The category is 'Memory'
Memory (6000)
- All Manufacturers
- ECCN Code
- Memory Format
- Memory Interface
- Memory Size
- Memory Types
- Moisture Sensitivity Level (MSL)
- Mounting Type
- Number of Terminations
- Operating Temperature
- Package / Case
- Packaging
- Part Status
- ECCN Code:
EAR99
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Number of Terminals | Access Time-Max | Base Product Number | Clock Frequency-Max (fCLK) | Frequency(Max) | Ihs Manufacturer | Manufacturer | Manufacturer Part Number | Memory Types | Mfr | Moisture Sensitivity Levels | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | Rohs Code | Supply Voltage-Nom (Vsup) | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Type | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Subcategory | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Supply Voltage | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Number of Channels | Interface | Memory Size | Analog IC - Other Type | Number of Ports | Nominal Supply Current | Operating Mode | Adjustable Threshold | Clock Frequency | Supply Current-Max | Access Time | Memory Format | Memory Interface | Data Bus Width | Organization | Output Characteristics | Seated Height-Max | Memory Width | Write Cycle Time - Word, Page | Address Bus Width | Density | Standby Current-Max | Memory Density | Screening Level | Access Time (Max) | Parallel/Serial | I/O Type | Sync/Async | Word Size | Memory IC Type | Programming Voltage | Serial Bus Type | Endurance | Write Cycle Time-Max (tWC) | Data Retention Time-Min | Write Protection | Standby Voltage-Min | Alternate Memory Width | Data Polling | Toggle Bit | Command User Interface | Number of Sectors/Size | Sector Size | Ready/Busy | Boot Block | Refresh Cycles | Common Flash Interface | I2C Control Byte | Sequential Burst Length | Interleaved Burst Length | Access Mode | Self Refresh | Memory Organization | Height Seated (Max) | Length | Width | Radiation Hardening | RoHS Status | Lead Free |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No CY7C006A-15AXC | Cypress Semiconductor Corp | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | Surface Mount | 64-LQFP | 64 | Volatile | 0°C~70°C TA | Tray | 1997 | e4 | Obsolete | 3 (168 Hours) | 64 | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | 4.5V~5.5V | QUAD | 260 | 1 | 5V | 0.8mm | unknown | 15GHz | 20 | CY7C006 | 64 | Not Qualified | 5V | 5V | 128Kb 16K x 8 | 2 | 280mA | SRAM | Parallel | 16KX8 | 3-STATE | 8 | 15ns | 28b | 128 kb | 0.0015A | 15 ns | COMMON | Asynchronous | 8b | 1.6mm | 14mm | ROHS3 Compliant | Lead Free | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No IS43DR16640B-3DBI | ISSI, Integrated Silicon Solution Inc | Datasheet | 400 | - | Min: 1 Mult: 1 | Surface Mount | 84-TFBGA | YES | 84 | Volatile | -40°C~85°C TA | Tray | Last Time Buy | 3 (168 Hours) | 84 | EAR99 | AUTO/SELF REFRESH | 8542.32.00.32 | 1.7V~1.9V | BOTTOM | NOT SPECIFIED | 1 | 1.8V | 0.8mm | NOT SPECIFIED | Not Qualified | 1.8V | 1.9V | 1.7V | 1Gb 64M x 16 | 1 | SYNCHRONOUS | 333MHz | 450ps | DRAM | Parallel | 16b | 64MX16 | 3-STATE | 16 | 15ns | 1 Gb | 0.015A | COMMON | 8192 | 48 | 48 | 1.2mm | 12.5mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No EDB2432B4MA-1DAAT-F-D | Micron Technology Inc. | Datasheet | 1216 | - | Min: 1 Mult: 1 | 10 Weeks | Surface Mount | 134-VFBGA | YES | Volatile | -40°C~105°C TC | Bulk | Last Time Buy | 3 (168 Hours) | 134 | EAR99 | SELF REFRESH; IT ALSO REQUIRES 1.8V NOM | 1.14V~1.95V | BOTTOM | NOT SPECIFIED | 1 | 1.2V | 0.65mm | NOT SPECIFIED | R-PBGA-B134 | 1.3V | 1.14V | 2Gb 64M x 32 | 1 | SYNCHRONOUS | 533MHz | DRAM | Parallel | 64MX32 | 32 | 2147483648 bit | SINGLE BANK PAGE BURST | 1mm | 11.5mm | 10mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No IS43DR16320E-3DBLI | ISSI, Integrated Silicon Solution Inc | Datasheet | 8 |
| Min: 1 Mult: 1 | 8 Weeks | Surface Mount | 84-TFBGA | YES | Volatile | -40°C~85°C TA | Tray | Active | 3 (168 Hours) | 84 | EAR99 | AUTO/SELF REFRESH | 1.7V~1.9V | BOTTOM | NOT SPECIFIED | 1 | 1.8V | 0.8mm | NOT SPECIFIED | R-PBGA-B84 | 1.9V | 1.7V | 512Mb 32M x 16 | 1 | SYNCHRONOUS | 333MHz | 450ns | DRAM | Parallel | 32MX16 | 16 | 15ns | 536870912 bit | 1.2mm | 10.5mm | 8mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No FM22LD16-55-BGTR | Cypress Semiconductor Corp | Datasheet | 5 |
| Min: 1 Mult: 1 | 9 Weeks | Surface Mount | Surface Mount | 48-TFBGA | 48 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2009 | F-RAM™ | e1 | Active | 3 (168 Hours) | 48 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.32.00.71 | 2.7V~3.6V | BOTTOM | 260 | 1 | 3.3V | 0.75mm | NOT SPECIFIED | FM22LD16 | 48 | Not Qualified | 3.3V | 3.6V | 2.7V | 4Mb 256K x 16 | 12mA | ASYNCHRONOUS | FRAM | Parallel | 16b | 256KX16 | 16 | 110ns | 4 Mb | 0.00015A | 55 ns | 16b | 1.2mm | 8mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MX25L1606EMI-12G | Macronix | Datasheet | - | - | Min: 1 Mult: 1 | SOIC | YES | 86MHz | FLASH, NOR | 16 | EAR99 | 85°C | -40°C | 8542.32.00.51 | DUAL | GULL WING | NOT SPECIFIED | 1 | 3V | 1.27mm | 86MHz | NOT SPECIFIED | 16 | R-PDSO-G16 | Not Qualified | 3.6V | 3/3.3V | INDUSTRIAL | 2.7V | SPI, Serial | SYNCHRONOUS | 8MX2 | 2 | 16 Mb | 0.00002A | 2.7V | SPI | 100000 Write/Erase Cycles | HARDWARE/SOFTWARE | 1 | 2.65mm | 10.3mm | 7.52mm | RoHS Compliant | Lead Free | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No BR24L16-W | ROHM Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | Through Hole | Through Hole | 8-DIP (0.300, 7.62mm) | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2011 | e3/e2 | yes | Obsolete | 1 (Unlimited) | 8 | EAR99 | TIN/TIN COPPER | 1.8V~5.5V | DUAL | 260 | 1 | 2.5V | 2.54mm | 10 | BR24L16 | 8 | Not Qualified | 5.5V | 2/5V | 2-Wire, I2C, Serial | 16Kb 2K x 8 | SYNCHRONOUS | 400kHz | 900 ns | EEPROM | I2C | 8 | 5ms | 16 kb | 0.000002A | I2C | 1000000 Write/Erase Cycles | 5ms | 40 | HARDWARE | 1010MMMR | 3.7mm | 9.3mm | 7.62mm | ROHS3 Compliant | Lead Free | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No CY7C144-15JXC | Cypress Semiconductor Corp | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 68-LCC (J-Lead) | YES | Volatile | 0°C~70°C TA | Tray | 1996 | e3 | Obsolete | 3 (168 Hours) | 68 | EAR99 | Matte Tin (Sn) | 8542.32.00.41 | 4.5V~5.5V | QUAD | 260 | 1 | 5V | 1.27mm | unknown | 20 | CY7C144 | 68 | S-PQCC-J68 | Not Qualified | 5.5V | 5V | 4.5V | 64Kb 8K x 8 | 2 | SRAM | Parallel | 8KX8 | 3-STATE | 8 | 15ns | 0.015A | 65536 bit | 15 ns | COMMON | 4.5V | 5.08mm | 24.2316mm | 24.2316mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No AT45DB041D-SU-2.5 | Adesto Technologies | Datasheet | 4 | - | Min: 1 Mult: 1 | Surface Mount | Surface Mount | 8-SOIC (0.209, 5.30mm Width) | 8 | Non-Volatile | -40°C~85°C TC | Tube | e3 | yes | Obsolete | 1 (Unlimited) | 8 | EAR99 | Matte Tin (Sn) | 2.5V~3.6V | DUAL | 260 | 1 | 2.7V | 1.27mm | 8 | 3.6V | 2.5V | SPI, Serial | 4Mb 264Bytes x 2048 pages | 15mA | 50MHz | 8 ns | FLASH | SPI | 8b | 4MX1 | 1 | 4ms | 1b | 4 Mb | Synchronous | 2.7V | 2.16mm | 5.29mm | No | RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AT24C02A-10TC-2.7 | Atmel | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | 0.1 MHz | ATMEL CORP | Atmel Corporation | AT24C02A-10TC-2.7 | 256 words | 256 | 70 °C | PLASTIC/EPOXY | TSSOP | TSSOP, TSSOP8,.25 | TSSOP8,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | SOIC | NOT SPECIFIED | 5.71 | No | 3.3 V | e0 | No | EAR99 | Tin/Lead (Sn/Pb) | 2 WIRE SERIAL INTERFACE; DATA RETENTION 100 YEARS; 1 MILLION ENDURANCE WRITE CYCLES | 8542.32.00.51 | EEPROMs | CMOS | DUAL | GULL WING | NOT SPECIFIED | 1 | 0.65 mm | compliant | 8 | R-PDSO-G8 | Not Qualified | 5.5 V | 3/5 V | COMMERCIAL | 2.7 V | SYNCHRONOUS | 0.003 mA | 256X8 | 1.2 mm | 8 | 0.000004 A | 2048 bit | SERIAL | EEPROM | I2C | 1000000 Write/Erase Cycles | 10 ms | 100 | HARDWARE | 1010DDDR | 4.4 mm | 3 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AM27S35/BUA | Advanced Micro Devices | Datasheet | - | - | Min: 1 Mult: 1 | 1 Week | Surface Mount | 32-CLCC | YES | 32-CLCC | 32 | AM27S35 | ADVANCED MICRO DEVICES INC | AMD | AM27S35/BUA | Non-Volatile | Advanced Micro Devices | 1024 words | 1000 | 125 °C | -55 °C | Bulk | CERAMIC, METAL-SEALED COFIRED | QCCN | QCCN, LCC32,.45X.55 | LCC32,.45X.55 | RECTANGULAR | CHIP CARRIER | Obsolete | QFJ | Active | 5.41 | No | 5 V | Military grade | -55°C ~ 125°C (TC) | - | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.32.00.71 | OTP ROMs | 4.5V ~ 5.5V | QUAD | NO LEAD | 1 | 1.27 mm | unknown | 32 | R-CQCC-N32 | Not Qualified | 5.5 V | MILITARY | 4.5 V | 8Kbit | SYNCHRONOUS | 45 ns | PROM | Parallel | 1KX8 | 3-STATE | 2.54 mm | 8 | - | 8192 bit | 38535Q/M;38534H;883B | PARALLEL | OTP ROM | 1K x 8 | 13.97 mm | 11.43 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M29W160EB70ZS6F | Micron | Datasheet | - | - | Min: 1 Mult: 1 | YES | 64 | 70 ns | NUMONYX | Numonyx Memory Solutions | M29W160EB70ZS6F | 1048576 words | 1000000 | 85 °C | -40 °C | PLASTIC/EPOXY | LBGA | LBGA, BGA64,8X8,40 | BGA64,8X8,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | Transferred | BGA | NOT SPECIFIED | 5.16 | Yes | 3 V | EAR99 | NOR TYPE | BOTTOM BOOT BLOCK | 8542.32.00.51 | Flash Memories | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 | 1 mm | unknown | 64 | R-PBGA-B64 | Not Qualified | 3.6 V | 3/3.3 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.02 mA | 1MX16 | 1.4 mm | 16 | 0.0001 A | 16777216 bit | PARALLEL | FLASH | 3 V | 8 | YES | YES | YES | 1,2,1,31 | 16K,8K,32K,64K | YES | BOTTOM | YES | 13 mm | 11 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No W9812G2KB-6I | Winbond Electronics | Datasheet | 1092 |
| Min: 1 Mult: 1 | 10 Weeks | Surface Mount | 90-TFBGA | YES | Volatile | -40°C~85°C TA | Tray | 2016 | Active | 3 (168 Hours) | 90 | EAR99 | AUTO/SELF REFRESH | 3V~3.6V | BOTTOM | NOT SPECIFIED | 1 | 3.3V | 0.8mm | NOT SPECIFIED | R-PBGA-B90 | 3.6V | 3V | 128Mb 4M x 32 | 1 | SYNCHRONOUS | 166MHz | 5ns | DRAM | Parallel | 4MX32 | 32 | 134217728 bit | 1.2mm | 13mm | 8mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AM27S47A/BUA | Advanced Micro Devices | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 32-CLCC | YES | 32-CLCC | 32 | AM27S47A | ROCHESTER ELECTRONICS LLC | Rochester Electronics LLC | AM27S47A/BUA | Non-Volatile | Advanced Micro Devices | 2048 words | 2000 | 125 °C | -55 °C | Bulk | CERAMIC, METAL-SEALED COFIRED | QCCN | QCCN, | RECTANGULAR | CHIP CARRIER | Active | QFJ | Active | 5.41 | 5 V | -55°C ~ 125°C (TC) | - | EAR99 | 8542.32.00.71 | 4.5V ~ 5.5V | QUAD | NO LEAD | 1 | 1.27 mm | unknown | 32 | R-CQCC-N32 | Not Qualified | 5.5 V | MILITARY | 4.5 V | 16Kbit | SYNCHRONOUS | 45 ns | PROM | Parallel | 2KX8 | 2.54 mm | 8 | - | 16384 bit | PARALLEL | OTP ROM | 2K x 8 | 13.97 mm | 11.43 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No CAT25040LE-G | ON Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | NO | 8 | 10 MHz | ON SEMICONDUCTOR | ON Semiconductor | CAT25040LE-G | 512 words | 512 | 125 °C | -40 °C | PLASTIC/EPOXY | DIP | 0.300 INCH, HALOGEN FREE AND ROHS COMPLIANT, PLASTIC, MS-001, DIP-8 | DIP8,.3 | RECTANGULAR | IN-LINE | Active | DIP | NOT SPECIFIED | 5.09 | Yes | 5 V | e4 | Yes | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | 8542.32.00.51 | EEPROMs | CMOS | DUAL | THROUGH-HOLE | NOT SPECIFIED | 1 | 2.54 mm | compliant | 8 | R-PDIP-T8 | Not Qualified | 5.5 V | 2/5 V | AUTOMOTIVE | 2.5 V | SYNCHRONOUS | 0.002 mA | 512X8 | 5.33 mm | 8 | 0.000002 A | 4096 bit | SERIAL | EEPROM | SPI | 1000000 Write/Erase Cycles | 5 ms | 100 | HARDWARE/SOFTWARE | 9.27 mm | 7.62 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No BR25H160FVT-WE2 | Rohm | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | 5 MHz | ROHM CO LTD | ROHM Semiconductor | BR25H160FVT-WE2 | 2048 words | 2000 | 125 °C | -40 °C | PLASTIC/EPOXY | LSSOP | LEAD FREE, TSSOP-8 | RECTANGULAR | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | Active | SOIC | 10 | 5.76 | Yes | 2.5 V | e3/e2 | Yes | EAR99 | TIN/TIN COPPER | 8542.32.00.51 | CMOS | DUAL | GULL WING | 260 | 1 | 0.65 mm | compliant | 8 | R-PDSO-G8 | Not Qualified | 5.5 V | AUTOMOTIVE | 1.8 V | SYNCHRONOUS | 2KX8 | 1.25 mm | 8 | 16384 bit | SERIAL | EEPROM | SPI | 5 ms | 4.4 mm | 3 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No BR34E02FVT-W | Rohm | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | 0.1 MHz | ROHM CO LTD | ROHM Semiconductor | BR34E02FVT-W | 256 words | 256 | 85 °C | -40 °C | PLASTIC/EPOXY | LSSOP | LSSOP, TSSOP8,.25 | TSSOP8,.25 | RECTANGULAR | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | Active | SOIC | NOT SPECIFIED | 5.64 | Yes | 2.5 V | e2 | Yes | EAR99 | Tin/Copper (Sn/Cu) | 8542.32.00.51 | EEPROMs | CMOS | DUAL | GULL WING | NOT SPECIFIED | 1 | 0.65 mm | compliant | 8 | R-PDSO-G8 | Not Qualified | 3.6 V | 1.8/3.3 V | INDUSTRIAL | 1.7 V | SYNCHRONOUS | 0.003 mA | 256X8 | 1.25 mm | 8 | 0.000002 A | 2048 bit | SERIAL | EEPROM | I2C | 1000000 Write/Erase Cycles | 5 ms | 40 | HARDWARE/SOFTWARE | 1010DDDR | 4.4 mm | 3 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MT46V16M16P-5BIT:F | Micron | Datasheet | - | - | Min: 1 Mult: 1 | YES | 66 | 0.7 ns | 200 MHz | MICRON TECHNOLOGY INC | Micron Technology Inc | MT46V16M16P-5BIT:F | 16777216 words | 16000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSSOP, TSSOP66,.46 | TSSOP66,.46 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | TSOP | 30 | 8.42 | Yes | 2.6 V | e3 | EAR99 | Matte Tin (Sn) | AUTO/SELF REFRESH | 8542.32.00.24 | DRAMs | CMOS | DUAL | GULL WING | 260 | 1 | 0.65 mm | unknown | 66 | R-PDSO-G66 | Not Qualified | 2.7 V | 2.6 V | INDUSTRIAL | 2.5 V | 1 | SYNCHRONOUS | 0.51 mA | 16MX16 | 3-STATE | 1.2 mm | 16 | 0.004 A | 268435456 bit | COMMON | DDR DRAM | 8192 | 2,4,8 | 2,4,8 | FOUR BANK PAGE BURST | YES | 22.22 mm | 10.16 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AM27S25A/B3A | Advanced Micro Devices | Datasheet | - | - | Min: 1 Mult: 1 | 1 Week | Surface Mount | 28-CLCC | YES | 28-CLCC | 28 | 25 ns | AM27S25A | ADVANCED MICRO DEVICES INC | AMD | AM27S25A/B3A | Non-Volatile | Advanced Micro Devices | 512 words | 512 | 125 °C | -55 °C | Bulk | CERAMIC, METAL-SEALED COFIRED | QCCN | QCCN, LCC28,.45SQ | LCC28,.45SQ | SQUARE | CHIP CARRIER | Obsolete | QLCC | Active | 5.18 | No | 5 V | Military grade | -55°C ~ 125°C (TC) | - | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.32.00.71 | OTP ROMs | 4.5V ~ 5.5V | QUAD | NO LEAD | 1 | 1.27 mm | unknown | 28 | S-CQCC-N28 | Not Qualified | 5.5 V | MILITARY | 4.5 V | 4Kbit | SYNCHRONOUS | 35 ns | PROM | Parallel | 512X8 | 3-STATE | 1.905 mm | 8 | - | 4096 bit | 38535Q/M;38534H;883B | PARALLEL | OTP ROM | 512 x 8 | 11.43 mm | 11.43 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No CAT1024ZI-42-G | ON Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | ON SEMICONDUCTOR | ON Semiconductor | CAT1024ZI-42-G | 1 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSSOP, | SQUARE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | TSSOP | 40 | 5.61 | Yes | 5 V | e4 | Yes | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | RESET THRESHOLD VOLTAGE IS 4.375V; MANUAL RESET INPUT | 8542.39.00.01 | CMOS | DUAL | GULL WING | 260 | 1 | 0.65 mm | compliant | 8 | S-PDSO-G8 | Not Qualified | 5.5 V | INDUSTRIAL | 2.7 V | 1 | POWER SUPPLY SUPPORT CIRCUIT | NO | 1.1 mm | 3 mm | 3 mm |
-
CY7C006A-15AXC
Cypress Semiconductor Corp
Package:Memory
Price: please inquire
-
IS43DR16640B-3DBI
ISSI, Integrated Silicon Solution Inc
Package:Memory
Price: please inquire
-
EDB2432B4MA-1DAAT-F-D
Micron Technology Inc.
Package:Memory
Price: please inquire
-
IS43DR16320E-3DBLI
ISSI, Integrated Silicon Solution Inc
Package:Memory
8.594436
-
FM22LD16-55-BGTR
Cypress Semiconductor Corp
Package:Memory
4.164004
-
MX25L1606EMI-12G
Macronix
Package:Memory
Price: please inquire
-
BR24L16-W
ROHM Semiconductor
Package:Memory
Price: please inquire
-
CY7C144-15JXC
Cypress Semiconductor Corp
Package:Memory
Price: please inquire
-
AT45DB041D-SU-2.5
Adesto Technologies
Package:Memory
Price: please inquire
-
AT24C02A-10TC-2.7
Atmel
Package:Memory
Price: please inquire
-
AM27S35/BUA
Advanced Micro Devices
Package:Memory
Price: please inquire
-
M29W160EB70ZS6F
Micron
Package:Memory
Price: please inquire
-
W9812G2KB-6I
Winbond Electronics
Package:Memory
6.829429
-
AM27S47A/BUA
Advanced Micro Devices
Package:Memory
Price: please inquire
-
CAT25040LE-G
ON Semiconductor
Package:Memory
Price: please inquire
-
BR25H160FVT-WE2
Rohm
Package:Memory
Price: please inquire
-
BR34E02FVT-W
Rohm
Package:Memory
Price: please inquire
-
MT46V16M16P-5BIT:F
Micron
Package:Memory
Price: please inquire
-
AM27S25A/B3A
Advanced Micro Devices
Package:Memory
Price: please inquire
-
CAT1024ZI-42-G
ON Semiconductor
Package:Memory
Price: please inquire