | Integrated Device Technology Inc | 71V416L12PHI | 3 | 262144 words | 256000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSOP2 | 0.400 INCH, TSOP2-44 | TSOP44,.46,32 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Obsolete | TSOP2 | 5.36 | No | 3.3 V | e0 | 3A991.B.2.A | Tin/Lead (Sn85Pb15) | 8542.32.00.41 | SRAMs | CMOS | DUAL | GULL WING | 1 | 0.8 mm | not_compliant | 44 | R-PDSO-G44 | Not Qualified | 3.6 V | 3.3 V | INDUSTRIAL | 3 V | ASYNCHRONOUS | 0.17 mA | 256KX16 | 3-STATE | 1.2 mm | 16 | 0.01 A | 4194304 bit | PARALLEL | COMMON | STANDARD SRAM | 3 V | 18.41 mm | 10.16 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No CY62168DV30LL-70BVXI | Cypress | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 70 ns | CYPRESS SEMICONDUCTOR CORP | Cypress Semiconductor | CY62168DV30LL-70BVXI | Cypress Semiconductor Corp | 3 | 2097152 words | 2000000 | 85 °C | -40 °C | Bulk | PLASTIC/EPOXY | VFBGA | VFBGA, | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Obsolete | BGA | Obsolete | 20 | 8.52 | Yes | 3 V | * | e1 | 3A991.B.2.A | TIN SILVER COPPER | 8542.32.00.41 | CMOS | BOTTOM | BALL | 260 | 1 | 0.75 mm | unknown | 48 | R-PBGA-B48 | Not Qualified | 3.6 V | INDUSTRIAL | 2.2 V | ASYNCHRONOUS | 2MX8 | 1 mm | 8 | 16777216 bit | PARALLEL | STANDARD SRAM | 9.5 mm | 8 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No GS880Z36BT-150 | GSI | Datasheet | - | - | Min: 1 Mult: 1 | YES | Aluminum | Rectangular, Fins | Assorted (BGA, LGA, CPU, ASIC...) | Blue Anodized | 100 | 7.5 ns | ROCHESTER ELECTRONICS LLC | Rochester Electronics LLC | GS880Z36BT-150 | 262144 words | 256000 | 70 °C | PLASTIC/EPOXY | LQFP | LQFP, | RECTANGULAR | FLATPACK, LOW PROFILE | Contact Manufacturer | 5.62 | 2.5 V | pushPIN™ | Active | 3A991.B.2.A | Top Mount | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY | 8542.32.00.41 | CMOS | QUAD | GULL WING | 1 | 0.65 mm | unknown | R-PQFP-G100 | 2.7 V | COMMERCIAL | 2.3 V | Push Pin | 0.700 (17.78mm) | 9.12°C/W @ 100 LFM | SYNCHRONOUS | 256KX36 | 1.6 mm | 36 | 9437184 bit | PARALLEL | ZBT SRAM | -- | -- | -- | 1.450 (36.83mm) | 2.267 (57.60mm) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No IDT71V124SA12YG | Renesas | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | 12 ns | INTEGRATED DEVICE TECHNOLOGY INC | Integrated Device Technology Inc | IDT71V124SA12YG | PEI-Genesis | 3 | 131072 words | 128000 | 70 °C | Bulk | PLASTIC/EPOXY | SOJ | SOJ, SOJ32,.44 | SOJ32,.44 | RECTANGULAR | SMALL OUTLINE | Active | SOJ | Active | 30 | 1.9 | Yes | 3.3 V | * | e3 | Yes | 3A991.B.2.A | Matte Tin (Sn) - annealed | 8542.32.00.41 | SRAMs | CMOS | DUAL | J BEND | 260 | 1 | 1.27 mm | compliant | 32 | R-PDSO-J32 | Not Qualified | 3.6 V | 3.3 V | COMMERCIAL | 3.15 V | ASYNCHRONOUS | 0.13 mA | 128KX8 | 3-STATE | 3.683 mm | 8 | 0.01 A | 1048576 bit | PARALLEL | COMMON | STANDARD SRAM | 3 V | 20.955 mm | 10.16 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No IDT70V3579S6BC | Renesas | Datasheet | - | - | Min: 1 Mult: 1 | YES | 256 | 256 | 6 ns | 83 MHz | INTEGRATED DEVICE TECHNOLOGY INC | Integrated Device Technology Inc | IDT70V3579S6BC | RAM, SRAM | Glenair | 3 | 32768 words | 32000 | 70 °C | Retail Package | PLASTIC/EPOXY | LBGA | LBGA, BGA256,16X16,40 | BGA256,16X16,40 | SQUARE | GRID ARRAY, LOW PROFILE | Active | BGA | Active | 20 | 5.15 | Compliant | No | 3.3 V | * | e0 | No | 3A991.B.2.A | Tin/Lead (Sn63Pb37) | 70 °C | 0 °C | PIPELINED OUTPUT MODE, SELF-TIMED WRITE CYCLE | 8542.32.00.41 | SRAMs | CMOS | BOTTOM | BALL | 225 | 1 | 1 mm | not_compliant | 256 | S-PBGA-B256 | Not Qualified | 3.45 V | 2.5/3.3,3.3 V | COMMERCIAL | 3.15 V | Parallel | 2 | SYNCHRONOUS | 0.31 mA | 32KX36 | 3-STATE | 1.5 mm | 36 | 1179648 bit | PARALLEL | COMMON | DUAL-PORT SRAM | 3.15 V | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No IDT7009L20PFI | Renesas | Datasheet | - | - | Min: 1 Mult: 1 | YES | 100 | 20 ns | INTEGRATED DEVICE TECHNOLOGY INC | Integrated Device Technology Inc | IDT7009L20PFI | RAM, SRAM | 3 | 131072 words | 128000 | 85 °C | -40 °C | PLASTIC/EPOXY | LFQFP | 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100 | QFP100,.63SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Obsolete | QFP | 20 | 5.25 | Compliant | No | 5 V | e0 | No | 3A991.B.2.A | Tin/Lead (Sn85Pb15) | 85 °C | -40 °C | 8542.32.00.41 | SRAMs | CMOS | QUAD | GULL WING | 240 | 1 | 0.5 mm | not_compliant | 100 | S-PQFP-G100 | Not Qualified | 5.5 V | 5 V | INDUSTRIAL | 4.5 V | Parallel | 2 | ASYNCHRONOUS | 0.36 mA | 128KX8 | 3-STATE | 1.6 mm | 8 | 0.006 A | 1048576 bit | PARALLEL | COMMON | DUAL-PORT SRAM | 4.5 V | 14 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No CY7C1069BV33-10ZXI | Infineon | Datasheet | - | - | Min: 1 Mult: 1 | YES | 54 | 10 ns | Class 5 = flexible | Bare | Orange | Colour | No | CYPRESS SEMICONDUCTOR CORP | No | Cypress Semiconductor | CY7C1069BV33-10ZXI | Polyvinyl chloride (PVC) | 24 | 2097152 words | 2000000 | 85 °C | -40 °C | 2.7 | PLASTIC/EPOXY | TSOP2 | TSOP2, | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Obsolete | TSOP2 | -25 - 90 | 5.75 | Yes | 3.3 V | 3A991.B.2.A | 8542.32.00.41 | CMOS | DUAL | GULL WING | 1 | 0.8 mm | unknown | 54 | R-PDSO-G54 | Not Qualified | 3.6 V | INDUSTRIAL | 3 V | ASYNCHRONOUS | 2MX8 | 1.2 mm | 8 | 16777216 bit | PARALLEL | STANDARD SRAM | 22.415 mm | 10.16 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No CY7C1380D-167AXC | Infineon | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 100-LQFP | YES | 100-TQFP (14x20) | 100 | 3.4 ns | CY7C1380 | 167 MHz | CYPRESS SEMICONDUCTOR CORP | Cypress Semiconductor | CY7C1380D-167AXC | Volatile | Infineon Technologies | 3 | 524288 words | 512000 | 70 °C | Tray | PLASTIC/EPOXY | LQFP | LQFP, QFP100,.63X.87 | QFP100,.63X.87 | RECTANGULAR | FLATPACK, LOW PROFILE | Obsolete | QFP | Obsolete | 40 | 8.18 | Yes | 3.3 V | 0°C ~ 70°C (TA) | - | e3 | Yes | 3A991.B.2.A | Matte Tin (Sn) | PIPELINED ARCHITECTURE | 8542.32.00.41 | SRAMs | SRAM - Synchronous, SDR | 3.135V ~ 3.6V | QUAD | GULL WING | 260 | 1 | 0.65 mm | compliant | 100 | R-PQFP-G100 | Not Qualified | 3.6 V | 2.5/3.3,3.3 V | COMMERCIAL | 3.135 V | 18Mbit | SYNCHRONOUS | 167 MHz | 0.275 mA | 3.4 ns | SRAM | Parallel | 512KX36 | 3-STATE | 1.6 mm | 36 | - | 0.07 A | 18874368 bit | PARALLEL | COMMON | CACHE SRAM | 512K x 36 | 20 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AS7C32096A-12TC | Alliance Memory | Datasheet | - | - | Min: 1 Mult: 1 | YES | 44 | 12 ns | CSA, UL | ALLIANCE MEMORY INC | Rubber | Cooper | E1015-50-COH | 262144 words | 256000 | 70 °C | PLASTIC/EPOXY | TSOP2 | TSOP2, TSOP44,.46,32 | TSOP44,.46,32 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Obsolete | TSOP2 | 30 | 5.61 | No | 3.3 V | e0 | No | 3A991.B.2.A | TIN LEAD | 8542.32.00.41 | SRAMs | CMOS | DUAL | GULL WING | 240 | 1 | 0.8 mm | compliant | 150 A | 44 | R-PDSO-G44 | Not Qualified | 3.6 V | 3/3.3 V | COMMERCIAL | 3 V | 600 VAC | ASYNCHRONOUS | 0.15 mA | 256KX8 | 3-STATE | 1.2 mm | 8 | 0.008 A | 2097152 bit | PARALLEL | COMMON | STANDARD SRAM | 3 V | Plug | 18.415 mm | 10.16 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AS7C4098A-12TI | Alliance Memory | Datasheet | - | - | Min: 1 Mult: 1 | YES | 44 | 12 ns | ALLIANCE SEMICONDUCTOR CORP | Alliance Semiconductor Corporation | AS7C4098A-12TI | 262144 words | 256000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSOP2 | TSOP2, | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Transferred | TSOP2 | 30 | 8.36 | Non-Compliant | No | 5 V | e0 | No | 3A991.B.2.A | TIN LEAD | 8542.32.00.41 | CMOS | DUAL | GULL WING | 225 | 1 | 0.8 mm | unknown | 44 | R-PDSO-G44 | Not Qualified | 5.5 V | INDUSTRIAL | 4.5 V | ASYNCHRONOUS | 256KX16 | 1.2 mm | 16 | 4194304 bit | PARALLEL | STANDARD SRAM | 18.415 mm | 10.16 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AS7C32098A-12TC | Alliance Memory | Datasheet | - | - | Min: 1 Mult: 1 | YES | 44 | 12 ns | ALLIANCE MEMORY INC | Dynapar | B581024HH722L0 | 131072 words | 128000 | 70 °C | PLASTIC/EPOXY | TSOP2 | TSOP2, TSOP44,.46,32 | TSOP44,.46,32 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Obsolete | TSOP2 | 30 | 5.49 | No | 3.3 V | e0 | No | 3A991.B.2.A | TIN LEAD | 8542.32.00.41 | SRAMs | CMOS | DUAL | GULL WING | 240 | 1 | 0.8 mm | compliant | 44 | R-PDSO-G44 | Not Qualified | 3.6 V | 3.3 V | COMMERCIAL | 3 V | ASYNCHRONOUS | 0.15 mA | 128KX16 | 3-STATE | 1.2 mm | 16 | 0.008 A | 2097152 bit | PARALLEL | COMMON | STANDARD SRAM | 3 V | 18.415 mm | 10.16 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AS7C32098A-15TC | Alliance Memory | Datasheet | - | - | Min: 1 Mult: 1 | YES | 44 | 15 ns | ALLIANCE MEMORY INC | ABB | ACH550-VCR-031A-2+F267+K451+L511 | 131072 words | 128000 | 70 °C | PLASTIC/EPOXY | TSOP2 | TSOP2, TSOP44,.46,32 | TSOP44,.46,32 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Obsolete | TSOP2 | 30 | 5.49 | No | 3.3 V | e0 | No | 3A991.B.2.A | TIN LEAD | 8542.32.00.41 | SRAMs | CMOS | DUAL | GULL WING | 240 | 1 | 0.8 mm | compliant | 44 | R-PDSO-G44 | Not Qualified | 3.6 V | 3.3 V | COMMERCIAL | 3 V | ASYNCHRONOUS | 0.13 mA | 128KX16 | 3-STATE | 1.2 mm | 16 | 0.008 A | 2097152 bit | PARALLEL | COMMON | STANDARD SRAM | 3 V | 18.415 mm | 10.16 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AS7C32098A-10TI | Alliance Memory | Datasheet | - | - | Min: 1 Mult: 1 | YES | 44 | 10 ns | ALLIANCE MEMORY INC | Danaher Controls | HS350800D1366 | 131072 words | 128000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSOP2 | TSOP2, TSOP44,.46,32 | TSOP44,.46,32 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Obsolete | TSOP2 | 30 | 5.49 | No | 3.3 V | e0 | No | 3A991.B.2.A | TIN LEAD | 8542.32.00.41 | SRAMs | CMOS | DUAL | GULL WING | 240 | 1 | 0.8 mm | compliant | 44 | R-PDSO-G44 | Not Qualified | 3.6 V | 3.3 V | INDUSTRIAL | 3 V | ASYNCHRONOUS | 0.18 mA | 128KX16 | 3-STATE | 1.2 mm | 16 | 0.008 A | 2097152 bit | PARALLEL | COMMON | STANDARD SRAM | 3 V | 18.415 mm | 10.16 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AS7C4096A-10JIN | Alliance Memory | Datasheet | - | - | Min: 1 Mult: 1 | YES | 36 | 10 ns | CSA, UL | ALLIANCE MEMORY INC | Thermoplastic Elastomer (TPE) | Cooper | E1016-1706S45-COH | 524288 words | 512000 | 85 °C | -40 °C | PLASTIC/EPOXY | SOJ | SOJ, SOJ36,.44 | SOJ36,.44 | RECTANGULAR | SMALL OUTLINE | Active | SOJ | 40 | 5.58 | Yes | 5 V | Yes | 3A991.B.2.A | 8542.32.00.41 | SRAMs | CMOS | DUAL | J BEND | 245 | 1 | 1.27 mm | compliant | 400 A | 36 | R-PDSO-J36 | Not Qualified | 5.5 V | 5 V | INDUSTRIAL | 4.5 V | 600 VAC | ASYNCHRONOUS | 0.16 mA | 512KX8 | 3-STATE | 3.7592 mm | 8 | 0.01 A | 4194304 bit | PARALLEL | COMMON | STANDARD SRAM | 4.5 V | Receptacle | 23.495 mm | 10.16 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No CY7C1062AV33-12BGC | Cypress | Datasheet | - | - | Min: 1 Mult: 1 | YES | 119 | 12 ns | ROCHESTER ELECTRONICS LLC | Rochester Electronics LLC | CY7C1062AV33-12BGC | PEI-Genesis | 3 | 524288 words | 512000 | 70 °C | Bulk | PLASTIC/EPOXY | BGA | BGA, | RECTANGULAR | GRID ARRAY | Contact Manufacturer | BGA | Active | NOT SPECIFIED | 5.56 | No | 3.3 V | * | e0 | No | 3A991.B.2.A | TIN LEAD | 8542.32.00.41 | CMOS | BOTTOM | BALL | 220 | 1 | 1.27 mm | unknown | 119 | R-PBGA-B119 | Not Qualified | 3.6 V | COMMERCIAL | 3 V | ASYNCHRONOUS | 512KX32 | 2.4 mm | 32 | 16777216 bit | PARALLEL | STANDARD SRAM | 22 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No N08L6182AB7IT | ON Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | SMD | YES | 48 | 85 ns | ON SEMICONDUCTOR | ON Semiconductor | N08L6182AB7IT | 1 | n/a | 524288 words | 512000 | 85 °C | -40 °C | PLASTIC/EPOXY | TFBGA | 8 X 10 MM, BGA-48 | BGA48,6X8,30 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | Obsolete | BGA | NOT SPECIFIED | 5.88 | Yes | No | 1.8 V | -40...+150°C | LTC | 3A991.B.2.A | 85 °C | -40 °C | 8542.32.00.41 | SRAMs | CMOS | BOTTOM | BALL | 225 | 1 | 0.75 mm | not_compliant | 200kHz | 48 | R-PBGA-B48 | Not Qualified | - | Adjustable | 2.2 V | 1.8/2 V | INDUSTRIAL | 1.65 V | - | 2.2 V | 1.65 V | 1 MB | ASYNCHRONOUS | 0.014 mA | 85 ns | 512KX16 | 3-STATE | 1.2 mm | 16 | 0.00001 A | 8388608 bit | PARALLEL | COMMON | STANDARD SRAM | 1.2 V | - | 10 mm | 8 mm | Contains Lead |
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