The category is 'Memory'
Memory (6000)
- All Manufacturers
- Lead Free
- Memory Format
- Memory Interface
- Memory Size
- Memory Types
- Moisture Sensitivity Level (MSL)
- Mounting Type
- Number of Functions
- Number of Pins
- Number of Terminations
- Operating Temperature
- Package / Case
- Lead Free:
Lead Free
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Lifecycle Status | Contact Plating | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Number of Terminals | Access Time-Max | Clock Frequency-Max (fCLK) | Ihs Manufacturer | Manufacturer | Manufacturer Lifecycle Status | Manufacturer Part Number | Memory Types | Moisture Sensitivity Levels | Number of Words | Number of Words Code | Operating Temperature-Max | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Supply Voltage-Nom (Vsup) | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Subcategory | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Supply Voltage | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Interface | Max Supply Voltage | Min Supply Voltage | Memory Size | Number of Ports | Nominal Supply Current | Operating Mode | Clock Frequency | Supply Current-Max | Access Time | Memory Format | Memory Interface | Data Bus Width | Organization | Output Characteristics | Seated Height-Max | Memory Width | Write Cycle Time - Word, Page | Address Bus Width | Density | Standby Current-Max | Memory Density | Max Frequency | Access Time (Max) | Parallel/Serial | I/O Type | Sync/Async | Word Size | Memory IC Type | Programming Voltage | Serial Bus Type | Endurance | Data Retention Time-Min | Write Protection | Standby Voltage-Min | Alternate Memory Width | Data Polling | Toggle Bit | Command User Interface | Number of Sectors/Size | Sector Size | Page Size | Ready/Busy | Boot Block | Refresh Cycles | Common Flash Interface | Sequential Burst Length | Interleaved Burst Length | Height Seated (Max) | Length | Width | Radiation Hardening | RoHS Status | Lead Free |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No MT40A2G4TRF-093E:A | Micron Technology Inc. | Datasheet | - | - | Min: 1 Mult: 1 | Copper, Silver, Tin | Surface Mount | Surface Mount | 78-TFBGA | 78 | Volatile | 0°C~95°C TC | Tray | 2015 | Obsolete | 3 (168 Hours) | EAR99 | 1.14V~1.26V | unknown | 1.2V | 8Gb 2G x 4 | 1067MHz | DRAM | Parallel | 4b | 8 Gb | ROHS3 Compliant | Lead Free | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MT46V128M4BN-6:D | Micron Technology Inc. | Datasheet | 2951 | - | Min: 1 Mult: 1 | Surface Mount | 60-TFBGA | YES | Volatile | 0°C~70°C TA | Tray | 2007 | e1 | Obsolete | 5 (48 Hours) | 60 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | AUTO/SELF REFRESH | 8542.32.00.28 | 2.3V~2.7V | BOTTOM | 260 | 1 | 2.5V | 1mm | 30 | MT46V128M4 | 60 | R-PBGA-B60 | Not Qualified | 2.5V | 2.7V | 2.3V | 512Mb 128M x 4 | 1 | SYNCHRONOUS | 167MHz | 700ps | DRAM | Parallel | 128MX4 | 3-STATE | 4 | 15ns | 0.005A | 536870912 bit | COMMON | 8192 | 248 | 248 | 1.2mm | 12.5mm | 10mm | ROHS3 Compliant | Lead Free | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No CY7C1381D-117AXCT | Cypress Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | 100 | Compliant | Tape & Reel (TR) | 70 °C | 0 °C | 117 MHz | 3.3 V | 3.6 V | 3.135 V | 2.3 MB | 4 | 7.5 ns | 19 b | 18 Mb | 117 MHz | Lead Free | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No RC28F640P30BF65A | Micron Technology Inc. | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | Surface Mount | 64-TBGA | 64 | Non-Volatile | -40°C~85°C TA | Tray | 2009 | StrataFlash™ | Obsolete | 3 (168 Hours) | 64 | 1.7V~2V | BOTTOM | 1 | 1.8V | 1mm | 28F640P30 | 1.8V | 2V | 1.81.8/3.3V | 1.7V | Parallel, Serial | 64Mb 4M x 16 | 28mA | 52MHz | FLASH | Parallel | 4MX16 | 16 | 65ns | 22b | 64 Mb | 0.000055A | 65 ns | Asynchronous | 16b | NO | NO | 463 | 8words | BOTTOM | 1.2mm | 13mm | No | Non-RoHS Compliant | Lead Free | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MT46V8M16P-6TIT:DTR | Micron Technology Inc. | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 66-TSSOP (0.400, 10.16mm Width) | 66-TSOP | Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2007 | Obsolete | 3 (168 Hours) | 85°C | -40°C | 2.3V~2.7V | 167MHz | MT46V8M16 | Parallel | 128Mb 8M x 16 | 167MHz | 700ps | DRAM | Parallel | 15ns | ROHS3 Compliant | Lead Free | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No CYD09S18V18-250BBXC | Cypress Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 256 | 512000 | Compliant | Bulk | 70 °C | 0 °C | 250 MHz | 1.8 V | 1.9 V | 1.7 V | 1.1 MB | 2 | 770 mA | 2.64 ns | 38 b | 9 Mb | 250 MHz | Synchronous | 18 b | Lead Free | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No F640BFHEPBTLDY | Sharp Microelectronics | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 48-TFSOP (0.488, 12.40mm Width) | 48-TSOP | Non-Volatile | -40°C~85°C TA | Tray | Obsolete | 3 (168 Hours) | 85°C | -40°C | 70GHz | Parallel | 64Mb 4M x 16 | 70ns | FLASH | Parallel | 70ns | RoHS Compliant | Lead Free | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MT41K256M8HX-187E:D | Micron Technology Inc. | Datasheet | 7 | - | Min: 1 Mult: 1 | Surface Mount | 78-TFBGA | YES | Volatile | 0°C~95°C TC | Tray | 2011 | e1 | yes | Obsolete | 3 (168 Hours) | 78 | EAR99 | TIN SILVER COPPER | AUTO/SELF REFRESH | 8542.32.00.36 | 1.283V~1.45V | BOTTOM | 260 | 1 | 1.35V | 0.8mm | 30 | MT41K256M8 | 78 | R-PBGA-B78 | Not Qualified | 1.35V | 1.45V | 1.283V | 2Gb 256M x 8 | 1 | SYNCHRONOUS | 533MHz | 13.125ns | DRAM | Parallel | 256MX8 | 8 | 2147483648 bit | 1.2mm | 11.5mm | 9mm | ROHS3 Compliant | Lead Free | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MT46V32M16BN-6:C | Micron Technology Inc. | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | Surface Mount | 60-TFBGA | 60 | 60-FBGA (10x12.5) | Volatile | 0°C~70°C TA | Tray | 2007 | Obsolete | 5 (48 Hours) | 70°C | 0°C | 2.3V~2.7V | 6GHz | MT46V32M16 | 2.5V | Parallel | 2.7V | 2.3V | 512Mb 32M x 16 | 195mA | 167MHz | 700ps | DRAM | Parallel | 15ns | 15b | 512 Mb | 333MHz | ROHS3 Compliant | Lead Free | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No CYD18S36V18-200BBXC | Cypress Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | YES | 256 | 256 | 9 ns | 200 MHz | CYPRESS SEMICONDUCTOR CORP | Cypress Semiconductor | CYD18S36V18-200BBXC | SDR | 3 | 512000 | 512000 | 70 °C | PLASTIC/EPOXY | LBGA | LBGA, BGA256,16X16,40 | BGA256,16X16,40 | SQUARE | GRID ARRAY, LOW PROFILE | Active | BGA | 20 | 5.56 | Compliant | Yes | 1.5 V | Bulk | e1 | Yes | 3A991.B.2.A | Tin/Silver/Copper (Sn/Ag/Cu) | 70 °C | 0 °C | PIPELINED OR FLOW-THROUGH ARCHITECTURE, IT CAN ALSO OPERATES AT 1.8V | 8542.32.00.41 | SRAMs | CMOS | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | 200 MHz | 256 | S-PBGA-B256 | Not Qualified | 1.8 V | 1.58 V | 1.5/1.8 V | COMMERCIAL | 1.42 V | Parallel | 1.9 V | 1.7 V | 2.3 MB | 2 | 800 mA | SYNCHRONOUS | 0.8 mA | 3.3 ns | 512KX36 | 3-STATE | 1.7 mm | 36 | 38 b | 18 Mb | 0.3 A | 18874368 bit | 200 MHz | PARALLEL | COMMON | Synchronous | 36 b | DUAL-PORT SRAM | 1.4 V | 19 mm | 19 mm | Lead Free | |||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MT47H64M16BT-5E:A | Micron Technology Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 16 Weeks | Surface Mount | Surface Mount | 92-VFBGA | 92 | Volatile | 0°C~85°C TC | Box | 2006 | e1 | Discontinued | 5 (48 Hours) | 92 | EAR99 | TIN SILVER COPPER | AUTO/SELF REFRESH | 8542.32.00.32 | 1.7V~1.9V | BOTTOM | 260 | 1 | 1.8V | 0.8mm | 30 | MT47H64M16 | 92 | 1.8V | 1.9V | 1.7V | 1Gb 64M x 16 | 1 | 160mA | 200MHz | 600ps | DRAM | Parallel | 16b | 64MX16 | 3-STATE | 16 | 15ns | 16b | 1 Gb | 0.007A | COMMON | 48 | 48 | 1.2mm | 19mm | No | ROHS3 Compliant | Lead Free | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No CYDD04S36V18-167BBXI | Cypress Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 256 | DDR | 128000 | Compliant | Bulk | 85 °C | -40 °C | 167 MHz | 1.8 V | Parallel | 1.9 V | 1.7 V | 512 kB | 2 | 550 mA | 600 ps | 32 b | 4.5 Mb | 167 MHz | Synchronous | 36 b | No | Lead Free | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No W19B320ABB7H | Winbond Electronics | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 48-TFBGA | YES | Non-Volatile | -20°C~85°C TA | Tray | 2005 | e1 | Discontinued | 3 (168 Hours) | 48 | 3A991.B.1.A | TIN SILVER COPPER | 8542.32.00.51 | 2.7V~3.6V | BOTTOM | NOT SPECIFIED | 1 | 3V | 0.8mm | unknown | 70GHz | NOT SPECIFIED | 48 | R-PBGA-B48 | Not Qualified | 3.6V | 3/3.3V | 2.7V | 32Mb 4M x 8 2M x 16 | ASYNCHRONOUS | FLASH | Parallel | 2MX16 | 16 | 70ns | 0.000005A | 33554432 bit | 70 ns | 3V | 8 | YES | YES | YES | 863 | 8K64K | YES | BOTTOM | YES | 1.2mm | 8mm | 6mm | ROHS3 Compliant | Lead Free | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No W25B40AVSNIG | Winbond Electronics | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 8-SOIC (0.154, 3.90mm Width) | YES | Non-Volatile | -40°C~85°C TA | Tube | 2006 | SpiFlash® | e3 | yes | Obsolete | 3 (168 Hours) | 8 | MATTE TIN | 2.7V~3.6V | DUAL | 225 | 1.27mm | NOT SPECIFIED | R-PDSO-G8 | Not Qualified | 3/3.3V | SPI, Serial | 4Mb 512K x 8 | 40MHz | 0.025mA | 40 μs | FLASH | SPI | 512KX8 | 8 | 15ms, 5ms | 0.000005A | 4194304 bit | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | ROHS3 Compliant | Lead Free | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No W25P80VSSIG | Winbond Electronics | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 8-SOIC (0.209, 5.30mm Width) | YES | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2006 | SpiFlash® | e3 | Obsolete | 3 (168 Hours) | 8 | EAR99 | MATTE TIN | 2.7V~3.6V | DUAL | 260 | 1 | 3V | 1.27mm | 40 | 8 | 3.6V | 3/3.3V | 2.7V | SPI, Serial | 8Mb 1M x 8 | 50MHz | 50 μs | FLASH | SPI | 1 | 7ms | 1b | 8 Mb | 0.000005A | 2.7V | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 2.16mm | 5.27mm | No | ROHS3 Compliant | Lead Free | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No PCF85103C2N | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 8 | Compliant | Bulk | 85 °C | -40 °C | 100 kHz | 5 V | I2C | 6 V | 2.5 V | 256 B | 100 kHz | Lead Free | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No K4H1G0438A-UCCC | Samsung | Datasheet | - | - | Min: 1 Mult: 1 | YES | 66 | 0.65 ns | 200 MHz | SAMSUNG SEMICONDUCTOR INC | Samsung Semiconductor | K4H1G0438A-UCCC | 1 | 268435456 words | 256000000 | 70 °C | PLASTIC/EPOXY | TSSOP | TSSOP, TSSOP66,.46 | TSSOP66,.46 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | 5.84 | Non-Compliant | Yes | 2.6 V | e3 | Yes | MATTE TIN | DRAMs | CMOS | DUAL | GULL WING | 225 | 0.635 mm | compliant | 200 MHz | NOT SPECIFIED | R-PDSO-G66 | Not Qualified | 2.6 V | COMMERCIAL | 0.25 mA | 256MX4 | 3-STATE | 4 | 0.015 A | 1073741824 bit | COMMON | DDR DRAM | 8192 | 2,4,8 | 2,4,8 | Lead Free | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No LE24L042CS-B-SH | ON Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | Obsolete (Last Updated: 2 years ago) | 4 | OBSOLETE (Last Updated: 2 years ago) | Compliant | 85 °C | -40 °C | 400 kHz | 2-Wire, Serial | 3.6 V | 1.7 V | 512 B | 3 mA | 900 ns | 4 kb | 400 kHz | Lead Free | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No PCF8582C2N | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | Through Hole | 8 | Compliant | 85 °C | -40 °C | 100 kHz | I2C, Serial | 6 V | 2.5 V | 256 B | 2 mA | 10 ms | 2 kb | 100 kHz | No | Lead Free | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No AS4C64M16D2-25BCNTR | Alliance Memory, Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | Surface Mount | 84-TFBGA | YES | 84 | Volatile | 0°C~85°C TC | Tape & Reel (TR) | 2013 | Obsolete | 3 (168 Hours) | 84 | EAR99 | AUTO/SELF REFRESH | 8542.32.00.32 | 1.7V~1.9V | BOTTOM | 1 | 1.8V | 0.8mm | 1.8V | 1.9V | 1.7V | 1Gb 64M x 16 | 1 | 400MHz | 400ps | DRAM | Parallel | 16b | 64MX16 | 3-STATE | 16 | 15ns | 13b | 1 Gb | 0.01A | COMMON | 8192 | 48 | 48 | 1.2mm | 12.5mm | No | RoHS Compliant | Lead Free |
-
MT40A2G4TRF-093E:A
Micron Technology Inc.
Package:Memory
Price: please inquire
-
MT46V128M4BN-6:D
Micron Technology Inc.
Package:Memory
Price: please inquire
-
CY7C1381D-117AXCT
Cypress Semiconductor
Package:Memory
Price: please inquire
-
RC28F640P30BF65A
Micron Technology Inc.
Package:Memory
Price: please inquire
-
MT46V8M16P-6TIT:DTR
Micron Technology Inc.
Package:Memory
Price: please inquire
-
CYD09S18V18-250BBXC
Cypress Semiconductor
Package:Memory
Price: please inquire
-
F640BFHEPBTLDY
Sharp Microelectronics
Package:Memory
Price: please inquire
-
MT41K256M8HX-187E:D
Micron Technology Inc.
Package:Memory
Price: please inquire
-
MT46V32M16BN-6:C
Micron Technology Inc.
Package:Memory
Price: please inquire
-
CYD18S36V18-200BBXC
Cypress Semiconductor
Package:Memory
Price: please inquire
-
MT47H64M16BT-5E:A
Micron Technology Inc.
Package:Memory
Price: please inquire
-
CYDD04S36V18-167BBXI
Cypress Semiconductor
Package:Memory
Price: please inquire
-
W19B320ABB7H
Winbond Electronics
Package:Memory
Price: please inquire
-
W25B40AVSNIG
Winbond Electronics
Package:Memory
Price: please inquire
-
W25P80VSSIG
Winbond Electronics
Package:Memory
Price: please inquire
-
PCF85103C2N
NXP USA Inc.
Package:Memory
Price: please inquire
-
K4H1G0438A-UCCC
Samsung
Package:Memory
Price: please inquire
-
LE24L042CS-B-SH
ON Semiconductor
Package:Memory
Price: please inquire
-
PCF8582C2N
NXP USA Inc.
Package:Memory
Price: please inquire
-
AS4C64M16D2-25BCNTR
Alliance Memory, Inc.
Package:Memory
Price: please inquire