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Memory (6000)

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ECCN Code:
EAR99

Part Number	Manufacturer	Datasheet	Availability	Pricing(USD)	Quantity	Surface Mount	Number of Terminals	Access Time-Max	Clock Frequency-Max (fCLK)	Ihs Manufacturer	Moisture Sensitivity Levels	Number of Words	Number of Words Code	Operating Temperature-Max	Operating Temperature-Min	Package Body Material	Package Code	Package Description	Package Equivalence Code	Package Shape	Package Style	Part Life Cycle Code	Part Package Code	Rohs Code	Supply Voltage-Nom (Vsup)	JESD-609 Code	Pbfree Code	ECCN Code	Terminal Finish	Additional Feature	HTS Code	Terminal Position	Terminal Form	Peak Reflow Temperature (Cel)	Number of Functions	Terminal Pitch	Reach Compliance Code	Time@Peak Reflow Temperature-Max (s)	Pin Count	JESD-30 Code	Qualification Status	Supply Voltage-Max (Vsup)	Temperature Grade	Supply Voltage-Min (Vsup)	Number of Ports	Operating Mode	Supply Current-Max	Organization	Output Characteristics	Seated Height-Max	Memory Width	Standby Current-Max	Memory Density	Parallel/Serial	I/O Type	Memory IC Type	Serial Bus Type	Endurance	Write Cycle Time-Max (tWC)	Data Retention Time-Min	Write Protection	Standby Voltage-Min	Alternate Memory Width	Output Enable	Refresh Cycles	I2C Control Byte	Sequential Burst Length	Interleaved Burst Length	Access Mode	Reverse Pinout	Self Refresh	Length	Width
Mfr Part No NM93C56AM8X	Texas Instruments	Datasheet	-	-	Min: 1 Mult: 1	YES	8		1 MHz	NATIONAL SEMICONDUCTOR CORP		256 words	256	70 °C		PLASTIC/EPOXY	SOP	SOP,		RECTANGULAR	SMALL OUTLINE	Transferred	SOIC		5 V			EAR99			8542.32.00.51	DUAL	GULL WING		1	1.27 mm	unknown		8	R-PDSO-G8	Not Qualified	5.5 V	COMMERCIAL	4.5 V		SYNCHRONOUS		256X8	3-STATE	1.75 mm	8		2048 bit	SERIAL		EEPROM	MICROWIRE		10 ms				16									4.9 mm	3.9 mm
Mfr Part No UPD4264405LE-A50	NEC Electronics Group	Datasheet	-	-	Min: 1 Mult: 1	YES	32	50 ns		NEC ELECTRONICS CORP		16777216 words	16000000	70 °C		PLASTIC/EPOXY	SOJ	SOJ,		RECTANGULAR	SMALL OUTLINE	Obsolete	SOJ		3.3 V			EAR99		RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	8542.32.00.02	DUAL	J BEND		1	1.27 mm	unknown		32	R-PDSO-J32	Not Qualified	3.6 V	COMMERCIAL	3 V	1	ASYNCHRONOUS		16MX4		3.76 mm	4		67108864 bit			EDO DRAM													FAST PAGE WITH EDO			20.96 mm	10.16 mm
Mfr Part No 100422DC5	National Semiconductor Corporation	Datasheet	-	-	Min: 1 Mult: 1	NO	24	5 ns		NATIONAL SEMICONDUCTOR CORP		256 words	256	85 °C		CERAMIC	DIP		DIP24,.4	RECTANGULAR	IN-LINE	Obsolete		No		e0		EAR99	Tin/Lead (Sn/Pb)		8542.32.00.41	DUAL	THROUGH-HOLE			2.54 mm	compliant			R-XDIP-T24	Not Qualified		OTHER			ASYNCHRONOUS	0.247 mA	256X4	OPEN-EMITTER		4		1024 bit	PARALLEL	SEPARATE	STANDARD SRAM
Mfr Part No XC17512LSOG20I	AMD Xilinx	Datasheet	-	-	Min: 1 Mult: 1	YES	20			XILINX INC	3	524288 words	512000	85 °C	-40 °C	PLASTIC/EPOXY	SOP	SOP,		RECTANGULAR	SMALL OUTLINE	Obsolete	SOIC	Yes	3.3 V	e3		EAR99	Matte Tin (Sn)	USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS	8542.32.00.51	DUAL	GULL WING	260	1	1.27 mm	compliant	30	20	R-PDSO-G20	Not Qualified	3.6 V	INDUSTRIAL	3 V		SYNCHRONOUS		512KX1		2.6416 mm	1		524288 bit	SERIAL		CONFIGURATION MEMORY																12.827 mm	7.5184 mm
Mfr Part No AM27C010-70LI	AMD	Datasheet	-	-	Min: 1 Mult: 1	YES	32	70 ns		ADVANCED MICRO DEVICES INC		131072 words	128000			CERAMIC	QCCN	QCCN, LCC32,.45X.55	LCC32,.45X.55	RECTANGULAR	CHIP CARRIER	Obsolete		No	5 V	e0		EAR99	Tin/Lead (Sn/Pb)		8542.32.00.61	QUAD	NO LEAD		1	1.27 mm	unknown			R-XQCC-N32	Not Qualified					ASYNCHRONOUS	0.03 mA	128KX8	3-STATE		8	0.0001 A	1048576 bit	PARALLEL	COMMON	UVPROM
Mfr Part No W981216BH-6	Winbond Electronics Corp	Datasheet	-	-	Min: 1 Mult: 1	YES	54	5 ns	166 MHz	WINBOND ELECTRONICS CORP		8388608 words	8000000	70 °C		PLASTIC/EPOXY	TSOP2	TSOP2, TSOP54,.46,32	TSOP54,.46,32	RECTANGULAR	SMALL OUTLINE, THIN PROFILE	Obsolete	TSOP2		3.3 V	e3		EAR99	MATTE TIN	AUTO/SELF REFRESH	8542.32.00.02	DUAL	GULL WING		1	0.8 mm	compliant		54	R-PDSO-G54	Not Qualified	3.6 V	COMMERCIAL	3 V	1	SYNCHRONOUS	0.18 mA	8MX16	3-STATE	1.2 mm	16	0.001 A	134217728 bit		COMMON	SYNCHRONOUS DRAM									4096		1,2,4,8,FP	1,2,4,8	FOUR BANK PAGE BURST		YES	22.22 mm	10.16 mm
Mfr Part No K4T51043QC-ZLCC	Samsung Semiconductor	Datasheet	-	-	Min: 1 Mult: 1	YES	60	0.6 ns	200 MHz	SAMSUNG SEMICONDUCTOR INC	3	134217728 words	128000000	95 °C		PLASTIC/EPOXY	FBGA	FBGA, BGA60,9X11,32	BGA60,9X11,32	RECTANGULAR	GRID ARRAY, FINE PITCH	Obsolete		Yes	1.8 V	e1	Yes	EAR99	TIN SILVER COPPER		8542.32.00.28	BOTTOM	BALL	260		0.8 mm	compliant			R-PBGA-B60	Not Qualified		OTHER				0.18 mA	128MX4	3-STATE		4	0.0045 A	536870912 bit		COMMON	DDR2 DRAM									8192		4,8	4,8
Mfr Part No LC3664AL-10	SANYO Electric Co Ltd	Datasheet	-	-	Min: 1 Mult: 1	NO	28	100 ns		SANYO ELECTRIC CO LTD		8192 words	8000	70 °C		PLASTIC/EPOXY	DIP	DIP, DIP28,.6	DIP28,.6	RECTANGULAR	IN-LINE	Obsolete		No	5 V			EAR99			8542.32.00.41	DUAL	THROUGH-HOLE			2.54 mm	unknown			R-PDIP-T28	Not Qualified		COMMERCIAL			ASYNCHRONOUS	0.05 mA	8KX8	3-STATE		8	0.0000025 A	65536 bit	PARALLEL	COMMON	STANDARD SRAM						2 V
Mfr Part No S-24CS04AFT-TBH-G	ABLIC Inc.	Datasheet	-	-	Min: 1 Mult: 1	YES	8		0.35 MHz	SEIKO INSTRUMENTS USA INC		512 words	512	105 °C	-40 °C	PLASTIC/EPOXY	TSSOP	TSSOP, TSSOP8,.25	TSSOP8,.25	RECTANGULAR	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	Obsolete	SOIC	Yes	5 V	e6		EAR99	TIN BISMUTH		8542.32.00.51	DUAL	GULL WING		1	0.65 mm	compliant		8	R-PDSO-G8	Not Qualified	5.5 V	INDUSTRIAL	4.5 V		SYNCHRONOUS	0.004 mA	512X8		1.1 mm	8	0.000002 A	4096 bit	SERIAL		EEPROM	I2C	1000000 Write/Erase Cycles	10 ms	10	HARDWARE					1010DDMR						4.4 mm	3 mm
Mfr Part No H5PS1G83EFR-S5	SK Hynix Inc	Datasheet	-	-	Min: 1 Mult: 1	YES	60	0.4 ns	400 MHz	SK HYNIX INC		134217728 words	128000000	85 °C		PLASTIC/EPOXY	TFBGA	TFBGA, BGA60,9X11,32	BGA60,9X11,32	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	Obsolete	BGA	Yes	1.8 V	e1		EAR99	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	AUTO/SELF REFRESH	8542.32.00.32	BOTTOM	BALL	260	1	0.8 mm	unknown	20	60	R-PBGA-B60	Not Qualified	1.9 V	OTHER	1.7 V	1	SYNCHRONOUS	0.23 mA	128MX8	3-STATE	1.2 mm	8		1073741824 bit		COMMON	DDR2 DRAM									8192		4,8	4,8	MULTI BANK PAGE BURST		YES	11.4 mm	8 mm
Mfr Part No NT5TU32M16FG-ACT	Nanya Technology Corporation	Datasheet	-	-	Min: 1 Mult: 1	YES	84	0.4 ns		NANYA TECHNOLOGY CORP		33554432 words	32000000			PLASTIC/EPOXY	VFBGA	VFBGA,		RECTANGULAR	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	Active		Yes	1.8 V			EAR99		AUTO/SELF REFRESH	8542.32.00.28	BOTTOM	BALL	NOT SPECIFIED	1	0.8 mm	compliant	NOT SPECIFIED		R-PBGA-B84		1.9 V		1.7 V	1	SYNCHRONOUS		32MX16		1 mm	16		536870912 bit			DDR2 DRAM													FOUR BANK PAGE BURST		YES	12.2 mm	7.5 mm
Mfr Part No MSM5117405D-60SJ	OKI Electric Industry Co Ltd	Datasheet	-	-	Min: 1 Mult: 1	YES	24	60 ns		OKI ELECTRIC INDUSTRY CO LTD		4194304 words	4000000	70 °C		PLASTIC/EPOXY	SOJ	SOJ,		RECTANGULAR	SMALL OUTLINE	Obsolete	SOJ		5 V			EAR99		RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	8542.32.00.02	DUAL	J BEND		1	1.27 mm	unknown		24	R-PDSO-J24	Not Qualified	5.5 V	COMMERCIAL	4.5 V	1	ASYNCHRONOUS		4MX4		3.55 mm	4		16777216 bit			EDO DRAM													FAST PAGE WITH EDO			17.15 mm	7.62 mm
Mfr Part No XC17128ELPCG20C	AMD Xilinx	Datasheet	-	-	Min: 1 Mult: 1	YES	20			XILINX INC	3	131072 words	128000	70 °C		PLASTIC/EPOXY	QCCJ	QCCJ,		SQUARE	CHIP CARRIER	Obsolete	QLCC	Yes	3.3 V	e3		EAR99	Matte Tin (Sn)	USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS	8542.32.00.51	QUAD	J BEND	260	1	1.27 mm	compliant	40	20	S-PQCC-J20	Not Qualified	3.6 V	COMMERCIAL	3 V		SYNCHRONOUS		128KX1		4.572 mm	1		131072 bit	SERIAL		CONFIGURATION MEMORY																8.9662 mm	8.9662 mm
Mfr Part No UPD42S16190LG5-A80-7JF	Renesas Electronics Corporation	Datasheet	-	-	Min: 1 Mult: 1	YES	44	80 ns		RENESAS ELECTRONICS CORP		1048576 words	1000000	70 °C		PLASTIC/EPOXY	TSOP	TSOP, TSOP44/50,.46,32	TSOP44/50,.46,32	RECTANGULAR	SMALL OUTLINE, THIN PROFILE	Obsolete		No	3.3 V	e0		EAR99	Tin/Lead (Sn/Pb)		8542.32.00.02	DUAL	GULL WING			0.8 mm	unknown			R-PDSO-G44	Not Qualified		COMMERCIAL				0.08 mA	1MX18	3-STATE		18	0.0001 A	18874368 bit		COMMON	FAST PAGE DRAM									4096						YES
Mfr Part No H5DU5162EFR-E3I	SK Hynix Inc	Datasheet	-	-	Min: 1 Mult: 1	YES	60	0.7 ns	200 MHz	SK HYNIX INC		33554432 words	32000000	85 °C	-40 °C	PLASTIC/EPOXY	VBGA	VBGA, BGA60,9X12,40/32	BGA60,9X12,40/32	RECTANGULAR	GRID ARRAY, VERY THIN PROFILE	Obsolete	BGA	Yes	2.5 V	e1		EAR99	Tin/Silver/Copper (Sn/Ag/Cu)	AUTO/SELF REFRESH	8542.32.00.28	BOTTOM	BALL	260	1	1 mm	unknown	20	60	R-PBGA-B60	Not Qualified	2.7 V	INDUSTRIAL	2.3 V	1	SYNCHRONOUS	0.26 mA	32MX16	3-STATE	1 mm	16	0.005 A	536870912 bit		COMMON	DDR1 DRAM									8192		2,4,8	2,4,8	FOUR BANK PAGE BURST		YES	12 mm	8 mm
Mfr Part No UPD424260LG5-A10-7KF	Renesas Electronics Corporation	Datasheet	-	-	Min: 1 Mult: 1	YES	40	100 ns		RENESAS ELECTRONICS CORP		262144 words	256000	70 °C		PLASTIC/EPOXY	TSOP	TSOP, TSOP40/44,.46,32	TSOP40/44,.46,32	RECTANGULAR	SMALL OUTLINE, THIN PROFILE	Obsolete		No	3.3 V	e0		EAR99	Tin/Lead (Sn/Pb)		8542.32.00.02	DUAL	GULL WING			0.8 mm	unknown			R-PDSO-G40	Not Qualified		COMMERCIAL				0.1 mA	256KX16	3-STATE		16	0.0005 A	4194304 bit		COMMON	FAST PAGE DRAM									512					YES	NO
Mfr Part No TC551001APL-85	Toshiba America Electronic Components	Datasheet	-	-	Min: 1 Mult: 1	NO	32	85 ns		TOSHIBA CORP		131072 words	128000	70 °C		PLASTIC/EPOXY	DIP	DIP,		RECTANGULAR	IN-LINE	Obsolete	DIP	No	5 V	e0	No	EAR99	TIN LEAD		8542.32.00.41	DUAL	THROUGH-HOLE		1	2.54 mm	unknown		32	R-PDIP-T32	Not Qualified	5.5 V	COMMERCIAL	4.5 V	1	ASYNCHRONOUS		128KX8		4.8 mm	8		1048576 bit	PARALLEL		STANDARD SRAM						2 V		YES								42 mm	15.24 mm
Mfr Part No IS42R16320D-7TL	Integrated Silicon Solution Inc	Datasheet	-	-	Min: 1 Mult: 1	YES	54	5.4 ns	143 MHz	INTEGRATED SILICON SOLUTION INC		33554432 words	32000000	70 °C		PLASTIC/EPOXY	TSOP2	TSOP2, TSOP54,.46,32	TSOP54,.46,32	RECTANGULAR	SMALL OUTLINE, THIN PROFILE	Obsolete	TSSOP	Yes	2.5 V			EAR99		AUTO/SELF REFRESH	8542.32.00.28	DUAL	GULL WING		1	0.8 mm	compliant		54	R-PDSO-G54	Not Qualified	2.7 V	COMMERCIAL	2.3 V	1	SYNCHRONOUS	0.22 mA	32MX16	3-STATE	1.2 mm	16	0.004 A	536870912 bit		COMMON	SYNCHRONOUS DRAM									8192		1,2,4,8,FP	1,2,4,8	FOUR BANK PAGE BURST		YES	22.22 mm	10.16 mm
Mfr Part No TMM41464P-12	Toshiba America Electronic Components	Datasheet	-	-	Min: 1 Mult: 1	NO	18	120 ns		TOSHIBA CORP		65536 words	64000	70 °C		PLASTIC/EPOXY	DIP	DIP, DIP18,.3	DIP18,.3	RECTANGULAR	IN-LINE	Obsolete		No	5 V	e0		EAR99	Tin/Lead (Sn/Pb)		8542.32.00.02	DUAL	THROUGH-HOLE			2.54 mm	unknown			R-PDIP-T18	Not Qualified		COMMERCIAL				0.07 mA	64KX4	3-STATE		4		262144 bit		COMMON	PAGE MODE DRAM									256
Mfr Part No P8111	Intel Corporation	Datasheet	-	-	Min: 1 Mult: 1	NO	18			INTEL CORP		256 words	256	70 °C		PLASTIC/EPOXY	DIP	DIP, DIP18,.3	DIP18,.3	RECTANGULAR	IN-LINE	Obsolete		No		e0		EAR99	Tin/Lead (Sn/Pb)		8542.32.00.41	DUAL	THROUGH-HOLE			2.54 mm	unknown			R-PDIP-T18	Not Qualified		COMMERCIAL			ASYNCHRONOUS		256X4	3-STATE		4		1024 bit	PARALLEL	COMMON	STANDARD SRAM

Memory (6000)