The category is 'Memory'
Memory (7)
- All Manufacturers
- Base Part Number
- Memory Format
- Memory Interface
- Memory Size
- Memory Types
- Moisture Sensitivity Level (MSL)
- Mounting Type
- Operating Temperature
- Package / Case
- Packaging
- Part Status
- RoHS Status
- Package / Case:
55-TFBGA
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Memory Types | Operating Temperature | Packaging | Published | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | HTS Code | Voltage - Rated DC | Voltage - Supply | Terminal Position | Peak Reflow Temperature (Cel) | Number of Functions | Supply Voltage | Terminal Pitch | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Voltage | Interface | Max Supply Voltage | Min Supply Voltage | Memory Size | Nominal Supply Current | Operating Mode | Access Time | Memory Format | Memory Interface | Organization | Memory Width | Write Cycle Time - Word, Page | Address Bus Width | Density | Standby Current-Max | Memory Density | Access Time (Max) | Sync/Async | Word Size | Programming Voltage | Data Polling | Toggle Bit | Command User Interface | Number of Sectors/Size | Sector Size | Page Size | Ready/Busy | Height Seated (Max) | Length | Width | Radiation Hardening | RoHS Status | Lead Free |
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 | Mfr Part No NAND256W3A2BZA6E | Micron Technology Inc. | Datasheet | 296 | - | Min: 1 Mult: 1 | Surface Mount | Surface Mount | 55-TFBGA | 48 | Non-Volatile | -40°C~85°C TA | Tray | 2004 | e1 | yes | Obsolete | 3 (168 Hours) | 55 | 3A991.B.1.A | TIN SILVER COPPER | 8542.32.00.51 | 3V | 2.7V~3.6V | BOTTOM | 260 | 1 | 3V | 0.8mm | 30 | NAND256-A | 55 | R-PBGA-B55 | 3V | 256Mb 32M x 8 | 20mA | FLASH | Parallel | 32MX8 | 8 | 50ns | 25b | 256 Mb | 0.00005A | 35 ns | Asynchronous | 8b | NO | NO | YES | 2K | 16K | 512words | YES | 1.05mm | 10mm | No | ROHS3 Compliant | ||||||||||||||||||||
 | Mfr Part No NAND256R3A2BZA6E | Micron Technology Inc. | Datasheet | 2201 | - | Min: 1 Mult: 1 | Surface Mount | Surface Mount | 55-TFBGA | 55 | 55-VFBGA (8x10) | Non-Volatile | -40°C~85°C TA | Tray | 2004 | Obsolete | 3 (168 Hours) | 85°C | -40°C | 1.7V~1.95V | NAND256-A | 1.8V | Parallel | 1.95V | 1.7V | 256Mb 32M x 8 | 15mA | 50ns | FLASH | Parallel | 50ns | 25b | 256 Mb | Asynchronous | 8b | No | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No NAND512R3A2AZA6E | STMicroelectronics | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 55-TFBGA | YES | 55 | Non-Volatile | -40°C~85°C TA | Tray | Obsolete | 1 (Unlimited) | 63 | 3A991.B.1.A | 8542.32.00.51 | 1.7V~1.95V | BOTTOM | NOT SPECIFIED | 1 | 1.8V | 0.8mm | NOT SPECIFIED | NAND512 | 63 | R-PBGA-B63 | Not Qualified | 1.95V | 1.8V | 1.7V | 512Mb 64M x 8 | ASYNCHRONOUS | FLASH | Parallel | 64MX8 | 8 | 60ns | 0.00005A | 536870912 bit | 15000 ns | 1.8V | NO | NO | YES | 4K | 16K | 512words | YES | 1.05mm | 11mm | 9mm | Non-RoHS Compliant | Contains Lead | |||||||||||||||||||||||
| Mfr Part No NAND512R3A3AZA6E | STMicroelectronics | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 55-TFBGA | YES | 55 | Non-Volatile | -40°C~85°C TA | Tray | Obsolete | 1 (Unlimited) | 63 | 3A991.B.1.A | 8542.32.00.51 | 1.7V~1.95V | BOTTOM | NOT SPECIFIED | 1 | 1.8V | 0.8mm | NOT SPECIFIED | NAND512 | 63 | R-PBGA-B63 | Not Qualified | 1.95V | 1.8V | 1.7V | 512Mb 64M x 8 | ASYNCHRONOUS | FLASH | Parallel | 64MX8 | 8 | 60ns | 0.00005A | 536870912 bit | 15000 ns | 1.8V | NO | NO | YES | 4K | 16K | 512words | YES | 1.05mm | 15mm | 8.5mm | ROHS3 Compliant | Lead Free | |||||||||||||||||||||||
| Mfr Part No NAND256W3A2BZAXE | Micron Technology Inc. | Datasheet | 4000 | - | Min: 1 Mult: 1 | 4 Weeks | Surface Mount | 55-TFBGA | YES | 55 | Non-Volatile | -40°C~85°C TA | Tray | 2004 | Obsolete | 3 (168 Hours) | 55 | 3.3V | 2.7V~3.6V | BOTTOM | 1 | 3V | 0.8mm | NAND256 | 3V | 3.3V | 256Mb 32M x 8 | FLASH | Parallel | 32MX8 | 8 | 50ns | 25b | 256 Mb | 0.00005A | 45 ns | NO | NO | YES | 2K | 16K | 528B | YES | 1.05mm | 10mm | No | ROHS3 Compliant | ||||||||||||||||||||||||||||||
 | Mfr Part No NAND256W3A0BZA6E | Micron Technology Inc. | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | Surface Mount | 55-TFBGA | 55 | Non-Volatile | -40°C~85°C TA | Tray | 2013 | e1 | yes | Obsolete | 3 (168 Hours) | 55 | 3A991.B.1.A | TIN SILVER COPPER | 8542.32.00.51 | 2.7V~3.6V | BOTTOM | 260 | 1 | 3V | 0.8mm | 30 | NAND256-A | 55 | 3.6V | 3/3.3V | 2.7V | 256Mb 32M x 8 | 20mA | FLASH | Parallel | 32MX8 | 8 | 50ns | 25b | 256 Mb | 0.00005A | 35 ns | Asynchronous | 8b | 3V | NO | NO | YES | 2K | 16K | 512words | YES | 1.05mm | 10mm | No | ROHS3 Compliant | |||||||||||||||||||
| Mfr Part No NAND256W3A2BZA6F TR | Micron Technology Inc. | Datasheet | 2009 | - | Min: 1 Mult: 1 | Surface Mount | 55-TFBGA | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2012 | Obsolete | 3 (168 Hours) | 2.7V~3.6V | NAND256 | 256Mb 32M x 8 | FLASH | Parallel | 50ns | ROHS3 Compliant |
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NAND256W3A2BZA6E
Micron Technology Inc.
Package:Memory
Price: please inquire
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NAND256R3A2BZA6E
Micron Technology Inc.
Package:Memory
Price: please inquire
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NAND512R3A2AZA6E
STMicroelectronics
Package:Memory
Price: please inquire
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NAND512R3A3AZA6E
STMicroelectronics
Package:Memory
Price: please inquire
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NAND256W3A2BZAXE
Micron Technology Inc.
Package:Memory
Price: please inquire
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NAND256W3A0BZA6E
Micron Technology Inc.
Package:Memory
Price: please inquire
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NAND256W3A2BZA6F TR
Micron Technology Inc.
Package:Memory
Price: please inquire