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Memory (6000)

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ECCN Code:
EAR99

Part Number	Manufacturer	Datasheet	Availability	Pricing(USD)	Quantity	Surface Mount	Number of Terminals	Access Time-Max	Clock Frequency-Max (fCLK)	Ihs Manufacturer	Number of Words	Number of Words Code	Operating Temperature-Max	Operating Temperature-Min	Package Body Material	Package Code	Package Description	Package Equivalence Code	Package Shape	Package Style	Part Life Cycle Code	Part Package Code	Rohs Code	Supply Voltage-Nom (Vsup)	JESD-609 Code	Pbfree Code	ECCN Code	Terminal Finish	Additional Feature	HTS Code	Terminal Position	Terminal Form	Peak Reflow Temperature (Cel)	Number of Functions	Terminal Pitch	Reach Compliance Code	Time@Peak Reflow Temperature-Max (s)	Pin Count	JESD-30 Code	Qualification Status	Supply Voltage-Max (Vsup)	Temperature Grade	Supply Voltage-Min (Vsup)	Number of Ports	Operating Mode	Supply Current-Max	Organization	Output Characteristics	Seated Height-Max	Memory Width	Standby Current-Max	Memory Density	Parallel/Serial	I/O Type	Memory IC Type	Programming Voltage	Serial Bus Type	Endurance	Write Cycle Time-Max (tWC)	Data Retention Time-Min	Write Protection	Standby Voltage-Min	Output Enable	Refresh Cycles	Sequential Burst Length	Interleaved Burst Length	Access Mode	Self Refresh	Length	Width
Mfr Part No KM416C254DT-6	Samsung Semiconductor	Datasheet	-	-	Min: 1 Mult: 1	YES	40	60 ns		SAMSUNG SEMICONDUCTOR INC	262144 words	256000	70 °C		PLASTIC/EPOXY	TSOP2	TSOP2, TSOP40/44,.46,32	TSOP40/44,.46,32	RECTANGULAR	SMALL OUTLINE, THIN PROFILE	Obsolete	TSOP2	No	5 V	e0		EAR99	TIN LEAD	CAS BEFORE RAS/RAS ONLY/HIDDEN REFRESH	8542.32.00.02	DUAL	GULL WING		1	0.8 mm	unknown		44	R-PDSO-G40	Not Qualified	5.5 V	COMMERCIAL	4.5 V	1	ASYNCHRONOUS	0.09 mA	256KX16	3-STATE	1.2 mm	16	0.001 A	4194304 bit		COMMON	EDO DRAM									512			FAST PAGE WITH EDO	NO	18.41 mm	10.16 mm
Mfr Part No CAT25C32U	Catalyst Semiconductor	Datasheet	-	-	Min: 1 Mult: 1	YES	8			CATALYST SEMICONDUCTOR INC	4096 words	4000	70 °C		PLASTIC/EPOXY	TSSOP	TSSOP, TSSOP8,.25	TSSOP8,.25	RECTANGULAR	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	Obsolete		No		e0		EAR99	Tin/Lead (Sn/Pb)		8542.32.00.51	DUAL	GULL WING			0.635 mm	unknown			R-PDSO-G8	Not Qualified		COMMERCIAL				0.005 mA	4KX8			8		32768 bit	SERIAL		EEPROM		SPI	1000000 Write/Erase Cycles		100	HARDWARE/SOFTWARE
Mfr Part No AT27C256R-70DC	Atmel Corporation	Datasheet	-	-	Min: 1 Mult: 1	NO	28	70 ns		ATMEL CORP	32768 words	32000	70 °C		CERAMIC, GLASS-SEALED	WDIP	0.600 INCH, WINDOWED, CERDIP-28	DIP28,.6	RECTANGULAR	IN-LINE, WINDOW	Obsolete	DIP	No	5 V	e0	No	EAR99	TIN LEAD		8542.32.00.61	DUAL	THROUGH-HOLE		1	2.54 mm	unknown		28	R-GDIP-T28	Not Qualified	5.5 V	COMMERCIAL	4.5 V		ASYNCHRONOUS	0.02 mA	32KX8	3-STATE	5.72 mm	8	0.0001 A	262144 bit	PARALLEL	COMMON	UVPROM	13 V													37.25 mm	15.24 mm
Mfr Part No UPD42S4800V-70	Renesas Electronics Corporation	Datasheet	-	-	Min: 1 Mult: 1	NO	28	70 ns		RENESAS ELECTRONICS CORP	524288 words	512000	70 °C		PLASTIC/EPOXY	ZIP	ZIP, ZIP28,.1	ZIP28,.1	RECTANGULAR	IN-LINE	Obsolete		No	5 V	e0		EAR99	Tin/Lead (Sn/Pb)		8542.32.00.02	ZIG-ZAG	THROUGH-HOLE			1.27 mm	unknown			R-PZIP-T28	Not Qualified		COMMERCIAL				0.105 mA	512KX8	3-STATE		8	0.00015 A	4194304 bit		COMMON	FAST PAGE DRAM									1024				YES
Mfr Part No K4H560438E-TCA2	Samsung Semiconductor	Datasheet	-	-	Min: 1 Mult: 1	YES	66	0.75 ns	133 MHz	SAMSUNG SEMICONDUCTOR INC	67108864 words	64000000	70 °C		PLASTIC/EPOXY	TSOP2	TSOP2, TSSOP66,.46	TSSOP66,.46	RECTANGULAR	SMALL OUTLINE, THIN PROFILE	Obsolete	TSOP2	No	2.5 V	e0		EAR99	TIN LEAD	AUTO/SELF REFRESH	8542.32.00.24	DUAL	GULL WING		1	0.65 mm	compliant		66	R-PDSO-G66	Not Qualified	2.7 V	COMMERCIAL	2.3 V	1	SYNCHRONOUS	0.24 mA	64MX4	3-STATE	1.2 mm	4	0.003 A	268435456 bit		COMMON	DDR1 DRAM									8192	2,4,8	2,4,8	FOUR BANK PAGE BURST	YES	22.22 mm	10.16 mm
Mfr Part No S-93C56AMFN	Seiko Epson Corporation	Datasheet	-	-	Min: 1 Mult: 1	YES	8		0.25 MHz	SEIKO EPSON CORP	128 words	128	85 °C	-40 °C	PLASTIC/EPOXY	LSSOP	LSSOP,		RECTANGULAR	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	Obsolete						EAR99			8542.32.00.51	DUAL	GULL WING		1	0.65 mm	unknown			R-PDSO-G8	Not Qualified	5.5 V	INDUSTRIAL	1.8 V		SYNCHRONOUS		128X16		1.3 mm	16		2048 bit	SERIAL		EEPROM		MICROWIRE		10 ms										2.95 mm	2.8 mm
Mfr Part No S-93C56AMFN	Epson Electronics America Inc	Datasheet	-	-	Min: 1 Mult: 1	YES	8		0.25 MHz	SEIKO EPSON CORP	128 words	128	85 °C	-40 °C	PLASTIC/EPOXY	LSSOP	LSSOP,		RECTANGULAR	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	Obsolete	MSOP					EAR99			8542.32.00.51	DUAL	GULL WING		1	0.65 mm	unknown		8	R-PDSO-G8	Not Qualified	5.5 V	INDUSTRIAL	1.8 V		SYNCHRONOUS		128X16		1.3 mm	16		2048 bit	SERIAL		EEPROM		MICROWIRE		10 ms										2.95 mm	2.8 mm
Mfr Part No S-93C56AMFN	ABLIC Inc.	Datasheet	-	-	Min: 1 Mult: 1	YES	8		2 MHz	SEIKO INSTRUMENTS USA INC	128 words	128	85 °C	-40 °C	PLASTIC/EPOXY	LSSOP	LSSOP, SSOP8,.16	SSOP8,.16	RECTANGULAR	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	Obsolete	MSOP	No	2.5 V	e0		EAR99	TIN LEAD	DATA RETENTION: 10 YEARS	8542.32.00.51	DUAL	GULL WING		1	0.65 mm	compliant		8	R-PDSO-G8	Not Qualified	5.5 V	INDUSTRIAL	1.8 V		SYNCHRONOUS	0.002 mA	128X16		1.3 mm	16	4e-7 A	2048 bit	SERIAL		EEPROM		MICROWIRE	1000000 Write/Erase Cycles	10 ms	10	SOFTWARE								2.95 mm	2.8 mm
Mfr Part No KM416V4104AS-5	Samsung Semiconductor	Datasheet	-	-	Min: 1 Mult: 1	YES	50	50 ns		SAMSUNG SEMICONDUCTOR INC	4194304 words	4000000	70 °C		PLASTIC/EPOXY	TSOP2	TSOP2, TSOP50,.46,32	TSOP50,.46,32	RECTANGULAR	SMALL OUTLINE, THIN PROFILE	Obsolete	TSOP2	No	3.3 V	e0	No	EAR99	TIN LEAD	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	8542.32.00.02	DUAL	GULL WING		1	0.8 mm	unknown		50	R-PDSO-G50	Not Qualified	3.6 V	COMMERCIAL	3 V	1	ASYNCHRONOUS	0.15 mA	4MX16	3-STATE	1.2 mm	16	0.0005 A	67108864 bit		COMMON	EDO DRAM									4096			FAST PAGE WITH EDO	NO	20.95 mm	10.16 mm
Mfr Part No NT5CB64M16AP-DG	Nanya Technology Corporation	Datasheet	-	-	Min: 1 Mult: 1	YES	96	20 ns	800 MHz	NANYA TECHNOLOGY CORP	67108864 words	64000000	85 °C		PLASTIC/EPOXY	LFBGA	LFBGA, BGA96,9X16,32	BGA96,9X16,32	RECTANGULAR	GRID ARRAY	Obsolete	BGA	Yes	1.5 V			EAR99		AUTO/SELF REFRESH	8542.32.00.32	BOTTOM	BALL	NOT SPECIFIED	1	0.8 mm	compliant	NOT SPECIFIED	96	R-PBGA-B96	Not Qualified	1.575 V	OTHER	1.425 V	1	SYNCHRONOUS		64MX16	3-STATE	1.39 mm	16		1073741824 bit		COMMON	DDR3 DRAM									8192	4,8	4,8	MULTI BANK PAGE BURST	YES	13 mm	9 mm
Mfr Part No MT5C1009CW-70	Micron Technology Inc	Datasheet	-	-	Min: 1 Mult: 1	NO	32	70 ns		MICRON TECHNOLOGY INC	131072 words	128000	70 °C		CERAMIC	DIP		DIP32,.6	RECTANGULAR	IN-LINE	Obsolete		No	5 V	e0		EAR99	Tin/Lead (Sn/Pb)		8542.32.00.41	DUAL	THROUGH-HOLE			2.54 mm	not_compliant			R-XDIP-T32	Not Qualified		COMMERCIAL			ASYNCHRONOUS	0.105 mA	128KX8	3-STATE		8	0.007 A	1048576 bit	PARALLEL	COMMON	STANDARD SRAM							4.5 V
Mfr Part No T2316162A-50J	TM Technology Inc	Datasheet	-	-	Min: 1 Mult: 1	YES	42	50 ns		TM TECHNOLOGY INC	1048576 words	1000000	70 °C		PLASTIC/EPOXY	SOJ	SOJ, SOJ42,.44	SOJ42,.44	RECTANGULAR	SMALL OUTLINE	Contact Manufacturer			5 V			EAR99		RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH	8542.32.00.02	DUAL	J BEND		1	1.27 mm	unknown			R-PDSO-J42	Not Qualified	5.5 V	COMMERCIAL	4.5 V	1	ASYNCHRONOUS	0.18 mA	1MX16	3-STATE	3.759 mm	16	0.001 A	16777216 bit		COMMON	EDO DRAM									1024			EDO PAGE	NO	27.305 mm	10.16 mm
Mfr Part No IM65X08AIJE	General Electric Solid State	Datasheet	-	-	Min: 1 Mult: 1	NO	16	200 ns		GENERAL ELECTRIC SOLID STATE	1024 words	1000	85 °C	-40 °C	CERAMIC	DIP	DIP, DIP16,.3	DIP16,.3	RECTANGULAR	IN-LINE	Obsolete		No	5 V	e0		EAR99	Tin/Lead (Sn/Pb)		8542.32.00.41	DUAL	THROUGH-HOLE			2.54 mm	unknown			R-XDIP-T16	Not Qualified		INDUSTRIAL			SYNCHRONOUS	0.01 mA	1KX1	3-STATE		1	0.00005 A	1024 bit	PARALLEL		STANDARD SRAM							2 V
Mfr Part No K4S56163LF-XN75	Samsung Semiconductor	Datasheet	-	-	Min: 1 Mult: 1	YES	54	5.4 ns	133 MHz	SAMSUNG SEMICONDUCTOR INC	16777216 words	16000000	85 °C	-25 °C	PLASTIC/EPOXY	FBGA		BGA54,9X9,32	SQUARE	GRID ARRAY, FINE PITCH	Active		No		e0		EAR99	Tin/Lead (Sn/Pb)		8542.32.00.24	BOTTOM	BALL			0.8 mm	compliant			S-PBGA-B54	Not Qualified		OTHER				0.165 mA	16MX16	3-STATE		16	0.0005 A	268435456 bit		COMMON	SYNCHRONOUS DRAM									8192	1,2,4,8,FP	1,2,4,8
Mfr Part No R1EX25512ATA00I	Renesas Electronics Corporation	Datasheet	-	-	Min: 1 Mult: 1	YES	8		5 MHz	RENESAS ELECTRONICS CORP	65536 words	64000	85 °C	-40 °C	PLASTIC/EPOXY	TSSOP	4.40 X 3 MM, 0.65 MM PITCH, LEAD FREE, PLASTIC, TSSOP-8	TSSOP8,.25	RECTANGULAR	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	Active	SOIC	Yes	3.3 V		Yes	EAR99			8542.32.00.51	DUAL	GULL WING	NOT SPECIFIED	1	0.65 mm	compliant	NOT SPECIFIED	8	R-PDSO-G8	Not Qualified	5.5 V	INDUSTRIAL	1.8 V		SYNCHRONOUS	0.005 mA	64KX8		1.1 mm	8	0.000005 A	524288 bit	SERIAL		EEPROM		SPI	1000000 Write/Erase Cycles	5 ms	100	HARDWARE/SOFTWARE								4.4 mm	3 mm
Mfr Part No K4M64163PH-RF75	Samsung Semiconductor	Datasheet	-	-	Min: 1 Mult: 1	YES	54	6 ns	133 MHz	SAMSUNG SEMICONDUCTOR INC	4194304 words	4000000	70 °C	-25 °C	PLASTIC/EPOXY	FBGA		BGA54,9X9,32	SQUARE	GRID ARRAY, FINE PITCH	Active		No	1.8 V	e0		EAR99	Tin/Lead (Sn/Pb)		8542.32.00.02	BOTTOM	BALL			0.8 mm	compliant			S-PBGA-B54	Not Qualified		OTHER				0.06 mA	4MX16	3-STATE		16	0.0003 A	67108864 bit		COMMON	SYNCHRONOUS DRAM									4096	1,2,4,8,FP	1,2,4,8
Mfr Part No MCM2167HP55	Motorola Semiconductor Products	Datasheet	-	-	Min: 1 Mult: 1	NO	20	55 ns		MOTOROLA INC	16384 words	16000	70 °C		PLASTIC/EPOXY	DIP		DIP20,.3	RECTANGULAR	IN-LINE	Obsolete		No	5 V	e0		EAR99	Tin/Lead (Sn/Pb)		8542.32.00.41	DUAL	THROUGH-HOLE			2.54 mm	unknown			R-PDIP-T20	Not Qualified		COMMERCIAL			ASYNCHRONOUS	0.12 mA	16KX1	3-STATE		1		16384 bit	PARALLEL	SEPARATE	STANDARD SRAM
Mfr Part No M5M5179P-35	Mitsubishi Electric	Datasheet	-	-	Min: 1 Mult: 1	NO	28	35 ns		MITSUBISHI ELECTRIC CORP	8192 words	8000	70 °C		PLASTIC/EPOXY	DIP	DIP, DIP28,.3	DIP28,.3	RECTANGULAR	IN-LINE	Obsolete	DIP	No	5 V	e0	No	EAR99	TIN LEAD		8542.32.00.41	DUAL	THROUGH-HOLE		1	2.54 mm	unknown		28	R-PDIP-T28	Not Qualified	5.5 V	COMMERCIAL	4.5 V	1	ASYNCHRONOUS	0.12 mA	8KX9	3-STATE		9	0.002 A	73728 bit	PARALLEL	COMMON	STANDARD SRAM							4.5 V	YES
Mfr Part No P4C188-15PC	Pyramid Semiconductor Corporation	Datasheet	-	-	Min: 1 Mult: 1	NO	22	15 ns		PYRAMID SEMICONDUCTOR CORP	16384 words	16000	70 °C		PLASTIC/EPOXY	DIP	0.300 INCH, PLASTIC, DIP-22	DIP22,.3	RECTANGULAR	IN-LINE	Active	DIP	No	5 V	e0	No	EAR99	TIN LEAD		8542.32.00.41	DUAL	THROUGH-HOLE		1	2.54 mm	compliant		22	R-PDIP-T22	Not Qualified	5.5 V	COMMERCIAL	4.5 V		ASYNCHRONOUS	0.16 mA	16KX4	3-STATE	5.334 mm	4	0.015 A	65536 bit	PARALLEL	COMMON	STANDARD SRAM							4.5 V							29.337 mm	7.62 mm
Mfr Part No TC511665BJ-80	Toshiba America Electronic Components	Datasheet	-	-	Min: 1 Mult: 1	YES	40	80 ns		TOSHIBA CORP	65536 words	64000	70 °C		PLASTIC/EPOXY	SOJ	SOJ,		RECTANGULAR	SMALL OUTLINE	Obsolete	SOJ	No	5 V	e0	No	EAR99	TIN LEAD	RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH	8542.32.00.02	DUAL	J BEND		1	1.27 mm	unknown		40	R-PDSO-J40	Not Qualified	5.5 V	COMMERCIAL	4.5 V	1	ASYNCHRONOUS		64KX16		3.7 mm	16		1048576 bit			FAST PAGE DRAM									256			FAST PAGE		26.04 mm	10.16 mm

Memory (6000)